CN101295723A - Thin image sensing chip encapsulation - Google Patents
Thin image sensing chip encapsulation Download PDFInfo
- Publication number
- CN101295723A CN101295723A CNA2007100975961A CN200710097596A CN101295723A CN 101295723 A CN101295723 A CN 101295723A CN A2007100975961 A CNA2007100975961 A CN A2007100975961A CN 200710097596 A CN200710097596 A CN 200710097596A CN 101295723 A CN101295723 A CN 101295723A
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- China
- Prior art keywords
- chip
- film
- image sensing
- conductive
- encapsulation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention relates to a thin image sensing chip package which is provided with an image sensing chip and a flexible euphotic thin film enclosing the chip. The chip has an acting face which is provided with a centrally positioned sensing region and a plurality of conductive contacts formed around the periphery of the sensing region. The flexible euphotic thin film has a euphotic region and a plurality of conductive pins which are arranged on a surface of the thin film and positioned around the periphery of the euphotic region. The thin film encloses the chip in such a manner that a sealing area is formed between the thin film and the chip. In the sealing area, the euphotic region of the thin film corresponds to the sensing region of the chip and spaces a predefined distance, and one end of each conductive pin of the thin film is electrically connected with each electrical contact of the chip. In addition, the other end of each conductive pin of the thin film is exposed outside and used for electrical connection with other external components.
Description
Technical field
The present invention is relevant with the encapsulation of image sensing chip, particularly about a kind of thin image sensing chip encapsulation.
Background technology
Known image sensing chip encapsulation, as shown in Figure 1, usually has a hard substrate 1, one sensor chip 2 places the upper surface of substrate 1, the contact on the sensor chip 2 and the contact of this substrate surface form with lead 3 and electrically connect, the periphery of chip 2 is by a flange 4 bed hedgehoppings, so that can cover a glass plate 6 apart from the mode of chip 2 sensing areas 5 one predetermined spaces.The maximum shortcoming of this kind encapsulation is that the thickness of overall package is too big.
In order to improve the shortcoming of aforementioned existing image sensing chip encapsulation, No. 92104751 application for a patent for invention case of TaiWan, China disclosed a kind of image sensing chip encapsulation of improvement, as shown in Figure 2, this encapsulation is to dig to establish a window on substrate 7, image sensing chip 8 is arranged on the surface of substrate 7 mode that should window with its sensing area, and glass plate 9 is to be placed in this window and directly to be bonded on this chip.Though the thickness of glass plate has been save in this kind encapsulation, the thickness of substrate still exists, and therefore the thickness that is reduced is limited.Moreover this kind encapsulation must be dug on substrate and be established window, not only increases manufacturing cost, and the structure of substrate is damaged, for example its evenness.In addition, glass plate be inserted in the set window of substrate complicated accurate course of processing especially, the meaning that it produced is the manufacturing cost height.
Base this, a kind of compact and be that the image sensing chip encapsulation of low manufacturing cost extremely needs.
Summary of the invention
That is, main purpose of the present invention promptly is that a kind of image sensing chip encapsulation of improvement is being provided, and it not only can effectively reduce the thickness of overall package, and volume also can be relative reduces.
Another object of the present invention then is that a kind of image sensing chip encapsulation of improvement is being provided, and it is not only compact but also can reduce manufacturing cost in large quantities.
Be the purpose of taking off before reaching, a kind of thin image sensing chip encapsulation provided by the present invention is characterized in that, includes:
One image sensing chip, this chip has an acting surface, and this acting surface has a sensing area and most conductive junction point that is formed at this sensing area periphery;
One pliability light transmission film, this film has a transparent area, and majority is arranged in the conductive pin that this transparent area periphery was gone up and was positioned on this film one surface; And
But this film is the mode with the two formation one sealing area coats this chip, in the sealing zone, the transparent area of this film is to sensing area that should chip and at a distance of a predetermined space, one end of each conductive pin of this film is that each conductive junction point with this chip forms and electrically connects, the other end is to be exposed to the outside, uses with other external module to electrically connect.
Wherein the sealing zone is to arrange that in this film and this chip chamber a sealant layer forms the sealing zone.
Wherein the sealing glue-line is to be an anisotropic conductive adhesive layer.
Wherein the electrical contact of this chip is a metal protuberance.
Wherein this anisotropic conductive adhesive layer is to be arranged on respectively this conductive junction point of this chip and between two adjacent conductive junction points in the mode around the sealing zone.
Wherein this anisotropic conductive adhesive layer is to be arranged between an end and adjacent two conductive pins of each conductive pin of this film in the mode around the sealing zone.
The invention provides a kind of thin image sensing chip encapsulation, it is characterized in that, include:
One image sensing chip, this chip has an acting surface, and this acting surface has a sensing area and most conductive junction point that is formed at this sensing area periphery;
One coats the pliability light transmission film of this chip, and this film has a transparent area, and majority is arranged in the conductive pin that this transparent area periphery was gone up and was positioned on this film one surface;
The transparent area of this film is to sensing area that should chip and at a distance of a predetermined space, and an end of each conductive pin is respectively to each conductive junction point that should chip, and the other end is to be exposed to the outside, use and other external module electrically connects, and
One anisotropic conductive adhesive layer is arranged between each conductive junction point of the end of each conductive pin of this film and this chip, with so that the two forms electrically connects, and forms one between this film and this chip and center on the sealing area of this chip sensing area.
Wherein this anisotropic conductive adhesive layer is to be arranged on respectively this conductive junction point of this chip and between two adjacent conductive junction points in the mode around this sensing area.
Wherein this anisotropic conductive adhesive layer is to be arranged between an end and adjacent two conductive pins of each conductive pin of this film in the mode around this transparent area.
By as can be known aforementioned, image sensing chip encapsulation provided by the present invention is that existing substrate and glass plate are integrated, more and the conductive pin of the conductive junction point of utilized chip or light transmission film replace the known flange that is used for the bed hedgehopping glass plate, therefore the thickness and the volume of overall package can reduce naturally significantly, in a preferred embodiment of the present invention, its thickness almost can existing person reduce half.Moreover image sensing chip encapsulation provided by the present invention only has two necessary assemblies, and therefore nature can fall ground significantly on manufacturing cost.
Description of drawings
The present invention is described further for following conjunction with figs. and embodiment, wherein:
Fig. 1 is the cutaway view of known image sensing chip encapsulation;
Fig. 2 is the cutaway view of another known image sensing chip encapsulation;
Fig. 3 is the stereogram of a preferred embodiment of the present invention;
Fig. 4 is the stereogram of image sensing chip embodiment illustrated in fig. 3;
Fig. 5 is a view of pliability light transmission film embodiment illustrated in fig. 3;
Fig. 6 is a part combination stereogram embodiment illustrated in fig. 3;
Fig. 7 is along the cutaway view on the 7-7 direction among Fig. 3;
Fig. 8 is along the cutaway view on the 8-8 direction among Fig. 3;
Fig. 9 is the cutaway view on another preferred embodiment of the present invention and Fig. 7 equidirectional; And
Figure 10 is the present invention's cutaway view on a preferred embodiment and Fig. 7 equidirectional again.
Embodiment
At first please cooperate and consult Fig. 3 to Fig. 8, a kind of image sensing chip encapsulation according to technical spirit that the present invention takes off is implemented shown in figure number 10, has an image sensing chip 12, and the pliability light transmission film 14 of a coating chip 12.
The acting surface of image sensing chip 12 has an image sensing district 16 and is surrounded on sensing area 16 multi-conducting contact 18 on every side.These contacts 18 can be the metal protuberance made from gold, copper, aluminium or its alloy or are recessed into, and are the modes of adopting projection in present embodiment.
Pliability light transmission film 14 is with made tool high light transmittances of organic material such as PE, PVC or PC, the pliability film of high-fire resistance, it has a central transparent area 20, and the flanging 22 that around transparent area 20, extends outward respectively, be respectively equipped with most conductive pins 24 on the surface of each flanging 22.
Image sensing chip encapsulation 10 must be in forming a sealing area 30 after pliability light transmission film 14 coats image sensing chips 12 between the two, central transparent area 20 is corresponding sensing area 16 and a predetermined space apart this sealing area 30 in.In addition, each conductive junction point 18 of chip 12 also must form with the medial extremity of each electrical pin 24 of film 14 and electrically connect.Be the aforesaid structure of construction, present embodiment is taken one deck anisotropic conductive film (ACF:AnisotropicConductive Film) laminating and is invested around the chip 12 image sensing districts 16, when attaching, simultaneously each conductive junction point 18 on it is covered together and cover, and then also pressurized, heated a period of time is solidified this anisotropic conductive film layer to coat pliability light transmission film 14.Because anisotropic conductive film has the characteristic of vertical conducting, lateral isolation and gummed, therefore, after it solidifies, each conductive junction point 18 of chip 12 can and the medial extremity of each conductive pin 24 of film 14 form and electrically connect, and form a sealant layer 32 and come construction sealing area 30.Certainly, also can be according to actual conditions, irritate again in sealing area 30 and to fill out suitable viscose glue, in order to improve tightness.
Again, after pliability light transmission film 14 coats image sensing chip 12, be that an end of its each flanging 22 is outwards bent in order to expose the outer end of each conductive pin 24, electrically connect for forming with other assembly.
See also Fig. 9 again, each conductive junction point 18 that another embodiment of the present invention also can make chip 12 directly contact to form with the medial extremity of each conductive pin 24 of film 14 and electrically connects, and then fills out an insulated enclosure glue-line 40 in chip 12 image sensing districts 16 filling all around and form sealing area 30.
In addition, see also Figure 10, the image sensing chip encapsulation of yet another embodiment of the invention, shown in figure number 40, it is to be laid in its outer surface that itself and image sensing chip encapsulate each conductive pin 44 that 10 differences are pliability light transmission film 42, in addition each conductive junction point 48 of these film 42 corresponding chips 46 to locate be the conductive salient point 52 of laying a through hole 50 respectively and being positioned at this through hole 50, each conductive salient point 52 be respectively with an end of each conductive pin 44 overlap joint, thus, behind pliability light transmission film 42 coating chips 46, each conductive salient point 52 of film 42 can form with each conductive junction point 48 of chip 44 and electrically connect, and each flanging of film 42 then is inside turnover.
Claims (9)
1. a thin image sensing chip encapsulation is characterized in that, includes:
One image sensing chip, this chip has an acting surface, and this acting surface has a sensing area and most conductive junction point that is formed at this sensing area periphery;
One pliability light transmission film, this film has a transparent area, and majority is arranged in the conductive pin that this transparent area periphery was gone up and was positioned on this film one surface; And
But this film is the mode with the two formation one sealing area coats this chip, in the sealing zone, the transparent area of this film is to sensing area that should chip and at a distance of a predetermined space, one end of each conductive pin of this film is that each conductive junction point with this chip forms and electrically connects, the other end is to be exposed to the outside, uses with other external module to electrically connect.
2. thin image sensing chip encapsulation as claimed in claim 1 is characterized in that, wherein the sealing zone is to arrange that in this film and this chip chamber a sealant layer forms the sealing zone.
3. thin image sensing chip encapsulation as claimed in claim 2 is characterized in that wherein the sealing glue-line is to be an anisotropic conductive adhesive layer.
4. thin image sensing chip encapsulation as claimed in claim 1 is characterized in that wherein the electrical contact of this chip is a metal protuberance.
5. thin image sensing chip as claimed in claim 3 encapsulation is characterized in that, wherein this anisotropic conductive adhesive layer is to be arranged on respectively this conductive junction point of this chip and between two adjacent conductive junction points in the mode around the sealing zone.
6. thin image sensing chip as claimed in claim 3 encapsulation is characterized in that, wherein this anisotropic conductive adhesive layer is to be arranged between an end and adjacent two conductive pins of each conductive pin of this film in the mode around the sealing zone.
7. a thin image sensing chip encapsulation is characterized in that, includes:
One image sensing chip, this chip has an acting surface, and this acting surface has a sensing area and most conductive junction point that is formed at this sensing area periphery;
One coats the pliability light transmission film of this chip, and this film has a transparent area, and majority is arranged in the conductive pin that this transparent area periphery was gone up and was positioned on this film one surface;
The transparent area of this film is to sensing area that should chip and at a distance of a predetermined space, and an end of each conductive pin is respectively to each conductive junction point that should chip, and the other end is to be exposed to the outside, use and other external module electrically connects, and
One anisotropic conductive adhesive layer is arranged between each conductive junction point of the end of each conductive pin of this film and this chip, with so that the two forms electrically connects, and forms one between this film and this chip and center on the sealing area of this chip sensing area.
8. thin image sensing chip as claimed in claim 7 encapsulation is characterized in that, wherein this anisotropic conductive adhesive layer is to be arranged on respectively this conductive junction point of this chip and between two adjacent conductive junction points in the mode around this sensing area.
9. thin image sensing chip as claimed in claim 7 encapsulation is characterized in that, wherein this anisotropic conductive adhesive layer is to be arranged between an end and adjacent two conductive pins of each conductive pin of this film in the mode around this transparent area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100975961A CN101295723A (en) | 2007-04-27 | 2007-04-27 | Thin image sensing chip encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100975961A CN101295723A (en) | 2007-04-27 | 2007-04-27 | Thin image sensing chip encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101295723A true CN101295723A (en) | 2008-10-29 |
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ID=40065865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100975961A Pending CN101295723A (en) | 2007-04-27 | 2007-04-27 | Thin image sensing chip encapsulation |
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| Country | Link |
|---|---|
| CN (1) | CN101295723A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560138A (en) * | 2013-11-19 | 2014-02-05 | 苏州晶方半导体科技股份有限公司 | Image sensor packaging structure and packaging method thereof |
| CN105810654A (en) * | 2014-12-30 | 2016-07-27 | 展讯通信（上海）有限公司 | Lead frame type packaging body |
| CN106132086A (en) * | 2016-07-08 | 2016-11-16 | 广东小天才科技有限公司 | Circuit board structure and electronic element welding method |
| CN106653790A (en) * | 2017-02-20 | 2017-05-10 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of iris recognition imaging module |
| CN107170769A (en) * | 2017-07-06 | 2017-09-15 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and its method for packing of image sensing chip |
| CN112951864A (en) * | 2021-04-29 | 2021-06-11 | 中国科学院长春光学精密机械与物理研究所 | Narrow-edge flexible packaging structure of image sensor for splicing and packaging method thereof |
| CN113823645A (en) * | 2020-06-18 | 2021-12-21 | 胜丽国际股份有限公司 | Sensor package structure |
-
2007
- 2007-04-27 CN CNA2007100975961A patent/CN101295723A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103560138A (en) * | 2013-11-19 | 2014-02-05 | 苏州晶方半导体科技股份有限公司 | Image sensor packaging structure and packaging method thereof |
| CN103560138B (en) * | 2013-11-19 | 2016-01-20 | 苏州晶方半导体科技股份有限公司 | Image sensor package and method for packing thereof |
| CN105810654A (en) * | 2014-12-30 | 2016-07-27 | 展讯通信（上海）有限公司 | Lead frame type packaging body |
| CN106132086A (en) * | 2016-07-08 | 2016-11-16 | 广东小天才科技有限公司 | Circuit board structure and electronic element welding method |
| CN106653790A (en) * | 2017-02-20 | 2017-05-10 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of iris recognition imaging module |
| CN106653790B (en) * | 2017-02-20 | 2024-03-12 | 苏州晶方半导体科技股份有限公司 | Iris recognition imaging module packaging structure and packaging method thereof |
| CN107170769A (en) * | 2017-07-06 | 2017-09-15 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and its method for packing of image sensing chip |
| CN107170769B (en) * | 2017-07-06 | 2023-09-08 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of image sensing chip |
| CN113823645A (en) * | 2020-06-18 | 2021-12-21 | 胜丽国际股份有限公司 | Sensor package structure |
| CN112951864A (en) * | 2021-04-29 | 2021-06-11 | 中国科学院长春光学精密机械与物理研究所 | Narrow-edge flexible packaging structure of image sensor for splicing and packaging method thereof |
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Open date: 20081029 |