CN100454566C - Image sensing-detecting chip and circuit board combination - Google Patents
Image sensing-detecting chip and circuit board combination Download PDFInfo
- Publication number
- CN100454566C CN100454566C CNB2005101261940A CN200510126194A CN100454566C CN 100454566 C CN100454566 C CN 100454566C CN B2005101261940 A CNB2005101261940 A CN B2005101261940A CN 200510126194 A CN200510126194 A CN 200510126194A CN 100454566 C CN100454566 C CN 100454566C
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- image sensing
- circuit substrate
- window
- wire welding
- image
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
An image-sensing wafer is installed on circuit base plate with window and throwing notches being prepared in advance. Using spacer region between the outside of image sensing area and weld pads makes weld pads through throwing notches face to direction of image sensing area. Thus, in inner throwing mode, weld pads are connected to connection points on circuit base plate electrically. Window on place of circuit base plate corresponding to image sensing area is closed over by gluing a glass plate. Finally, glue material is filled in order to reach airtight and protection.
Description
Technical field
The present invention relates to a kind of interval region that utilizes between the outside, image sensing district on the wafer and weld pad, via for the window routing that exposes weld pad, and form the image sensor structure of the electrically connect of wafer and circuit substrate by the circuit on the circuit substrate.
Background technology
As shown in Figure 5, be the image sensor structure of commonly using, this image sensor comprises a circuit board 70, a frame dam 71, an image sensing wafer 72, a glass plate 73, these circuit board 70 surperficial cordings have most pins 701, this image sensing wafer 72 electrically connects with each pin 701 by the routing mode, and is adhered to frame dam 71 and seals this image sensing wafer 72 with glass plate 73.Yet, this shortcoming of commonly using image sensor structure is that the volume of encapsulation back can be more many than image sensing wafer size, reason is the condition restriction that is subject on the bonding wire processing procedure, for reaching good routing effect in the bonding wire process, the requirement of routing minimum range is arranged to the spacing of 71 of pins between image sensing wafer 72 peripheries, so can become many greatly, so impede for the mobile design of electronic products formation of classes such as mobile phone, personal numerical digit product, network video camera through planting encapsulation volume thus.
Based on the aforementioned too big problem of encapsulation volume that is caused with the routing processing procedure, so the dealer is improved to cover crystalline substance (Flipchip) structure packing technique.Be illustrated in figure 6 as the image sensor crystal covering type assembling structure of commonly using, this kind processing procedure needs to carry out earlier the processing procedure of each crystal grain 81 growth projection 82 (Bump) on a wafer (Wafer), make the circuit junction 83 on each tool projection 82 crystal grain 81 and each glass substrate 84 engage do reflow again.Yet, the glass substrate 84 inner faces system of crystal grain 81 tops utilizes light shield etching technique framework to go out circuit 85, so its crystal covered package processing procedure is rather complicated, and may lack, and influence the reliability of its optical characteristics or its encapsulating products because of the filler of 81 of glass substrate 84 and crystal grain.Therefore, though this crystal covering type assembling structure has the best opering characteristic of electric apparatus, the crystal grain thermal diffusivity is good and the plurality of advantages of less package dimension, the structure packing technique of this image sensor still has its degree of difficulty at present, and the processing procedure cost is higher, and the product yield is also wayward.
So if consider with processing procedure cost and technological side, most of in the packaging industry at present is main flow with the bonding wire processing procedure still.How to design the image sensor structure of small size and low packaging cost simultaneously, and accord with the demands of the market, be the present invention's research emphasis in fact.
Summary of the invention
The image sensor structure that the purpose of this invention is to provide a kind of small size and low packaging cost.
For achieving the above object, the present invention takes following design: a kind of image sensor structure, and this structure comprises: an image sensing wafer, a circuit substrate and a glass plate; It is characterized in that: this image sensing wafer has an image sensing district, several wire welding areas, and respectively this wire welding area is in the layout of this outside, image sensing district, and respectively comprises a plurality of weld pads on this wire welding area; This circuit substrate offers and penetrates into one of another corresponding surface window in a surface, and corresponds to respectively several routing notches of this wire welding area; The specification of this window is comparable to this image sensing district size, and respectively the specification of this routing notch then is comparable to respectively this wire welding area size; This circuit substrate surface is in this window side and respectively have a plurality of electric connection points between this routing notch, and puts a conducting wire that is connected with electric connection; With the image sensing district of this image sensing wafer window, be bonded in this circuit substrate for this image sensing wafer corresponding to this circuit substrate; This image sensing wafer is more with its this routing notch respectively of the weld pad correspondence in this wire welding area respectively, and with the gold thread electrically connect to respectively electrically connecting point; This glass plate system is to should the image sensing district and be arranged on this circuit substrate the window's position and top, this image sensing district, and the specification of this glass plate is comparable to this window size.
This glass plate system is glued at this circuit substrate the window's position and this window of capping.
This circuit substrate is a flexible circuit board.
Advantage of the present invention is: the present invention offers window and number routing notch in advance by a circuit substrate, for the device image sensing wafer, and utilize the interval region between image sensing district periphery and weld pad on the wafer, make weld pad on the wafer can the inside routing of economy-combat wire casing mouth electrically connect point to the circuit substrate, and do the telecommunication transmission with circuit substrate.Use and lower original restricted volume size, even the size of circuit substrate can be comparable to the image sensing wafer size with the bonding wire encapsulation.
Around this image sensing wafer, this glass plate and the routing notch of this circuit substrate be filling glue material, use and constitute airtight and protect electrically connect between each weld pad and each electrically connect point.
Description of drawings
Fig. 1 is the present invention's composition structure schematic side view
Fig. 2 finishes vertical view for the present invention's circuit board etching
Fig. 3 is the present invention's composition structure vertical view
Fig. 4 system is installed in lens group on the compositions structure of Fig. 1 and the schematic diagram of formation image capture module
The image sensor structure schematic diagram is commonly used by Fig. 5 system
Chip package formula image sensor structure schematic diagram is commonly used by Fig. 6 system
Embodiment
See also Fig. 1, Fig. 2, Fig. 3, Fig. 4, person shown in the figure is the selected example structure of the present invention, and this only for the usefulness of explanation, is not subjected to the restriction of this kind structure in patent application.
The composition structure of present embodiment comprises: an image sensing wafer 1, a circuit substrate 2 and a glass plate 3.
This image sensing wafer 1 has an image sensing district 11, number wire welding area 12, and each wire welding area 12 layout also is surrounded on this 11 outsides, image sensing district, and comprises most weld pads 13 on each wire welding area 12.
This circuit substrate 2 offers and penetrates into one of another corresponding surface window 23 in a surface, and corresponds to several routing notches 24 of each wire welding area 12.The specification of this window 23 is comparable to image sensing district 11 sizes, the specification of each routing notch 24 then is comparable to each wire welding area 12 size, and circuit substrate 2 surfaces are in these window 23 sides and respectively have most points 25 that electrically connect between this routing notch 24, and with electrically connect point 25 conducting wires that are connected 26.Wherein, this circuit substrate 2 is a flexible circuit board.
With the image sensing district 11 of this image sensing wafer 1 window 23, can be bonded in circuit substrate 2 for image sensing wafer 1 corresponding to this circuit substrate 2.This image sensing wafer 1 is more with weld pad 13 corresponding each the routing notch 24 in its each wire welding area 12, and is connected to each with gold thread 14 and electrically connects point 25 and constitute electrically connect.
This glass plate 3 is to should image sensing district 11 and be arranged on these circuit substrate 2 windows, 23 positions and this 11 tops, image sensing district, and the specification of this glass plate 3 is comparable to this window 23 sizes.
The routing notch 24 that reaches this circuit substrate 2 around this image sensing wafer 1, this glass plate 3 more is filled with glue material 4, and it is airtight to use formation, reaches the electrically connect of 25 of each weld pad 13 of protection and each electrically connect points.
Structure is of the present invention as can be seen significantly focuses on by aforementioned forming, as shown in Figure 3, it is formed structure system and offer window 23 and number routing notch 24 in advance on circuit substrate 2, for device image sensing wafer 1, and make full use of the regional extent of 13 of image sensing district 11 peripheries and weld pad on the image sensing wafer 1, make the image sense spatter weld pad 13 on the wafer 1 can economy-combat wire casing mouths 24 the inside electrically connect point 25 of the direction of image sensing district 11 (promptly towards) routing to the circuit substrate 2, transmit and make signal with circuit substrate 2.This forms the restriction that structural advantages foot lowers original volume size with the bonding wire encapsulation relatively, both solved the minimal distance requirement of weld pad in the original bonding wire processing procedure 13 to electrically connect point 25, even because the size of circuit substrate 2 can closely be similar to image sensing wafer 1 size, and reduce the usable floor area of circuit substrate 2 in a large number, relatively reduce packaging cost and reach the better reliability degree demand.
As shown in Figure 4, it is to use the present invention's composition structure and the image capture module that a lens group 5 is constituted, this module constituted mode system is located at circuit substrate 2 tops that image sensing wafer 1 is installed with lens mount set on the lens group 51, and forms an image capture module that can be applicable to the mobile electronic product of classes such as mobile phone, personal numerical digit product and network video camera.
So advantage of the present invention provides on the encapsulation procedure and the automated production of image capture module group assembling needs Ask. Compared to known encapsulation technology, the present invention can effectively promote production capacity and lower device requirement, so the product cost Can significantly reduce, and solve simultaneously the crystalline substance that covers than big final encapsulation volume and high price that utilizes the bonding wire processing procedure to be caused The dual problem of structure packing technique.
Claims (3)
1, a kind of image sensor structure comprises: an image sensing wafer, a circuit substrate and a glass plate; It is characterized in that:
This image sensing wafer has an image sensing district, several wire welding areas, and respectively this wire welding area is in the layout of this outside, image sensing district, and respectively comprises a plurality of weld pads on this wire welding area;
This circuit substrate offers and penetrates into one of another corresponding surface window in a surface, and corresponds to respectively several routing notches of this wire welding area; The specification of this window is comparable to this image sensing district size, and respectively the specification of this routing notch then is comparable to respectively this wire welding area size;
This circuit substrate surface is in this window side and respectively have a plurality of electric connection points between this routing notch, and puts a conducting wire that is connected with electric connection;
With the image sensing district of this image sensing wafer window, be bonded in this circuit substrate for this image sensing wafer corresponding to this circuit substrate; This image sensing wafer is more with its this routing notch respectively of the weld pad correspondence in this wire welding area respectively, and with the gold thread electrically connect to respectively electrically connecting point;
This glass plate system is to should the image sensing district and be arranged on this circuit substrate the window's position and top, this image sensing district, and the specification of this glass plate is comparable to this window size.
2, image sensor structure according to claim 1 is characterized in that: this glass plate system is glued at this circuit substrate the window's position and this window of capping.
3, image sensor structure according to claim 1 is characterized in that: this circuit substrate is a flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101261940A CN100454566C (en) | 2005-12-01 | 2005-12-01 | Image sensing-detecting chip and circuit board combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101261940A CN100454566C (en) | 2005-12-01 | 2005-12-01 | Image sensing-detecting chip and circuit board combination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979880A CN1979880A (en) | 2007-06-13 |
| CN100454566C true CN100454566C (en) | 2009-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101261940A Expired - Fee Related CN100454566C (en) | 2005-12-01 | 2005-12-01 | Image sensing-detecting chip and circuit board combination |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576552A (en) * | 2013-10-15 | 2015-04-29 | 林登炎 | Chip packaging structure and manufacture procedure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6933493B2 (en) * | 2003-04-07 | 2005-08-23 | Kingpak Technology Inc. | Image sensor having a photosensitive chip mounted to a metal sheet |
| CN1682376A (en) * | 2002-09-09 | 2005-10-12 | 皇家飞利浦电子股份有限公司 | Semiconductor device and method of manufacturing such a device |
| US20050258336A1 (en) * | 2004-05-24 | 2005-11-24 | Wen-Ching Chen | Image sensor with protective package structure for sensing area |
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2005
- 2005-12-01 CN CNB2005101261940A patent/CN100454566C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1682376A (en) * | 2002-09-09 | 2005-10-12 | 皇家飞利浦电子股份有限公司 | Semiconductor device and method of manufacturing such a device |
| US6933493B2 (en) * | 2003-04-07 | 2005-08-23 | Kingpak Technology Inc. | Image sensor having a photosensitive chip mounted to a metal sheet |
| US20050258336A1 (en) * | 2004-05-24 | 2005-11-24 | Wen-Ching Chen | Image sensor with protective package structure for sensing area |
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| Publication number | Publication date |
|---|---|
| CN1979880A (en) | 2007-06-13 |
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