CN108712814A - Lamp source circuit board, lamp source and lamp source circuit board production method - Google Patents
Lamp source circuit board, lamp source and lamp source circuit board production method Download PDFInfo
- Publication number
- CN108712814A CN108712814A CN201810550407.XA CN201810550407A CN108712814A CN 108712814 A CN108712814 A CN 108712814A CN 201810550407 A CN201810550407 A CN 201810550407A CN 108712814 A CN108712814 A CN 108712814A
- Authority
- CN
- China
- Prior art keywords
- location structure
- lamp source
- circuit board
- welding disking
- ink layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention puies forward a kind of lamp source circuit board production method, including, in several regularly arranged welding disking areas for symmetrical structure defined in the positive line pattern of base material, wherein welding disking area around there are one anode and with the spaced cathode of the anode；Location structure is preset in setting between at least partly welding disking area, and default location structure is located at the centre position between two adjacent welding disking areas of same row；Ink layer is formed on the front for be formed with line pattern；Location structure is formed on ink layer according to the position of preset location structure；According to the position relationship at the center of location structure and four points of the welding disking area, welding disking area is determined in the position of the ink layer and etching, to form the pad for including the anode and cathode that expose ink layer.
Description
Technical field
The present invention relates to lighting technical field, more particularly to a kind of lamp source circuit board manufacturing method and lamp source circuit board.
Background technology
Application for light emitting diode, mini-LED (secondary millimeter light emitting diode) are the hot spot of existing market exploitation,
It has ultra-thin, light emission luminance is high, energy saving, ultimate attainment narrow frame, high dynamic contrast can be done small size panel etc. it is many
Advantage.But in the technique for preparing mini-LED, due to the factors such as characteristic of the difference and circuit board plate material of machining accuracy
It influences, the anode of pad and the size identical property of cathode are more difficult to control in wiring board, if the positive and negative anodes of pad on wiring board
Cause not of uniform size can make that array arrangement is irregular after the connection of LED pins, influence whole light efficiency.
Invention content
The purpose of the present invention is to provide a kind of lamp source circuit board and production methods.
The present invention puies forward a kind of lamp source circuit board production method, the method includes,
Several regularly arranged welding disking areas for symmetrical structure, wherein institute defined in the positive line pattern of base material
State in welding disking area around there are one anode and with the spaced cathode of the anode；
Location structure is preset in setting between at least partly welding disking area, presets two phases of location structure position same row
Centre position between adjacent welding disking area, and meet relationship：With the weldering in four points on the welding disking area contour line
The distance at center of the symmetrical each two point of line of symmetry of disk area to the location structure is identical, and two points and described fixed
The line at the center of bit architecture is identical as the angle of the line of symmetry；
Ink layer is formed on the front for be formed with line pattern；
Location structure is formed on ink layer according to the position of the preset location structure；
According to the position relationship at the center of location structure and four points of the welding disking area, determine welding disking area described
Welding disking area on the position of ink layer and etching ink layer, to form the pad for including the anode and cathode that expose ink layer.
Wherein, the welding disking area profile is rectangle, circle or ellipse, and is rectangle in the welding disking area profile
When, four points are four vertex of rectangle.
Wherein, the coordinate according to the location structure further includes in the step of forming location structure on ink layer
Ink layer to being formed with location structure carries out hot setting processing.
Wherein, the default location structure in centre position between every group of two welding disking areas in same row
Step specifically includes the size of welding disking area as needed, determines the seat of the centre coordinate and four points of the location structure
Mark and position relationship, and prestored into etching machines.
Wherein, the location structure is formed by coining mode or etching mode.
Wherein, the method includes forming metal layer, and positive metal described in technology in the front and back of base material
Layer and the metal layer at the back side are with the step of front and back forms line pattern.
The present invention provides a kind of lamp source circuit board, including base material, the routing layer on the base material and covering at least portion
Divide the ink layer of routing layer, the windowing of several arrays arrangements is formed on the ink layer, there are one the interior tools of each windowing
Pad, is equipped with location structure at least partly between pad, the location structure is located between two adjacent pads of same row.
Wherein, include multigroup spaced pad group in the pad of same row, each pad group includes two adjacent
Pad, and set that there are one location structures in the same row between same group of two pads.
Wherein, the centre position between the location structure is located in same row per two groups of adjacent pads.
Wherein, it is located in the pad group of same row, the centre position between each two adjacent pad group is additionally provided with described
Location structure.
Wherein, the section of the location structure is arc-shaped.
The present invention provides a kind of lamp source comprising several lamp source chips and the lamp source circuit board, several lamp sources
Chip is arranged in arrays on the circuit board, and two pins of each chip are welded with the positive and cathode in a pad respectively
It connects.
Lamp source circuit board of the present invention processes pad, in base by the way of location structure is arranged on ink layer
Material or ink layer occur in the case of harmomegathus, it is ensured that locating element structure is to the consistency of the positioning of pad locations, Jin Erbao
The regularity for demonstrate,proving pad and the light emitting diode being welded on pad avoids the reflecting effect for influencing ink layer, ensure that lamp source
Luminance.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is lamp source circuit board production method flow chart of steps provided in an embodiment of the present invention.
Fig. 2 is the simple of the structure that the part steps of lamp source circuit board production method provided in an embodiment of the present invention are formed
Figure.
Fig. 3 is the relational graph of a location structure and welding disking area shown in Fig. 2.
Fig. 4 is the side schematic view of the lamp source circuit board of the present invention.
Fig. 5 is the floor map of volume lamp source circuit board of the present invention.
Fig. 6 is that each two pad group also is provided with location structure floor map in lamp source circuit board described in Fig. 5.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of lamp source circuit board production method, the method includes, it please refers to Fig.1 and Fig. 2, step S1,
Several regularly arranged welding disking areas 17 for symmetrical structure defined in the line pattern in the front 111 of base material 11.Wherein institute
State in welding disking area 17 around there are one anode 181 and with the 181 spaced cathode 182 of anode.In this step, described
Method further includes, and metal layer is formed in the front 111 of base material 11 and the back side 112, and the metal layer in front 111 described in technology and
The metal layer at the back side 112 is with the step of front 111 and the back side 112 form line pattern, the line pattern is exactly routing layer.
Specifically, described positive 181 and cathode 182 with the line of symmetry H of the welding disking area 17 be symmetrical arranged.
Location structure 19 is preset in step S2, the setting between at least partly welding disking area, and it is same to preset location structure 19
Centre position between two adjacent welding disking areas 17 of one row.The specific coordinate and shape of location structure are namely set,
And location structure meets with welding disking area position relationship：With the pad area in four points on 17 contour line of the welding disking area
The distance at line of symmetry H symmetrical each two point to 16 center of location structure in domain is identical, and two points and the location structure
The line at 16 centers is identical as the angle of line of symmetry H.Actually the center of the location structure 16 is also in described right
Claim on line H.
Referring to Fig. 3,17 profile of the welding disking area is rectangle, circle or ellipse.The location structure 16 is recessed
It is arc-shaped recess portion set on the section of the ink layer 14.In the present embodiment, the welding disking area 17 be rectangle for carry out
Illustrate, four points are four vertex A1, A2, A3, A4 of rectangle.The line of center O to the A1 and A2 of the location structure
Length is identical, and O to A3, the wire length of A4 are identical, while angular relationship meets α 1=α 2, α 3=α 4.Actually vertex A1
Symmetrical with the line of symmetry with vertex A2, vertex A3 is symmetrical with line of symmetry with vertex A4.
In this step, the size for specifically including welding disking area 17 as needed, determines the position of the location structure 16
It sets, the coordinate and position relationship at the location structure center and four points, and is prestored into etching machines.Specifically
, the position at 16 center of the location structure, that is, the coordinate of coordinate value and described four vertex A1, A2, A3, A4 are remembered
The wire length of center O to the A1 and A2 of record and the location structure are identical, and O to A3, the wire length of A4 are identical, simultaneously
Angular relationship meets α 1=α 2, and the relationship of α 3=α 4 is pre-stored in etching machines, to make when etching ink layer forms pad
For the data of etched path.
Step S3 forms ink layer 14 on the front 111 for be formed with line pattern.Ink layer 14 can lead in this step
It crosses coating method and forms and cover the line pattern, to protect and insulated circuit, the ink layer 14 is white ink.
Step S4 forms location structure 16 according to the position of the preset location structure 16 on ink layer 14.It is described
Location structure 16 is formed by coining mode or etching mode.In the present embodiment, the location structure 16 is recess portion, concave surface
It is arc-shaped, that is, section is in arc-shaped, after loading secondary millimeter light emitting diode on each pad 18, is located at two and shines
The concave surface of location structure 16 between diode can be used as reflecting surface to carry out reflection light, to improve luminance.
Specifically in step 2, the position of preset location structure 16 is prestored, it is fixed being formed by etching mode
When bit architecture 16, etched path is processed according to preset data.When coining mode is formed, directly according to predeterminated position data
It is imprinted.In this step, further include the steps that carrying out hot setting processing to being formed with the ink layer 14 of location structure 16.
It should be noted that even if expanding the breathing with plank in high temperature cure process, since location structure 16 is set at
On ink layer 14, the deformation of all location structures 16 is consistent with ink layer 14, with location structure on ink layer 14
16 pairs of pads position, even if expanding, it is also ensured that the consistency of the size of all pads, then also ensuring that
The pad 18 of array arrangement still keeps regular arrangement, to ensure the highly consistent of tin cream in subsequent brush process of tin, keeps away
The arrangement of the reflecting effect for exempting from influence ink layer, the light emitting diode welded with pad 18 is also regular, would not influence to send out
Light effect.
Referring to Fig. 5, step S5, is closed according to the center of location structure 16 and the position of four points of the welding disking area 17
System, determines welding disking area 17 of the welding disking area 17 on the position of the ink layer 14 and etching ink layer 14, includes to be formed
Expose the pad 18 of the anode 181 and cathode 182 of ink layer 14.Particularly the ink layer of welding disking area is etched away to be formed out
Window exposes the pad for including the anode and cathode.Can be understood as the pad 18 be anode 181 and cathode 182 with
And around the part of anode 181 and cathode 182.The position at the center of the location structure 16 and four points of the welding disking area 17
The relationship of setting is in four points on 17 contour line of welding disking area described in previous step 2 with the line of symmetry H symmetrical every two
The distance at a point to 16 center of location structure is identical, and the line at 16 center of two points and the location structure with it is described symmetrical
The angle of line H is identical.In etching process, it is processed according to four vertex region that line surrounds successively.
In lamp source circuit board production method of the present invention, using the positioning for presetting welding disking area and pad locations
Structure simultaneously stores data, and pad is processed on ink layer according to preset data, and harmomegathus situation occurs in base material or ink layer
Under, it is also ensured that locating element structure ensures pad size identical property to the consistency of the determination of pad locations, also just protects
The regularity and illumination effect for being welded in the light emitting diode on pad are demonstrate,proved.
Fig. 4 and Fig. 5 are please referred to, the present invention provides a kind of lamp source circuit boards, are made up of the above method.Specifically, institute
Stating lamp source circuit board, it includes that base material 11, the routing layer 12 set on the base material 11 positive 111 and the back side 112 and covering are described just
The ink layer 14 of the routing layer 12 in face 111 is formed with the windowing (figure is not marked) of several arrays arrangements on the ink layer 14, each
There are one pads 18 for tool in the windowing, and location structure 16 is equipped at least partly between pad 18, and the location structure 16 is located at
Between two adjacent pads 18 of same row.The location structure can be according to the common position that deforms of lamp source circuit board
It is configured, that is, the location structure is arranged according to actual conditions selection region, entirely lamp source circuit board can also all set
The location structure is set, such as including multigroup spaced welding disking area in same row, every group includes two adjacent
Welding disking area, set that there are one location structures between two adjacent welding disking areas.
Include multigroup spaced pad group with the pad in same row in the present embodiment, each pad group includes
Two adjacent pads, and set that there are one said for location structure in the same row between same group of two pads
It is bright.Set in each described pad 18 there are one described positive 181 and with the 181 spaced cathode 182 of anode；Same
Include multigroup spaced pad 18 on row, pad group Z can be referred to as, every group of pad group Z includes two adjacent
Pad 18, and set that there are one location structure 16, the location structures 16 in the same row between same group of two pads 18
Centre position between described two adjacent pads 18.The section of the location structure 16 is arc-shaped location structure
16.Anode 181 and cathode 182 in the preferred pad 18 is symmetrical with the line of symmetry of the pad 18.Specifically, it is described just
Pole 181 and the setting of the interval of cathode 182, and it is located at line of symmetry H opposite sides.The center of the location structure 16 of same row is located at the row
The line of symmetry H on.The lamp source circuit board be mainly used for include LED lamp source, for being electrically connected time millimeter light-emitting diodes
Pipe.The base material 11 is plate body comprising two outer surfaces are respectively described positive 111 and the back side 112.The routing layer 12 is
It is formed by the line pattern of metal, mainly by being laid with metal layer, technology metal layer obtains.There is number in the line pattern
It is arranged to the anode and cathode used as pad, and in array.The ink layer 14 is white ink layer, has centainly anti-
Light effect.The location structure 16 be circular recess, for when making pad 18 for capture pad area and
Setting；The concave surface 161 of the location structure 16 is arc-shaped simultaneously, that is, section is in arc-shaped, is filled when on each pad 18
After carrying time millimeter light emitting diode, the concave surface of the location structure 16 between two light emitting diodes can also serve as reflecting
The reflection to light, and the stronger reflecting effect with plane of launching effect of arc surface are realized, then being interspersed in entire array in face
In the concave surface of location structure 16 equally constitute curved-surface reflection side, be conducive to the diffusion of wide-angle light, make light-emitting angle bigger, more
Added with the mixed light conducive to area source.Therefore, it sets the location structure 16 and is not limited in positioning function, it is also preferable reflective
Effect.As shown in Figure 6.Further, in same row, it also is provided with location structure 16 between each two adjacent pad group Z, it can be with
Increase the light radiation area of whole circuit board.
In lamp source circuit board of the present invention, using the location structure on ink layer 14 to pad 18 processing when
Positioning ensures that the positive and cathode in the pad 18 is symmetrical with the line of symmetry of the pad 18, improves pad position as far as possible
The consistency of the precision and size set, and then there is a situation where position offsets for pad in array on reduction wiring board, it is effectively anti-
Only because of the arrangement regularity of light emitting diode on the entire wiring board of bias effect of pad locations, Integral luminous light efficiency ensure that
The uniformity.
The present invention provides a kind of lamp source comprising what several lamp source chips and the lamp source circuit board manufacturing method were formed
Lamp source circuit board, several lamp source chips can be understood as light emitting diode, and on the arranged in arrays and circuit board, often
Two pins of a chip respectively in a pad 18 anode 181 and cathode 182 weld.Lamp source of the present invention ensures
The arrangement regularity of light emitting diode, and then the luminous efficiency of the lamp source ensured.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and is wanted according to right of the present invention
Equivalent variations made by asking, still belong to the scope covered by the invention.
Claims (10)
1. a kind of lamp source circuit board production method, which is characterized in that the method includes,
Several regularly arranged welding disking areas for symmetrical structure defined in the positive line pattern of base material, wherein the weldering
In disk area around there are one anode and with the spaced cathode of the anode；
Location structure is preset in setting between at least partly welding disking area, and default location structure be located at same row two are adjacent
Welding disking area between centre position, and meet relationship：With the pad in four points on the welding disking area contour line
The distance at center of the symmetrical each two point of line of symmetry in region to the location structure is identical, and two points and the positioning
The line at the center of structure is identical as the angle of the line of symmetry；
Ink layer is formed on the front for the base material for being formed with line pattern；
Location structure is formed on ink layer according to the position of the default location structure；
According to the position relationship at the center of location structure and four points of the welding disking area, determine welding disking area in the ink
The position of layer and the welding disking area on etching ink layer, include the anode and the pad of cathode for exposing ink layer to be formed.
2. lamp source circuit board production method according to claim 1, which is characterized in that the welding disking area profile is square
Shape, circle or ellipse, and when the welding disking area profile is rectangle, four points are four vertex of rectangle.
3. lamp source circuit board production method according to claim 1, which is characterized in that described according to the location structure
Coordinate further includes carrying out hot setting to being formed with the ink layer of location structure in the step of forming location structure on ink layer
Processing.
4. according to claim 1-3 any one of them lamp source circuit board production methods, which is characterized in that described at least portion
The step of location structure is preset in the setting divided between welding disking area, specifically includes the size of welding disking area as needed, determines
The coordinate and position relationship of the centre coordinate of the location structure and four points, and prestored into etching machines.
5. a kind of lamp source circuit board, which is characterized in that routing layer and covering including base material, on the base material are at least partly
The ink layer of routing layer, is formed with the windowing of several arrays arrangements on the ink layer, and there are one welderings for tool in each windowing
Disk, is equipped with location structure at least partly between pad, the location structure is located between two adjacent pads of same row.
6. lamp source circuit board according to claim 5, which is characterized in that the pad of same row include it is multigroup interval set
The pad group set, each pad group include two adjacent pads, and are set between same group in same row of two pads
There are one location structures.
7. lamp source circuit board according to claim 6, which is characterized in that the location structure is located in same row per adjacent
Two groups of pads between centre position.
8. lamp source circuit board according to claim 6, which is characterized in that be located in the pad group of same row, each two phase
Centre position between adjacent pad group is additionally provided with the location structure.
9. lamp source circuit board according to claim 8, which is characterized in that the section of the location structure is arc-shaped.
10. a kind of lamp source, which is characterized in that including several light emitting diodes and claim 5-9 any one of them lamp source lines
Road plate, several lamp source chips are arranged in arrays on the circuit board, and two pins of each chip are welded with one respectively
Anode in disk and cathode welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810550407.XA CN108712814B (en) | 2018-05-31 | 2018-05-31 | Lamp source circuit board, lamp source and manufacturing method of lamp source circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810550407.XA CN108712814B (en) | 2018-05-31 | 2018-05-31 | Lamp source circuit board, lamp source and manufacturing method of lamp source circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108712814A true CN108712814A (en) | 2018-10-26 |
| CN108712814B CN108712814B (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810550407.XA Active CN108712814B (en) | 2018-05-31 | 2018-05-31 | Lamp source circuit board, lamp source and manufacturing method of lamp source circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021248970A1 (en) * | 2020-06-10 | 2021-12-16 | 海信视像科技股份有限公司 | Display apparatus |
| CN114566570A (en) * | 2022-02-25 | 2022-05-31 | 东莞市中麒光电技术有限公司 | LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module |
| CN115188282A (en) * | 2021-04-07 | 2022-10-14 | 西安青松光电技术有限公司 | Display module manufacturing method and display module |
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| US20070128896A1 (en) * | 2005-12-07 | 2007-06-07 | Dan Willis | Electrical interface for memory connector |
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| WO2021248970A1 (en) * | 2020-06-10 | 2021-12-16 | 海信视像科技股份有限公司 | Display apparatus |
| CN115188282A (en) * | 2021-04-07 | 2022-10-14 | 西安青松光电技术有限公司 | Display module manufacturing method and display module |
| CN114566570A (en) * | 2022-02-25 | 2022-05-31 | 东莞市中麒光电技术有限公司 | LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module |
| CN114566570B (en) * | 2022-02-25 | 2023-01-03 | 东莞市中麒光电技术有限公司 | LED lamp bead manufacturing method, LED lamp bead, display module manufacturing method and display module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108712814B (en) | 2020-01-03 |
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