KR101896684B1 - Light emitting module and lighting system having the same - Google Patents

Abstract

An embodiment relates to a light emitting module.
A light emitting module according to an embodiment includes: a first body having a cavity; a first light emitting diode disposed in a cavity of the first body and including a first light emitting chip emitting blue light; A second body having a cavity; A second light emitting chip disposed in the cavity of the second body and emitting light having a green wavelength; And a first light emitting diode including a first phosphor emitting light of a longer wavelength than a wavelength emitted from the second light emitting chip in the second body; A third body having a cavity, a third light emitting chip disposed in the cavity of the third body and emitting red light; A third light emitting diode including a second phosphor emitting light having a wavelength longer than a wavelength emitted from the third light emitting chip in the third body; And a module substrate on which the first to third light emitting diodes are disposed.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting module,

Embodiments relate to a light emitting module and an illumination system having the same.

BACKGROUND ART Light emitting diodes, for example, light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light, and have been widely recognized as a next generation light source in place of conventional fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

As a result, many researches for replacing the existing light source with light emitting diodes have been conducted. As information processing technology has developed, display devices such as LCD, PDP, and AMOLED have been widely used. Of these display devices, the LCD requires an illumination unit such as a backlight unit capable of generating light in order to display an image.

Embodiments provide a light emitting module in which different phosphors are added to different light emitting diode bodies.

Embodiments provide a light emitting module in which first to third light emitting diodes that emit different colors are arranged on a substrate, and a red phosphor and a green phosphor are added to the body of the red light emitting diode and the body of the green light emitting diode, respectively.

Embodiments provide a light emitting module in which first to third light emitting diodes are arranged on a substrate, different phosphors are added to the bodies of the first to third light emitting diodes, and an illumination system having the same.

A light emitting module according to an embodiment includes: a first body having a cavity; a first light emitting diode disposed in a cavity of the first body and including a first light emitting chip emitting blue light; A second body having a cavity; A second light emitting chip disposed in the cavity of the second body and emitting light having a green wavelength; And a first light emitting diode including a first phosphor emitting light of a longer wavelength than a wavelength emitted from the second light emitting chip in the second body; A third body having a cavity, a third light emitting chip disposed in the cavity of the third body and emitting red light; A third light emitting diode including a second phosphor emitting light having a wavelength longer than a wavelength emitted from the third light emitting chip in the third body; And a module substrate on which the first to third light emitting diodes are disposed.

The embodiment can improve the color reproduction rate in the light emitting module.

The embodiment can improve the color reproduction rate of the light emitting module, so that the color coordinate can have a distribution suitable for NTSC.

The embodiment can improve the reliability of the light emitting module.

Embodiments can improve the reliability of an illumination system having a light emitting module.

1 is a perspective view illustrating a light emitting module according to an embodiment.
2 is a partial cross-sectional view of the light emitting module of FIG.
3 is a view showing another example of the light emitting module of FIG.
4 is a view showing a wavelength spectrum of the light emitting diodes of FIG. 2. FIG.
5 is a diagram illustrating a color coordinate diagram according to an embodiment.
6 is a view showing a display device having the light emitting module of FIG.
7 is a view showing another example of a display device having the light emitting module of FIG.
8 is a view showing a lighting unit having the light emitting module of FIG.

In the description of the embodiments, each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, Quot; on "and" under "include both what is meant to be" directly "or" indirectly & . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

FIG. 1 is a view showing a light emitting module according to an embodiment, and FIG. 2 is a partial cross-sectional view of the light emitting module of FIG.

Referring to FIG. 1, the light emitting module 300 includes first to third light emitting diodes 101, 102, and 103; And a module substrate 200 in which the first to third light emitting diodes 101, 102, and 103 are alternately arranged.

The module substrate 200 may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The module substrate 200 may include a printed circuit board having a metal layer therein.

The light emitting diodes 101, 102, and 103 may be disposed on the upper surface 201 of the module substrate 200 in one or two rows. Adjacent light emitting diodes (101, 102, 103) mounted on the module substrate 200 may be arranged at regular intervals or at irregular intervals.

As shown in FIGS. 1 and 4, the plurality of light emitting diodes 101, 102 and 103 may be arranged in a first direction at a predetermined pitch or in a matrix form (not shown). The first light emitting diode 101 of the plurality of light emitting diodes 101, 102 and 103 has at least one blue light emitting chip for emitting a blue wavelength W1 and the second light emitting diode 102 has a green wavelength W2 And the third light emitting diode 103 includes at least one red light emitting chip that emits a red peak wavelength W3. Any one of the light emitting diodes 101, 102, and 103 may include a plurality of light emitting chips, but the present invention is not limited thereto.

The first light emitting diode 101 emits a first main peak wavelength P1 of blue and the second light emitting diode 102 emits a second main peak wavelength P2 of green and a third main peak wavelength P21 And the third light emitting diode 103 emits a red fourth main peak wavelength P3 and a fifth main peak wavelength P31.

The second main peak wavelength P2 is light emitted by the green light emitting chip and the third main peak wavelength P21 is the wavelength excited by the second main peak wavelength P2, Is a wavelength longer than the peak wavelength (P21). The fourth main peak wavelength P3 emits light by a red light emitting chip and the fifth main peak wavelength P31 excites a part of light emitted from the red light emitting chip to form the fourth main peak wavelength P3 The fifth main peak wavelength P31 having a longer wavelength than the first main peak wavelength P31.

The module substrate 200 may be arranged in a bar shape, but the present invention is not limited thereto. For example, the light emitting diodes 101, 102, and 103 may be connected by a parallel connection method or a serial-parallel connection method, but the present invention is not limited thereto.

The light emitting module can realize various colors by mixing the blue / green / red wavelengths emitted from the first to third light emitting diodes (101, 102, 103).

Referring to FIG. 2, each light emitting diode of the light emitting module will be described in detail as follows.

2, the first light emitting diode 101 includes at least two lead frames having a first body 11, first and second lead frames 12 and 13, at least one first light emitting chip 15 And a molding member 17.

The second light emitting diode 102 includes at least two lead frames having a second body 21, first and second lead frames 22 and 23, at least one second light emitting chip 25 and a molding member 27 ).

The third light emitting diode 103 includes at least two lead frames having a third body 31, first and second lead frames 32 and 33, at least one third light emitting chip 35 and a molding member 37 ).

The first, second, and third bodies 11, 21, and 31 are made of an insulating material such as polyphthalamide (PPA), polychloroprene (PCT), LCP (liquid crystal polymer) Polyamide 9T), silicone, epoxy molding compounds (EMC), a material containing metal, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and a printed circuit board . For example, the first, second, and third bodies 11, 21, and 31 include at least one of a resin material having high reflectance and easy injection molding with the lead frame, such as PPA and silicon .

A cathode mark may be formed on the first, second, and third bodies 11, 21, and 31, but the present invention is not limited thereto. The cathode mark can prevent confusion about the polarity direction of each of the light emitting diodes (101, 102, 103).

The cavities 11A, 21A and 31A are formed in the first, second and third bodies 11, 21 and 31 and the cavities 11A, 21A and 31A are concave or recessed do. The cavities 11A, 21A, and 31A may be formed in a circular shape, an elliptical shape, a polygonal shape, or the like when viewed from the top side, but the present invention is not limited thereto. The first to third bodies 11, 21 and 31 cover the peripheries of the cavities 11A, 21A and 31A.

A plurality of lead frames 11 and 13 are disposed separately from each other at the bottom of the cavity 11A of the first body 11 by a gap. In the bottom portion of the cavity 21A of the second body 21, a plurality of lead frames 22, 23 are disposed separately from each other by a gap portion. A plurality of lead frames (32, 33) are separately arranged at the bottom of the cavity (31A) of the third body (31) by a gap portion.

The lead frames 12, 13, 22, 23, 32, and 33 may be formed of a metal plate having a predetermined thickness, and other metal layers may be plated on the surface of the metal plate. The lead frames 12, 13, 22, 23, 32, and 33 are made of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, And may include at least one of tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorous (P) and may be formed to have a single layer or multi- To 2 mm, but the present invention is not limited thereto.

The first light emitting chip 15 is mounted on at least one of the plurality of lead frames 12 and 13 and may be connected to the at least one lead frame by wires 16. The second light emitting chip 25 is mounted on at least one of the plurality of lead frames 22 and 23 and may be connected to the at least one lead frame by a wire 26. The third light emitting chip 35 may be mounted on at least one of the plurality of lead frames 32 and 33 and may be connected to at least one lead frame by a wire 36.

The first to third light emitting chips 15, 25, and 35 may include a compound semiconductor and may be selectively formed using a group III-V compound semiconductor. For example, the first to third light emitting chips 15, 25 and 35 may be formed of a compound semiconductor of a group III-V element, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP , GaAs, GaAsP, and AlGaInP-based semiconductor materials, and emits light having a color inherent to the semiconductor material.

The first light emitting chip 15 emits light B1 having a first main peak wavelength P1 of a blue wavelength and the second light emitting chip 25 emits light having a second main peak wavelength P2 of a green wavelength, And the third light emitting chip 35 emits light R1 having a fourth main peak wavelength P3 of a red wavelength.

The light emitting chips 15, 25, and 35 may be implemented as a horizontal chip having two electrodes arranged in parallel to each other or a vertical chip having two electrodes disposed on opposite sides of the chip, . The horizontal chip may be connected to at least two wires, and the vertical chip may be connected to at least one wire 42, but the invention is not limited thereto.

Molding members 17, 27 and 37 are formed in the cavities 11A, 21A and 31A, and the molding members 17, 27 and 37 may include a transparent resin material such as epoxy or silicone. Further, a phosphor may not be separately added to the molding members 17, 27, 37, but a diffusion agent may be disposed. A lens may be formed on the molding members 17, 27, and 37, and the lens may include a concave lens shape, a convex lens shape, and a lens having a concave portion and convex portions.

The first to third light emitting diodes 101, 102 and 103 may be bonded to the pads 12 and 13 of the module substrate 200 with a bonding member 202.

2 and 4, the first body 11 reflects the blue light W1 emitted from the first light emitting chip 15 and the blue light W1, For example, a reflectance in the range of 92-99% and a transmittance in the range of 1-8%, which is 8% or less. The first light emitting chip 15 emits light B1 having a first main peak wavelength P1 in a range of 410-460 nm.

A green phosphor 29 is added to the second body 21 and the second body 21 reflects light G1 of a green wavelength W2 emitted from the second light emitting chip 25 And transmitted. The second body 21 has a reflectance of 86% or more, for example, a reflectance in the range of 86-92% and a transmittance of 14% or less, for example, in the range of 8 to 14% with respect to the green wavelength light G2. The light reflected from the second body 21 is emitted through the cavity 21A and the transmitted part of the light passes through the third main peak wavelength P21 of the green wavelength range by the green phosphor 29 And emits light G2.

The second light emitting chip 25 emits light G1 having a second main peak wavelength P2 within a range of 525 to 555 nm. The green phosphor 29 excites the green light G1 emitted from the second light emitting chip 25 and emits a green third main peak wavelength P21 which is longer than the second main peak wavelength P2 The light G2 having the wavelength? The light G2 emitted from the green phosphor 29 can compensate the green color gamut in the color coordinate area A2 of FIG. The green phosphor 29 is ^{ZnS: Cu + (Al 3 +} ), SrGa 2 S 4: Eu 2 +, CaMgSi 2 O 7: Eu 2 +, Ca 8 Mg (SiO 4) Cl 2: Eu 2 + (Mn ^{2 +), (Ba, Sr} ) 2 SiO 4: may include at least one of Eu _{2 +.}

A red fluorescent material 39 is added to the third body 31 and the third body 31 has a fourth main peak wavelength P3 of red emitted from the third light emitting chip 35 And reflects and transmits light. The third body 31 has a reflectance in the range of 86-92% with respect to the light R1 having the fourth main peak wavelength P3 and a transmittance in the range of 8-14%. The third light emitting chip 35 emits light R1 having a fourth main peak wavelength P4 in the range of 615 to 630 nm. The light reflected from the third body 31 is emitted through the cavity 31A and the transmitted light passes through the fifth main peak wavelength P31 having a different red wavelength range by the red phosphor 39 And emits the light R2. The red phosphor 39 excites the light R 1 emitted from the third light emitting chip 35 and emits light R2 having a fifth main peak wavelength P31 longer than the fourth main peak wavelength P3 . The red phosphors 39 can compensate the red color gamut in the color coordinate area A2 of FIG. The red phosphor 39 ^{_{La 2 O 2 S: Eu 3}} +, Y 2 O 2 S: Eu 3 +, Y 2 O 3: Eu 3 + (Bi 3 +), CaS: Eu 2 +, (Zn, ^{Cd) S: Ag + (Cl} -), K 5 (WO 4) 6.25: Eu 3 + 2.5, LiLa 2 O 2 BO 3: may include at least one of Eu ^{+ 3.}

The first to third light emitting diodes 101, 102 and 103 are arranged alternately on the module substrate 200 to emit light of the first to fifth main peak wavelengths P1, P2, P21, P3 and P31 do. As shown in FIG. 5, the blue color wavelengths, the different green wavelengths, and the mixed color coordinates of different red wavelengths emitted from the light emitting module are distributed in the region A2 which is 12-20% wider than the region A1 in NTSC . Therefore, by adjusting the color coordinate distribution of the first to third light emitting diodes 101, 102, and 103, the color gamut can be improved as a whole.

3 is another example of the light emitting diodes of FIG.

Referring to FIG. 3, a blue phosphor 19 is added to the first body 11 among the first to third light emitting diodes 101A, 102, and 103. The blue phosphor 19 emits light of a blue wavelength excited by a long wavelength with respect to a first main peak wavelength emitted from the first light emitting chip 15 and emits a main peak wavelength in the range of 470 10 nm, do.

And a blue phosphor (19) above, wherein the blue phosphor is, for _{example, Sr 2 MgSi 2 O 7:} Eu 2 +, BaMgAl 10 O 17: Eu (Mn), Sr 5 Ba 3 MgSi 2 O 8: Eu 2+, Sr ^{_{2 P 2 O 7: Eu 2}} +, SrSiAl 2 O 3 N 2: Eu 2 +, (Ba 1 - x Sr x) SiO 4: Eu 2 +, (Sr, Ca, Ba, Mg) 10 (PO 4) ^{_{6 C l2: Eu 2+, CaMgSi}} 2 O 6: may include at least one of Eu ^{2 +.}

6 is an exploded perspective view showing a display device having a light emitting module according to an embodiment.

6, the display apparatus 1000 includes a display panel 1061 on which an image is displayed, and a backlight unit 1050 that provides light to the display panel 1061. [

The backlight unit 1050 includes a light guide plate 1041 for providing a surface light source to the display panel 1061, a reflective sheet 1022 for reflecting the leaked light, The light emitting module 300 and the bottom cover 1011 forming a lower outer appearance of the display device 1000. [

Although not shown, the display device 1000 includes a panel supporter that supports the display panel 1061 from the lower side, a tower that supports the periphery of the display panel 1061 and forms a rim of the display device 1000 Cover.

Although not shown in detail, the display panel 1061 may include a lower substrate and an upper substrate coupled to each other to maintain a uniform cell gap, and a liquid crystal layer (not shown) interposed between the two substrates . A plurality of gate lines and a plurality of data lines intersecting the plurality of gate lines may be formed on the lower substrate, and a thin film transistor (TFT) may be formed on the intersections of the gate lines and the data lines. Color filters may be formed on the upper substrate. The structure of the display panel 1061 is not limited thereto, and the display panel 1061 may have various structures. As another example, the lower substrate may include a color filter as well as a thin film transistor. In addition, the display panel 1061 may have various structures according to a method of driving the liquid crystal layer.

Although not shown, a gate driving printed circuit board (PCB) for supplying a scan signal to a gate line is formed at an edge of the display panel 1061, a data driving printed circuit board (PCB) May be provided.

A polarizing film (not shown) may be disposed on at least one of the upper side and the lower side of the display panel 1061. An optical sheet 1051 is disposed under the display panel 1061 and the optical sheet 1051 may be included in the backlight unit 1050 and may include at least one prism sheet and / have. The optical sheet 1051 can be removed, but is not limited thereto.

The diffusing sheet diffuses the incident light evenly, and the diffused light can be converged on the display panel by the prism sheet. Here, the prism sheet may be selectively formed using a horizontal or vertical prism sheet, one or more roughness enhancing sheets, or the like. The type and number of the optical sheets 1051 can be added or deleted within the technical scope of the embodiments, but the invention is not limited thereto.

The light emitting module 300 may be disposed on at least one side of the inside of the bottom cover 1011. The light emitting module 300 may be disposed on both sides or all sides of the bottom cover 1011, but is not limited thereto. Further, the light emitting module 300 may be disposed on the bottom of the bottom cover 1011 and may be mounted in a direct-down manner. In this case, the optical members such as the light guide plate and the optical sheet may have different configurations.

The light emitting module 300 includes a module substrate 200 and a plurality of light emitting diodes 101, 102, and 103 arranged on one side of the module substrate 200.

The module substrate 200 may be coupled to the bottom of the bottom cover 1011 in a direction perpendicular to the bottom of the bottom cover 1011 or may be disposed in a direction parallel to the bottom of the bottom cover 1011.

The module substrate 200 may be bonded to the bottom cover 1011 or the heat dissipation plate using an adhesive, an adhesive, or a fastening member, but the present invention is not limited thereto.

The plurality of light emitting diodes 101, 102 and 103 are disposed on at least one side of the light guide plate 1041 so as to face each other and light generated from the plurality of light emitting diodes 101, 102 and 103 is incident. The light guide plate 1041 may be formed in a polygonal shape including at least four sides, as viewed from the upper surface where the surface light source is generated, and the upper surface. The light guide plate 1041 is made of a transparent material and may include one of acrylic resin such as PMMA (polymethyl methacrylate), polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate . The light guide plate 1041 may be formed by an extrusion molding method, but the invention is not limited thereto.

A reflection pattern (not shown) may be formed on the upper surface and / or the lower surface of the light guide plate 1041. The reflection pattern may be uniformly irradiated through the entire surface of the light guide plate 1041 by reflecting / / diffusing the incident light, which is made up of a predetermined pattern, for example, a reflection pattern or / and a prism pattern. The lower surface of the light guide plate 1041 may be formed in a reflective pattern, and the upper surface may be formed in a prism pattern. A scattering agent may be added to the inside of the light guide plate 1041, but the present invention is not limited thereto.

A reflective sheet 1022 may be provided under the light guide plate 1041. The reflective sheet 1022 reflects light traveling to the lower portion of the light guide plate 1041 toward the display panel. The reflective sheet 1022 re-enters the light guide plate 1041 with light leaking to the lower portion of the light guide plate 1041, thereby preventing problems such as reduction in light efficiency, deterioration in optical characteristics, and occurrence of dark areas. The reflective sheet 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective sheet 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 includes a housing 1012 having an opened upper portion and a light emitting module 300, an optical sheet 1051, a light guide plate 1041 and a reflection sheet 1022 Can be accommodated. The bottom cover 1011 may be formed of a material having a high heat dissipation efficiency, such as stainless steel, and is not limited thereto.

The bottom cover 1011 may include a reflective sheet 1022, a light guide plate 1041 and an optical sheet 1051 sequentially stacked on the bottom cover 1011, And the light guide plate 1041 is disposed to correspond to one side of the light guide plate 1041 on the side of the light guide plate 1041.

At least one light emitting module 300 may be disposed in the bottom cover 1011, but the present invention is not limited thereto.

7 is a view showing a display device having the light emitting module of FIG.

7, the display device 1100 includes a bottom cover 1152, a module substrate 200 on which the first through third light emitting diodes 101, 102, and 103 described above are arranged, an optical member 1154, 1155).

The light emitting module 300 includes the module substrate 200 and the first to third light emitting diodes 101, 102, and 103 disclosed in the embodiment. The bottom cover 1152, the at least one light emitting module 300, and the optical member 1154 may be defined as a light unit (not shown).

The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto.

The optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methy methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses the incident light, and the horizontal and vertical prism sheets condense the incident light onto the display panel 1155. The brightness enhancing sheet reuses the lost light to improve the brightness .

The optical member 1154 is disposed on the light emitting module 300, and performs surface light source, diffusion, and light condensation of the light emitted from the light emitting module 300.

8 is a perspective view of a lighting device having the light emitting module of FIG.

8, the lighting apparatus 1500 includes a case 1510, a light emitting module 300 disposed in the case 1510, a connection terminal 1520 installed in the case 1510 and supplied with power from an external power source, Lt; RTI ID = 0.0 > 1520 < / RTI >

The case 1510 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal material or a resin material.

The light emitting module 300 may include a module substrate 200 and first to third light emitting diodes 101, 102 and 103 according to embodiments of the present invention mounted on the module substrate 200. A plurality of the first to third light emitting diodes 101, 102 and 103 may be arrayed in a matrix or at a predetermined interval.

The module substrate 200 may have a printed circuit pattern on an insulator. For example, the module substrate 200 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB , FR-4 substrate, and the like.

In addition, the module substrate 200 may be formed of a material that efficiently reflects light, or may be a coating layer of a color such as white, silver, or the like whose surface is efficiently reflected.

The first to third light emitting diodes 101, 102, and 103 may improve the color reproduction rate by using light of blue, different green wavelengths, and different red wavelengths. The light emitting module 300 can combine the first to third light emitting diodes 101, 102, and 103 to ensure high CRI.

The connection terminal 1520 may be electrically connected to the light emitting module 300 to supply power. The connection terminal 1520 is connected to the external power source by being inserted in a socket manner, but the present invention is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source through wiring.

The light emitting module disclosed in the above embodiments can be applied to a backlight unit of a top view type or to a backlight unit such as a portable terminal and a computer as well as to an illumination device such as an illumination light, a traffic light, a vehicle headlight, an electric signboard, a streetlight, It is not limited. Further, the light guide plate may not be disposed in the direct-type light emitting module, but the present invention is not limited thereto. Further, a light transmitting material such as a lens or glass may be disposed on the light emitting module, but the present invention is not limited thereto.

The present invention is not limited to the above-described embodiment and the attached drawings, but is defined by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the appended claims, As will be described below.

A light emitting device comprising: a body; 15 a first light emitting chip, 25 a second light emitting chip, 35 a third light emitting chip, 19 a blue phosphor, 29 a green phosphor, 39 a red phosphor, 101,102,103 a light emitting diode : Module substrate, 300: light emitting module

Claims (12)

A first light emitting diode disposed in a cavity of the first body and including a first light emitting chip emitting blue light;
A second body having a cavity; A second light emitting chip disposed in the cavity of the second body and emitting light having a green wavelength; And a first light emitting diode including a first phosphor emitting light of a longer wavelength than a wavelength emitted from the second light emitting chip in the second body;
A third body having a cavity, a third light emitting chip disposed in the cavity of the third body and emitting red light; A third light emitting diode including a second phosphor emitting light having a wavelength longer than a wavelength emitted from the third light emitting chip in the third body; And
And a module substrate on which the first light emitting diode to the third light emitting diode are arranged,
Wherein the first phosphor and the second phosphor are distributed in the second body and the third body, respectively, disposed around the cavity. The light emitting module according to claim 1, wherein the first phosphor comprises a green phosphor. The light emitting module according to claim 1, wherein the second phosphor comprises a red phosphor. The light emitting module according to any one of claims 1 to 3, comprising a blue phosphor emitting light of a longer wavelength than light of a wavelength emitted from the first light emitting chip in the first body. 4. The method according to any one of claims 1 to 3,
And a third phosphor disposed in the first body disposed around the cavity. The light emitting device of claim 1, wherein the first body has a transmittance in a range of 1-8% with respect to light emitted from the first light emitting chip,
The second body has a transmittance in a range of 8-14% with respect to the light emitted from the second light emitting chip,
And the third body has a transmittance in a range of 8-14% with respect to light emitted from the third light emitting chip. 4. The method according to any one of claims 1 to 3,
The second light emitting diode emits two main peak wavelengths in the green wavelength range,
Wherein the third light emitting diode emits two main peak wavelengths within a red wavelength range.
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