CN213240753U

CN213240753U - Backlight module and display device thereof

Info

Publication number: CN213240753U
Application number: CN202022065873.4U
Authority: CN
Inventors: 李泽龙; 季洪雷; 陈细俊
Original assignee: Shenzhen TCL New Technology Co Ltd
Current assignee: Shenzhen TCL New Technology Co Ltd
Priority date: 2020-09-18
Filing date: 2020-09-18
Publication date: 2021-05-18
Anticipated expiration: 2030-09-18

Abstract

The utility model discloses a backlight module and display device thereof, wherein, be in including circuit board and setting reflecting plate and a plurality of illuminating part on the circuit board, every illuminating part top all is equipped with and is used for the encapsulation the packaging structure of illuminating part, the last reflecting structure that is provided with of packaging structure, reflecting structure can with the light reflection that the illuminating part sent extremely the reflecting plate. The utility model provides a backlight unit during operation, partial light that the illuminating part sent passes packaging structure directive reflection configuration, enlarges the light-emitting angle of single illuminating part through reflection configuration to improve the light efficiency, make backlight unit luminous even, enlarge the interval of illuminating part, reduce the application cost.

Description

Backlight module and display device thereof

Technical Field

The utility model relates to a display device technical field especially relates to a backlight unit and display device thereof.

Background

The existing lcd or lcd tv can be roughly divided into a side-type backlight module and a direct-type backlight module according to the position of the backlight source. The traditional direct type backlight device needs a certain optical thickness to realize light mixing among different light sources, the ultrathin backlight design is difficult to realize, the ultra-multi-partition backlight design cannot be realized, and the optical uniformity is poor compared with the traditional side-entering type backlight device. In order to realize the ultra-thin design of the Mini LED backlight application, the backlight adopts a Light Emitting Diode (LED) or an LED chip to be directly Printed on a Printed Circuit Board (PCB) as a backlight source, and the application of a lens is removed, so that the ultra-high uniformity design of the ultra-multi-partition ultra-thin backlight is achieved.

However, in the ultra-thin backlight design, the light mixing distance is small, for example, the light mixing distance is less than 5mm or even about 1mm, and the light emitting angle of the LED chip is generally about 140 °, so that the number of light emitting elements (LED chips) required at this time will increase sharply, and the cost and mass production application of the backlight module will be affected finally.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art not enough, an object of the present invention is to provide a backlight module and a display device thereof, which aims to solve the problem of requiring more illuminating members due to the small illuminating angle of the illuminating members in the ultra-thin backlight module.

The technical scheme of the utility model as follows:

the utility model provides a backlight module, wherein, is in including circuit board and setting reflecting plate and a plurality of illuminating part on the circuit board, every illuminating part top all is equipped with and is used for the encapsulation the packaging structure of illuminating part, the last reflecting structure that is provided with of packaging structure, reflecting structure can with the light reflection that the illuminating part sent extremely the reflecting plate.

The backlight module is characterized in that the reflecting structure is arranged right opposite to the light emitting direction of the light emitting piece, and the surface of the reflecting structure close to one side of the light emitting piece is a convex surface protruding towards the light emitting piece.

The backlight module, wherein, the illuminating part is one or more in cob encapsulation LED chip, mini LED chip, the Mirco LED chip.

In the backlight module, the light emitting element is one or more of a blue light chip, a green light chip or a red light chip.

The backlight module is characterized in that the circuit board is provided with a plurality of circuit boards which are spliced with each other; the reflecting plate and the circuit board are arranged in a staggered mode and are in contact with the adjacent circuit board.

In the backlight module, the plurality of light emitting elements are arranged on the circuit board in an array manner.

The backlight module is characterized in that the plurality of light emitting elements are arranged in at least two rows in an array manner, and the light emitting elements in two adjacent rows are arranged in a staggered manner.

The backlight module further comprises a diffusion plate arranged above the light emitting element and a support column arranged on the circuit board, wherein the support column is used for supporting the diffusion plate; a luminous piece through hole is formed in the position, corresponding to the luminous piece, of the reflecting plate, and a support column through hole is formed in the position, corresponding to the support column, of the reflecting plate; the backlight module further comprises an optical diaphragm, and the optical diaphragm is arranged on one side, deviating from the circuit board, of the diffusion plate.

The backlight module is characterized in that the optical film is one or more of a transparent film, a green quantum dot film or a red quantum dot film.

The utility model discloses still disclose a display device, wherein, include as above arbitrary one backlight unit.

Compared with the prior art, the embodiment of the utility model provides a have following advantage:

the application discloses set up reflective structure above the circuit board, that is to the region that light gathering nature is high on the illuminating part, the light that has inclination that jets out the illuminating part reflects the circuit board around the illuminating part, reflect once more through the reflecting plate on the circuit board, change the propagation direction of light, make light upwards propagate from the slope around the illuminating part, indirectly enlarge the light-emitting angle of single illuminating part, can set up the interval of adjacent illuminating part with the increase, reduce the illuminating part quantity on the backlight unit, reduce the application cost, reduce illuminating part central light gathering simultaneously, make whole backlight unit's luminous even.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of a backlight module according to the present invention;

FIG. 2 is a schematic structural view of a middle reflection plate according to the present invention;

fig. 3 is a schematic structural diagram of the middle reflection plate and the circuit board of the present invention.

10, a circuit board; 20. a light emitting member; 30. a reflective structure; 40. a packaging structure; 50. a reflective plate; 501. perforating the luminous piece; 502. a splice; 503. perforating the support columns; 60. a diffusion plate; 70. a support pillar; 80. an optical film.

Detailed Description

In order to make the technical solution of the present invention better understood, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

At present, with the development of computer technology and the expansion of internet market, the use of display devices is becoming more and more frequent, and companies and manufacturers are further developing new display devices to adapt to the development of technology, wherein the ultra-thin display technology is a great development trend in the field of display devices.

The Mini LED backlight technology uses LED chips for light emitting, has higher resolution and higher control precision compared with the traditional direct type backlight source and side type backlight source, and can reduce the thickness of the backlight module. However, when the Mini LED backlight driver is used to manufacture an ultra-thin model, the light mixing distance is small, which is less than 5mm and even about 1mm, and the LED light emitting angle is generally about 140 °, and the coverage area of each individual LED chip is small, so the number of LED chips required by the backlight module to emit light is greatly increased, which is a great challenge for the manufacturing cost.

Referring to fig. 1, the present application discloses a backlight module, wherein, including circuit board 10 and setting up reflecting plate 50 and a plurality of light-emitting component 20 on the circuit board 10, every light-emitting component 20 top all is equipped with and is used for the encapsulation packaging structure 40 of light-emitting component 20, be provided with reflecting structure 30 on the packaging structure 40, reflecting structure 30 can with the light reflection that light-emitting component 20 sent extremely reflecting plate 50.

The application discloses that the packaging structure 40 is arranged above the light-emitting member 20 of the backlight module, so that air is isolated, the influence of factors such as oxygen, water vapor and the like in the air on the light-emitting member 20 is reduced, the possibility that the light-emitting member 20 is affected by damp, short circuit, oxidation and the like is reduced, and the service life of the light-emitting member 20 is prolonged; in addition, each light emitting member 20 is separated, so that the mutual influence between the adjacent light emitting members 20 is reduced, and the product yield is improved. Meanwhile, the package structure 40 is a transparent solid, and the light emitted by the light emitting element 20 propagates faster in the transparent solid than in the air, and diffuse reflection is reduced, so that the package structure 40 can also improve the response speed and the light emitting quality of the backlight module.

The reflective structure 30 is disposed on the package structure 40, and the reflective structure 30 may be doped with SiO₂Or TiO₂Glue of equal reflection substance, the glue can be silica gel glue, epoxy resin glue, other transparent glue, etc., SiO₂Or TiO₂The material can block light and change the propagation direction of light, so that the surface of the reflective structure 30 can reflect light, and light emitted from the light emitting element 20 is blocked by the reflective structure 30 during the propagation process through the packaging structure 40, and is reflected to the circuit board 10 to pass throughThe reflecting plate 50 disposed on the circuit board 10 reflects again, change the propagation direction of the light, make the light upwards propagate from the slope around the light emitting component 20, the reflecting structure 30 cooperates with the reflecting plate 50, part of the light emitted from the light emitting component 20 is reflected twice, increase the light intensity around the light emitting component 20, indirectly enlarge the light-emitting angle of a single light emitting component 20, therefore, the space between adjacent light emitting components 20 can be increased in the embodiment, reduce the number of light emitting components 20 on the backlight module, reduce the application cost, reduce the central light gathering of the light emitting component 20, make the light emission of the whole backlight module uniform.

It should be noted that the circuit board 10 according to the embodiment of the present invention is preferably an aluminum-based board, and may also be an FR4 board or a bt (bimoleimide) board. A circuit is printed on the circuit board 10, and wiring connected to the light emitting member 20 is reduced and assembly is reduced. In addition, the surface of the circuit board 10 on which the light emitting member 20 is mounted is coated with a reflective layer. The addition of the reflecting layer can be a reflecting ink layer or SiO is doped₂Or TiO₂And the like, such as silica gel glue, epoxy glue, other transparent glue, and the like. The light is reflected to the circuit board 10 through the reflection structure 30, reflected once again, and then emitted, and the reflection layer is arranged, so that the reflection effect of the surface of the circuit board 10 is increased, the loss of the light in the reflection process is reduced, and good light intensity is maintained.

It should be further noted that the embodiment of the present invention relates to the light emitting component 20 can be one or more of COB package (chip on Board, COB) LED chip, mini LED chip and Micro LED chip, the light emitting component 20 can also be one or more of blue light chip, green light chip and red light chip, and can adopt the mode of flip chip to make. The method is suitable for different chips, can be used for manufacturing different display devices, and is applied to various occasions. Preferably, a cob packaging mode is adopted, each chip is independently sealed, a reflecting material is added at the position of the silica gel right above the chip to increase the emergent angle of light, and the structure of the reflecting part can be adjusted according to the final optical effect, so that the purposes of expanding the chip spacing and reducing the application cost are achieved.

Further, the package structure 40 is one or more of a silicone glue, an epoxy glue, other transparent glues, and the like. When the transparent glue is used for assembly, the glue is liquid and has surface tension, so that the water-drop-shaped packaging structure 40 can be obtained without a special die, a tapered three-dimensional structure with a sharp upper end and a thick lower end is formed after solidification, bubbles are not easily generated in the glue, the interference of the packaging structure 40 on light is reduced, the controllability of the light is increased, and the brightness balance of the backlight module is maintained as much as possible.

Further, the coating manner of the package structure 40 on the chip is printing, dispensing, spraying, molding, and the like.

Specifically, the reflection structure 30 is disposed right opposite to the light emitting direction of the light emitting element 20, and the surface of the reflection structure 30 close to the light emitting element 20 is a convex surface protruding toward the light emitting element. When the light emitting element 20 emits light, the intensity of the forward light is the largest, which easily causes the problems of light collection and uneven light distribution of the backlight module, so the reflection structure 30 is arranged to reduce light concentration, and the brightness of the whole backlight module is uniform. And light irradiates on the surface of the reflecting structure 30 close to one side of the light-emitting member 20, the light dispersion effect of the convex surface is better, when light irradiates on the reflecting structure 30 with a middle low edge height, the incident angle formed by the light and the contact surface changes along with the change of the position of the light irradiating on the convex surface, the light closer to the edge position of the reflecting structure 30 is dispersed farther, the effect of solving the bright point problem at the top of the chip is more obvious, and the convex curved surface is more beneficial to realizing the expansion of the light-emitting range of the single light-emitting member 20 as a whole.

Of course, the surface of the reflective structure 30 close to the light emitting member 20 may also be a plane or a concave arc surface concave to the side away from the light emitting member. The light source also can play the roles of dispersing and condensing light and expanding the light emitting range.

As shown in fig. 2, specifically, a reflection plate 50 is further disposed on one side of the circuit board 10, where the light emitting element 20 is disposed, and a light emitting element through hole 501 is disposed on the reflection plate 50 at a position corresponding to the light emitting element 20. The reflective plate 50 can increase the reflection effect, reduce the loss during the light transmission process, and maintain the sufficient light intensity during the reflection process. The reflecting plate 50 may be connected to the circuit board 10 by an adhesive or a double-sided tape. The shaking of the reflecting plate 50 in the use process is reduced by gluing, the reflecting plate 50 is prevented from colliding with the luminous piece 20, and the damage is reduced.

Specifically, the backlight module further includes a diffusion plate 60 disposed above the light emitting element 20 and a support column 70 disposed on the circuit board 10, wherein the support column 70 is used for supporting the diffusion plate 60. In order to further obtain uniform light, the backlight module is further provided with a layer of diffusion plate 60 above the light-emitting member 20, some light emitted by the light-emitting member 20 directly irradiates the surface of the diffusion plate 60, and some light irradiates the surface of the diffusion plate 60 through repeated reflection, so that the intensity and the direction are different. The support columns 70 are arranged to prevent the diffusion plate 60 from pressing on the reflection structure 30, so that the part of the light emitting element 20 shielded by the reflection structure 30 can be supplemented by other light rays emitted from the light emitting element 20 in an oblique direction, and the problem of black spots on the light emitting surface is avoided; in addition, the diffusion plate 60 does not press the light emitting member 20, and mutual abrasion is reduced during use.

Further, the diffusion plate 60 is a Polystyrene (PS) material plate or a polymethyl methacrylate (PMMA) material plate.

Further, the support posts 70 are preferably truncated cone-shaped, widening from near the top end of the diffuser plate 60 to near the bottom end of the circuit board 10. Firstly, the support in the shape of a circular truncated cone is stable, the shock resistance is better, and the support column 70 is not easy to collapse; in addition, the surface of the supporting column 70 can be coated with a reflective material layer, the side wall of the supporting column 70 is a curved surface, light rays transmitted everywhere can be uniformly dispersed, the condition of light ray aggregation can not be caused, and the reflective material is coated, so that the absorption of the supporting column 70 to the light rays can be reduced, and enough light intensity can be maintained.

In addition, the supporting posts 70 may be made of plastic material, which has certain elasticity and flexibility, and the diffusion plate 60 and the circuit board 10 are connected to the supporting posts 70, so that when vibration or displacement occurs during use, the supporting posts 70 may play a role in buffering, thereby reducing the possibility of damage to the circuit board 10 or the supporting posts 70.

In addition, the support posts 70 may be a transparent material if desired. Such as PS, PMMA or other high light transmitting plastic. Firstly, when the diffusion plate 60 is a PS plate or a PMMA plate, the material used for the support column 70 is the same as the material used for the diffusion plate 60, which saves resources, reduces waste, and reduces cost; and secondly, the transparent material reduces the blocking of light rays, thereby being beneficial to improving the overall brightness uniformity of the backlight module.

Further, when the reflection plate 50 is disposed, a support post through hole 503 is further disposed on the reflection plate 50 at a position corresponding to the support post 70, and the support post 70 passes through the support post through hole 503 and directly contacts the circuit board 10. The supporting column 70 can further limit the reflecting plate 50, so that the reflecting plate 50 is prevented from colliding with the light emitting part 20, and damage is reduced.

Specifically, the backlight module further includes an optical film 80, and the optical film 80 is disposed on a side of the diffusion plate 60 away from the circuit board 10. The optical film 80 can uniformly diffuse the light generated by the point light source, so that the light becomes further uniform, and the problem of uneven brightness is thoroughly solved; meanwhile, the light irradiation range is increased, and the illumination blind area is eliminated.

Further, the optical film 80 is one or more of a transparent film, a red-green quantum dot film, or a red-green quantum dot film. The optical film 80 can be matched with the light emitting element 20, and when the light emitting element 20 is a blue-green-red chip, the optical film 80 can be matched with a transparent film; when the light emitting element 20 is a blue light chip, the optical film 80 can be a red and green quantum dot film; when the light emitting element 20 is a blue-green chip, the optical film 80 can be a red quantum dot film. Therefore, high-color-gamut display can be realized in various forms, and the application cost is effectively reduced. The quantum dot material can be a first compound composed of III-V group elements including one of CdSe, SrSe, ZnSe, CdTe, CaSe, ZnS, CaS, MgS, SrS, BaS, MgTe, ZnTe, SrTe, MgSe, CaTe, BaSe, BaTe and CdS, or a second compound composed of II-VI group elements including one of GaAs, GaP, InP, InN, GaN and InAs, or a third compound including organic-inorganic hybrid perovskite (CH)₃NH₃PbX₃X ═ Cl, Br, I) material, or a fourth compound comprising all-inorganic perovskite cesium lead halide quantum dots (CsPbX)₃X ═ Cl, Br, I), or a core-shell structured compound or doped nanocrystal formed by coating with a plurality of the first compound and/or the second compound and/or the third compound and/or the fourth compound; the CdSe quantum dot material is preferred, the green quantum dot size is preferably between 2 and 6nm, the peak wavelength of the excited green light is between 510 and 550nm, the red quantum dot size is preferably between 4 and 9nm, and the peak wavelength of the excited red light is between 620 and 650 nm.

Further, the optical film 80 is a composite film of films such as a diffusion film, a brightness enhancement film, and a DBEF film.

Further, a plurality of the light emitting members 20 are arranged in an array on the circuit board 10. The plurality of light emitting members 20 are uniformly arranged on the circuit board 10, so that the light emitting intensity of the backlight module is further improved, and the brightness of each position on the backlight module is more uniform.

Further, the plurality of light emitting members 20 are arranged in at least two rows, and the light emitting members 20 in two adjacent rows are staggered. The staggered arrangement mode enables the distance between the adjacent light-emitting members 20 in each row and each column to be uniform, further improves the brightness uniformity, can save the number of the light-emitting members 20 and saves the cost.

As shown in fig. 3, the circuit board 10 has a plurality of circuit boards 10, and the circuit boards 10 are spliced with each other; the reflection plate 50 is disposed to be offset from the circuit board 10 and contacts the adjacent circuit board 10. The reflection plate 50 is provided with a splicing part 502 exceeding the surface of the circuit board 10, and is used for adhering to adjacent circuit boards 10 when a plurality of circuit boards 10 are spliced. Because the pursuit of people for a large screen cannot be met at one time by the existing process technology, a plurality of circuit boards 10 can be spliced together to form images together. Set up concatenation portion 502 and the laminating of adjacent circuit board 10 on with reflecting plate 50, then each circuit board 10 laminates each other together, and overall structure is stable, is difficult for droing, keeps the use in-process picture complete, uses the laminating of reflecting plate 50 moreover, then the clearance between the adjacent circuit board 10 also is sheltered from by reflecting plate 50, reduces influences such as shadow, light that the luminescence time gap caused and weakens.

As another embodiment of the present application, a display device is disclosed, which includes the backlight module as described above.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a backlight module which characterized in that, is in including circuit board and setting reflecting plate and a plurality of illuminating part on the circuit board, every illuminating part top all is equipped with and is used for the encapsulation the packaging structure of illuminating part, the last reflecting structure that is provided with of packaging structure, reflecting structure can with the light reflection that the illuminating part sent extremely the reflecting plate.

2. The backlight module according to claim 1, wherein the reflective structure is disposed opposite to the light emitting direction of the light emitting element, and a surface of the reflective structure on a side close to the light emitting element is a convex surface protruding toward the light emitting element.

3. The backlight module according to claim 1 or 2, wherein the light emitting member is one or more of a cob package LED chip, a mini LED chip, and a Mirco LED chip.

4. The backlight module as claimed in claim 1 or 2, wherein the light emitting member is one or more of a blue light chip, a green light chip or a red light chip.

5. The backlight module as claimed in claim 1, wherein the circuit board has a plurality of circuit boards, and the circuit boards are spliced with each other; the reflecting plate and the circuit board are arranged in a staggered mode and are in contact with the adjacent circuit board.

6. The backlight module as claimed in claim 1, wherein a plurality of the light emitting members are arranged on the circuit board in an array.

7. The backlight module as claimed in claim 6, wherein the plurality of light emitting members are arranged in at least two rows, and the light emitting members of two adjacent rows are staggered.

8. The backlight module according to claim 1, further comprising a diffuser plate disposed over the light emitting elements and supporting posts disposed on the circuit board for supporting the diffuser plate;

a luminous piece through hole is formed in the position, corresponding to the luminous piece, of the reflecting plate, and a support column through hole is formed in the position, corresponding to the support column, of the reflecting plate; the backlight module further comprises an optical diaphragm, and the optical diaphragm is arranged on one side, deviating from the circuit board, of the diffusion plate.

9. The backlight module of claim 8, wherein the optical film is one or more of a transparent film, a green quantum dot film, or a red quantum dot film.

10. A display device comprising the backlight module according to any one of claims 1 to 9.