KR20130072997A - Light emitting module and lighting system having the same - Google Patents

Abstract

PURPOSE: A light emitting module and a lighting system having the same are provided to improve color reproductivity by adding different fluorescent substances to first to third light emitting diode body. CONSTITUTION: A first light emitting diode (101) includes a first light emitting chip. The first light emitting chip emits blue light. A second light emitting diode (102) includes a first fluorescent substance. A third light emitting diode (103) includes a second fluorescent substance. The second phosphor emits a long wavelength of light.

Description

LIGHT EMITTING MODULE AND LIGHTING SYSTEM HAVING THE SAME}

Embodiments relate to a light emitting module and a lighting system having the same.

A light emitting diode, for example, a light emitting device is a kind of semiconductor device that converts electrical energy into light, and has been spotlighted as a next-generation light source by replacing an existing fluorescent lamp and an incandescent lamp.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, many researches are being conducted to replace the existing light sources with light emitting diodes, and as information processing technologies are developed, display devices such as LCDs, PDPs, and AMOLEDs are widely used. Among these display devices, an LCD requires an illumination unit such as a backlight unit capable of generating light in order to display an image.

The embodiment provides a light emitting module in which different phosphors are added to bodies of different light emitting diodes.

The embodiment provides a light emitting module in which first to third light emitting diodes emitting different colors are arranged on a substrate, and a green phosphor is added to a body of a red light emitting diode and a body of a green light emitting diode.

The embodiment provides a light emitting module having a first to third light emitting diodes arranged on a substrate and having different phosphors added to the bodies of the first to third light emitting diodes, and an illumination system having the same.

The light emitting module according to the embodiment includes a first light emitting diode including a first body having a cavity and a first light emitting chip disposed in the cavity of the first body and emitting blue light; A second body having a cavity; A second light emitting chip disposed in the cavity of the second body and emitting light having a green wavelength; And a first phosphor in the second body, the first phosphor emitting light having a longer wavelength than the wavelength emitted from the second light emitting chip; A third body having a cavity, a third light emitting chip disposed in the cavity of the third body and emitting red light; A third light emitting diode including a second phosphor in the third body that emits light having a longer wavelength than the wavelength emitted from the third light emitting chip; And a module substrate on which the first to third light emitting diodes are disposed.

The embodiment can improve color reproduction in the light emitting module.

The embodiment may improve the color reproducibility of the light emitting module so that the color coordinates have a distribution suitable for NTSC.

The embodiment can improve the reliability of the light emitting module.

The embodiment can improve the reliability of the lighting system having the light emitting module.

1 is a perspective view illustrating a light emitting module according to an embodiment.
FIG. 2 is a partial cross-sectional view of the light emitting module of FIG. 1.
3 is a diagram illustrating another example of the light emitting module of FIG. 1.
4 is a diagram illustrating a wavelength spectrum of the light emitting diodes of FIG. 2.
5 is a diagram illustrating a color coordinate diagram according to an embodiment.
6 is a diagram illustrating a display device having the light emitting module of FIG. 1.
FIG. 7 is a diagram illustrating another example of a display device having the light emitting module of FIG. 1.
8 is a view showing an illumination unit having the light emitting module of FIG. 1.

In the description of the embodiment, each substrate, frame, sheet, layer, or pattern is formed "on" or "under" of each substrate, frame, sheet, layer, or pattern. When described as being "in", "on" and "under" include both "directly" or "indirectly" formed other components. . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is a view showing a light emitting module according to an embodiment, Figure 2 is a partial cross-sectional view of the light emitting module of FIG.

Referring to FIG. 1, the light emitting module 300 may include first to third light emitting diodes 101, 102, and 103; The first to third light emitting diodes 101, 102, and 103 include a module substrate 200 alternately arranged.

The module substrate 200 may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The module substrate 200 may include a printed circuit board having a metal layer therein.

The light emitting diodes 101, 102, and 103 may be arranged in one or two rows on the top surface 201 of the module substrate 200. Adjacent light emitting diodes 101, 102, 103 mounted on the module substrate 200 may be arranged at regular intervals or at irregular intervals.

1 and 4, the plurality of light emitting diodes 101, 102, and 103 may be arranged in a first direction at a predetermined pitch or in a matrix form (not shown). Among the plurality of light emitting diodes 101, 102, and 103, the first light emitting diode 101 includes at least one blue light emitting chip that emits a blue wavelength W1, and the second light emitting diode 102 has a green wavelength W2. At least one green light emitting chip for emitting light, and the third light emitting diode 103 includes at least one red light emitting chip for emitting a red peak wavelength (W3). Any one of the light emitting diodes 101, 102, and 103 may include a plurality of light emitting chips, but is not limited thereto.

The first light emitting diode 101 emits a blue first main peak wavelength P1, and the second light emitting diode 102 has a green second main peak wavelength P2 and a third main peak wavelength P21. ) And the third light emitting diode 103 emits a red fourth main peak wavelength P3 and a fifth main peak wavelength P31.

The second main peak wavelength P2 is light emitted by the green light emitting chip, and the third main peak wavelength P21 is a wavelength excited by the second main peak wavelength P2. It is a wavelength longer than the peak wavelength P21. The fourth main peak wavelength P3 emits light by a red light emitting chip, and the fifth main peak wavelength P31 excites some light emitted from the red light emitting chip and thus the fourth main peak wavelength P3. Emission of the fifth main peak wavelength (P31), which is longer than the wavelength.

The module substrate 200 may be disposed in a bar shape, but is not limited thereto. The plurality of light emitting diodes 101, 102, and 103 may be connected by, for example, a parallel connection or a series-parallel connection, but is not limited thereto.

The light emitting module may implement various colors by mixing blue / green / red wavelengths emitted from the first to third light emitting diodes 101, 102, and 103.

Referring to FIG. 2, each light emitting diode of the light emitting module will be described in detail.

2, the first light emitting diode 101 may include a first body 11, at least two lead frames having first and second lead frames 12 and 13, and at least one first light emitting chip 15. ) And the molding member 17.

The second light emitting diode 102 includes at least two lead frames having a second body 21, first and second lead frames 22, 23, at least one second light emitting chip 25, and a molding member 27. ).

The third light emitting diode 103 includes at least two lead frames having a third body 31, first and second lead frames 32 and 33, at least one third light emitting chip 35, and a molding member 37. ).

The first to third bodies 11, 21, and 31 are insulating materials, for example, polyphthalamide (PPA), polychloro triphenyl (PCT) -based material, liquid crystal polymer (LCP) -based material, PA9T ( At least one of a resin material such as polyamide9T), a silicon, epoxy molding compound (EMC), a material containing metal, photosensitive glass (PSG), sapphire (Al ₂ O ₃ ), and a printed circuit board (PCB). Can be formed. For example, the first to third bodies 11, 21 and 31 will be described as including at least one of a resin material having high reflectance and easy injection molding with the lead frame, for example, PPA and silicon. .

A cathode mark may be formed on the upper side of the first to third bodies 11, 21, and 31, but is not limited thereto. The cathode mark can prevent confusion in the direction of the polarity of each of the light emitting diodes 101, 102, 103.

Cavities 11A, 21A, 31A are formed in the first to third bodies 11, 21, 31, and the cavities 11A, 21A, 31A include a concave shape or a recessed shape with an open upper portion. do. Each cavity 11A, 21A, 31A may be formed in a circular shape, an elliptic shape, a polygonal shape, etc. when viewed from the top side, but is not limited thereto. The first to third bodies 11, 21, and 31 cover the circumferences of the cavities 11A, 21A, and 31A.

At the bottom of the cavity 11A of the first body 11, a plurality of lead frames 11 and 13 are separated from each other by a gap portion. At the bottom of the cavity 21A of the second body 21, a plurality of lead frames 22 and 23 are separated from each other by a gap portion. A plurality of lead frames 32 and 33 are separated by a gap at the bottom of the cavity 31A of the third body 31.

The lead frames 12, 13, 22, 23, 32, and 33 may be formed of a metal plate having a predetermined thickness, and another metal layer may be plated on the surface of the metal plate, but is not limited thereto. The lead frames 12, 13, 22, 23, 32, and 33 are made of metal, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum. It may include at least one of titanium (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), and may be formed to have a single layer or a multilayer structure, and the thickness thereof is 0.8 mm. It may be formed to ˜2mm, but is not limited thereto.

The first light emitting chip 15 may be mounted on at least one of the plurality of lead frames 12 and 13 and may be connected to at least one lead frame by a wire 16. The second light emitting chip 25 may be mounted on at least one of the plurality of lead frames 22 and 23 and may be connected to at least one lead frame by a wire 26. The third light emitting chip 35 may be mounted on at least one of the plurality of lead frames 32 and 33, and may be connected to at least one lead frame by a wire 36.

The first to third light emitting chips 15, 25, and 35 may include a compound semiconductor, and may be selectively formed using a group III-V compound semiconductor. For example, the first to third light emitting chips 15, 25 and 35 may be compound semiconductors of group III-V elements, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP. , GaAs, GaAsP, AlGaInP-based semiconductor material, it can emit light having a unique color of the semiconductor material.

The first light emitting chip 15 emits light B1 having a first main peak wavelength P1 having a blue wavelength, and the second light emitting chip 25 has a second main peak wavelength P2 having a green wavelength. The light emitting device G1 emits light G1, and the third light emitting chip 35 emits light R1 having a fourth main peak wavelength P3 having a red wavelength.

The light emitting chip 15, 25, 35 may be implemented as a horizontal chip in which two electrodes in a chip are disposed in parallel, or a vertical chip in which two electrodes in a chip are disposed on opposite sides of the chip, but is not limited thereto. . The horizontal chip may be connected with at least two wires, and the vertical chip may be connected with at least one wire 42, but is not limited thereto.

Molding members 17, 27, and 37 may be formed in the cavities 11A, 21A, and 31A, and the molding members 17, 27, and 37 may include a translucent resin material such as epoxy or silicon. In addition, a phosphor may not be added to the molding members 17, 27, and 37, but a diffusion agent may be disposed. Lenses may be formed on the molding members 17, 27, and 37, and the lens may include a lens having a concave lens shape, a convex lens shape, a concave portion, and a convex shape.

The first to third light emitting diodes 101, 102 and 103 may be bonded to the bonding members 202 on the pads 12 and 13 of the module substrate 200.

2 and 4, the first body 11 reflects the light B1 of the blue wavelength W1 emitted from the first light emitting chip 15, and the blue wavelength W1. Has a reflectance of 92% or more, for example, in the range of 92-99% and a transmittance of 8% or less, for example, in the range of 1-8%. The first light emitting chip 15 emits light B1 having a first main peak wavelength P1 in the range of 410-460 nm.

A green phosphor 29 is added to the second body 21, and the second body 21 reflects light G1 having a green wavelength W2 emitted from the second light emitting chip 25. And permeate. The second body 21 has a reflectance of 86% or more, for example, 86-92%, and a transmittance of 14% or less, for example, 8-14%, of the light G2 having the green wavelength. The light reflected from the second body 21 is emitted through the cavity 21A, and the transmitted part of the light is emitted by the green phosphor 29 to the third main peak wavelength P21 of another green wavelength range. The light G2 having light is emitted.

The second light emitting chip 25 emits light G1 having a second main peak wavelength P2 within a range of 525 to 555 nm. The green phosphor 29 excites the green light G1 emitted from the second light emitting chip 25 to cause the green third main peak wavelength P21 to be longer than the second main peak wavelength P2. Emit light G2 having The light G2 emitted from the green phosphor 29 may compensate for the color reproduction rate of green in the color coordinate area A2 of FIG. 5. The green phosphor 29 is ^{ZnS: Cu + (Al 3 +} ), SrGa 2 S 4: Eu 2 +, CaMgSi 2 O 7: Eu 2 +, Ca 8 Mg (SiO 4) Cl 2: Eu 2 + (Mn ^{2 +), (Ba, Sr} ) 2 SiO 4: may include at least one of Eu _{2 +.}

A red phosphor 39 is added to the third body 31, and the third body 31 has a fourth red peak wavelength P3 emitted from the third light emitting chip 35. It reflects and transmits light. The third body 31 has a reflectance in the range of 86-92% and a transmittance in the range of 8-14% with respect to the light R1 having the fourth main peak wavelength P3. The third light emitting chip 35 emits light R1 having a fourth main peak wavelength P4 in the range of 615 nm to 630 nm. The light reflected from the third body 31 is emitted through the cavity 31A, and the transmitted light emits the fifth main peak wavelength P31 having a different red wavelength range by the red phosphor 39. Light R2 having light is emitted. The red phosphor 39 excites the light R1 emitted from the third light emitting chip 35 to emit light R2 having a fifth main peak wavelength P31 longer than the fourth main peak wavelength P3. ) Will emit light. The red phosphor 39 may compensate for the red color reproduction rate in the color coordinate area A2 of FIG. 5. The red phosphor 39 ^{_{La 2 O 2 S: Eu 3}} +, Y 2 O 2 S: Eu 3 +, Y 2 O 3: Eu 3 + (Bi 3 +), CaS: Eu 2 +, (Zn, Cd) S: Ag ^{+ (} Cl ⁻ ), K ₅ (WO ₄ ) _6.25 : Eu ^{3 +} _2.5 , LiLa ₂ O ₂ BO ₃ : Eu ^{3 +} .

As described above, the first to third light emitting diodes 101, 102, and 103 are alternately arranged on the module substrate 200 to emit light of the first to fifth main peak wavelengths P1, P2, P21, P3, and P31. do. As shown in FIG. 5, the mixed color coordinates of the blue wavelength, the different green wavelength, and the different red wavelengths emitted from the light emitting module are distributed in the area A2 which is 12-20% wider than the area A1 in NTSC. . Therefore, by adjusting the color coordinate distribution of the first to third light emitting diodes (101, 102, 103), it is possible to improve the color reproduction rate as a whole.

3 is another example of the light emitting diodes of FIG. 1.

Referring to FIG. 3, a blue phosphor 19 is added to the first body 11 among the first to third light emitting diodes 101A, 102 and 103. The blue phosphor 19 emits light having a blue wavelength excited with a long wavelength with respect to the first main peak wavelength emitted by the first light emitting chip 15, and emits a main peak wavelength in the range of 470 ± 10 nm, for example. do.

And a blue phosphor (19) above, wherein the blue phosphor is, for _{example, Sr 2 MgSi 2 O 7:} Eu 2 +, BaMgAl 10 O 17: Eu (Mn), Sr 5 Ba 3 MgSi 2 O 8: Eu 2+, Sr ₂ P ₂ O ₇ : Eu ^{2 +} , SrSiAl ₂ O ₃ N ₂ : Eu ^{2 +} , (Ba _{1 - x} Sr _x ) SiO ₄ : Eu ^{2 +} , (Sr, Ca, Ba, Mg) ₁₀ (PO ₄ ) ^{_{6 C l2: Eu 2+, CaMgSi}} 2 O 6: may include at least one of Eu ^{2 +.}

6 is an exploded perspective view illustrating a display device having a light emitting module according to an embodiment.

Referring to FIG. 6, the display device 1000 includes a display panel 1061 in which an image is displayed, and a backlight unit 1050 which provides light to the display panel 1061.

The backlight unit 1050 may include a light guide plate 1041 for providing a surface light source to the display panel 1061, a reflective sheet 1022 for reflecting leakage light, and light at an edge region of the light guide plate 1041. The light emitting module 300 and the bottom cover 1011 forming the outer appearance of the lower side of the display device 1000 are included.

Although not illustrated, the display apparatus 1000 may include a panel supporter that supports the display panel 1061 from the lower side, a top that forms an edge of the display apparatus 1000, and surrounds and supports the periphery of the display panel 1061. It may include a cover.

Although not shown in detail, the display panel 1061 may include, for example, a lower substrate and an upper substrate coupled to each other to maintain a uniform cell gap, and a liquid crystal layer (not shown) interposed between the two substrates. Include. A plurality of gate lines and a plurality of data lines intersecting the plurality of gate lines may be formed on the lower substrate, and a thin film transistor (TFT) may be formed at an intersection of the gate line and the data line. Color filters may be formed on the upper substrate. The structure of the display panel 1061 is not limited thereto, and the display panel 1061 may have various structures. In another example, the lower substrate may include a color filter as well as a thin film transistor. In addition, the display panel 1061 may be formed in various shapes according to a method of driving the liquid crystal layer.

Although not shown, a gate driving printed circuit board (PCB) for supplying scan signals to gate lines and a data driving printed circuit board (PCB) for supplying data signals to data lines are provided at edges of the display panel 1061. ) May be provided.

A polarizing film (not shown) may be disposed on at least one of the top and bottom of the display panel 1061. An optical sheet 1051 may be disposed below the display panel 1061, and the optical sheet 1051 may be included in the backlight unit 1050, and may include at least one prism sheet or / and a diffusion sheet. have. The optical sheet 1051 may be removed, but is not limited thereto.

The diffusion sheet evenly spreads the incident light, and the diffused light may be focused onto the display panel by the prism sheet. Here, the prism sheet may be selectively configured using a horizontal or / and vertical prism sheet, one or more roughness reinforcing sheets, and the like. The type, number, etc. of the optical sheet 1051 may be added or deleted within the technical scope of the embodiment, but is not limited thereto.

The light emitting module 300 may be disposed on at least one side of an inner side of the bottom cover 1011. The light emitting module 300 may be disposed on both side surfaces or all side surfaces of the bottom cover 1011, but is not limited thereto. In addition, the light emitting module 300 may be disposed on the bottom of the bottom cover 1011 to be mounted in a direct manner. In this case, the configuration of an optical member such as a light guide plate or an optical sheet may vary.

The light emitting module 300 includes a module substrate 200 and a plurality of light emitting diodes 101, 102, 103 arranged on one surface of the module substrate 200.

The module substrate 200 may be coupled in a direction perpendicular to the bottom of the bottom cover 1011 or disposed in a direction parallel to the bottom of the bottom cover 1011, but is not limited thereto.

The module substrate 200 may be combined with an adhesive, an adhesive, or a fastening member on the bottom cover 1011 or the heat dissipation plate, but is not limited thereto.

The plurality of light emitting diodes 101, 102, 103 are disposed to face at least one side of the light guide plate 1041, and light generated from the plurality of light emitting diodes 101, 102, 103 is incident. The light guide plate 1041 may be formed in a polygonal shape including an upper surface at which a surface light source is generated, a lower surface opposite to the upper surface, and at least four side surfaces. The light guide plate 1041 is made of a transparent material, and may include, for example, one of an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN) resin. Can be. The light guide plate 1041 may be formed by an extrusion molding method, but is not limited thereto.

A reflective pattern (not shown) may be formed on the top or / and bottom of the light guide plate 1041. The reflection pattern is formed of a predetermined pattern, for example, a reflection pattern and / or a prism pattern, thereby reflecting or / and diffusely reflecting light, so that the light may be uniformly irradiated through the entire surface of the light guide plate 1041. The lower surface of the light guide plate 1041 may be formed in a reflective pattern, and the upper surface may be formed in a prism pattern. A scattering agent may be added to the inside of the light guide plate 1041, but is not limited thereto.

The reflective sheet 1022 may be provided under the light guide plate 1041. The reflective sheet 1022 reflects light traveling toward the lower portion of the light guide plate 1041 toward the display panel. The reflective sheet 1022 re-injects the light leaked to the lower portion of the light guide plate 1041 to the light guide plate 1041, thereby preventing problems such as a decrease in light efficiency, a decrease in optical characteristics, and dark areas. The reflective sheet 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective sheet 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 includes an accommodating part 1012 having an open top, and the accommodating part 1012 includes a light emitting module 300, an optical sheet 1051, a light guide plate 1041, and a reflecting sheet 1022. Can be stored. The bottom cover 1011 may be formed of a material having a high heat dissipation efficiency, for example, a stainless material, but is not limited thereto.

A reflective sheet 1022, a light guide plate 1041, and an optical sheet 1051 may be sequentially stacked on the accommodating portion 1012 of the bottom cover 1011, and the light emitting module 300 may include the bottom cover 1011. The side surface of the light guide plate 1041 is disposed to correspond to.

At least one light emitting module 300 may be disposed in the bottom cover 1011, but is not limited thereto.

7 is a diagram illustrating a display device having the light emitting module of FIG. 1.

Referring to FIG. 7, the display device 1100 may include a bottom cover 1152, a module substrate 200 on which the first to third light emitting diodes 101, 102, and 103 disclosed above are arranged, an optical member 1154, and a display panel ( 1155).

The light emitting module 300 includes the module substrate 200 and the first to third light emitting diodes 101, 102, and 103 disclosed in the embodiment. The bottom cover 1152, the at least one light emitting module 300, and the optical member 1154 may be defined as a light unit (not shown).

The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto.

The optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methy methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses the incident light, and the horizontal and vertical prism sheets condense the incident light onto the display panel 1155. The brightness enhancing sheet reuses the lost light to improve the brightness .

The optical member 1154 is disposed on the light emitting module 300, and performs surface light source, diffusion, condensing, etc. of the light emitted from the light emitting module 300.

8 is a perspective view of a lighting device having the light emitting module of FIG. 1.

Referring to FIG. 8, the lighting device 1500 includes a case 1510, a light emitting module 300 disposed in the case 1510, and a connection terminal installed in the case 1510 and receiving power from an external power source. 1520.

The case 1510 may be formed of a material having good heat dissipation, for example, may be formed of a metal material or a resin material.

The light emitting module 300 may include a module substrate 200 and first to third light emitting diodes 101, 102, and 103 according to an embodiment mounted on the module substrate 200. The first to third light emitting diodes 101, 102, and 103 may be arranged in a plurality of matrix forms or spaced apart at predetermined intervals.

The module substrate 200 may be a circuit pattern printed on the insulator, for example, a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB , FR-4 substrates, and the like.

In addition, the module substrate 200 may be formed of a material that reflects light efficiently, or a surface may be coated with a color such as white, silver, etc., in which the light is efficiently reflected.

The first to third light emitting diodes 101, 102, and 103 may improve color reproducibility using light of blue, different green wavelengths, and different red wavelengths. The light emitting module 300 may secure high color rendering (CRI) by combining the first to third light emitting diodes 101, 102, and 103.

The connection terminal 1520 may be electrically connected to the light emitting module 300 to supply power. The connection terminal 1520 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

The light emitting module disclosed in the above embodiments may be applied to a backlight unit of a top view type, or to a backlight unit such as a portable terminal, a computer, or an illumination device such as a lamp, a traffic light, a vehicle headlight, an electric sign, a street lamp, and the like. It is not limited. In addition, the light guide plate may not be disposed in the direct type light emitting module, but is not limited thereto. In addition, a light transmitting material such as a lens or glass may be disposed on the light emitting module, but is not limited thereto.

It is not intended to be limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims, As will be described below.

11, 21, 31: body, 15: first light emitting chip, 25: second light emitting chip, 35: third light emitting chip, 19: blue phosphor, 29: green phosphor, 39: red phosphor, 101, 102, 103: light emitting diode, 200 Module substrate 300 light emitting module

Claims (12)

A first light emitting diode comprising a first body having a cavity and a first light emitting chip disposed in the cavity of the first body and emitting blue light;
A second body having a cavity; A second light emitting chip disposed in the cavity of the second body and emitting light having a green wavelength; And a first phosphor in the second body, the first phosphor emitting light having a longer wavelength than the wavelength emitted from the second light emitting chip;
A third body having a cavity, a third light emitting chip disposed in the cavity of the third body and emitting red light; A third light emitting diode including a second phosphor in the third body that emits light having a longer wavelength than the wavelength emitted from the third light emitting chip; And
A light emitting module comprising a module substrate on which the first to third light emitting diodes are disposed. The light emitting module of claim 1, wherein the first phosphor comprises a green phosphor. The light emitting module of claim 1, wherein the second phosphor comprises a red phosphor. The light emitting module according to any one of claims 1 to 3, further comprising a blue phosphor in the first body that emits light having a longer wavelength than light having a wavelength emitted from the first light emitting chip. The light emitting module according to any one of claims 1 to 3, wherein the first and second phosphors are respectively distributed in the first and second bodies disposed around the cavity. The light emitting module of claim 1, wherein the first body has a transmittance in a range of 1-8% with respect to light emitted from the first light emitting chip. The light emitting module according to any one of claims 1 to 3, wherein the second body has a transmittance in a range of 8-14% with respect to light emitted from the second light emitting chip. The light emitting module according to any one of claims 1 to 3, wherein the third body has a transmittance in the range of 8-14% with respect to light emitted from the third light emitting chip. The light emitting module according to any one of claims 1 to 3, wherein the second light emitting diode emits two main peak wavelengths in a green wavelength range. The light emitting module of claim 9, wherein the third light emitting diode emits two main peak wavelengths within a red wavelength range. The light emitting module of claim 1, wherein the first to third cavities include a transparent resin material. An illumination system comprising the light emitting module of claim 1.

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