CN219351987U

CN219351987U - LED circuit board structure with ink consistency

Info

Publication number: CN219351987U
Application number: CN202320234966.6U
Authority: CN
Inventors: 王涛; 田晓燕; 陈业跃; 苏明华; 龙亚山
Original assignee: Tongyuan Technology Huizhou Co ltd
Current assignee: Tongyuan Technology Huizhou Co ltd
Priority date: 2023-02-16
Filing date: 2023-02-16
Publication date: 2023-07-14
Anticipated expiration: 2033-02-16

Abstract

The utility model belongs to the technical field of circuit boards, and discloses an LED circuit board structure with consistent ink color, wherein a first sub-board solder mask layer is covered on the upper side of a sub-board, and an LED board lamp surface is connected to the upper side of the first sub-board solder mask layer through a first PP layer; the lower end of the sub board is connected with the LED board driving surface through a second PP layer, the sub board comprises one or more core boards, the adjacent core boards are bonded by a third PP layer, the core boards are of a multilayer structure formed by mixing and pressing a fourth PP layer and copper foils, and two sides of the fourth PP layer are respectively provided with a layer of copper foil. According to the utility model, the traditional two-time surface solder resist is separated through the sub-board solder resist layer and the surface solder resist layer, the surface of the sub-board is printed once, and the traditional outer layer surface is printed once, so that the problem of too thick outer layer surface solder resist can be solved, and the problem of short circuit caused by using black PP can be solved; the utility model can solve the problem of color difference of the LED board on the premise of not increasing the solder resist thickness or not using black PP which is easy to conduct.

Description

LED circuit board structure with ink consistency

Technical Field

The utility model belongs to the technical field of circuit boards, and particularly relates to an LED circuit board structure with consistent ink color.

Background

Along with the higher and higher requirements on the consistency of the surface colors of the LED boards, various PCB manufacturing enterprises experiment different schemes for solving the LED color difference problem, but the existing solutions can not effectively solve the problem. If the solder resist ink is printed twice, the problem that the thickness of the solder resist ink exceeds the thickness of the copper foil on the outer layer to affect LED welding and cause cold joint is easily caused; and for example, black PP is adopted to replace the traditional light color system (such as yellow) PP, and the surface color difference is reduced by increasing the blackness, but the method is extremely easy to generate PCB short circuit phenomenon, so that the PCBA fails.

Through the above analysis, the problems and defects existing in the prior art are as follows: the existing mode for solving the chromatic aberration of the LED circuit board is easy to cause that the thickness of the solder resist ink exceeds the thickness of the outer copper foil to influence LED welding, and causes virtual welding, so that the PCB short-circuit phenomenon is very easy to occur, and the PCBA is invalid.

Disclosure of Invention

To overcome the problems in the related art, the disclosed embodiments of the present utility model provide an LED circuit board structure with ink consistency. The technical scheme is as follows:

the LED circuit board structure with the consistency of ink colors is provided with a sub board, a first sub board solder mask layer is covered on the upper side of the sub board, and an LED board lamp surface is connected to the upper side of the first sub board solder mask layer through a first PP layer;

the lower end of the sub-board is connected with the LED board driving surface through the second PP layer.

In one embodiment, the daughter board includes one or more core boards, with a third PP layer bonding between adjacent core boards.

In one embodiment, the core board is a multi-layer structure formed by mixing and pressing a fourth PP layer and copper foils, and two sides of the fourth PP layer are respectively provided with a layer of copper foil.

In one embodiment, the copper foil has a thickness of 15-30um.

In one embodiment, the lower end of the sub-board is covered with a second sub-board solder mask, and the LED board driving surface is fixed at the lower end of the second sub-board solder mask through a second PP layer.

In one embodiment, the first and second sub-board solder masks are solder mask ink layers, spray ink layers, print ink layers, or non-conductive plastic layers.

In one embodiment, the light surface of the LED board is provided with a light surface solder mask layer and a light surface circuit layer, and the light surface circuit layer includes a plurality of wires and light bead pads.

In one embodiment, the lamp face solder mask layer covers the upper side of the first PP layer or the lamp face circuit layer.

In one embodiment, the driving surface of the LED board is provided with a driving surface solder mask layer and a driving surface circuit layer, and the driving surface circuit layer includes a plurality of wires and circuit pads.

In one embodiment, the driving surface solder mask layer covers the underside of the second PP layer or driving surface wiring layer.

By combining all the technical schemes, the utility model has the advantages and positive effects that:

according to the utility model, the traditional two-time surface solder resist is separated through the sub-board solder resist layer and the surface solder resist layer, the surface of the sub-board is printed once, and the traditional outer layer surface is printed once, so that the problem of too thick outer layer surface solder resist can be solved, and the problem of short circuit caused by using black PP can be solved.

The utility model can solve the problem of color difference of the LED board on the premise of not increasing the solder resist thickness or not using black PP which is easy to conduct.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure of the utility model as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic diagram of an LED circuit board structure with ink uniformity comprising a core board according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of an LED circuit board structure including ink color consistency of two core boards according to an embodiment of the present utility model;

in the figure: 1. a sub-board; 2. a first sub-board solder mask layer; 3. a first PP layer; 4. LED board lamp surface; 5. a second PP layer; 6. an LED board driving surface; 7. a third PP layer; 8. a fourth PP layer; 9. copper foil; 10. a second sub-board solder mask layer; 11. a lamp face solder mask layer; 12. a lamp face circuit layer; 13. a driving surface solder mask layer; 14. and driving the surface circuit layer.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit or scope of the utility model, which is therefore not limited to the specific embodiments disclosed below.

As shown in fig. 1 and fig. 2, the upper side of a sub-board 1 in the LED circuit board structure with consistent ink color provided by the embodiment of the utility model is covered with a first sub-board solder mask layer 2, and the upper side of the first sub-board solder mask layer 2 is connected with an LED board lamp surface 4 through a first PP layer 3; the lower end of the sub board 1 is connected with the LED board driving surface 6 through the second PP layer 5.

The daughter board 1 in the embodiment of the utility model comprises one or more core boards, and the adjacent core boards are bonded by adopting a third PP layer 7. The sub-board 1 is constituted by one core board or a plurality of core boards. When the core board is a plurality of core boards, the core boards are bonded by PP, and are cured after high temperature and high pressure to form a reliable structure.

The core board in the embodiment of the utility model is a multi-layer structure formed by mixing and pressing the fourth PP layer 8 and the copper foil 9, and two sides of the fourth PP layer 8 are respectively provided with a layer of copper foil 9. The thickness of the copper foil 9 is 15-30um.

The lower end of the sub-board 1 in the embodiment of the utility model is covered with a second sub-board solder mask 10, and the LED board driving surface 6 is fixed at the lower end of the second sub-board solder mask 10 through a second PP layer 5. The second sub-board solder mask layer 10 at the lower end of the sub-board 1 may or may not be printed.

The LED board lamp face 4 in the embodiment of the utility model is provided with a lamp face solder mask layer 11 and a lamp face circuit layer 12, wherein the lamp face circuit layer 12 comprises a plurality of wires and lamp bead bonding pads. The lamp surface solder mask layer 11 covers the upper side of the first PP layer 3 or the lamp surface circuit layer 12.

The driving surface 6 of the LED board in the embodiment of the utility model is provided with a driving surface solder mask layer 13 and a driving surface circuit layer 14, wherein the driving surface circuit layer 14 comprises a plurality of wires and circuit pads. The driving surface solder mask layer 13 covers the lower side of the second PP layer 5 or the driving surface circuit layer 14.

The first PP layer 3, the second PP layer 5, the third PP layer 7 and the fourth PP layer 8 are PP layers composed of epoxy resin, glass fiber and other curing agents, and the copper foil 9 for electronic use is pressed on the rear two sides, wherein the copper foil 9 is a copper foil 9 used in a conventional PCB factory, and the thickness is as follows: 15-30um, thereby forming a core plate.

The first and second

sub-board solder masks

2 and 10 may be solder resist ink in a conventional sense, or may be other insulating materials, such as: spray ink, print ink, non-conductive plastic, and the like.

In order to ensure the bonding force between the solder resist of the sub-board 1 and the PP on the outer side of the sub-board 1, the sub-board 1 can be subjected to chemical or physical treatment, such as gold deposition, OSP or nickel palladium gold process, and then the light-emitting component is attached to enhance the surface bonding force.

The working principle of the utility model is as follows:

(1) And manufacturing a sub-board of the LED board. The sub-board structure comprises at least 1 core board, which can be a core board or a multi-layer structure after the core board and the copper foil 9 are pressed together.

(2) At least 1 surface of the outer layer of the sub-board 1 is printed with a solder resist layer of the sub-board 1, wherein the solder resist layer of the sub-board 1 is a dark color (such as bright black, matte black, deep blue and the like) ink or coating, the thickness of the ink or coating is 5-60um, and the optimal thickness of the ink is 10-35um. The ink or the coating can be printed on one side of the sub-board 1 close to the LED lamp bead surface independently, and the sub-board 1 can also be printed on both sides.

(3) And pressing the sub board 1. And pressing the printed ink or coated sub-board 1, the PP and the copper foil 9 to form a multi-layer board structure.

(4) Surface circuit, solder mask, text and surface treatment are manufactured. And (3) carrying out circuit manufacture on the copper foil 9 of the multi-layer board structure formed by the pressing in the step (3), and then printing a solder resist on the surface of the multi-layer board, wherein the solder resist is liquid photosensitive ink, has a conventional thickness of 5-60um, and exposes a copper exposure area for surface treatment. Printing characters on the printed solder mask plate, and performing surface treatment on the copper exposure area to form the circuit board capable of being delivered for use.

While the utility model has been described with respect to what is presently considered to be the most practical and preferred embodiments, it is to be understood that the utility model is not limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims

1. The LED circuit board structure with the consistent ink color is characterized in that the LED circuit board structure with the consistent ink color is provided with a sub board (1), a first sub board solder mask layer (2) is covered on the upper side of the sub board (1), and an LED board lamp surface (4) is connected to the upper side of the first sub board solder mask layer (2) through a first PP layer (3);

the lower end of the sub board (1) is connected with the LED board driving surface (6) through the second PP layer (5).

2. The LED circuit board structure of claim 1, characterized in that the sub-board (1) comprises one or more core boards, adjacent core boards being bonded with a third PP layer (7).

3. The LED circuit board structure with consistency of ink colors according to claim 2, wherein the core board is a multi-layer structure formed by mixing and pressing a fourth PP layer (8) and copper foils (9), and a layer of copper foil (9) is respectively arranged at two sides of the fourth PP layer (8).

4. A LED circuit board structure according to claim 3, characterized in that the copper foil (9) has a thickness of 15-30um.

5. The LED circuit board structure of claim 1, wherein the lower end of the sub-board (1) is covered with a second sub-board solder mask layer (10), and the LED board driving surface (6) is fixed at the lower end of the second sub-board solder mask layer (10) through a second PP layer (5).

6. The LED circuit board structure of claim 5, wherein said first and second sub-board solder masks (2, 10) are solder mask ink layers, spray ink layers, print ink layers or non-conductive plastic layers.

7. The LED circuit board structure of claim 1, wherein the LED board light surface (4) is provided with a light surface solder mask layer (11) and a light surface circuit layer (12), and the light surface circuit layer (12) is provided with a plurality of light bead bonding pads.

8. The ink consistency LED circuit board structure of claim 7, wherein the lamp face solder mask layer (11) covers the upper side of the first PP layer (3) or the lamp face circuit layer (12).

9. The LED circuit board structure of claim 1, wherein the LED board driving surface (6) is provided with a driving surface solder mask layer (13) and a driving surface circuit layer (14), the driving surface circuit layer (14) comprising a plurality of wires and circuit pads.

10. The ink consistency LED circuit board structure according to claim 9, characterized in that the driving surface solder mask layer (13) covers the underside of the second PP layer (5) or the driving surface wiring layer (14).