CN103886299B - A kind of encapsulating structure of capacitive fingerprint sensing device - Google Patents
A kind of encapsulating structure of capacitive fingerprint sensing device Download PDFInfo
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- CN103886299B CN103886299B CN201410117837.4A CN201410117837A CN103886299B CN 103886299 B CN103886299 B CN 103886299B CN 201410117837 A CN201410117837 A CN 201410117837A CN 103886299 B CN103886299 B CN 103886299B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
A kind of encapsulating structure of semicoductor capacitor formula fingerprint sensor, including semiconductor transducer tube core, the groove base plate being made of insulating material, connecting wire, connector and note seal structure；The bottom of substrate recess is for carrying and by the fixed sensor die of adhesive, its front, the back side or side, which have multilayer interconnection lead and be electrically connected on the contact through hole and its fluting face between multilayer interconnection lead, is printed with one or more conductive metal edge strip；Connecting wire is used to connect the pin of sensor die and the connection pad in substrate fluting face；Connector is for the electrical connection between groove base plate and printed circuit board；Metal edge strip is connected by the interconnecting line for being formed in substrate front side or the back side and in its each layer with one or more ground pins of connector, and one or more ground pins of connector and the ground level of printed circuit board are electrical connected；Tube core pin, substrate conducting metal edge strip and connecting wire are packaged by infusing seal structure.
Description
Technical field
The present invention relates to integrated antenna package technical fields, pass more specifically to a kind of semicoductor capacitor formula fingerprint
The encapsulating structure of sensor.
Background technique
In recent years, with the development of fingerprint identification technology, fingerprint recognition system is increasingly used in daily life,
Such as fingerprint identification entrance guard system, fingerprint gate lock and fingerprint safe cabinet etc., especially to personal device (such as notebook electricity
Brain, smart phone, personal digital assistant (Personal Digital Assistant, abbreviation PDA) equipment, refers to tablet computer
Line USBKey) etc. the identity purpose of identifiers application become very common.
Fingerprint sensor presses sensing principle (fingerprint imaging principle and technology), can be divided into optical fingerprint sensor, partly lead
Body capacitance sensor, semiconductor heat dependent sensor, semiconductor pressure sensor, ultrasonic sensor and radio frequency (Radio
Frequency, abbreviation RF) sensor etc.；Strip fingerprint sensor and planar fingerprint sensor can be divided into again by face shaping.
Capacitive fingerprint sensing device based on semiconductor technology includes the tube core of silicon material, and front is formed with sensor and adopts
Collect cell array, driving circuit and reading circuit.About 100000 condenser types are integrated in sensor array of acquisition units
Sensor (outer layer insulation), sensor array of acquisition units every bit are a metal electrodes, are equivalent to the anode of capacitor, finger
When being placed on above the anode, the skin of finger becomes another pole of capacitor, and the sensitive face between them forms Jie of two interpolars
Electric layer.
Capacitance changes with ridge (close) and paddy (far) relative to the distance of sensor array of acquisition units.The mankind's
Fingerprint is made of close adjacent concave convex texture, by that can detect to canonical reference discharge current is applied on each pixel
To the lines situation of fingerprint.
Each pixel is pre-charged to a certain reference voltage, then, is discharged by reference current.Voltage changes on capacitor anode
Variability is with capacitor thereon at following proportionate relationship:
Ref=C × dv/dt
Pixel (capacitance is high) electric discharge under protrusion in fingerprint is slower, and the pixel (electricity under the recess in fingerprint
Capacity is low) electric discharge is comparatively fast.This different discharge rate can pass through sampling hold circuit (S/H) detect and be converted into one 8 it is defeated
Out, this detection method is to fingerprint protrusion and indentation sensibility with higher, and can form extraordinary original fingerprint image.
After encapsulation, sensor cell array is exposed, for user's finger contacts；Or covering protection material connects with finger thereon
Touching, to protect the sensor from physics and environmental damage, abrasion etc..
Semiconductor element usually has the sensor acquisition unit formed on the surface thereof by photoetching (or other modes)
Array.Sensor die is usually fairly small, and contact pad is also corresponding small, thus supplementary structure must be used to realize tube core
With the encapsulation of component, with realize and printed circuit board (PCB) between electrical connection.Such supplementary structure includes lead frame
With chip carrier etc..
In common semiconductor packaging technology, tube core is attached to lead frame, realizes tube core by tiny connecting wire
Small size pad and large scale lead frame between interconnection.In general, tube core, lead frame and connecting wire are wrapped in encapsulating
In material, it is put into mold by the tube core and lead frame that have been connected to conducting wire, injects encapsulating material simultaneously into mold
Make encapsulating material harden and realize.
It is damaged caused by sensor to solve electrostatic breakdown, a kind of preparation method that industry generallys use is in silicon material
The non-fingerprint collecting area of die surfaces is made the metal conducting layer of a very thin golden material of craft of gilding, then by through silicon via
The metal layer that tube core is shown is connected on the static drainage welding pad of tube core, which is soldered to printed circuit board again
On system earth end.When electrostatic of the finger on sensor, finger passes through the metal of sensor surface through above-mentioned conductive path
Diameter is released to systematically.
However, the biggest problem of the preparation method is craft of gilding, because introducing the semiconductor work of metallic element gold and standard
Skill is incompatible, can produce that manufacturability is very poor, and yield is very low, and production cost is very high.
It discloses in the United States Patent (USP) US8378508B2 of Robert Henry Bond et al. for fingerprint sensor etc.
Integrally molded tube core and panel structure, wherein be formed with the tube core and at least one conduction edge of sensor array of acquisition units
Item is installed on substrate.Tube core and panel are coated in integrated encapsulating structure, to protect these elements not by mechanical, electricity and environment
Damage, and sensor array of acquisition units and a part of panel are then exposed, or are covered by protective coating material.This preparation
Method needs to make the conductive bezel of a supplementary structure, and the conductive bezel of production not only increases additional cost, is also difficult to sealing
It fills and carries out machine assembly in technique, need that manually conductive bezel is pasted on printed circuit board substrate, considerably increase encapsulation
Difficulty.
Summary of the invention
In order to solve the above-mentioned technical problem, it is an object of that present invention to provide one kind to have low cost, packaging technology simple, easy
Large-scale production, semicoductor capacitor formula fingerprint sensor with anti-static function encapsulating structure.
To achieve the above object, technical scheme is as follows:
A kind of encapsulating structure of semicoductor capacitor formula fingerprint sensor, the sensor are that planar sensor or strip sense
Device comprising semiconductor transducer tube core, the groove base plate being made of insulating material, connecting wire, connector and note sealed knot
Structure；The semiconductor transducer tube core for acquire fingerprint and have image storage unit, image reading circuit unit, pin with
And sensor pixel array；The bottom of the substrate recess is used to carry and fixes the sensor die by adhesive,
Front, the back side or side have multilayer interconnection lead and the contact through hole being electrically connected between multilayer interconnection lead and its open
One or more conductive metal edge strip is printed on groove face；The connecting wire be used for connect the sensor die pin and
The connection pad in substrate fluting face；The connector is for the electrical connection between groove base plate and printed circuit board；Wherein,
The metal edge strip is by being formed in substrate front side or the back side and interconnecting line in its each layer and the connector
One or more ground pins are connected, and one or more ground pins of the connector and the ground level of printed circuit board are electrical
It is connected；The sensor die pin, substrate conducting metal edge strip and connecting wire are packaged by infusing seal structure, the note
Together with closure material fills up the gap of substrate recess surrounding so that substrate is fitted closely with tube core.
Preferably, the sensor pixel array face is parallel with the fluting face of the groove base plate.
Preferably, the sensor die is made of one or more layers silicon-based semiconductor；The sensor tube wicking surface
It is covered with one layer of protective coating；The protective coating material is inorganic material or organic polymer material.
Preferably, the inorganic material is that silicon nitride, silicon carbide, alumina silicate, barium titanate, strontium titanates, oxidation are smooth or without fixed
Shape diamond；The organic polymer material is polyimides or polytetrafluoroethylene (PTFE).
Preferably, the back side of the groove base plate is arranged in the connector, is used for the substrate and printed circuit
It is electrically connected between plate.
Preferably, the material of the groove base plate is resin, plastics or ceramics；The material of the note seal structure is epoxy
The insulating materials such as resin or plastics；The note seal structure be by injecting glue technology, casting process or integrated circuit molding technology it
One forms.
Preferably, the connecting wire is made of the metal material aluminium or gold of tens micron diameters；Pass through the connection
Conducting wire by the pin of the relatively narrow side of die front side be electrically connected to the substrate front side wherein one or both sides fluting face connection
Pad.
Preferably, the substrate is rectangle, for carrying planar sensor die；The rectangular substrate groove length and width
Size is greater than the length and width dimensions of planar sensor die, and groove depth is higher than the height of planar sensor die, and by described
Connecting wire by the pin of the relatively narrow side of die front side be electrically connected to substrate front side wherein two sides fluting face connection pad.
Preferably, the substrate is strip, for carrying strip sensor die；The strip substrate recess length and width dimensions
Greater than the length and width dimensions of strip sensor tube core, the depth of fluting is higher than the height of strip sensor tube core, and passes through the company
Connect conducting wire by the pin of the relatively narrow two sides of die front side be electrically connected to substrate front side wherein two sides fluting face connection pad.
Preferably, the connector is terminal pad grid array or ball grid array, the connection being made of the metal edge strip
Pad passes through the interconnecting line and terminal pad grid array or ball bar battle array that are formed in substrate front side or the back side and in its each layer
One or more ground pins of column are connected, the terminal pad grid array or ball grid array for substrate and printed circuit board it
Between electrical connection, the ground of the one or more ground pins and printed circuit board of the terminal pad grid array or ball grid array
Plane is connected.
It can be seen from the above technical proposal that the encapsulating structure of semicoductor capacitor formula fingerprint sensor provided by the invention,
It is golden by using being embedded in the substrate of semicoductor capacitor formula fingerprint sensor tube core and being printed on the one or more on substrate
Belong to the structure in edge strip component, not only have that low cost, packaging technology be simple, easy large-scale production, while also having antistatic
Function.
Detailed description of the invention
Fig. 1 show the structural representation of the encapsulating structure first embodiment of semicoductor capacitor formula fingerprint sensor of the present invention
Figure, wherein include planar fingerprint sensor component in the encapsulating structure；
The structure partial that Fig. 2 show the encapsulating structure first embodiment of semicoductor capacitor formula fingerprint sensor of the present invention cuts open
View；
Fig. 3 show the structure normal cross-section of the encapsulating structure first embodiment of semicoductor capacitor formula fingerprint sensor of the present invention
Schematic diagram；
Fig. 4 show the structure side section of the encapsulating structure first embodiment of semicoductor capacitor formula fingerprint sensor of the present invention
Schematic diagram；
Fig. 5 show the structural representation of the encapsulating structure second embodiment of semicoductor capacitor formula fingerprint sensor of the present invention
Figure, wherein include strip fingerprint sensing device assembly in the encapsulating structure；
Fig. 6 show the structure normal cross-section of the encapsulating structure first embodiment of semicoductor capacitor formula fingerprint sensor of the present invention
Schematic diagram
Fig. 7 show the back side signal with grid array terminal pad of second embodiment of the invention strip sensor component
Figure
Fig. 8 show the schematic rear view with ball grid array of second embodiment of the invention strip sensor component
Fig. 9 show the side schematic view with ball grid array of second embodiment of the invention strip sensor component
[symbol description in figure]
100, planar sensor module
101, rectangular substrate
The groove of 101a, rectangular substrate
102, semiconductor planar sensor die
102a, the positive sensor pixel array of semiconductor planar sensor die
102b, semiconductor planar sensor die front side pin
103, the metal edge strip being printed on rectangular substrate
104, be printed on rectangular substrate wherein side fluting face connection pad
105, connector
200, strip sensor component
201, strip-like-shaped substrate
The groove of 201a, strip-like-shaped substrate
202, semiconductor strip sensor die
202a, the positive sensor pixel array of semiconductor strip sensor die
202b, semiconductor strip sensor die front two sides pin
203, the metal edge strip being printed on strip-like-shaped substrate
204, it is printed on the connection pad in strip-like-shaped substrate front side two sides fluting face
205, terminal pad grid array
206, ball grid array
300, finger
301, connecting wire
302, seal structure is infused
303, protective coating
Specific embodiment
Exemplary embodiment is described in detail in conjunction with the accompanying drawings, These characteristics of the invention and advantage will become brighter
It is aobvious, in the accompanying drawings, is adopted between each attached drawing and similar element is designated with like reference numerals.The attached drawing is demonstration
Rather than it is drawn to scale.
It should be noted that the encapsulating structure of semicoductor capacitor formula fingerprint sensor of the present invention, by by semi-conductor electricity
Appearance formula fingerprint sensor tube core is embedded in the groove of groove base plate, and one or more metal edges by being printed on substrate
Sensor die and external connector electrical connection are finally encapsulated integral sensor die product structure by bar assembly.This hair
Bright sensor-packaging structure can be adapted for encapsulating capacitive fingerprint sensing device planar sensor or capacitive fingerprint sensing device
Strip sensor.With reference to the accompanying drawing 1 to 4, to the first embodiment of capacitive fingerprint sensing device planar sensor of the present invention
It is described in further detail, in conjunction with attached drawing 5 to 9, implements to the second of capacitive fingerprint sensing device strip sensor of the present invention
Mode is described in further detail.
[embodiment one]
Referring to FIG. 1 to FIG. 4, wherein, Fig. 1 show the encapsulating structure of semicoductor capacitor formula fingerprint sensor of the present invention
The structural schematic diagram of one embodiment, wherein include planar fingerprint sensor component 100 in the encapsulating structure.As shown, planar
Sensor module 100 includes mainly rectangular substrate 101 and planar sensor die 102, and the front of the groove base plate 101 is opened
The length and width dimensions of fluted 101a, groove 101a are slightly larger than planar sensor die 102, and the groove depth of groove 101a is slightly higher
In the height of planar sensor die 102.In the present embodiment, which can be embedded into base for sensor die 102
102 fixed area of planar sensor die of the bottom plate groove 101a, and make the front of planar sensor die 102 in horizontal plane
The fluting face of upper slightly below substrate 101.Rectangular substrate 101 can be using resin known in the field, plastics or ceramics etc.
Insulating materials is made, and can have from front, the back side or side will be in the interconnecting line (not shown) in its each layer.
Planar sensor die 102 is usually to have the silicon-based semiconductor for being formed in one or more layers, in these layers may be used
Laid respectively including integrated circuit device such as such as transistor, capacitor, resistance and interconnection lines, which usually can be with
It is formed by photoetching or other semiconductor fabrication process.
Specifically, there is planar sensor die 102 image storage unit (not shown) formed thereon, image to read
The two-dimensional array 102a of sense circuit (not shown) and sensor pixel.It is recessed by the back side and substrate of planar sensor die 102
Adhesive between the bottom of slot 101a, planar sensor die 102 can be physically connected to substrate recess 101a.Planar sensing
The front of device tube core 102 is usually rectangle, and connecting wire 301 can be by the 102 relatively narrow side in front of planar sensor die
Pin (PAD) 102b is electrically connected to the connection pad 104 in the front of substrate 101 wherein side fluting face, and connecting wire 301 can be with
Using metal materials such as the aluminium of tens micron diameters or gold.
The fluting face of substrate 101 is printed with one or more metal edge strip 103, these metal edge strips 103 are using conduction
The metal materials such as copper, aluminium or gold are made.Metal edge strip 103 is by being formed in 101 front of substrate or the back side and being likely to be in
Interconnecting line (not shown) in its each layer is connected with one or more ground pins of the connector 105 at 101 back side of substrate (to be schemed
Do not show).
Connector 105 is for the electrical connection between substrate 101 and printed circuit board, the one or more of connector 105
Ground pin is connected with the ground level of printed circuit board, and ESD electrostatic leakage access is consequently formed.For example, when finger 300 presses
When 102 positive two-dimensional array 102a of planar sensor die, because planar sensor die 102 is omited in the horizontal plane
Lower than the fluting face of substrate 101, finger 300 can contact one or more conductive metal of the fluting face printing of substrate 101 first
Edge strip 103, the electrostatic carried can be released to ground by above-mentioned ESD electrostatic leakage access, effectively avoid electrostatic to silicon material
Sensor die 102 causes serious harm.
The pin 102b of the relatively narrow side in the front of planar sensor die 102 and 101 front of substrate wherein side fluting face
Connection pad 104 and connecting wire 301 are all wrapped in note seal structure 302, keep the front of planar sensor die 102 (outstanding
It is the part sensor pixel array 102a) it exposes.
Planar sensor is covered with one layer of protective coating 303 on the front of tube core 102, which can
To use inorganic material coating；For example, silicon nitride, silicon carbide, alumina silicate or amorphous diamond, can make to connect with finger in this way
The surface of touching greatly enhances wearability, particularly with abrasive grains.
Certainly, 303 material of protective coating can also use other organic polymer materials, for example, polyimides
(Polyimide (KaptonTM)) or polytetrafluoroethylene (PTFE) (PTFF (TeflonTM)), can make the surface contacted with finger in this way
With the good characteristics such as good hydrophobicity, corrosion-resistant, acid and alkali-resistance, wear-resisting.
The material for forming note seal structure 302 can be the insulating materials such as epoxy resin or plastics known in the field.Note
Envelope can be realized by injecting glue or casting process, and one of various integrated circuit molding technologies known in the art can also be used and carry out shape
At note seal structure 302.Note seal structure 302 wrap the pin 102b of tube core 102, substrate 101 connection pad 104, connection lead
Line 301, and the gap for making note closure material fill up substrate recess 101a surrounding makes substrate 101 and planar sensor die 102 tight
It is closely connected to be combined.Note seal structure 302 can protect 104 and of pad of the pin 102b of planar sensor die 102, substrate 101
Connecting wire 301 is not by mechanical, electricity and environmental damage.
The back side of substrate 101 is equipped with connector 105, for will be electrically connected between substrate 101 and printed circuit board,
The back side interconnection of the other component mounting assembly of a part as resulting device construction, so that sensor module 100 be allowed to exist
Electrical interconnection in another electric system.The one or more for being completely embedded in and being printed on substrate based on substrate thereby is achieved
The planar sensor module 100 for fingerprint collecting of metal edge strip structure and sensor die.
[embodiment two]
It please join Fig. 5 to Fig. 9, wherein Fig. 5 show the encapsulating structure second of semicoductor capacitor formula fingerprint sensor of the present invention
The structural schematic diagram of embodiment, wherein include strip fingerprint sensing device assembly 200 in the encapsulating structure.Strip fingerprint sensor
Component 200 mainly includes the groove type strip substrate 201 and strip sensor tube core 202, has and is formed in its front or the back side
And the interconnecting line (picture does not show) being likely to be in its each layer, the front of the groove type strip substrate 201 is provided with groove
201a, groove 201a length and width dimensions are slightly larger than strip sensor tube core 202, and the groove depth of groove 201a is slightly above tube core
202 height.In the present embodiment, strip sensor tube core 202 is embedded into the strip sensor pipe of the bottom substrate recess 201a
202 fixed area of core, and make the positive fluting face for being slightly below substrate 201 in the horizontal plane of strip sensor tube core 202.Strip
Substrate 201 can be made of insulating materials such as resin known in the field, plastics or ceramics, can be from front, the back side
Or the interconnecting line being in its each layer (is drawn and is not shown) by side.
Strip sensor tube core 202 is usually to have the silicon-based semiconductor for being formed in one or more layers, in these layers may be used
Laid respectively including integrated circuit device such as such as transistor, capacitor, resistance and interconnection lines, which usually can be with
It is formed by photoetching or other semiconductor fabrication process.
Specifically, there is strip sensor tube core 202 image storage unit (not shown) formed thereon, image to read
The two-dimensional array 202a of sense circuit (not shown) and sensor pixel.Pass through the back side of tube core 202 and the bottom of substrate recess 201a
Adhesive between portion, tube core 202 are physically connected to substrate recess 201a.Connecting wire 301 can be relatively narrow by 202 front of tube core
The pin 202b of two sides is electrically connected to the connection pad 204 in the positive wherein two sides fluting of substrate 201 face, and connecting wire 301 is adopted
With metal materials such as the aluminium of tens micron diameters or gold.
The fluting face of substrate 201 is printed with one or more metal edge strip 203, these metal edge strips 203 are using conduction
The metal materials such as copper, aluminium or gold are made.Metal edge strip 203 is by being formed in 201 front of substrate or the back side and being likely to be in
Interconnecting line (not shown) and 201 Runners type two sides of substrate in its each layer are evenly distributed with terminal pad grid array 205
Or the connected (not shown) of one or more ground pins of ball grid array 206, terminal pad grid array 205 or ball grid array 206
For the electrical connection between substrate 201 and printed circuit board, one of terminal pad grid array 205 or ball grid array 206 or
Multiple ground pins are connected with the ground level of printed circuit board, and ESD electrostatic leakage access is consequently formed.
For example, when finger 300 slips over 202 positive two-dimensional array 202a of strip sensor tube core, because of pipe
Core 202 is slightly below the fluting face of substrate 201 in the horizontal plane, and finger 300 can contact the one of the fluting face printing of substrate 201 first
Item or a plurality of conductive metal edge strip 203, the electrostatic carried can be released to ground by above-mentioned ESD electrostatic leakage access, effectively kept away
Exempt from electrostatic to cause serious harm to the sensor die 202 of silicon material.
The pin 202b of the 202 relatively narrow two sides in front of tube core and the connection pad 204 in the positive wherein two sides fluting of substrate 201 face
And connecting wire 301 is all wrapped in note seal structure 302, makes front (the especially sensor pixel array of tube core 202
202a) expose.
Strip sensor is covered with one layer of protective coating 303 on the front of tube core 202, and 303 material of protective coating can be with
Use inorganic coating；For example, silicon nitride, silicon carbide, alumina silicate or amorphous diamond, can make the surface contacted with finger in this way
Wearability is greatly enhanced, particularly with abrasive grains.
Certainly, 303 material of protective coating can also use other organic polymer materials, for example, polyimides
(Polyimide (KaptonTM)) or polytetrafluoroethylene (PTFE) (PTFF (TeflonTM)), can make the surface contacted with finger in this way
With the good characteristics such as good hydrophobicity, corrosion-resistant, acid and alkali-resistance, wear-resisting.
The material for forming note seal structure 302 can be the insulating materials such as epoxy resin or plastics known in the field.Note
Envelope can be realized by injecting glue or casting process, and one of various integrated circuit molding technologies known in the art can also be used and carry out shape
At note seal structure 302.Note seal structure 302 wrap the pin 202b of tube core 202, substrate 201 connection pad 204, connection lead
Line 301, and the gap for making note closure material fill up substrate recess 201a surrounding makes substrate 201 and tube core 202 be fitted tightly over one
It rises.Note seal structure 302 can protect the pin 202b of tube core 202, the pad 204 of substrate 201 and connecting wire 301 not by it is mechanical,
Electricity and environmental damage.
The Runners type two sides of substrate 201 are evenly distributed with terminal pad grid array 205 or ball grid array 206, are used for
It will be electrically connected between substrate 201 and printed circuit board, the other component installation of a part as resulting device construction
The back side of component interconnects, to allow electrical interconnection of the sensor module 200 in another electric system.Complete base thereby is achieved
In the one or more metal edge strip structures and sensor die that substrate is embedded in and is printed on substrate for fingerprint collecting
Strip sensor component 200.
Above-described to be merely a preferred embodiment of the present invention, the patent that the embodiment is not intended to limit the invention is protected
Range is protected, therefore all with the variation of equivalent structure made by specification and accompanying drawing content of the invention, similarly should be included in
In protection scope of the present invention.
Claims (10)
1. a kind of encapsulating structure of semicoductor capacitor formula fingerprint sensor, the sensor is that planar sensor or strip sense
Device characterized by comprising
Semiconductor transducer tube core, for acquire fingerprint and have image storage unit, image reading circuit unit, pin and
Sensor pixel array；
The groove base plate being made of insulating material, the bottom of groove is for carrying and by the fixed sensor of adhesive
Tube core, front, the back side or side have multilayer interconnection lead and are electrically connected the contact through hole of interconnecting line between multilayer, with
And its one or more conductive metal edge strip is printed on fluting face；
Connecting wire, for connecting the pin of the sensor die and the connection pad in substrate fluting face；
Connector, for the electrical connection between groove base plate and printed circuit board；
Wherein, the metal edge strip is by being formed in substrate front side or the back side and interconnecting line in its each layer and described
One or more ground pins of connector are connected, one or more ground pins of the connector and the ground of printed circuit board
Plane is electrical connected；The sensor die pin, substrate conducting metal edge strip and connecting wire are sealed by infusing seal structure
Dress, together with the note seal structure fills up the gap of substrate recess surrounding so that substrate fits closely with tube core.
2. the encapsulating structure of semicoductor capacitor formula fingerprint sensor according to claim 1, which is characterized in that the sensor
The plane of pixel array is parallel with the fluting face of the groove base plate.
3. the encapsulating structure of semicoductor capacitor formula fingerprint sensor according to claim 1, which is characterized in that the sensing
Device tube core is made of one or more layers silicon-based semiconductor；The sensor tube wicking surface is covered with one layer of protective coating；It is described
Protective coating material is inorganic material or organic polymer material.
4. the encapsulating structure of semicoductor capacitor formula fingerprint sensor according to claim 3, which is characterized in that described inorganic
Material is silicon nitride, silicon carbide, alumina silicate, barium titanate, strontium titanates, aoxidizes smooth or amorphous diamond；The organic polymer
Material is polyimides or polytetrafluoroethylene (PTFE).
5. the encapsulating structure of semicoductor capacitor formula fingerprint sensor according to claim 1, which is characterized in that described to patch
The back side of the groove base plate is arranged in part, for will be electrically connected between the substrate and printed circuit board.
6. the encapsulating structure of semicoductor capacitor formula fingerprint sensor according to claim 1, which is characterized in that the groove
The material of formula substrate is resin, plastics or ceramics；The material of the note seal structure is epoxy resin or plastic insulation material；It is described
Note seal structure is formed by one of injecting glue technology, casting process or integrated circuit molding technology.
7. the encapsulating structure of semicoductor capacitor formula fingerprint sensor according to claim 1, which is characterized in that the connection
Conducting wire is made of the metal material aluminium or gold of tens micron diameters；By the connecting wire by the relatively narrow side of die front side
Pin be electrically connected to the substrate front side wherein one or both sides fluting face connection pad.
8. the encapsulating structure of -7 any one of semicoductor capacitor formula fingerprint sensors according to claim 1, which is characterized in that
The substrate is rectangle, for carrying planar sensor die；The rectangular substrate groove length and width dimensions are passed greater than planar
The length and width dimensions of sensor tube core, groove depth are higher than the height of planar sensor die, and by the connecting wire by tube core
The pin of the relatively narrow side in front is electrically connected to the connection pad in substrate front side wherein two sides fluting face.
9. the encapsulating structure of -7 any one of semicoductor capacitor formula fingerprint sensors, feature exist according to claim 1
In the substrate is strip, for carrying strip sensor die；The strip substrate recess length and width dimensions are sensed greater than strip
The length and width dimensions of device tube core, the depth of fluting are higher than the height of strip sensor tube core, and by the connecting wire by tube core
The pin of the relatively narrow side in front is electrically connected to the connection pad in substrate front side wherein two sides fluting face.
10. the encapsulating structure of semicoductor capacitor formula fingerprint sensor according to claim 9, which is characterized in that described to connect
Plug-in unit is terminal pad grid array or ball grid array, and the connection pad being made of the metal edge strip is by being formed in substrate front side
Or one or more ground pins of the back side and interconnecting line and terminal pad grid array or ball grid array in its each layer
It is connected, the terminal pad grid array or ball grid array are for the electrical connection between substrate and printed circuit board, the connection
One or more ground pins of disk grid array or ball grid array are connected with the ground level of printed circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410117837.4A CN103886299B (en) | 2014-03-27 | 2014-03-27 | A kind of encapsulating structure of capacitive fingerprint sensing device |
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|---|---|---|---|
| CN201410117837.4A CN103886299B (en) | 2014-03-27 | 2014-03-27 | A kind of encapsulating structure of capacitive fingerprint sensing device |
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| CN103886299B true CN103886299B (en) | 2019-04-05 |
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|---|---|---|---|---|
| CN104051366B (en) | 2014-07-01 | 2017-06-20 | 苏州晶方半导体科技股份有限公司 | Fingerprint recognition chip-packaging structure and method for packing |
| CN104050465B (en) * | 2014-07-02 | 2018-02-09 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor and electronic installation |
| CN104036264B (en) * | 2014-07-02 | 2018-07-31 | 南昌欧菲生物识别技术有限公司 | Manufacture method, fingerprint Identification sensor and the electronic device of fingerprint Identification sensor |
| CN104091154B (en) * | 2014-07-02 | 2018-10-02 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor, integrated package and terminal device |
| CN104077572B (en) * | 2014-07-02 | 2018-07-31 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection components and terminal device |
| CN104063693B (en) * | 2014-07-02 | 2018-01-30 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection components and the terminal device for including it |
| CN104050485B (en) * | 2014-07-02 | 2018-10-02 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor, fingerprint recognition detection components and terminal device |
| CN104036263A (en) * | 2014-07-02 | 2014-09-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection device, terminal device and fingerprint recognition method |
| CN104050464B (en) * | 2014-07-02 | 2018-05-08 | 南昌欧菲生物识别技术有限公司 | Manufacture method, fingerprint Identification sensor and the electronic device of fingerprint Identification sensor |
| CN104036265B (en) * | 2014-07-02 | 2018-12-21 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor and electronic device |
| CN104050466B (en) * | 2014-07-02 | 2019-03-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor, integrated package and electronic device |
| CN104156714B (en) * | 2014-08-26 | 2018-10-02 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor and electronic device |
| CN104239893A (en) * | 2014-08-26 | 2014-12-24 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification detecting component and terminal device with fingerprint identification detecting function |
| CN104217220A (en) * | 2014-08-27 | 2014-12-17 | 深圳贝特莱电子科技有限公司 | Embedded semiconductor fingerprint sensor |
| CN105405771B (en) * | 2014-09-11 | 2018-11-27 | 旭景科技股份有限公司 | Chip is in the method on printed circuit board |
| CN105742253B (en) * | 2014-12-10 | 2018-08-07 | 旭景科技股份有限公司 | The printed circuit board assembly of image sensor is installed |
| CN104615981B (en) * | 2015-01-27 | 2018-05-22 | 华进半导体封装先导技术研发中心有限公司 | A kind of fingerprint recognition modular structure and preparation method thereof |
| CN104615980B (en) * | 2015-01-27 | 2018-11-23 | 华进半导体封装先导技术研发中心有限公司 | A kind of fingerprint identification device and preparation method thereof |
| CN104657715A (en) * | 2015-02-10 | 2015-05-27 | 柳州市金旭节能科技有限公司 | Fingerprint detector |
| CN105990269B (en) * | 2015-03-06 | 2019-03-05 | 吴勇军 | A kind of fingerprint recognition chip-packaging structure and its packaging method |
| SE1551288A1 (en) * | 2015-06-08 | 2016-12-09 | Fingerprint Cards Ab | Fingerprint sensing device with interposer structure |
| CN106470527B (en) * | 2015-08-21 | 2018-12-14 | 旭景科技股份有限公司 | It is used to form the printed circuit board arrangement of enhanced identification of fingerprint module |
| CN105224927A (en) * | 2015-10-09 | 2016-01-06 | 广东欧珀移动通信有限公司 | Electronic equipment, mobile device, fingerprint recognition sensing apparatus and manufacture method |
| WO2017070863A1 (en) * | 2015-10-28 | 2017-05-04 | Shanghai Oxi Technology Co., Ltd | Fingerprint imaging system and method for forming the same |
| CN105676953B (en) * | 2015-12-25 | 2020-03-20 | 上海菲戈恩微电子科技有限公司 | Mobile terminal with fingerprint sensor packaging structure and preparation method thereof |
| CN105631421B (en) * | 2015-12-25 | 2020-03-20 | 上海菲戈恩微电子科技有限公司 | Mobile terminal with fingerprint sensor packaging structure |
| CN106068516B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Bio-sensing chip and electronic equipment |
| US20180102330A1 (en) * | 2016-10-12 | 2018-04-12 | Sunasic Technologies, Inc. | Sensing chip package having esd protection and method making the same |
| CN106816432A (en) * | 2016-12-22 | 2017-06-09 | 创智能科技股份有限公司 | Encapsulating structure with antistatic structure |
| CN106972007A (en) * | 2016-12-23 | 2017-07-21 | 创智能科技股份有限公司 | Fingerprint sensing device for identifying with antistatic structure |
| CN106657478B (en) * | 2017-01-20 | 2020-03-03 | Oppo广东移动通信有限公司 | Fingerprint identification module and mobile terminal |
| CN106803079B (en) * | 2017-01-20 | 2020-08-21 | Oppo广东移动通信有限公司 | Fingerprint module and mobile terminal |
| CN106980835B (en) * | 2017-03-24 | 2018-08-17 | 维沃移动通信有限公司 | A kind of fingerprint identification device and electronic equipment |
| CN109144311B (en) * | 2018-07-26 | 2022-06-07 | 京东方科技集团股份有限公司 | Display substrate, fingerprint identification method and touch display device |
| CN111816643A (en) * | 2020-07-10 | 2020-10-23 | 山东砚鼎电子科技有限公司 | Touch sensor |
| KR20220032181A (en) * | 2020-09-07 | 2022-03-15 | 엘지이노텍 주식회사 | Circuit board and fingerprint recognition smart card including the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100372116C (en) * | 2004-09-22 | 2008-02-27 | 日月光半导体制造股份有限公司 | Packaging structure of contact type sensor and its manufacturing method |
| TWI325618B (en) * | 2007-01-02 | 2010-06-01 | Chipmos Technologies Inc | Film type package for fingerprint sensor |
| US8378508B2 (en) * | 2010-03-05 | 2013-02-19 | Authentec, Inc. | Integrally molded die and bezel structure for fingerprint sensors and the like |
| JP5977739B2 (en) * | 2010-06-18 | 2016-08-24 | アップル インコーポレイテッド | Finger sensor having sealing layer on sensing area and associated method |
| GB2489100A (en) * | 2011-03-16 | 2012-09-19 | Validity Sensors Inc | Wafer-level packaging for a fingerprint sensor |
| CN203799391U (en) * | 2014-03-27 | 2014-08-27 | 成都费恩格尔微电子技术有限公司 | Packaging structure of capacitive fingerprint sensor |
-
2014
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