JPH056989A - Solid-state image sensing device and manufacture thereof - Google Patents
Solid-state image sensing device and manufacture thereofInfo
- Publication number
- JPH056989A JPH056989A JP3287523A JP28752391A JPH056989A JP H056989 A JPH056989 A JP H056989A JP 3287523 A JP3287523 A JP 3287523A JP 28752391 A JP28752391 A JP 28752391A JP H056989 A JPH056989 A JP H056989A
- Authority
- JP
- Japan
- Prior art keywords
- image pickup
- plate
- pickup device
- base
- shaped body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はビデオカメラ等に用いら
れる撮像装置とその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device used in a video camera or the like and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】図５は従来の撮像装置の断面図である。
図５において、２０はベース、２１は撮像素子、２２は
リード、２３はワイヤー、２４はフィルタ、２５はフレ
ア防止板、２６は透明板である。2. Description of the Related Art FIG. 5 is a sectional view of a conventional image pickup apparatus.
In FIG. 5, 20 is a base, 21 is an image sensor, 22 is a lead, 23 is a wire, 24 is a filter, 25 is a flare prevention plate, and 26 is a transparent plate.
【０００３】多層セラミック製のベース２０の中央凹部
に、ＣＣＤなどの撮像素子２１が固定され、撮像素子２
１の電極とリード２２はワイヤー２３で接続されてい
る。撮像素子２１の受光面にはフィルタ２４が接着され
ている。ベース２０の中央凹部の中段にはフレア防止板
２５が設けられ、その上が透明板２６で封じられてい
る。An image pickup device 21, such as a CCD, is fixed in a central recess of a base 20 made of a multilayer ceramic.
The electrode 1 and the lead 22 are connected by a wire 23. A filter 24 is adhered to the light receiving surface of the image sensor 21. A flare prevention plate 25 is provided in the middle of the central recess of the base 20, and a transparent plate 26 is sealed above the flare prevention plate 25.
【０００４】一方、従来の製造方法としては、多層セラ
ミック製のベース２０の中央凹部に、ＣＣＤなどの撮像
素子２１を固定し、撮像素子２１の電極とリード２２の
をワイヤー２３で接続する。撮像素子２１の受光面には
フィルタ２４を接着し、ベース２０の中央凹部の中段に
はフレア防止板２５を設ける。その後、透明板２６をそ
の周縁部においてベース２０に接着して密封構造として
いた。On the other hand, as a conventional manufacturing method, an image pickup device 21 such as a CCD is fixed in a central recess of a base 20 made of a multilayer ceramic, and an electrode of the image pickup device 21 and a lead 22 are connected by a wire 23. A filter 24 is attached to the light receiving surface of the image pickup device 21, and a flare prevention plate 25 is provided in the middle of the central recess of the base 20. After that, the transparent plate 26 was adhered to the base 20 at the peripheral portion thereof to form a hermetically sealed structure.
【０００５】[0005]
【発明が解決しようとする課題】以上のような従来の撮
像装置では、コスト面からはベースに用いられる多層セ
ラミックやフレア防止板が高価であり、コストダウンの
障害となっていた。また、撮像素子がベースの凹部に収
納される構造なので、完成後の撮像装置の薄型化に限界
があった。また、従来の製造方法では、撮像素子をベー
スに固定してからの工程が長くかつ複雑であって、拡散
工程完了後のリードタイム短縮の妨げになっていただけ
でなく、これらの工程で不良が発生した場合には、既に
搭載された良品である撮像素子もあわせて廃棄せざるを
得ず、不良品廃棄による損害が大きかった。In the conventional image pickup apparatus as described above, the multilayer ceramic and the flare prevention plate used for the base are expensive in terms of cost, which is an obstacle to cost reduction. Further, since the image pickup device is housed in the recess of the base, there is a limit to the reduction in thickness of the image pickup device after completion. Further, in the conventional manufacturing method, the process after fixing the image sensor to the base is long and complicated, which not only hinders the reduction of the lead time after completion of the diffusion process, but also causes a defect in these processes. In the case of occurrence, there is no choice but to discard the already mounted non-defective image pickup device, and the damage caused by discarding the defective product is large.
【０００６】本発明は上記の問題を解決し、低コスト
で、かつ薄型化に適した撮像装置とその製造方法の提供
を目的としている。An object of the present invention is to solve the above problems and to provide an imaging device which is low in cost and suitable for thinning, and a manufacturing method thereof.
【０００７】[0007]
【課題を解決するための手段】上記の目的を達成するた
めに、第１の発明の撮像装置は、少なくとも央部に透明
部を有する板状体と、この板状体の一つの面に形成され
た複数の導体パターンと、導体パターンのそれぞれの内
端に電極が接続され、板状体に受光面を向けて固定され
た撮像素子と、板状体と撮像素子受光面との間の空間を
密閉すべく設けられた封止手段とを有している。In order to achieve the above-mentioned object, the image pickup device of the first invention is a plate-shaped body having a transparent portion at least in the center and formed on one surface of the plate-shaped body. A plurality of conductive patterns, an electrode connected to each inner end of the conductive pattern, and an imaging element fixed with the light receiving surface facing the plate-shaped body, and a space between the plate-shaped body and the light receiving surface of the image sensor And a sealing means provided to hermetically seal the.
【０００８】また、第２の発明の撮像装置は、央部に窓
を有するベースと、ベース表面に設けられそれぞれ一端
が窓内に延び、他端がベース外部に延びる複数の導体
と、ベースに接着された、少なくとも央部に透明部を有
する板状体と、導体の内端に電極を接続し受光面を前記
板状体に向けて前記窓内に保持された撮像素子と、前記
板状体と撮像素子受光面との間の空間を密閉する封止手
段とを有している。In the image pickup device of the second invention, a base having a window at the center, a plurality of conductors provided on the surface of the base, one end of which extends into the window and the other end of which extends outside the base, are formed on the base. A plate-like body having a transparent portion at least in the center, which is adhered to the plate, an image sensor connected to an electrode at an inner end of a conductor and held in the window with a light-receiving surface facing the plate-like body, and the plate-like body. It has a sealing means for sealing the space between the body and the light receiving surface of the image sensor.
【０００９】さらに、第３の発明の撮像装置では、第２
の発明の撮像装置において、ベースと板状体とを接着す
る接着剤の一部が、板状体の中央部に向かって延びフレ
ア防止層となっている。Further, in the image pickup device of the third invention,
In the image pickup device according to the invention described above, a part of the adhesive that bonds the base and the plate-shaped body extends toward the center of the plate-shaped body to form a flare prevention layer.
【００１０】一方、第４の発明の撮像装置の製造方法
は、少なくとも央部に透光部を有する板状体と、板状体
の一つの面に形成された複数の導体パターンとを有する
構体を用意する工程と、撮像素子の電極が導体パターン
のそれぞれの内端に接続され、撮像素子を板状体に受光
面を向けて固定する工程と、板状体と撮像素子受光面と
の間の空間を密閉する封止工程とを有している。On the other hand, in the method for manufacturing an image pickup device according to the fourth aspect of the invention, a structure having a plate-shaped body having a light-transmitting portion at least in the center and a plurality of conductor patterns formed on one surface of the plate-shaped body. Between the plate-shaped body and the image-sensing element light-receiving surface, the step of preparing the And a sealing step of sealing the space.
【００１１】第５の発明の撮像装置の製造方法は、央部
に窓を有するベースと、ベース表面に設けられそれぞれ
一端が窓内に延び、他端がベース周縁部ないし外部に延
びる複数の導体と、ベースに接着され、少なくとも央部
に透光部を有する板状体とを有する構体を用意する工程
と、撮像素子の電極が導体の内端に接続され、撮像素子
をその受光面を板状体に向けて窓内に固定する工程と、
撮像素子の受光面と板状体との間の空間を密閉する封止
工程とを有している。According to a fifth aspect of the present invention, there is provided a method of manufacturing an image pickup device, wherein a base having a window at its center and a plurality of conductors provided on the surface of the base have one end extending into the window and the other end extending to the peripheral portion of the base or the outside. And a step of preparing a structure having a plate-like body that is bonded to a base and has a light-transmitting portion in at least a central portion, and an electrode of the image pickup device is connected to an inner end of the conductor, and Fixing the inside of the window toward the body,
And a sealing step of sealing a space between the light receiving surface of the image pickup element and the plate-shaped body.
【００１２】[0012]
【作用】上記構成によれば、高価な多層構造のベースが
不要となり、コストダウンが図られるとともに、ベース
に撮像素子を収納する深さが不要となるので、撮像装置
の薄型化も実現される。また、ダイスボンド工程やワイ
ヤボンド工程が不要となるだけでなく、撮像素子固定後
の工程も短く、リードタイムの短縮が図られるととも
に、不良発生時の廃棄による損害も最小限に抑えられ
る。According to the above construction, an expensive multi-layered base is not required, cost can be reduced, and the depth for accommodating the image pickup element in the base is not required, so that the image pickup apparatus can be made thin. . Further, not only the die-bonding process and the wire-bonding process are unnecessary, but also the process after fixing the image pickup element is short, the lead time can be shortened, and the damage due to the discard when a defect occurs can be minimized.
【００１３】[0013]
【実施例】図１は第１の発明の一実施例装置の断面図、
図２はその平面図である。なお、図１は図２のＸ−Ｙの
位置における断面図である。両図において、１は撮像素
子、２はフィルタ、３は透明板、４は封止樹脂、５は配
線、６はバンプ電極である。１ｍｍ〜２ｍｍの厚さのガ
ラスでなる透明板３の一方の面に蒸着金属あるいはスク
リーン印刷によって形成された複数の導体パターンによ
り配線５が設けられている。各配線の内端は透明板３の
中央部をはさむ位置に並び、その外端が透明板３の長辺
に沿って並んで外部との接続端子となっている。配線の
外端は封止樹脂４には覆われていない。この接続端子に
二段突起状のバンプ電極を設けておいてもよい。撮像素
子１は、配線５のそれぞれの内端にバンプ電極６と導電
性接着剤（図示せず）によって電気的に接続され、その
受光面を透明板３に向けて固定されている。バンプ電極
６はめっき法またはスタッドバンプ法によって金を材料
として撮像素子１の表面に形成しておくか、あらかじめ
配線５の所定位置に転写しておけばよい。スタッドバン
プ法で形成されたバンプ電極は、押しつぶされたボール
でなるベース部分と、このベース部分から延びるワイヤ
ーを折り返して形成した突起部とからなる二段突起形状
をしている。このような電極を用いれば、従来の形状の
バンプ電極よりも高さの大きい電極を形成することがで
きる。本実施例装置においてバンプ電極６として二段突
起電極を用いれば、透明板３と撮像素子１の表面との間
隔を充分広くとることができ、フィルタ２を余裕を持っ
て設けることが可能となる。また、二段突起電極はその
形状から、衝撃を緩和する作用があり、配線５に接続す
る際の機械的衝撃を吸収して透明板や撮像素子にダメー
ジを与えない。バンプ電極と配線との接続は直接圧着し
てもよいし、導電性接着剤を介して接着してもよい。導
電性接着剤は一括転写して用いる。撮像素子１の受光面
にはフィルタ２が被着されている。撮像素子１の裏面か
らその周囲にかけてはエポキシ樹脂またはシリコーン樹
脂等の封止樹脂４で覆われており、撮像素子１の受光面
と透明板３との間の空間には不活性ガスである窒素ガス
が封入され、密閉されている。本実施例装置の構造によ
れば、導体パターンで形成された配線５が外部リードを
兼ねており、外部リードを別に設ける必要がないという
メリットとともに、装置の薄型化が実現される。1 is a sectional view of an apparatus according to an embodiment of the first invention,
FIG. 2 is a plan view thereof. Note that FIG. 1 is a cross-sectional view taken along the line XY in FIG. In both figures, 1 is an image sensor, 2 is a filter, 3 is a transparent plate, 4 is sealing resin, 5 is wiring, and 6 is a bump electrode. The wiring 5 is provided on one surface of the transparent plate 3 made of glass having a thickness of 1 mm to 2 mm by a plurality of conductive patterns formed by vapor deposition metal or screen printing. The inner ends of the wirings are arranged at positions sandwiching the central portion of the transparent plate 3, and the outer ends are arranged along the long sides of the transparent plate 3 to serve as connection terminals to the outside. The outer end of the wiring is not covered with the sealing resin 4. A bump electrode having a two-step protrusion may be provided on this connection terminal. The image pickup device 1 is electrically connected to each inner end of the wiring 5 with a bump electrode 6 by a conductive adhesive (not shown), and is fixed with its light receiving surface facing the transparent plate 3. The bump electrodes 6 may be formed on the surface of the image pickup device 1 by using gold as a material by a plating method or a stud bump method, or may be transferred to a predetermined position of the wiring 5 in advance. The bump electrode formed by the stud bump method has a two-step protrusion shape including a base portion made of a crushed ball and a protrusion formed by folding back a wire extending from the base portion. By using such an electrode, it is possible to form an electrode having a height higher than that of a bump electrode having a conventional shape. If a two-step projecting electrode is used as the bump electrode 6 in the device of this embodiment, the gap between the transparent plate 3 and the surface of the image pickup device 1 can be made sufficiently wide, and the filter 2 can be provided with a margin. . Further, the shape of the two-stage projecting electrode has a function of cushioning an impact, and does not damage the transparent plate or the image pickup element by absorbing a mechanical impact when connecting to the wiring 5. The connection between the bump electrode and the wiring may be directly performed by pressure bonding or may be performed by a conductive adhesive. The conductive adhesive is used by being collectively transferred. A filter 2 is attached to the light receiving surface of the image sensor 1. The back surface of the image sensor 1 and its periphery are covered with a sealing resin 4 such as an epoxy resin or a silicone resin, and the space between the light receiving surface of the image sensor 1 and the transparent plate 3 is nitrogen, which is an inert gas. Gas is sealed and sealed. According to the structure of the device of this embodiment, the wiring 5 formed of the conductor pattern also serves as the external lead, and it is not necessary to separately provide the external lead, and the device can be thinned.
【００１４】本実施例装置の望ましい製造方法として
は、まず、透明板３に配線５を形成した構体をあらかじ
め用意しておき、その構体を洗浄後、バンプ電極６とフ
ィルタ２を設けた撮像素子１を配線５の内端に接続す
る。その後、窒素ガス雰囲気中で撮像素子１の裏面から
その周囲にかけてをエポキシ樹脂またはシリコーン樹脂
等の封止樹脂４で覆い、撮像素子１の受光面と透明板３
との間の空間は密閉すればよい。As a desirable manufacturing method of the apparatus of this embodiment, first, an assembly having wirings 5 formed on a transparent plate 3 is prepared in advance, the assembly is washed, and then an image pickup device provided with bump electrodes 6 and a filter 2 is provided. 1 is connected to the inner end of the wiring 5. Then, in the nitrogen gas atmosphere, the back surface of the image sensor 1 and its periphery are covered with a sealing resin 4 such as an epoxy resin or a silicone resin, and the light receiving surface of the image sensor 1 and the transparent plate 3 are covered.
The space between and may be sealed.
【００１５】この製造方法によれば、撮像素子を接続し
た後の工程は封止工程のみとなるので、いわゆる拡散工
程完了後のリードタイムが短縮されるとともに、撮像素
子を接続した後で工程不良が発生することが少なく、撮
像素子を含む半製品を不良品として廃棄することが少な
くなり、不良発生による損害を最小限に抑えられる。ま
た、撮像素子１の表面がある空間は不活性ガスである窒
素ガスで満たされているので、酸化や吸湿による素子の
劣化が起こらない。According to this manufacturing method, since only the sealing step is performed after the image pickup element is connected, the lead time after completion of the so-called diffusion step is shortened, and the process failure occurs after the image pickup element is connected. Is less likely to occur, a semi-finished product including an image sensor is less likely to be discarded as a defective product, and damage due to the occurrence of a defect can be minimized. Further, since the space where the surface of the image pickup device 1 is present is filled with nitrogen gas which is an inert gas, deterioration of the device due to oxidation or moisture absorption does not occur.
【００１６】図３は第２の発明の一実施例おける撮像装
置の断面図である。同図において、７はベース、８はリ
ード、９は接着剤である。単層セラミック製のベース７
はその央部に撮像素子１を収納できるサイズの長方形の
窓を有し、一方の面には複数のリード８が形成されてい
る。リード８はたとえば、鉄系合金などの導体で成り、
それぞれその内端が前記ベース７の窓に突出している。
この突出部分にはバンプ電極６との接合性を高めるため
に、たとえばバンプ電極６が金の場合にはリード８の表
面に錫メッキを施しておけば好ましい。リード８の他端
はベース７の外部にまで延長され、ベース７の側面に沿
って下方に曲げられ、外部リードとなっている。撮像素
子１は、リード８のそれぞれの内端にバンプ電極６によ
って電気的に接続され、その受光面を透明板３に向けて
ベース７の窓内に固定されている。リード８の内端とバ
ンプ電極６との電気的接続は熱圧着による一括接合によ
ればよい。バンプ電極６はめっき法またはスタッドバン
プ法で撮像素子１の表面に形成しておくか、あらかじめ
リード８の所定位置に転写しておけばよい。スタッドバ
ンプ法で形成されたバンプ電極は、押しつぶされたボー
ルでなるベース部分と、このベース部分から延びるワイ
ヤーを折り返して形成した突起部とからなる二段突起形
状をしている。このような電極を用いれば、従来の形状
のバンプ電極よりも高さの大きい電極を形成することが
できる。本実施例装置においてバンプ電極６として二段
突起電極を用いれば、透明板３と撮像素子１の表面との
間隔を充分広くとることができ、フィルタ２を余裕を持
って設けることが可能となる。また、二段突起電極はそ
の形状から衝撃を緩和する作用があり、配線５に接続す
る際の機械的衝撃を吸収して配線や撮像素子にダメージ
を与えない。FIG. 3 is a sectional view of an image pickup apparatus according to an embodiment of the second invention. In the figure, 7 is a base, 8 is a lead, and 9 is an adhesive. Base 7 made of single layer ceramic
Has a rectangular window having a size capable of accommodating the image pickup device 1 in the center thereof, and has a plurality of leads 8 formed on one surface thereof. The lead 8 is made of a conductor such as an iron-based alloy,
The inner end of each protrudes into the window of the base 7.
In order to improve the bondability with the bump electrode 6, it is preferable that the surface of the lead 8 is plated with tin in order to improve the bondability with the bump electrode 6. The other end of the lead 8 extends to the outside of the base 7 and is bent downward along the side surface of the base 7 to form an external lead. The image pickup device 1 is electrically connected to the inner ends of the leads 8 by bump electrodes 6, and is fixed in the window of the base 7 with the light receiving surface thereof facing the transparent plate 3. Electrical connection between the inner ends of the leads 8 and the bump electrodes 6 may be performed by collective bonding by thermocompression bonding. The bump electrode 6 may be formed on the surface of the image pickup device 1 by a plating method or a stud bump method, or may be transferred to a predetermined position of the lead 8 in advance. The bump electrode formed by the stud bump method has a two-step protrusion shape including a base portion formed of a crushed ball and a protrusion portion formed by folding back a wire extending from the base portion. By using such an electrode, it is possible to form an electrode having a height higher than that of a bump electrode having a conventional shape. If a two-step projecting electrode is used as the bump electrode 6 in the apparatus of this embodiment, the gap between the transparent plate 3 and the surface of the image pickup device 1 can be made sufficiently wide, and the filter 2 can be provided with a margin. . Further, the two-stage projecting electrode has a function of mitigating impact due to its shape, and absorbs mechanical impact when connecting to the wiring 5 and does not damage the wiring or the image pickup device.
【００１７】本実施例の構造によれば、撮像素子１が、
ベース７の窓内中空に突出したリード８の内端において
接続されているので、封止樹脂４の硬化の際の応力をリ
ード８のフレキシビリティーによって吸収することがで
きる。According to the structure of this embodiment, the image pickup device 1 is
Since the lead 8 is connected to the inner end of the lead 8 that protrudes into the hollow of the window of the base 7, the flexibility of the lead 8 can absorb the stress when the sealing resin 4 is cured.
【００１８】撮像素子１の受光面にはフィルタ２が被着
されている。撮像素子１の裏面からその周囲にかけては
エポキシ樹脂またはシリコーン樹脂等の封止樹脂４で覆
われており、撮像素子１の受光面と透明板３との間の空
間は密閉され窒素ガスが封入されている。A filter 2 is attached to the light receiving surface of the image pickup device 1. The back surface of the image pickup device 1 and its periphery are covered with a sealing resin 4 such as epoxy resin or silicone resin, and the space between the light receiving surface of the image pickup device 1 and the transparent plate 3 is sealed and filled with nitrogen gas. ing.
【００１９】本実施例装置の望ましい製造方法として
は、まず、ベース７、リード８、接着剤９、透明板３に
よって構成される構体をあらかじめ用意しておき、その
構体を洗浄後、バンプ電極６とフィルタ２を設けた撮像
素子１をリード８の内端に接続する。その後、窒素ガス
雰囲気中で撮像素子１の裏面からその周囲にかけてをエ
ポキシ樹脂またはシリコーン樹脂等の封止樹脂４で覆
い、撮像素子１の受光面と透明板３との間の空間は密閉
すればよい。この製造方法によれば、撮像素子を接続し
た後の工程は封止工程のみとなるので、いわゆる拡散工
程完了後のリードタイムが短縮されるとともに、撮像素
子を接続した後で工程不良が発生することが少なく、撮
像素子を含む半製品を不良品として廃棄することが少な
くなり、不良発生による損害を最小限に抑えられる。ま
た、撮像素子１の表面がある空間は不活性ガスである窒
素ガスで満たされているので、酸化や吸湿による素子の
劣化が起こらない。さらに、単層セラミック製のベース
７を用いているので、多層セラミック製のベースを用い
ていた従来の構造に比べて安価な撮像装置を実現でき
る。As a desirable manufacturing method of the device of this embodiment, first, a structure composed of the base 7, the leads 8, the adhesive 9, and the transparent plate 3 is prepared in advance, and after cleaning the structure, the bump electrode 6 is formed. The image pickup device 1 provided with the filter 2 is connected to the inner end of the lead 8. Then, in the nitrogen gas atmosphere, the back surface of the image sensor 1 and its periphery are covered with a sealing resin 4 such as an epoxy resin or a silicone resin, and the space between the light receiving surface of the image sensor 1 and the transparent plate 3 is sealed. Good. According to this manufacturing method, the process after connecting the image pickup device is only the sealing process, so that the lead time after completion of the so-called diffusion process is shortened and a process defect occurs after connecting the image pickup device. It is less likely that a semi-finished product including an image sensor will be discarded as a defective product, and damage due to the occurrence of defects can be minimized. Further, since the space where the surface of the image pickup device 1 is present is filled with nitrogen gas which is an inert gas, deterioration of the device due to oxidation or moisture absorption does not occur. Furthermore, since the base 7 made of a single-layer ceramic is used, it is possible to realize an inexpensive imaging device as compared with the conventional structure using the base made of a multi-layer ceramic.
【００２０】図４は第３の発明の一実施例の撮像装置の
断面図である。同図において、１０はフレア防止層であ
る。単層セラミック製のベース７はその央部に窓を有
し、一方の面には複数のリード８が形成されている。リ
ード８はそれぞれその内端が前記ベース７の窓に突出し
ている。撮像素子１は、リード８のそれぞれの内端にバ
ンプ電極６によって電気的に接続され、その受光面を透
明板３に向けてベース７の窓内に固定されている。リー
ド８の内端とバンプ電極６との電気的接続は熱圧着によ
る一括接合によればよい。バンプ電極６はめっき法また
はスタッドバンプ法で撮像素子１の表面に形成しておく
か、あらかじめリード８の所定位置に転写しておけばよ
い。スタッドバンプ法で形成されたバンプ電極は、押し
つぶされたボールでなるベース部分と、このベース部分
から延びるワイヤーを折り返して形成した突起部とから
なる二段突起形状をしている。このような電極を用いれ
ば、従来の形状のバンプ電極よりも高さの大きい電極を
形成することができる。本実施例装置においてバンプ電
極６として二段突起電極を用いれば、透明板３と撮像素
子１の表面との間隔を充分広くとることができ、フィル
タ２を余裕を持って設けることが可能となる。また、二
段突起電極はその形状から衝撃を緩和する作用があり、
配線５に接続する際の機械的衝撃を吸収して配線や撮像
素子にダメージを与えない。リード８の他端はベース７
の外部にまで延長され、ベース７の側面に沿って下方に
曲げられ、外部リードとなっている。FIG. 4 is a sectional view of an image pickup apparatus according to an embodiment of the third invention. In the figure, 10 is a flare prevention layer. The base 7 made of single-layer ceramic has a window in its center, and a plurality of leads 8 are formed on one surface thereof. Each inner end of each lead 8 projects into the window of the base 7. The image pickup device 1 is electrically connected to the inner ends of the leads 8 by bump electrodes 6, and is fixed in the window of the base 7 with the light receiving surface thereof facing the transparent plate 3. Electrical connection between the inner ends of the leads 8 and the bump electrodes 6 may be performed by collective bonding by thermocompression bonding. The bump electrode 6 may be formed on the surface of the image pickup device 1 by a plating method or a stud bump method, or may be transferred to a predetermined position of the lead 8 in advance. The bump electrode formed by the stud bump method has a two-step protrusion shape including a base portion formed of a crushed ball and a protrusion portion formed by folding back a wire extending from the base portion. By using such an electrode, it is possible to form an electrode having a height higher than that of a bump electrode having a conventional shape. If a two-step projecting electrode is used as the bump electrode 6 in the apparatus of this embodiment, the gap between the transparent plate 3 and the surface of the image pickup device 1 can be made sufficiently wide, and the filter 2 can be provided with a margin. . In addition, the two-stage protruding electrode has a function of absorbing impact due to its shape,
The mechanical impact when connecting to the wiring 5 is absorbed and the wiring and the image pickup element are not damaged. The other end of the lead 8 is the base 7
To the outside and bent downward along the side surface of the base 7 to form an external lead.
【００２１】撮像素子１の受光面にはフィルタ２が被着
されている。撮像素子１の裏面からその周囲にかけては
エポキシ樹脂またはシリコーン樹脂等の封止樹脂４で覆
われており、撮像素子１の受光面と透明板３との間の空
間は密閉され、窒素ガスが封入されている。A filter 2 is attached to the light receiving surface of the image pickup device 1. The back surface of the image sensor 1 and its periphery are covered with a sealing resin 4 such as epoxy resin or silicone resin, the space between the light receiving surface of the image sensor 1 and the transparent plate 3 is sealed, and nitrogen gas is sealed. Has been done.
【００２２】本発明の基本的な構造は図３に示した例と
共通しているが、本発明の特徴としては、ベース７と透
明板３とを接着する接着剤９の一部が透明板３の接着面
において透明板３の中央に向かって延び、フレア防止層
１０を形成していることである。フレア防止層１０は、
撮像素子１の有効画素領域に垂直に入射する光を妨げな
い部分にのみ設けられている。接着剤９は黒色にしたエ
ポキシ樹脂等を用い、遮光性と吸光性を持たせればよ
い。このような構造にすることにより、フレア防止のた
めの部材を別に設ける必要がなくなり、コストダウンと
ともに、薄型で耐フレア性の優れた撮像装置が実現され
る。また、単層セラミック製のベース７を用いているの
で、多層セラミック製のベースを用いていた従来の構造
に比べて安価な撮像装置を実現できる。The basic structure of the present invention is common to the example shown in FIG. 3, but the feature of the present invention is that a part of the adhesive 9 for bonding the base 7 and the transparent plate 3 is a transparent plate. The flare prevention layer 10 is formed by extending toward the center of the transparent plate 3 on the adhesive surface of No. 3. The flare prevention layer 10 is
It is provided only in a portion that does not interfere with light that is vertically incident on the effective pixel area of the image sensor 1. The adhesive 9 may be made of blackened epoxy resin or the like, and may have a light blocking property and a light absorbing property. By adopting such a structure, it is not necessary to separately provide a member for preventing flare, the cost is reduced, and a thin imaging device excellent in flare resistance is realized. Further, since the base 7 made of a single-layer ceramic is used, an inexpensive imaging device can be realized as compared with the conventional structure using the base made of a multi-layer ceramic.
【００２３】また、本実施例の構造によれば、撮像素子
１が、ベース７の窓内中空に突出したリード８の内端に
おいて接続されているので、封止樹脂４の硬化の際の応
力をリード８のフレキシビリティーによって吸収するこ
とができる。Further, according to the structure of this embodiment, since the image pickup device 1 is connected at the inner end of the lead 8 protruding in the hollow of the window of the base 7, the stress at the time of curing the sealing resin 4 is increased. Can be absorbed by the flexibility of the lead 8.
【００２４】上記各実施例におけるスタッドバンプ法に
ついては、たとえば、特開昭６３−３０４５８７号公報
に詳しく示されている。The stud bump method in each of the above embodiments is described in detail, for example, in JP-A-63-304587.
【００２５】なお、以上の各実施例においては、板状体
として全体が透明なガラス板を用いたが、撮像素子の有
効画素領域に入射する光が通過する央部のみが透明材料
で形成された板状のものを用いてもよい。In each of the above embodiments, a glass plate which is entirely transparent is used as the plate-shaped body, but only the central portion through which the light incident on the effective pixel area of the image sensor passes is formed of a transparent material. You may use the plate-shaped thing.
【００２６】また、図３、図４に示した実施例において
は、リード８の導出部分をベース７の側面に沿って下方
に折り曲げて、いわゆるデュアルインライン型のリード
形状になっているが、このリード形状はフラットパッケ
ージ型の形状（ガルウィング型）にしてもよい。Further, in the embodiment shown in FIGS. 3 and 4, the lead-out portion of the lead 8 is bent downward along the side surface of the base 7 to form a so-called dual in-line type lead. The lead shape may be a flat package type (gull wing type).
【００２７】[0027]
【発明の効果】以上詳しく述べたように、本発明の撮像
装置およびその製造方法によれば、高価な多層構造のベ
ースが不要となり、コストダウンが図られるとともに、
ベースに撮像素子を収納する深さが不要となるので、撮
像装置の薄型化も実現される。また、撮像素子固定後の
工程が短く、リードタイムの短縮が図られるとともに、
不良発生時の廃棄による損害も最小限に抑えられる。As described above in detail, according to the image pickup device and the method of manufacturing the same of the present invention, an expensive multi-layered base is not required, and the cost can be reduced.
Since it is unnecessary to store the image pickup element in the base, the image pickup apparatus can be made thin. In addition, the process after fixing the image sensor is short and the lead time is shortened.
Damage caused by scrapping when a defect occurs can be minimized.
【図１】本発明実施例装置を示す断面図FIG. 1 is a sectional view showing an apparatus according to an embodiment of the present invention.
【図２】本発明実施例装置を示す平面図FIG. 2 is a plan view showing an apparatus according to an embodiment of the present invention.
【図３】本発明実施例装置を示す断面図FIG. 3 is a sectional view showing an apparatus according to an embodiment of the present invention.
【図４】本発明実施例装置を示す断面図FIG. 4 is a sectional view showing an apparatus according to an embodiment of the present invention.
【図５】従来例装置を示す断面図FIG. 5 is a sectional view showing a conventional device.
１ 撮像素子 ３ 透明板 ４ 封止樹脂 ５ 配線 ６ バンプ電極 1 Image sensor 3 transparent plate 4 Sealing resin 5 wiring 6 bump electrodes
Claims (6)
と、前記板状体の一つの面に形成された複数の導体パタ
ーンと、前記導体パターンのそれぞれの内端に電極が接
続され、前記板状体に受光面を向けて固定された撮像素
子と、前記板状体と前記撮像素子受光面との間の空間を
密閉する封止手段とを有する撮像装置。1. A plate-shaped body having a light-transmitting portion at least in the center, a plurality of conductor patterns formed on one surface of the plate-shaped body, and electrodes connected to inner ends of the conductor patterns, respectively. An image pickup device comprising: an image pickup device fixed to the plate-shaped body with a light-receiving surface facing the light-receiving surface; and a sealing unit that seals a space between the plate-shaped body and the light-receiving surface of the image pickup device.
表面に設けられそれぞれ、一端が前記窓内に延び、他端
が前記ベース外部に延びた複数の導体と、前記ベースに
接着された、少なくとも央部に透光部を有する板状体
と、前記導体の内端に電極が接続され、受光面を前記板
状体に向けて前記窓内に固定された撮像素子と、前記板
状体と前記撮像素子受光面との間の空間を密閉する封止
手段とを有する撮像装置。2. A base having a window at its center, and a plurality of conductors provided on the surface of the base, one end of which extends into the window and the other end of which extends outside the base, and which are bonded to the base. A plate-shaped body having a light-transmitting part at least in the center, an electrode connected to an inner end of the conductor, and an image sensor fixed in the window with a light-receiving surface facing the plate-shaped body; An image pickup device comprising: a sealing unit that seals a space between a body and a light receiving surface of the image pickup element.
部が前記板状体の中央部に向かって展在し、フレア防止
層となっている請求項２に記載の撮像装置。3. The image pickup device according to claim 2, wherein a part of an adhesive agent for adhering the base and the plate-shaped body is spread toward a central portion of the plate-shaped body to form a flare prevention layer.
と、前記板状体の一つの面に形成された複数の導体パタ
ーンとを有する構体を用意する工程と、撮像素子の電極
を前記導体パターンのそれぞれの内端に接続して前記撮
像素子を前記板状体に受光面を向けて固定する工程と、
前記板状体と前記撮像素子受光面との間の空間を密閉す
る封止工程とを有する撮像装置の製造方法。4. A step of preparing a structure having a plate-shaped body having a light-transmitting part in at least a central part and a plurality of conductor patterns formed on one surface of the plate-shaped body, and an electrode of an image pickup device. Connecting the respective inner ends of the conductor patterns and fixing the image pickup device to the plate-shaped body with its light-receiving surface facing;
A method of manufacturing an image pickup device, comprising: a sealing step of sealing a space between the plate-shaped body and the light receiving surface of the image pickup element.
の表面に設けられそれぞれ一端が前記窓内に延び、他端
が前記ベース周縁部ないし外部に延びる複数の導体と、
前記ベースに接着され少なくとも央部に透光部を有する
板状体とを有する構体を用意する工程と、撮像素子の電
極を前記導体の内端に接続し前記撮像素子をその受光面
を前記板状体に向けて前記窓内に固定する工程と、前記
撮像素子の受光面と前記板状体との間の空間を密閉する
封止工程とを有する撮像装置の製造方法。5. A base having a window in the center, and a plurality of conductors provided on the surface of the base, one end of each of which extends into the window and the other end of which extends to the base peripheral portion or the outside.
A step of preparing a structure having a plate-like body adhered to the base and having at least a light-transmitting part in a central part; and connecting an electrode of the image pickup device to an inner end of the conductor to make the light receiving surface of the image pickup device the plate. A method of manufacturing an image pickup device, comprising: a step of fixing the sheet-shaped body toward the window and a sealing step of sealing a space between the light-receiving surface of the image pickup element and the plate-shaped body.
請求項１、請求項２または請求項３に記載の撮像装置。6. The image pickup device according to claim 1, wherein the electrode of the image pickup element is a two-step projecting electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3287523A JP2769255B2 (en) | 1990-11-05 | 1991-11-01 | Imaging device and method of manufacturing the same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2-300849 | 1990-11-05 | ||
| JP30084990 | 1990-11-05 | ||
| JP3287523A JP2769255B2 (en) | 1990-11-05 | 1991-11-01 | Imaging device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH056989A true JPH056989A (en) | 1993-01-14 |
| JP2769255B2 JP2769255B2 (en) | 1998-06-25 |
Family
ID=26556759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3287523A Expired - Lifetime JP2769255B2 (en) | 1990-11-05 | 1991-11-01 | Imaging device and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2769255B2 (en) |
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| US5786589A (en) * | 1993-05-28 | 1998-07-28 | Kabushiki Kaisha Toshiba | Photoelectric converting device with anisotropically conductive film for connecting leads of wiring board and electrode pads of photoelectric converting device |
| JPH11274460A (en) * | 1998-03-23 | 1999-10-08 | Sharp Corp | Two-dimensional image detector |
| WO2000033022A2 (en) * | 1998-11-27 | 2000-06-08 | Dr. Johannes Heidenhain Gmbh | Optoelectronic component |
| US6399995B1 (en) * | 1996-01-17 | 2002-06-04 | Sony Corporation | Solid state image sensing device |
| JP2006128432A (en) * | 2004-10-29 | 2006-05-18 | Dainippon Printing Co Ltd | Sensor package and manufacturing method thereof |
| JP2007158184A (en) * | 2005-12-07 | 2007-06-21 | Fujifilm Corp | Solid photographing device |
| US7250664B2 (en) | 2002-04-18 | 2007-07-31 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device packaging structure and packaging method |
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| JP3955487B2 (en) | 2002-03-19 | 2007-08-08 | 松下電器産業株式会社 | Method for mounting integrated circuit element |
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|---|---|---|---|---|
| US5786589A (en) * | 1993-05-28 | 1998-07-28 | Kabushiki Kaisha Toshiba | Photoelectric converting device with anisotropically conductive film for connecting leads of wiring board and electrode pads of photoelectric converting device |
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| JP2002531936A (en) * | 1998-11-27 | 2002-09-24 | ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Optoelectronic structure unit |
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| JP2006128432A (en) * | 2004-10-29 | 2006-05-18 | Dainippon Printing Co Ltd | Sensor package and manufacturing method thereof |
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| JP2007158184A (en) * | 2005-12-07 | 2007-06-21 | Fujifilm Corp | Solid photographing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2769255B2 (en) | 1998-06-25 |
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