CN211979377U

CN211979377U - LED backlight device

Info

Publication number: CN211979377U
Application number: CN202020803061.2U
Authority: CN
Inventors: 秦彪
Original assignee: Shenzhen Qinbo Hexin Technology Development Co ltd
Current assignee: Shenzhen Qinbo Hexin Technology Development Co ltd
Priority date: 2020-05-09
Filing date: 2020-05-09
Publication date: 2020-11-20
Anticipated expiration: 2030-05-09

Abstract

The utility model provides a device for LCD is shaded, LED wafer (4) are established in wafer caulking opening (11) on bearing piece (1), and flexible printed circuit board (FPC) is adopted in bearing piece (1), adopts the solder directly to link LED wafer and the circuit on the bearing piece, and the thickness of light source module reduces; the light source light guide part (2) is provided with a reflective film (21) which forms a reflector of the LED light source, and a side light system with high light efficiency can be realized by adding the reflective film (15) on the bearing sheet, the reflective film (13) and the reflective sheet (7) at the bottom; the reflective film (21) adopts a partial light-transmitting structure, so that full-screen non-dark-area backlight can be realized.

Description

LED backlight device

Technical Field

The utility model belongs to the technical field of the LED, in particular to a technique in a poor light that is used for the luminous side of LCD display screen.

Background

The thinner the handset, the better, and the thinner the thickness of the backlight components in its LCD display. In the existing side-lighting LED backlight, the packaged side-lighting LED lamp beads are pasted and welded on a flexible printed circuit board (FPC), the thickness of the side-lighting LED lamp beads is limited to 0.4mm, and the thickness of the FPC is 0.1mm, so that the thickness is at least 0.5 mm. In addition, the area of the LED lamp bead has dark areas without light, so that the design of no frame on four sides of the full screen cannot be realized.

Disclosure of Invention

The utility model discloses an aim at just above the problem, provide simple structure, thickness attenuate, can realize the full-screen no dark space, LED side-emitting backlight technical scheme that the cost is low again.

The technical scheme of the utility model: the utility model discloses a LED backlight device for LCD display screen, including: the carrier sheet, light source leaded light spare, the light guide plate, the LED wafer, the fluorescent layer, its characterized in that: the LED light source module is characterized in that the bearing sheet is made of flexible insulating materials and is in a strip shape, the driving circuit and the driving bonding pads are distributed on the bearing sheet, a plurality of multi-chip embedding openings are formed in the bearing sheet, the LED chips are arranged in the chip embedding openings, the driving bonding pads on the bearing sheet are close to the electrode bonding pads on the LED chips, and the two bonding pads are connected through welding fluxes to form the LED light source module; the bearing sheet is attached to the lower surface of the light source light guide part, the upper surface and the outer side surface of the light source light guide part are provided with reflecting films to form a reflector of the LED light source, upward light of the LED light source is changed into a horizontal direction, and side surface light emitting is formed and is right opposite to the light inlet side surface of the light guide plate.

Drawings

The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown and described, and in which embodiments of the invention are shown by way of illustration, and not by way of limitation.

Fig. 1 is a schematic characteristic cross-sectional view of an LED backlight device according to the present invention.

Fig. 2 is a characteristic schematic view of the carrier sheet of the present invention.

Fig. 3 and 4 are schematic characteristic cross-sectional views of two LED backlight devices according to the present invention.

Fig. 5 is a partially enlarged view of fig. 4.

Fig. 6 is a schematic plan view of a wafer pocket and an LED wafer according to the present invention.

Fig. 7 is a schematic cross-sectional view of a feature of a wafer pocket and an LED wafer according to the present invention.

Fig. 8 is a characteristic cross-sectional schematic view of the die paddle and LED die of fig. 7 with a phosphor layer disposed thereon.

Fig. 9 is a schematic plan view of a wafer pocket and an LED wafer according to the present invention.

Fig. 10 is a schematic cross-sectional view of a feature of a wafer pocket and an LED wafer of the present invention.

In the figure: 1. the LED light source comprises a carrier sheet, 11 wafer embedding openings, 12, external terminals, 13, a reflective film, 14, a driving bonding pad, 15, the reflective film, 2, a light source light guide piece, 21, the reflective film, 22, an outer side light guide sheet, 3, a light guide plate, 4, an LED wafer, 41, an electrode bonding pad, 42, a round notch, 5, a fluorescent layer, 6, solder, 7, the reflective sheet, 8 and transparent adhesive.

Detailed Description

Fig. 1 shows the LED backlight device of the present invention, the LED chip 4 is disposed in the chip embedding opening 11, the thickness of the LED chip 4 is smaller than that of the carrier sheet 1, the fluorescent layer 5 is disposed on the LED chip 4, the fluorescent layer is disposed in the chip embedding opening 11 by silk screen printing, and a thin and uniform fluorescent layer can be obtained; a driving circuit and a driving bonding pad are distributed on the carrier sheet 1, the driving bonding pad on the carrier sheet 1 is communicated with an electrode bonding pad on the LED wafer (not shown in the figure), and the carrier sheet 1 is made of opaque material; the bearing sheet 1 is attached to the lower surface of the light source and light guide member 2, and the upper surface and the outer side surface of the light source and light guide member 2 are provided with reflective films 21 to form a reflector of the LED light source, and upward light of the LED light source is changed into a horizontal direction to form side light emission which is opposite to a light inlet side surface of the light guide plate 3. The light source light guide 2 is shown as being inclined on the outer side.

The carrier 1 shown in fig. 2 is a strip, a plurality of chip sockets 11 are arranged in a single row, the chip sockets 11 are rectangular, and the corresponding LED chips should also be rectangular; the external connection terminals 12 of the carrier sheet 1 are shown arranged at the sides.

The LED backlight device of the present invention shown in fig. 3 is different from that shown in fig. 2 in that: the light source and light guide member 2 and the light guide plate 3 adopt an integrated structure; the lateral surface of light source leaded light spare 2 adds outside limit leaded light piece 22, and thickness is less than light guide plate 3, has the light of small part to derive here, and reflective membrane 21 on the light source leaded light spare 2 has adopted partial printing opacity structure, for example adopts laser processing, has the inhomogeneous light-emitting pore that distributes for the higher authority light-emitting of light source leaded light spare 2 is even, just so can realize that the full-screen does not have the dark space and is shaded.

The LED backlight device of the present invention shown in fig. 4 and 5 is different from that shown in fig. 3 in that: the upper surface and the outer side surface of the light source light guide part 2 adopt curved surface structures, the upper surface of the bearing sheet 1 is plated with a reflective film 15, the side wall of the wafer embedding opening 11 is plated with a reflective film 13, the lower surface of the bearing sheet 1 is pasted with a reflective sheet 7, and transparent glue 8 is filled between the LED wafer 4 and the side wall of the wafer embedding opening 11. The figure shows that the lower surface of the carrier sheet 1 is adhered with a reflective sheet 7 which is integrated with the reflective sheet below the light guide plate 3. The dashed lines and arrows in fig. 4 and 5 represent light rays.

Both sides and the bottom of the LED wafer are provided with the reflective film, the light efficiency of the LED light module is also high, and the light channel is formed by the reflective film 21 on the light source light guide part 2 and the reflective film 15 on the bearing sheet 1, so that the light loss is small, and the overall light efficiency is high.

In the technical solution of the present invention shown in fig. 6-8, the wafer embedding opening 11 and the LED wafer 4 are in a strip structure, the driving pad 14 on the carrier sheet 1 is disposed on the sidewall of the wafer embedding opening 11, and the electrode pad 41 of the LED wafer 4 is directly above the LED wafer 4 (similar to a gold bonding pad); the electrode pad 41 and the driving pad 14 are directly connected to each other by solder 6 (typically, tin solder).

Fig. 9 and 10 show the technical scheme of the utility model, the last electrode pad 41 of LED wafer 4 sets up on the lateral wall of LED wafer 1, and there is the circle of LED wafer 4 to lack 42, is provided with electrode pad 41 on the lateral wall of circle lack 42, and such structure is shown than fig. 6 ~ 8, welds electrode pad 41 and drive pad 14 more easily.

The thickness of the carrier sheet 1 is 0.1mm, the thickness of the LED wafer 4 is 0.08mm, and the thickness of the light source and light guide piece 2 is 0.2mm, which is 0.3mm in sum, so that the thickness identical to that of the light guide plate can be realized.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. An LED backlight device for a display screen, comprising: carrier sheet (1), light source leaded light spare (2), light guide plate (3), LED wafer (4), fluorescent layer (5), its characterized in that: the LED chip carrier is characterized in that the carrier sheet (1) is made of flexible insulating materials, a driving circuit and driving bonding pads (14) are distributed on the carrier sheet (1), a plurality of multi-chip embedding openings (11) are formed in the carrier sheet (1), the LED chips (4) are arranged in the chip embedding openings (11), the driving bonding pads (14) on the carrier sheet (1) are close to electrode bonding pads (41) on the LED chips (4), and the two bonding pads are connected through welding fluxes (6); the bearing sheet (1) is attached to the lower surface of the light source light guide piece (2), and the upper surface and the outer side surface of the light source light guide piece (2) are provided with reflecting films (21) to form a reflector of the LED wafer (4) light source.

2. The LED backlight device according to claim 1, wherein: the outer side surface of the light source light guide part (2) adopts an inclined surface structure.

3. The LED backlight device according to claim 1, wherein: the outer side surface of the light source light guide part (2) adopts a curved surface structure.

4. The LED backlight device according to claim 1, wherein: the light source light guide part (2) and the light guide plate (3) adopt an integrated structure.

5. The LED backlight device according to claim 1, wherein: the reflective film (21) on the light source and light guide member (2) adopts a partially light-transmitting structure.

6. The LED backlight device according to claim 1, 2, 3, 4, or 5, wherein: the side wall of the wafer embedding opening (11) is provided with a driving bonding pad (14).

7. The LED backlight device according to claim 1, 2, 3, 4, or 5, wherein: the side wall of the chip embedding opening (11) is plated with a reflective film (13).

8. The LED backlight device according to claim 1, 2, 3, 4, or 5, wherein: the upper surface of the bearing sheet (1) is plated with a reflective film (15).

9. The LED backlight device according to claim 1, 2, 3, 4, or 5, wherein: the lower surface of the bearing sheet (1) is adhered with a reflective sheet (7).

10. The LED backlight device according to claim 1, 2, 3, 4, or 5, wherein: the LED chip (4) has a notch (42), and an electrode pad (41) is provided on the side wall of the notch (42).