CN218122927U - AM mini LED panel packaging structure - Google Patents

Abstract

The utility model discloses a AM mini LED panel packaging structure, including AM mini LED lamp plate body, the LED chip and the AM chip have still been welded on the surface of AM mini LED lamp plate body, LED chip and AM chip are provided with a plurality ofly, and a plurality of AM chips all set up between two adjacent LED chips, still be provided with reflection configuration on the AM mini LED lamp plate body, reflection configuration is used for preventing that the light of LED chip is absorbed in the position of AM chip, still be provided with on the AM mini LED lamp plate body and seal a rubber structure, it is used for encapsulating LED chip, AM chip and the reflection configuration that sets up on AM mini LED lamp plate body to seal a rubber structure. The LED chip is arranged on the AM chip through the reflection structure and is blocked by the reflected light, the light is prevented from being absorbed at the position of the AM chip, the light is prevented from being lost, and the shadow on the whole AM mini LED panel caused by the reflection of the light source of the LED chip is avoided.

Description

AM mini LED panel packaging structure

Technical Field

The utility model relates to a LED lamp plate encapsulation, especially an AM mini LED panel packaging structure.

Background

The AM mini LED technology is a technology that uses a TFT as a driving circuit to realize Active matrix (AM mini LED) driving, and can bring the potential of the mini LED into full play. The AM mini LED panel adopts the AM mini LED technology, has the characteristics of high contrast and high color rendering performance, and has lower cost than the traditional PM-LED panel.

However, an AM type chip needs to be arranged on the AM mini LED panel, and the surface of the AM type chip is black coated, generally larger than the size of the chip, and needs to be printed on the same surface as the LED chip when the piece is printed. Therefore, light rays of the LED chip can be absorbed at the position of the AM chip, and the whole light-emitting surface can generate a shadow, so that the optical effect is displayed unevenly.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a set up reflection configuration on the AM mini LED lamp plate body that is provided with the AM chip, realize placing the AM mini LED panel packaging structure that the reflection shadow appears in LED light source receives.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a AM mini LED panel packaging structure, includes AM mini LED lamp plate body, the LED chip and the AM chip of still welding on the surface of AM mini LED lamp plate body, LED chip and AM chip are provided with a plurality ofly, and a plurality of AM chips all set up between two adjacent LED chips, still be provided with reflection configuration on the AM mini LED lamp plate body, reflection configuration is used for preventing that the light of LED chip is absorbed in the position of AM chip, still be provided with on the AM mini LED lamp plate body and seal the glue structure, it is used for encapsulating LED chip, AM chip and the reflection configuration of setting on AM mini LED lamp plate body to seal the glue structure.

As an improvement of the technical scheme, the LED chips are arranged on the AM mini LED lamp panel body in an array mode, and the distance between every two LED chips is larger than or equal to 5mm.

As the further improvement of the technical scheme, the reflecting structure is a reflector plate, and the reflector plate is arranged on the surface of the AM mini LED lamp panel body.

As a further improvement of the above technical solution, the reflector plate is further provided with an LED opening and an AM opening at a position corresponding to the AM chip, the AM opening is used for auxiliary mounting of the AM chip, and the LED opening is used for auxiliary mounting of the LED chip.

As a further improvement of the technical scheme, the AM opening is arranged in a cross shape.

As a further improvement of the above technical solution, the reflection structure is a white closed structure, and the white closed structure is used for covering the AM chip.

As a further improvement of the technical scheme, the white sealing structure is white glue, and the white glue covers the periphery of each AM chip arranged on the AM mini LED lamp panel body.

As a further improvement of the above technical solution, the white glue is arranged in an arc shape on the periphery of the AM chip.

The beneficial effects are that: the utility model discloses a last LED chip and the AM chip of having set up of AM mini LED panel packaging structure simultaneously to the reflection configuration who sets up at the installation region of LED chip and AM chip. The LED chip is arranged on the AM chip through the reflection structure and is blocked by the reflected light, the light is prevented from being absorbed at the position of the AM chip, the loss of the light is avoided, and the shadow on the whole AM mini LED panel caused by the reflection of the light source of the LED chip is avoided.

Drawings

The present invention will be further explained with reference to the drawings and examples.

FIG. 1 is an assembly schematic of the present invention;

FIG. 2 is a schematic view of the reflector of the present invention;

fig. 3 is a cross-sectional view of a first embodiment of the present invention;

fig. 4 is a cross-sectional view of a second embodiment of the present invention.

1. An AM mini LED lamp panel body; 2. an LED chip; 3. an AM chip; 4. sealing a glue structure; 5. a reflective sheet; 6. an LED opening; 7. an AM opening; 8. and (5) white glue.

Detailed Description

The conception, specific structure, and technical effects of the present invention will be clearly and completely described in conjunction with the embodiments and the accompanying drawings, so that the objects, features, and effects of the present invention can be fully understood. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. The utility model discloses each technical feature in the creation can the interactive combination under the prerequisite that does not contradict conflict each other.

Referring to fig. 1, 3 and 4, in general, when the LED lamp panel is manufactured, an LED chip 2 emitting light is soldered to a PCB, and the LED chip 2 emits light for illumination. For the AM mini LED panel with better performance, the AM chip 3 is welded on the PCB board simultaneously during production, and the luminous performance of the LED chip 2 is improved through the AM chip 3. However, when the AM chip 3 is provided, a sufficient mounting distance needs to be reserved between two adjacent LED chips 2, which results in a large distance between two adjacent LED chips 2. When such an LED light source is projected onto the AM chip 3, it is easily absorbed by the black surface of the AM chip 3, resulting in a dark shadow at the AM chip 3. For this reason, this application provides an AM mini LED panel packaging structure, including AMminiLE lamp plate body 1, AM miniLE lamp plate body 1 still is provided with LED chip 2 and AM chip 3 on the surface, LED chip 2 and AM chip 3 are provided with a plurality ofly, and a plurality of AM chip 3 all set up between two adjacent LED chips 2.

Still be provided with reflection configuration on AM mini LED lamp plate body 1, reflection configuration is used for preventing that the light of LED chip 2 is absorbed in AM chip 3's position, and reflection configuration mainly sets up in AM chip 3's position, prevents that AM chip 3 from throwing the light of coming to LED chip 2 from AM chip 3 department and being absorbed. The reflection structure may be provided in another region, and the AM chip 3 may be subjected to auxiliary antireflection from the other region. In addition, still be provided with on AM mini LED lamp plate body 1 and seal glue structure 4, it is used for encapsulating LED chip 2, AM chip 3 and the reflection configuration of setting on AM mini LED lamp plate body 1 to seal glue structure 4. For the LED chips 2 and the AM chips 3 which are pasted on the PCB in batch through the pasting equipment, in order to ensure the stability of the installation of the LED chips 2 and the AM chips on the PCB, glue sealing is required to be carried out on the PCB, the LED chips 2 and the AM chips 3 are sealed on the PCB through the glue sealing, and the stability of the whole chip structure is ensured.

And for the LED chips 2 arranged on the PCB, the AM mini LED lamp panel body 1 is arranged in an array manner. The LED chips 2 arranged in the array are adjacent to each other, and the distance between the two adjacent LED chips 2 is set according to different requirements. When the distance between two adjacent LED chips 2 is large, the light source emitted from the LED chip 2 is more difficult to cover the AM chip 3, and the light source that can reach the AM chip 3 is weaker, and thus reflection is likely to occur on the protruding AM chip 3, resulting in a dark shadow at the position of the AM chip 3. In this case, when the distance between every two LED chips 2 is greater than or equal to 5mm, a shadow is more likely to be generated.

Referring to fig. 2 and 3, as a first embodiment of the reflection structure, the reflection structure is a reflection sheet 5, and the reflection sheet 5 is disposed on a surface of the AM mini LED lamp panel body 1. The arrangement of the reflector sheet 5 can affect the AM chip 3 located between the two LED chips 2, so that the light source of the LED chip 2 can be reflected at the AM chip 3, thereby avoiding the occurrence of a shadow at the AM chip 3. Reflector plate 5 still is provided with LED opening 6 and AM opening 7 in the position that AM chip 3 corresponds, AM opening 7 is used for carrying out supplementary installation to AM chip 3, LED opening 6 is used for the supplementary installation to LED chip 2, AM opening 7 is the setting of cross. Since the AM chip 3 and the LED chip 2 need to be mounted on the PCB board at the bottom of the reflection sheet 5, and the LED chip needs to emit light above the reflection sheet 5. Therefore, the LED opening 6 with a square shape is arranged at the position of the LED chip, and the LED chip 2 can be directly connected with the PCB board from the LED opening 6. The AM chip 3 needs to be disposed between the reflective sheet 5 and the PCB, and the reflective sheet 5 above the AM chip 3 is easily lifted by the bottom AM chip 3 and deformed. Therefore, a cross-shaped scribing opening is formed in the reflector 5 at the position corresponding to the AM chip 3, so that a deformation space is reserved for the reflector 5 at the position of the AM chip 3, and the reflector 5 does not generate serious convex deformation. And the light of the LED chip 2 is projected on the AM chip 3 from the side, so the cross-shaped opening does not affect the reflection preventing effect of the reflector 5 on the LED light at the side of the AM chip 3.

Referring to fig. 4, as a second embodiment of the reflection structure, the reflection structure is a white closed structure for covering the AM chip 3. White enclosed construction covers the back to AM chip 3, hits the light in AM chip 3 region on LED chip 2 and just can directly fall on white enclosed construction's surface, and light on white enclosed construction can directly be reflected by white enclosed construction to avoided the light in AM chip 3 department to absorbed, avoided the lamp plate to appear the shadow when using. Preferably, white enclosed construction is white glue 8, white glue 8 covers at each AM chip 3 periphery that sets up on AM mini LED lamp plate body 1. The white glue is arranged in an arc shape at the periphery of the AM chip 3. When the AM chip 3 is sealed by the white glue 8, a good sealing effect can be achieved, the sealing operation of the white glue 8 is simple and easy to implement, and glue can be directly dispensed on the AM chip 3 through glue dispensing equipment. And the surface is the white glue 8 of arc setting and does not have the water caltrop, and is more even to the light reflection that throws from LED chip 2 for lamp plate overall structure's luminous more even soft.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims (8)

1. The utility model provides an AM mini LED panel packaging structure which characterized in that: including AM mini LED lamp plate body, AM mini LED lamp plate body still welds LED chip and AM chip on the surface, LED chip and AM chip are provided with a plurality ofly, and a plurality of AM chips all set up between two adjacent LED chips, still be provided with reflective structure on the AM mini LED lamp plate body, reflective structure is used for preventing that the light of LED chip is absorbed in the position of AM chip, still be provided with on the AM mini LED lamp plate body and seal the glue structure, it is used for encapsulating LED chip, AM chip and the reflective structure of setting on AM mini LED lamp plate body to seal the glue structure.

2. The AM mini LED panel packaging structure of claim 1, wherein: the LED chips are arranged on the AM mini LED lamp panel body in an array mode, and the distance between every two LED chips is larger than or equal to 5mm.

3. The AM mini LED panel package structure of claim 2, wherein: the reflection configuration is the reflector plate, the reflector plate sets up the surface at AM miniLED lamp plate body.

4. The AM mini LED panel package structure of claim 3, wherein: the position that the reflector plate corresponds at the AM chip still is provided with LED opening and AM opening, the AM opening is used for carrying out the auxiliary installation to the AM chip, the LED opening is used for the auxiliary installation to the LED chip.

5. The AM mini LED panel package structure of claim 4, wherein: the AM opening is arranged in a cross shape.

6. The AM mini LED panel package structure of claim 2, wherein: the reflection structure is a white closed structure, and the white closed structure is used for covering the AM chip.

7. The AM mini LED panel package structure of claim 6, wherein: white enclosed construction is white glue, white glue covers at each AM chip periphery that sets up on AM mini LED lamp plate body.

8. The AM mini LED panel package structure of claim 7, wherein: the white glue is arranged in an arc shape on the periphery of the AM chip.

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