JPH0187562U - - Google Patents
Info
- Publication number
- JPH0187562U JPH0187562U JP1987184574U JP18457487U JPH0187562U JP H0187562 U JPH0187562 U JP H0187562U JP 1987184574 U JP1987184574 U JP 1987184574U JP 18457487 U JP18457487 U JP 18457487U JP H0187562 U JPH0187562 U JP H0187562U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- imaging device
- light
- connection part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003566 sealing material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
第１図は本考案による一実施例の側面図、第２
図は同実施例の分解図、第３図は同実施例におけ
る導体パターンの一例を示す図、第４図は従来の
固体撮像装置のパツケージ構造を示す図である。
１１：固体撮像素子、１２：突起電極、１３：
透明基板、１４：導体パターン、１６：カラーフ
イルタ、１７：封止樹脂。
Figure 1 is a side view of one embodiment of the present invention;
The figure is an exploded view of the same embodiment, FIG. 3 is a diagram showing an example of a conductor pattern in the same embodiment, and FIG. 4 is a diagram showing the package structure of a conventional solid-state imaging device. 11: solid-state imaging device, 12: protruding electrode, 13:
Transparent substrate, 14: conductor pattern, 16: color filter, 17: sealing resin.
Claims (1)
出力電極部に突起電極を形成してなる固体撮像素
子と、 透光性基板と、 上記固体撮像素子の突起電極と対向する位置に
接続部が形成され、該接続部から外周部に延びる
他方の先端に外部接続部が形成された上記透光性
基板上の導体パターンと、 上記固体撮像素子背面を被つて固体撮像素子を
透光性基板に固定する封止材とを備えてなること
を特徴とする固体撮像装置。[Scope of Claim for Utility Model Registration] A solid-state imaging device in which a light-receiving element and a charge transfer device are formed, and protruding electrodes are formed in input/output electrode portions, a light-transmitting substrate, and protruding electrodes of the solid-state imaging device. A conductive pattern on the light-transmitting substrate, in which a connection part is formed at opposing positions, and an external connection part is formed at the other end extending from the connection part to the outer periphery; A solid-state imaging device comprising: a sealing material for fixing an element to a translucent substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184574U JPH0187562U (en) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184574U JPH0187562U (en) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187562U true JPH0187562U (en) | 1989-06-09 |
Family
ID=31475925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987184574U Pending JPH0187562U (en) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187562U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH056989A (en) * | 1990-11-05 | 1993-01-14 | Matsushita Electron Corp | Solid-state image sensing device and manufacture thereof |
| US10236312B2 (en) | 2015-02-16 | 2019-03-19 | Sony Corporation | Camera module and electronic apparatus to lower risk of breakage of camera module |
-
1987
- 1987-12-02 JP JP1987184574U patent/JPH0187562U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH056989A (en) * | 1990-11-05 | 1993-01-14 | Matsushita Electron Corp | Solid-state image sensing device and manufacture thereof |
| US10236312B2 (en) | 2015-02-16 | 2019-03-19 | Sony Corporation | Camera module and electronic apparatus to lower risk of breakage of camera module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0187562U (en) | ||
| JPH01137554U (en) | ||
| JPH032661U (en) | ||
| JPS61156239U (en) | ||
| JPS6339955U (en) | ||
| JPH0244355U (en) | ||
| JPS628672U (en) | ||
| JPS61111160U (en) | ||
| JPS6340074U (en) | ||
| JPH0356101U (en) | ||
| JPS62166653U (en) | ||
| JPS61203537U (en) | ||
| JPH0163155U (en) | ||
| JPH0432070U (en) | ||
| JPH0327123U (en) | ||
| JPH0270347U (en) | ||
| JPS60160665U (en) | Image sensor structure | |
| JPH0428436U (en) | ||
| JPS6176978U (en) | ||
| JPS61173126U (en) | ||
| JPS61158941U (en) | ||
| JPH0312452U (en) | ||
| JPS60121755A (en) | Semiconductor device | |
| JPS638781U (en) | ||
| JPS61134005U (en) |