KR20150086670A - Lighting source module and light system having the same - Google Patents

Abstract

The present invention relates to a lighting source module. A lighting source module according to an embodiment includes a plate which has the length of a first direction which is wider than that of a second direction and has electrode parts and at least one insulating part between the electrode parts; light emitting chips which are arranged in the first direction on the first surface of the plate; and a molding member which covers the light emitting chips. The light emitting chips are electrically connected to the electrode parts. The insulating parts include the same material as the electrode part. The plate includes grooves which are concave in a direction from the second surface opposite to the first surface to the first surface. At least one groove is arranged in each of the electrode parts.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light source module,

Embodiments relate to a light source module and an illumination system having the same.

BACKGROUND ART Light emitting diodes, for example, light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light, and have been widely recognized as a next generation light source in place of conventional fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

As a result, many researches for replacing the existing light source with light emitting diodes have been conducted. As information processing technology has developed, display devices such as LCD, PDP, and AMOLED have been widely used. Among these display devices, the LCD requires an illumination system such as a backlight unit capable of generating light in order to display an image.

Embodiments provide a light source module in which a plurality of light emitting chips are arranged on a plate whose length is longer than the width.

Embodiments provide a light source module having a plurality of light emitting chips mounted on a plate having at least three electrode portions.

An embodiment covers a light emitting chip with a molding member having a width equal to the width of the plate, and provides two or three side faces of the molding member with the light source module open.

A light source module according to an embodiment includes a plate having a length in a first direction longer than a width in the second direction and having a plurality of electrode portions and at least one insulating portion between the plurality of electrode portions; A plurality of light emitting chips arranged on the first surface of the plate in the first direction; And a molding member covering the plurality of light emitting chips, wherein the plurality of light emitting chips are electrically connected to the plurality of electrode portions, the insulating portion includes the same material as the plurality of electrode portions, And a plurality of grooves recessed in the direction of the first surface from a second surface opposite to the first surface, wherein the plurality of grooves are disposed in at least one of the electrode portions.

The embodiment can improve the heat radiation efficiency of the light emitting chip.

Embodiments can provide a thin thickness of a light source module in which a plurality of light emitting chips are packaged by mounting a plurality of light emitting chips on a plate.

The embodiment can improve the reliability of the light source module.

Embodiments can improve the reliability of an illumination system having a light source module.

1 is a plan view of a light source module according to a first embodiment.
2 is a side view of the light source module of FIG.
3 is a perspective view of the light source module of FIG.
4 is a detailed view of the first electrode unit of the light source module of FIG.
FIG. 5 is a detailed view of a second electrode portion of the light source module of FIG. 2. FIG.
6 is a view illustrating a center region of a third electrode portion of the light source module of FIG.
7 is a view illustrating connection terminals of the light source module of FIG.
8 is a view showing an example in which the light source module of FIG. 2 is mounted on a substrate.
9 is a cross-sectional view of the light source module and the substrate of Fig. 8 on the AA side.
10 is a cross-sectional side view of the light source module and the substrate of Fig. 8 on the BB side.
FIGS. 11 and 12 are side views showing a modification of the groove of the light source module according to the embodiment.
13 and 14 show an example in which the number and the interval of the grooves are modified in the plate of the light source module in the embodiment.
15A and 15B are views showing an example of changing the shape of the groove of the plate of the light source module according to the embodiment.
16 is a side view showing a part of the light source module according to the second embodiment.
17 is a perspective view showing a light source module according to the third embodiment.
18 is a side view showing a light source module according to the fourth embodiment.
FIG. 19 is a diagram showing the light source module of FIG. 2 mounted on a substrate.
20 and 21 are views showing a manufacturing process of the light source module of FIG.
22 is a perspective view showing a display device having a light source module according to an embodiment.

In the description of the embodiments, each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, Quot; on "and" under "include both what is meant to be" directly "or" indirectly & . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

Hereinafter, a light source module according to an embodiment will be described with reference to the accompanying drawings.

1 is a side view of the light source module of FIG. 1, FIG. 3 is a perspective view of the light source module of FIG. 1, and FIG. 4 is a cross- FIG. 6 is a view showing a center region of the third electrode portion of the light source module of FIG. 2, and FIG. 7 is a cross-sectional view of the light source module of FIG. 2 is a view showing a light emitting chip and a connection terminal of the light source module of FIG. 2. FIG.

1 to 7, the light source module 100 includes a plate 10 having a plurality of electrode portions 11, 13, and 15 and a plurality of insulating portions 113 and 114; A plurality of light emitting chips (50; 51, 53, 55, 57) disposed on a first side (1) of the plate (10); A plurality of grooves (31, 32, 33) disposed on the second surface (2) of the plate (10); And a molding member (81) covering the plurality of light emitting chips (50, 51, 53, 55, 57).

The plate 10 includes a first surface 1 on which a plurality of light emitting chips 50 are arranged, a second surface 2 opposite to the first surface 1, first through fourth surfaces 4, 3, 4, 5, 6). The first surface 1 may be formed as a continuous horizontal surface, and the side wall portions 12 and 14 may protrude from both ends thereof. The second surface 2 may have a horizontal surface, for example, an area excluding the grooves 31, 32, and 33, as a horizontal surface. The surface of the plurality of insulating portions 113 and 114 may be formed as a flat horizontal surface with respect to the first surface 1, the second surface 2, the third surface 5 and the fourth surface 6. In addition, the surfaces of the plurality of insulating portions 113 and 114 may be formed in the same horizontal plane as the surface of the plate 10. At least one of the third and fourth side surfaces 5 and 6 is a surface to be mounted on the substrate, so that the light source module 100 emits light in a lateral direction.

The plate 10 includes a plurality of electrode portions 11, 13, and 15 divided by a plurality of insulating portions 113 and 114. The plurality of insulating portions 113 and 114 may be formed of two or more, It is not limited thereto. In an embodiment, the plate 10 is arranged such that the length D2 is longer than the width D1 by more than a hundred times, and the plurality of light emitting chips 50 are arranged in a row along the direction Y of the length D2. The width D1 of the plate 10 may be less than twice the length of either side of the light emitting chip 50. For example, when the light emitting chip 50 is rectangular, May be less than 2 times.

The plate 10 may be formed in a bar shape having a predetermined length D2, and 10 or more, for example, 15 or more light emitting chips 50 may be arranged. The length D2 of the plate 10 in the first direction Y is in the range of 100 to 200 times the width D1 of the second direction X and the length D2 is not less than 50 mm For example, in the range of 50 mm to 100 mm. The width D1 of the plate 10 may be 1 mm or less, for example, 0.35 mm to 0.5 mm. The thickness T1 of the plate 10 may be greater than the width D1. The thickness T1 of the plate 10 may be in the range of 1/80 to 1/120 times the length D2, and may be in the range of 0.5 mm to 0.6 mm, for example. Since the thickness T1 of the plate 10 is the thickness excluding the first and second side wall portions 12 and 14, the heat radiation surface area increases as the plate 10 increases, so that the heat radiation efficiency can be improved. The width D1 of the plate 10 may be three times or less, for example, two times the width of the light emitting chip 50, that is, the width of the light emitting chip 50 in the second direction. Here, the plate 10 may be provided with a width considering the process margin by doubling the width of the light emitting chip 50. For example, the light emitting chip 50 may be spaced apart from the third and fourth side faces 5 and 6 of the plate 10 by a predetermined distance, for example, in a range of 50 mu m or more, for example, 50 mu m to 100 mu m. As another example, the length D2 of the plate 10 may be 100 mm or more, and the light emitting chip 10 may be arranged, for example, in two or more rows. When the number of the light emitting chips 50 is two or more, the width D1 may be 2 mm or less.

The plate 10 includes a first side wall portion 12 and a second side wall portion 14 facing each other. The first and second side wall portions 12 and 14 protrude from the horizontal line of the first surface 1 of the plate 10 and can reflect light emitted from the light emitting chip 50, The overflow of the member 81 can be prevented. The first and second sidewall portions 12 and 14 may have the same structure as the plate 10, or they may be attached with different metal materials.

The first and second side wall portions 12 and 14 have the same width as the width D1 of the plate 10 and the upper surface of the light emitting chip 50 is higher than the upper surface of the light emitting chip 50, The wire 59 may be disposed at a position higher than the peak of the wire 59 connected thereto. The upper surfaces of the first and second side wall portions 12 and 14 may be located at the same position as the upper surface of the molding member 81. The thickness T2 of the first and second sidewall portions 12 and 14 may be equal to or greater than the width D1 of the plate 10 and may be 0.4 to 0.45 mm, for example. The thickness T2 of the first and second sidewall portions 12 and 14 may be formed in consideration of the thickness of the light emitting chip 50 and the peak position of the wire 59,

The entire area of the plate 10 can be used as a member for dissipating heat generated from the light emitting chip 50 and supplying power. The plate 10 is exposed by the first to fourth side surfaces 3, 4, 5, 6 and the second surface 2.

The material of the plate 10 may be a metal having a high heat dissipation efficiency, for example, aluminum (Al) or a ceramic material. The plate 10 may be formed of another metal material such as iron (Fe), titanium (Ti), magnesium (Mg), copper (Cu), nickel (Ni), gold (Au), chromium And may further include at least one of Ta, Pt, Sn, Ag, P, a selective alloy of the above metals, or a ceramic material. Further, a plating layer such as gold (Au) may be formed on the surface of the plate 10, but the present invention is not limited thereto. The plate 10 may be formed in multiple layers selectively using the metals, but the present invention is not limited thereto.

The plate 10 may be formed of a metal such as aluminum (Al), silver (Ag), and gold (Au) having a reflection efficiency of 70% or more with respect to light emitted from the light emitting chip 50 have. Such a plate 10 may be formed in consideration of heat radiation efficiency and reflection efficiency, but is not limited thereto.

The plurality of electrode portions 11, 13 and 15 are arranged in a line and are separated and insulated by insulation portions 113 and 114 disposed between adjacent two electrode portions 11, When one insulating portion is disposed on the plate 10, two electrode portions may be formed, and when two insulating portions are disposed, three electrode portions may be formed. This means that the number of the electrode parts is one more than the number of the insulating parts. The first and second electrode units 11 and 13 and the first and second electrode units 11 and 12 disposed on the opposite sides of the first electrode unit 11 and the second electrode unit 13 when the plurality of electrode units 11, And a third electrode part 15 disposed between the first electrode part 13 and the second electrode part 15. The first and second electrode units 11 and 13 may be connected to a power source having the same polarity and a power source having a polarity different from that of the polarity power source connected to the third electrode unit 15. For example, the first and second electrode units 11 and 13 may be connected to the minus (-) terminal of the power source, the third electrode unit 15 may be connected to the positive terminal of the power source, It is not limited thereto.

The insulating portions 113 and 114 are formed of a metal oxide having a first metal. The electrode portions 11, 13, 15 of the plate 10 may be a first metal, for example, a single metal or an alloy. For example, the first metal may be formed of aluminum (Al), or may be an alloy containing aluminum. The insulating portions 113 and 114 may be formed of a metal oxide having the first metal, for example, aluminum oxide (Al ₂ O ₃ ).

Here, the plurality of insulating portions 113 and 114 may be an anodized region formed by anodizing the plate 10. The insulating portions 113 and 114 are formed of, for example, an oxide film for aluminum metal. The method for forming the insulating portions 113 and 114 is anodizing the anode and the cathode as a metal surface treatment method. Loses. This treatment method is called anodizing, alumite, and aluminum oxide coating treatment and forms an oxide film on the surface of aluminum metal. Accordingly, the plate 10 may include a plurality of insulating portions 113 and 114 and a plurality of electrode portions 11, 13, and 15.

The insulating portions 113 and 114 have the same height as the thickness of the plate 10 and can be formed without a boundary in the boundary region with the adjacent two electrode portions 11, 15, and 15. Since the insulation portions 113 and 114 in the plate 10 are formed by the anodic oxidation process, the interface between the electrode portions 11 and 13 and the insulation portions 113 and 114 may not exist, 11, 13, 15).

The width of each of the insulation portions 113 and 114 is an interval between adjacent electrode portions 11 and 13 and 15 and is a distance between adjacent two electrode portions 11, . The width of each of the insulating portions 113 and 114 may be smaller than the width of one side of the light emitting chip 50. The width of each of the insulating portions 113 and 114 may be, for example, 70 mu m or more, but is not limited thereto. As the number of the insulating portions 113 and 114 increases in the plate 10, the rigidity of the plate 10 decreases. This is because the insulation portions 113 and 114 made of different materials are disposed in the long plate 10, thereby causing the rigidity in the longitudinal direction to deteriorate.

3 to 5, the length of the first electrode unit 11, that is, the length B1 of the first direction Y is determined by the distance between the first side 3 of the plate 10 and the first insulation unit And the length B2 of the second electrode portion 13 is an interval between the second side surface 4 of the plate 10 and the second insulating portion 114. [ The length B1 of the first electrode part 11 may be the same as or different from the length B2 of the second electrode part 13 and is not limited thereto. The lengths B1 and B2 of the first and second electrode portions 11 and 13 may be changed according to the positions of the first and second insulating portions 113 and 114. [ One or a plurality of light emitting chips 51 and 53 may be disposed on the first and second electrode units 11 and 13, or no light emitting chip may be disposed.

The length of the third electrode part 15 may be a distance between the insulating parts 113 and 114 and may be at least twice the sum of the lengths B1 and B2 of the first and second electrode parts 11 and 13. [ But it is not limited thereto. At least 80% of the light emitting chips 50 may be mounted on the third electrode part 15.

As shown in FIG. 2, the plurality of light emitting chips 50, for example, ten or more light emitting chips 50 may be arranged in a row on the first surface 1 of the plate 10. The plurality of light emitting chips 50 may include a plurality of arrays 50A and 50B connected in series and include, for example, a first array 50A and a second array 50B. The first and second light emitting chips 51 and 55 located at both ends of the first array 50A are connected in series and are electrically connected to the first and third electrode units 11 and 15. Third and fourth light emitting chips 53 and 57 located at both ends of the second array 50B are connected in series and are electrically connected to the second and third electrode units 13 and 15. [ The first array 50A and the second array 50B may be connected to the third electrode unit 15 through a common electrode. The number of light emitting chips of the first array 50A and the number of light emitting chips of the second array 50B may be the same.

The center region 17 between the first array 50A and the second array 50B is a common electrode and the second light emitting chip 55 and the fourth light emitting chip 57 are bonded to the wires 59 . The center region 17 may not have a separate connection terminal. The distance between the light emitting chips of the first array 50A adjacent to the center region 17 and the light emitting chips of the second array 50B may be equal to or different from the distance between the light emitting chips in the respective arrays 50A and 50B have.

The first light emitting chip 51 is connected to the first electrode unit 11 by a wire 59 and the third light emitting chip 53 is connected to the second electrode unit 13 by a wire 59 do. A region of the first electrode unit 11 connected to the wire 59 is an area between the first light emitting chip 51 and the first sidewall unit 12, (59) is an area between the third light emitting chip (53) and the second side wall part (14).

The area of the third electrode part 15 connected by the wire 59 may be a plurality of areas or the center area 17 of the plate 10 or the second and fourth light emitting chips 55 and 57 ). In addition, the regions connected by the wires 59 in the first to third electrode units 11, 13, and 15 may be located on the same plane, but the present invention is not limited thereto.

The plurality of light emitting chips 50 are divided into two or more arrays 50A and 50B on the plate 10 to provide electrically and circuit stabilized drive circuits. In addition, when the plurality of light emitting chips 50 are arranged by the two arrays 50A and 50B, the allowable capacity of the drive driver can be prevented from exceeding.

Each of the light emitting chips 50 is an LED chip, and includes semiconductor layers having at least one of compound semiconductor, such as Group II-VI compound semiconductor and Group III-V compound semiconductor, . The light emitting chip 50 may be implemented as a chip that emits a visible light band such as red, green, blue, or white or an ultra violet band. The light emitting chip 50 may be implemented as a horizontal chip having two electrodes disposed adjacent to each other or a vertical chip having two electrodes disposed on opposite sides of the chip, And the vertical chip can be connected to at least one wire. The at least one light emitting chip 50 may be mounted in a flip structure, but is not limited thereto. Embodiments may be such that wires are bonded to a horizontal chip. Each light emitting chip 50 may be connected to two wires 59, for example.

The light-emitting chip 50 may include a support substrate (not shown), such as a conductive, insulating, or translucent support substrate. The support substrate may be disposed on the first side 1 of the plate 10 And can be adhered with an adhesive.

A connection terminal 171 is disposed between adjacent two light emitting chips of the plurality of light emitting chips 50. The connection terminal 171 functions as an intermediate connection terminal for connecting two adjacent light emitting chips, do. In addition, the number of connection terminals 171 is arranged in a smaller number than the total number of the light emitting chips 50, and may be increased or decreased according to the distance between the light emitting chips 50.

The thickness of the connection terminal 171 may be smaller than the thickness of the light emitting chip 50. The thickness of the connection terminal 171 may be reduced to reduce the height difference between the ends of the wire 59, And the tensile force acting on the wire 59 can be improved.

4 to 6, the connection terminal 171 includes a conductive layer 175 and an insulating layer 173, and the insulating layer 173 is formed between the conductive layer 175 and the plate 10 Is disposed between the first surface (1). The conductive layer 175 overlaps with the insulating layer 173 in the vertical direction and electrically connects the adjacent two light emitting chips 50, 51, 53, 55, and 57. The insulating layer 171 may be made of a resin material such as silicon or epoxy or a material such as a tape. The conductive layer 175 may include a material for bonding, such as gold or gold alloy, , Ag), but the present invention is not limited thereto.

The interval between the connection terminals 171 may be equal to or narrower than the interval between the light emitting chips 50, but the present invention is not limited thereto. The size of the connection terminal 171 may be smaller than the size of the light emitting chip 50, but the present invention is not limited thereto. The connection terminal 171 may be disposed in a region between the light emitting chips 50 and may be molded without being exposed by the molding member 81. As another example, the connection terminal 171 may be partially exposed on the side of the molding member 81, for example, on the third or fourth side of the plate 10.

All the connection terminals 171 may be disposed on the third electrode unit 15 so that the lengths of the first and second electrode units 11 and 13 may be shortened. As another example, at least one connection terminal may be disposed on or overlapped with the insulating portions 113 and 114, but is not limited thereto. The connection terminals 171 may be removed, and the plurality of light emitting chips 50 may be connected to each other by wires.

A molding member 81 is disposed on the first side 1 of the plate 10 and the molding member 81 is disposed between the first side wall portion 12 and the second side wall portion 14. The molding member 81 contacts the first and second side wall portions 12 and 14 and covers the plurality of light emitting chips 50, the connection terminals 171 and the wires 59. The length of the molding member 81 is a distance between the first and second side wall portions 12 and 14 and the width of the molding member 81 may be a width D1 of the plate 10. The thickness of the molding member 81 may be the same as the height T2 of the first and second side wall portions 12 and 14, but the present invention is not limited thereto. As another example, at least a part of the molding member 81 may be formed thicker or thinner than the height T2 of the first and second side wall portions 12 and 14, but is not limited thereto.

The molding member 81 is exposed on its top and both sides, and light is extracted through the exposed surface. Both sides of the molding member 81 may be disposed on the same plane as the third and fourth sides 5 and 6 of the plate 10, but the present invention is not limited thereto.

The molding member 81 may have corner portions between the upper surface and both side surfaces thereof, chamfered surfaces, or curved surfaces. Accordingly, the molding member 81 may have a polygonal cross section or a hemispherical cross section, but the present invention is not limited thereto.

The upper surface of the molding member 81 may be a flat horizontal surface, a concave curved surface, or a convex curved surface. Alternatively, the upper surface of the molding member 81 may be formed as a rough surface.

The molding member 81 may include a light transmitting resin material such as epoxy or silicon, and a phosphor or a diffusing agent may be optionally added thereto, but the present invention is not limited thereto. The fluorescent material may include, for example, a YAG-based, a silicate-based, or a TAG-based fluorescent material. An optical lens (not shown) may be formed on the molding member 81. The optical lens may have a concave lens shape, a convex lens shape, or a lens having a concave portion and convex portions.

An adhesive layer may be further formed on the interface between the molding member 81 and the plate 10 and the adhesive layer may be made of the same material as the molding member 81 or a different material or a material such as silicone or epoxy have. A metal oxide such as TiO ₂ or SiO ₂ may be added to the adhesive layer, but the present invention is not limited thereto.

The light source module 100 of the embodiment can be provided with a thin thickness by disposing a plate having a plurality of electrode portions 11, 13, and 15 below the plurality of light emitting chips 50. [ For example, the light emitting chip package is manufactured by mounting a light emitting chip on a lead frame in the body and packaging the molded light emitting chip package with a molding member 81, arranging the light emitting chip package on the board (PCB) There is a problem that the thickness of the light source module becomes thick and the number of steps is complicated.

The light source module 100 according to the embodiment may be provided as a linear light source, and the plurality of light emitting chips 50 may be selected from serial connection, serial-parallel connection, or parallel connection.

FIG. 8 is an example of mounting the light source module of FIG. 2 on a substrate, FIG. 9 is a sectional view of the light source module of FIG. 8 on the A-A side, and FIG. 10 is a sectional view of the light source module of FIG. 8 on the B-B side.

Referring to FIGS. 8 to 10, when the plate 10 is a metal having a weak adhesive force such as aluminum, it may include a layer plated with a different material for bonding with the substrate 191. The plated layer may be provided on at least one of the second side 2, the third and the fourth sides 5, 6 of the plate 10. The plated layer may be provided on the second side 2 for efficiency of the manufacturing process of the light source module 100. The first to fourth side surfaces 3, 4, 5, and 6 of the plate 10 may be cut surfaces, and a plating layer may be formed on the first to fourth side surfaces 3, 4, There is a difficulty in forming. Here, the cut first to fourth side faces 3, 4, 5, 6 may have rougher faces, for example, roughness, than the second face 2.

Here, although a via structure vertically penetrating the plate 10 can be formed, there is a problem that the molding member 81 penetrates into the via structure when the molding member 81 is molded. Therefore, when bonding the plate to the substrate, there is a problem that bonding failure occurs. Further, when a plurality of via structures are formed on the plate, there is a problem that the rigidity may be deteriorated. Further, when the via structure is formed on the third and fourth side faces 5 and 6 of the plate 10, there is a problem that the process margin becomes small.

4 to 10, the embodiment provides a plurality of grooves 31, 32, 33 on the second surface 2 of the plate 10 without forming a via structure in the plate 10 , And the bonding layer 26 can be formed. The plate 10 can be provided in a structure that can be mounted on the substrate 191 as the third side 5 or the fourth side 6 by the second side 2, It is possible to prevent leakage of the light source 81, prevent the rigidity of the plate 10 from being lowered, and improve the margins in the manufacturing process of the light source module.

Referring to FIGS. 2 to 6, the plate 10 includes a plurality of grooves 31, 32, and 33. The plurality of grooves 31, 32, 33 are recessed from the second surface 2 of the plate 10 toward the first surface 1. The distance D3 between the grooves 31, 32 and 33 arranged on the second surface 2 of the plate 10 may be larger than the distance between the light emitting chips 50, for example. The interval D3 may be in a range of 10 mm or less, for example, 7 mm to 9 mm, and the interval D3 may vary depending on the number of grooves 31, 32, and 33.

The depth T4 of the plurality of grooves 31,32,33 is less than the thickness T1 of the plate 10 and less than the height T2 of the first and second sidewall portions 12,14. Depth. The depth T4 of the grooves 31, 32 and 33 may be in the range of 30% to 70% of the thickness of the plate 10 and may be in the range of 0.27 mm to 0.33 mm, for example. The gap T5 between the second groove 33 and the first surface 1 may be smaller than the depth T4 of the grooves 31, 32 and 33 in the range of 0.25 mm to 0.3 mm.

The widths T3 and T4 of the grooves 31 and 32 may be equal to or different from each other and the width T3 may be greater than the depth T4. This makes it possible to increase the bonding area efficiently by increasing the width T3 of the grooves 31, 32, 33 arranged in the plate 10 having the long length D2. The width T3 of the grooves 31,32 and 33 is larger than the depth T4 of the grooves 31,32 and 33 and the width T4 of the grooves 31,32 and 33 is 140% To 200%, for example, in the range of 0.4 mm to 0.6 mm.

Here, the plurality of grooves 31, 32, and 33 may have the same width or at least one or at least two different widths, but the present invention is not limited thereto. The depth of the third groove 33 may be smaller than the depth of the first and second grooves 31 and 32. This ensures the rigidity of the center region of the plate 10. [ In addition, by providing a plurality of the third grooves 33 in a plurality, the electrical reliability can be improved. Any one of the third grooves 33 may be disposed at the same interval as the center area 17 of the plate 10, that is, the first and second grooves 31 and 32, (31, 32).

The length of each of the grooves 31, 32, and 33 may be the same as the width D1 of the plate 10. Accordingly, the lengths of the grooves 31, 32, and 33 may be equal to the width of the molding member 81. The length of each of the grooves 31, 32, and 33 may be the same as the width of the first to third electrode portions 11, 13 and 15, or the width of the first and second side wall portions 12 and 14 ≪ / RTI > The grooves 31, 32, and 33 may be longer than the width T3. The longitudinal direction of the grooves 31, 32, 33 is the width direction of the plate 10, and is a direction orthogonal to the longitudinal direction of the plate 10.

4 to 6, at least one groove 31, 32, 33 may be disposed in each of the electrode portions 11, 13, 15 in the plurality of grooves 31, 32, 33. For example, the first electrode unit 11 and the second electrode unit 13 may include at least one groove 31, 32, and the first groove 31 (31) of the first electrode unit 11 And the second grooves 32 of the second electrode part 13 are arranged so as to overlap with the second side wall part 14 in a direction perpendicular to the first side wall part 12 do.

The third electrode part 15 may be provided with one or a plurality of third grooves 33. The third grooves 33 of the third electrode part 15 may be disposed in a larger number than the grooves 31 and 32 of the first and second electrode parts 11 and 13, I do not. A plurality of third grooves 33 of the third electrode unit 15 may be spaced at regular intervals or at irregular intervals for fixing the plate 10. The distance between the third groove 33 and the central region 17 of the plate 10 may be gradually widened to prevent the rigidity of the center region 17, which is relatively weaker than the peripheral region, can do.

A bonding layer 26 may be formed on each of the grooves 31, 32, and 33. The bonding layer 26 may be made of a material different from the material of the plate 10. For example, the bonding force of the bonding material 199 of FIG. 9 is better than that of the plate 10, and the electrical conductivity and thermal conductivity (10). The bonding layer 26 may be formed of, for example, silver or a silver alloy. Further, another layer such as a base plating layer may be formed between the bonding layer 26 and the plate 10. The underlying plating layer includes nickel, copper, a nickel alloy, or a copper alloy.

When the bonding layer 26 is formed in the grooves 31, 32 and 33, the bonding layer 26 may be exposed to the second surface 2, the third and fourth sides 5 and 6 . Since the bonding layer 26 is disposed on the surfaces of the grooves 31, 32 and 33 as a thin film, the inner region 25 of each bonding layer 26 is an open groove, 3 and the fourth side faces 5, 6 are opened. 8 to 10, when the third side surface 5 of the plate 10 is mounted on the substrate 191, the bonding layer 26 of the grooves 31, 32, 33 of the plate 10, And the pad 195 of the substrate 191 are bonded to the bonding member 199. At this time, the bonding member 199 can be disposed in the inner region 25 of the grooves 31, 32, 33, so that the bonding area with the bonding layer 26 can be increased. The bonding member 199 may electrically connect the first, second, and third electrode portions 11, 13, and 15 to the substrate 191 through a bonding layer 26. Here, the area of the pad 195 of the substrate 191 may be larger than the area of the grooves 31, 32, 33.

The grooves 31,32 and 33 of the electrode parts 11,13 and 15 and the substrate 191 are connected to each other by the bonding member 199 so that the substrate 191 is electrically connected to the electrode parts 11 , 13, 15).

The light emitted from the light source module 100 may be emitted through the molding member 81. Here, the third side surface 5, which is the mounting surface of the plate 10, may be contacted with or spaced from the substrate 191, and either side of the molding member 81 is in contact with the substrate 191, It is not limited thereto. That is, when the third side surface 5 of the plate 10 is mounted on the substrate 191, the third side surface 5 of the plate 10 and one side surface of the molding member 81 are bonded to the substrate 191 191), and in this case, the optical loss can be reduced.

The third electrode part 15 may include grooves that are not electrically connected to the substrate 191 among the plurality of third grooves 33. For example, the third electrode part 15 may include the center area 17 May be electrically connected to the substrate 191 and the remaining grooves may not be electrically connected to the substrate 191. [ This can improve the heat dissipation efficiency by the grooves rather than the electrically connected grooves. For the non-electrically-connected grooves, the substrate 191 may be provided with a heat-radiating pad or a dummy pad separately from other pads.

11 and 12 are views showing an example in which the number of grooves is modified in the light source module according to the embodiment. 11 and 12, the same configuration as that of the first embodiment will be described with reference to the description of the first embodiment.

11, the plate 10 includes a plurality of third grooves 33 and 34 disposed in the third electrode portion 15 and a plurality of third grooves 33 and 34, The number of the grooves 33 disposed in the center region 17 of each of the plurality of grooves may be smaller than the number of the grooves 34 disposed in the adjacent region. The grooves 33 in the center region 17 are formed in a single structure for rigidity and the grooves 34 in the region spaced from the center region 17 may be formed in a multi-structure. The multi-structure includes a structure in which two or more grooves 34 and two or more protrusions 34A are disposed in the interval B3 of the light emitting chips 50. [

The multi-structure grooves 34 of FIG. 11 are collectively arranged in the interval B3, and the multi-structure grooves 35 of FIG. 12 include five grooves 35 and protrusions 35A, Are collectively arranged in the interval B3. The widths A2 and A3 of the grooves 34 and 35 of the multi-structure of FIGS. 11 and 12 can be formed in an area smaller than the interval B3 of the light emitting chips 50, there is a problem. The widths of the multi-structure grooves 34 and 35 may be equal to or narrower than the grooves 33 of the center area, but are not limited thereto. By forming the bonding layer on the surfaces of the multi-structure grooves 34 and 35, the bonding area with the bonding member can be increased. By increasing this bonding area, electrical conductivity and thermal conductivity can be improved.

13 and 14 show an example in which the number of light source modules is adjusted in the embodiment.

13 may have five grooves 31, 32, 33 smaller than the grooves 31, 32, 33 shown in FIG. 2, and FIG. 14 shows grooves 32, 32 , 33) may be arranged in the grooves (31, 32, 33). These grooves 31, 32, 33 can be arranged in an odd number and have a constant spacing D4, D6. For example, the grooves 31, 32, 33 disposed in the center region 17 of the first electrode portion 11, the second electrode portion 13, and the third electrode portion 15 are fixed, To increase or decrease the distance between them. 13 to 14, the grooves 31, 32, and 33 of the plate 10 are formed such that as the distance D6>D3> D4 between the grooves 33 of the third electrode unit 15 becomes narrower, It can be seen that the number increases more,

15A and 15B show an example in which the groove of the plate is modified.

As shown in FIG. 15A, the groove 36 of the plate 10 may have a polygonal shape, for example, a wide upper portion and a narrow lower portion, and a bonding layer 26 is formed on the surface thereof. The inner area 25A of the groove 36 can be increased in area of adhesion with the bonding member by inclined side surfaces.

The groove 37 of the plate 10 may have a hemispherical shape and the bonding layer 26 and the inner region 25B may be formed into a hemispherical shape depending on the shape of the groove 37, .

16 is a perspective view of a light source module according to the second embodiment. In the description of the second embodiment, the same portions as those of the first embodiment will be described with reference to the description of the first embodiment.

16, the light source module has first and second grooves 31 and 32 disposed below the first electrode portion 11 and the second electrode portion 13 of the plate 10, And the sub-grooves 121, 122, 141, and 142 are disposed on the third and fourth side surfaces of the first and second electrode units 11 and 13, respectively.

The sub-grooves 121, 122, 141 and 142 disposed on the third and fourth side surfaces of the first and second electrode units 11 and 13 may have a hemispherical shape or a polygonal shape. The sub grooves 121, 122, 141 and 142 disposed on the third and fourth side surfaces are overlapped with the first and second grooves 31 and 32 arranged below the first and second electrode portions 11 and 13, Or may be arranged in a shifted manner.

The sub-grooves 121, 122, 141 and 142 formed on the third and fourth side surfaces of the first and second electrode units 11 and 13 may be formed in the vertical direction, for example, in the thickness direction of the plate 10.

Since the sub-grooves 121, 122, 141 and 142 disposed on the third and fourth side surfaces of the first and second electrode units 11 and 13 are not in contact with the molding member 81, It is possible to prevent occurrence of defects. Accordingly, when the sub-grooves 121, 122, 141, and 142 are disposed on the third and fourth sides, the first and second grooves 31 and 32 under the first and second electrode units 11 and 13 are bonded So that the bonding efficiency can be improved. As another example, the grooves under the first and second electrode portions 11 and 13 may be removed.

The sub-grooves 121, 122, 141 and 142 disposed on the third and fourth sides of the first and second electrode units 11 and 13 may be formed to be less than the width of the plate 10, And a depth of 30% or less of the width. The depths of the sub-grooves 121, 122, 141 and 142 disposed on the third and fourth side surfaces may be less than 0.35 mm, or may be formed with a curvature of 0.6 mm to 0.8 mm in the hemispherical shape.

The spacing between the sub-grooves 121, 122, 141, and 142 disposed on the third and fourth sides may be less than the width of the light emitting chip 50, but the present invention is not limited thereto. A bonding layer may be formed on the sub-grooves 121, 122, 141, and 142.

17 is a side view of the light source module according to the third embodiment. In the description of FIG. 17, the same configuration as that of the first embodiment will be described with reference to the description of the first embodiment.

Referring to FIG. 17, the light source module is a modified structure of the first and second electrode portions 11 and 13 of the plate 10 having a plurality of light emitting chips 50. The first and second electrode parts 11 and 13 are provided with first and second grooves 31 and 32 on a second surface thereof and the first and second side wall parts 12 and 14 are provided with sub- 31A, and 32A. The sub grooves 31A and 32A disposed in the first and second side wall portions 12 and 14 are recessed from the upper surfaces of the first and second side wall portions 12 and 14 to a predetermined depth, 10).

The lengths and widths of the first and second grooves 31 and 32 and the grooves 31A and 32A may be the same or different and are not limited thereto. A bonding layer 26 formed on the grooves 31, 33, and 35 may be formed in the sub-grooves 31A and 32A. At least one of the sub-grooves 31A and 32A may be bonded by a bonding member. Since the sub-grooves 31A and 32A are disposed on the opposite sides of the grooves 31 and 32 disposed on the first and second electrode units 13 and 15, the bonding positions may also be opposite to each other.

18 is a side view showing a part of the light source module according to the fourth embodiment. In explaining FIG. 18, the same configuration as that of the first embodiment will be described with reference to the description of the first embodiment.

Referring to FIG. 18, a plurality of connection terminals 171 are disposed in a region between adjacent light emitting chips 50, and the plurality of connection terminals 171 connect adjacent two light emitting chips 50 to one another. The plurality of connection terminals 171 are connected in series by the adjacent light emitting chips 50 by the wires 59 so that the interval B4> B3 between the adjacent two light emitting chips 50 can be widened. Accordingly, the number of the light emitting chips 50 in the light source module can be reduced.

19 is a view showing a light emitting device having a light source module according to the third embodiment.

Referring to FIG. 19, the light source module 100 is mounted on a substrate 191. One side of the plate 10 of the light source module 100 faces the substrate 191 and a bonding member is bonded to the grooves 31,32 and 33 of the plate 10 to form the substrate 191 ). ≪ / RTI > Accordingly, the first to third electrode units 11, 13 and 15 of the plate 10 can be electrically connected to the substrate 191, and the plurality of light emitting chips 50 emit light.

The substrate 191 includes line patterns P1, P2, and P3 connected to the first electrode unit 11, the second electrode unit 13, and the third electrode unit 15 of the plate 10, , And at least three lines of the line patterns (P1, P2, P3) may be connected to the respective electrode portions (11, 13, 15).

The substrate 191 may be a flexible substrate, a substrate made of a resin material, a substrate made of a ceramic material, or a substrate having a metal layer, but the invention is not limited thereto.

19, the grooves 31, 32, and 33 disposed in the center regions of the first, second, and third electrode portions 11, 13, And the grooves other than the center region of the third electrode unit 15 may be electrically connected to the substrate 191 or may not be connected. If the grooves other than the center region of the third electrode part 15 are not electrically connected, the third electrode part 15 can be used only for the purpose of heat dissipation, and the heat dissipation efficiency can be further improved. In addition, the heat radiation pad (s) of the substrate 191 may be disposed in an area corresponding to the grooves other than the center area of the third electrode part 15. The heat radiation pad may not be electrically connected to the line patterns P1, P2, and P3.

20 and 21 are views showing a part of the manufacturing process of the light source module of the first embodiment.

20 and 21, insulating portions 113 and 114 spaced apart from each other in the longitudinal direction (x-axis direction) of the circular plate 100B are disposed, and a predetermined region A1 of the circular plate 100B is provided with a concave first face And a plurality of grooves 31, 32, and 33 are formed long in the Y-axis direction on the second surface opposite to the first surface as shown in FIG. Here, the first surface on which the plurality of light emitting chips 50 are disposed may be positioned lower than the upper surface of the side wall portion. Here, the plurality of grooves 31, 32, and 33 may be formed with a bonding layer by a plating process, but the present invention is not limited thereto.

Thereafter, a plurality of light emitting chips 50 are mounted on the first surface of the individual plate region 100A of the circular plate 100B, then connected by wires, and molded by the molding member 81. [ Then, the cutting is performed in the unit of the width of the individual plate area 100A in the x-axis direction, and cut in the length of the plate area 100A in the Y-axis direction. Accordingly, a plurality of grooves 31, 32, 33 may be provided on the second surface of the plate region 100A of the individual light source module, and a plurality of electrode portions may be provided by the insulating portions 113, 114. Further, the grooves 31, 32, and 33 are disposed in the respective electrode portions, thereby enabling electrical connection with the substrate.

<Lighting system>

The light source module according to the embodiment may be mounted on a substrate and applied to an illumination system. The lighting system includes a light source module and includes the display device shown in Fig. 22, and may include an illumination lamp, a traffic light, a vehicle headlight, an electric signboard, and the like.

22 is an exploded perspective view of the display device according to the embodiment.

22, a display device 1000 includes a light guide plate 1041, a light source module 100 and a substrate 1033 according to an embodiment for providing light to the light guide plate 1041, An optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, a light guide plate 1041, a light source module 100, and a reflection member (not shown) 1022, but it is not limited thereto.

The bottom cover 1011, the light source module 100, the substrate 1033, the reflective sheet 1022, the light guide plate 1041 and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 diffuses the light from the light source module 100 to form a surface light source. The light guide plate 1041 may be formed of a transparent material such as acrylic resin such as PMMA (polymethyl methacrylate), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphtha late ) &Lt; / RTI &gt; resin.

The light source module 100 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041 and ultimately serves as a light source of the display device.

At least one light source module 100 described above may be disposed in the bottom cover 1011 and may provide light directly or indirectly at one side of the light guide plate 1041. The light source module 100 may be selected from the modules according to the embodiment.

An insulating adhesive sheet may be attached between the side surfaces of the light source module 100 and the bottom cover 1011, but the present invention is not limited thereto.

A heat radiation plate may be disposed in the bottom cover 1011, and a part of the heat radiation plate may be in contact with the top surface of the bottom cover 1011.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and supplies the reflected light to the display panel 1061 to improve the brightness of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may receive the light guide plate 1041, the light source module 100, the substrate 1033, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 transmits or blocks light provided from the light source module 100 to display information. The display device 1000 can be applied to video display devices such as portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet concentrates incident light on the display panel 1061. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

The optical path of the light source module 100 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the present invention is not limited thereto.

The light source module disclosed in the above embodiments can be applied to a backlight unit of a top view type, a backlight unit of a portable terminal, a computer, and the like, as well as a lighting device such as an illumination light, a traffic light, a vehicle headlight, an electric signboard, a streetlight, It is not limited. Further, the light guide plate may not be disposed in the direct-type light source module, and the present invention is not limited thereto. Further, a light transmitting material such as a lens or glass may be disposed on the light source module, but the present invention is not limited thereto.

The present invention is not limited to the above-described embodiment and the attached drawings, but is defined by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims, As will be described below.

10: Plates 11, 13 and 15:
12, 14: side wall portions 31, 32, 33, 34, 35:
26: bonding layer 50,51,53,55,57: light emitting chip
81: molding member 100: light source module
113, 114: insulation part 171: connection terminal
191: substrate

Claims (16)

A plate having a length in a first direction longer than a width in the second direction and having a plurality of electrode portions and at least one insulating portion between the plurality of electrode portions;
A plurality of light emitting chips arranged on the first surface of the plate in the first direction; And
And a molding member covering the plurality of light emitting chips,
Wherein the plurality of light emitting chips are electrically connected to the plurality of electrode units,
Wherein the insulating portion includes the same material as the plurality of electrode portions,
Wherein the plate includes a plurality of grooves recessed from a second side opposite to the first side in the first surface direction,
Wherein at least one of the plurality of grooves is disposed in each of the electrode portions. The method according to claim 1,
Wherein the plate comprises a metal material,
Wherein a surface of the plate has the same horizontal surface as the plurality of insulating portions. The method according to claim 1,
Wherein the insulating portion has a smaller number than the number of the electrode portions. The method according to claim 1,
The plurality of electrode portions include first to third electrode portions formed of the plate,
The third electrode portion is disposed between the first and second electrode portions,
And at least 80% of the plurality of light emitting chips is disposed on the third electrode unit. 5. The method of claim 4,
Wherein the first electrode portion includes a first side wall portion protruding from a first surface of the plate,
The second electrode portion includes a second side wall portion protruding from the first surface of the plate and facing the first side wall portion,
And the first and second side wall portions are in contact with the molding member. 6. The method according to any one of claims 1 to 5,
The plurality of grooves may include a first groove disposed below the first electrode portion; A second groove disposed below the second electrode portion; And a plurality of third grooves disposed under the third electrode portion,
Wherein the first to third grooves have a length equal to the width of the plate. The method according to claim 6,
And the third groove has a larger number than the sum of the numbers of the first and second grooves. The method according to claim 6,
Wherein the first groove is overlapped with the first sidewall portion and the second groove is overlapped with the second sidewall portion,
And one of the third grooves is disposed at the same interval as the first groove and the second groove. The light source module according to claim 6, wherein the third groove has regular or irregular intervals below the third electrode part. The light source module according to claim 6, wherein the third electrode part includes a fourth groove in which a plurality of grooves are arranged in an area corresponding to an interval between the light emitting chips. The light source module according to claim 9, wherein the first and second electrode portions include sub-grooves formed on the third and fourth side surfaces of the plate in the thickness direction of the plate. The light source module according to claim 5, comprising a sub-groove recessed from an upper surface of the first and second sidewall portions. The light source module according to claim 9, wherein the plate has a length in the first direction that is at least 100 times longer than a width in the second direction. 10. The light emitting device according to claim 9, further comprising a plurality of connection terminals for connecting adjacent two light emitting chips among the plurality of light emitting chips, wherein at least one connection terminal is disposed between the adjacent two light emitting chips,
Wherein each of the connection terminals includes an insulating layer on a first surface of the plate and a conductive layer on the insulating layer. 15. The light source module according to claim 14, comprising a plurality of connection terminals between the adjacent two light emitting chips and a wire connected to the plurality of connection terminals. 2. The plate of claim 1, wherein each groove has a depth ranging from 30% to 70% from the underside of the second surface of the plate,
And a bonding layer different from the material of the plate in each of the grooves.

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