JPS6340074U - - Google Patents
Info
- Publication number
- JPS6340074U JPS6340074U JP13358086U JP13358086U JPS6340074U JP S6340074 U JPS6340074 U JP S6340074U JP 13358086 U JP13358086 U JP 13358086U JP 13358086 U JP13358086 U JP 13358086U JP S6340074 U JPS6340074 U JP S6340074U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- circuit pattern
- transparent substrate
- protection device
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図はこの考案の一実施例によるイメージセ
ンサの保護装置を示す斜視図、第２図はハンダバ
ンプと回路パターンの接続を示す横断面図、第３
図はイメージセンサの斜視図、第４図は従来のイ
メージセンサの保護装置を示す斜視図である。
１はイメージセンサ本体、２は受光センサ列、
８は不透明のモールド樹脂体、９はハンダバンプ
、１０は透明基板、１１は回路パターン。なお、
図中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a perspective view showing an image sensor protection device according to an embodiment of the invention, FIG. 2 is a cross-sectional view showing the connection between a solder bump and a circuit pattern, and FIG.
This figure is a perspective view of an image sensor, and FIG. 4 is a perspective view showing a conventional image sensor protection device. 1 is the image sensor body, 2 is the light receiving sensor array,
8 is an opaque molded resin body, 9 is a solder bump, 10 is a transparent substrate, and 11 is a circuit pattern. In addition,
In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
サ列の形成面を除いて不透明のモールド樹脂体に
封止したイメージセンサと、表面に回路パターン
を形成した透明基板とを有し、前記ハンダバンプ
と前記回路パターンとが接続するように前記イメ
ージセンサと前記透明基板とを重ね合せて一体化
したイメージセンサの保護装置。 The image sensor has an image sensor sealed in a molded resin body that is opaque except for the surface on which the solder bumps and the light receiving sensor array are formed, and a transparent substrate on which a circuit pattern is formed, and the solder bump and the circuit pattern are formed on the same surface. An image sensor protection device in which the image sensor and the transparent substrate are stacked and integrated so that they are connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13358086U JPS6340074U (en) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13358086U JPS6340074U (en) | 1986-08-29 | 1986-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6340074U true JPS6340074U (en) | 1988-03-15 |
Family
ID=31034021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13358086U Pending JPS6340074U (en) | 1986-08-29 | 1986-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6340074U (en) |
-
1986
- 1986-08-29 JP JP13358086U patent/JPS6340074U/ja active Pending