CN114220901A - Packaging assembly and packaging method thereof - Google Patents
Packaging assembly and packaging method thereof Download PDFInfo
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- CN114220901A CN114220901A CN202111540041.6A CN202111540041A CN114220901A CN 114220901 A CN114220901 A CN 114220901A CN 202111540041 A CN202111540041 A CN 202111540041A CN 114220901 A CN114220901 A CN 114220901A
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- lens
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- dispensing
- nozzle
- contact interface
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000003292 glue Substances 0.000 claims description 63
- 239000007788 liquid Substances 0.000 claims description 27
- 108010010803 Gelatin Proteins 0.000 claims description 20
- 229920000159 gelatin Polymers 0.000 claims description 20
- 239000008273 gelatin Substances 0.000 claims description 20
- 235000019322 gelatine Nutrition 0.000 claims description 20
- 235000011852 gelatine desserts Nutrition 0.000 claims description 20
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
The embodiment of the invention discloses a packaging assembly and a packaging method thereof, wherein the packaging assembly comprises a chip, a first lens and a second lens, the first lens covers the chip, the second lens is connected to the outer surface of the first lens, the first lens comprises an enclosing surface and a contact interface, the enclosing surface encloses the chip, the contact interface is a connecting surface of the first lens and the second lens, the contact interface is in an inverted cone structure, and the cone top of the contact interface faces the chip. By the mode, when the chip emits light, part of the light is emitted from the surrounding surface, part of the light enters the contact interface, the light entering the contact interface is reflected for multiple times and then emitted from the surrounding surface, and the emission angle is opened, so that better uniform light mixing is realized in a fixed light mixing distance.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a packaging assembly and a packaging method thereof.
Background
The LED is a semiconductor light-emitting element manufactured based on a P-N junction electroluminescence principle, and has the characteristics of high electro-optic conversion efficiency, long service life, energy conservation, environmental protection, small size and the like.
When the LED is applied, the LED is arranged on the chip and then packaged to obtain a complete component or a product, and the LED is arranged on the chip and fixed on the base and packaged by carrying out die bonding and glue dispensing on the LED through a die bonder.
Among the prior art, the point is glued through the single sleeve of the piezoceramics of point gum machine, glue at the first layer of point on the chip through single sleeve, glue and carry out high temperature curing to this first layer and form specific shape, wait for after the first layer glues high temperature curing and accomplishes, on the basis that the first layer was glued, point second floor is glued, and glue to this second layer and carry out high temperature curing and form specific shape, the relatively poor inefficiency of the mixed light homogeneity of the structure that makes like this, be unfavorable for the volume production, the Lens simple structure of design, be unfavorable for the more complicated optical design of implementation.
Disclosure of Invention
The embodiment of the invention provides a packaging assembly and a packaging method thereof, wherein an inverted cone structure is formed among colloids through concentration difference and osmosis, a Lens structure with high light mixing uniformity and complex light mixing uniformity is realized, and the production efficiency is improved.
In a first aspect, an embodiment of the present invention provides a package assembly, including: chip, first lens and second lens, first lens cover the chip, the second lens connect in the surface of first lens, first lens is including surrounding surface and contact surface, surrounding surface encloses and establishes the chip, contact surface does first lens with the connection face of second lens, contact surface is the back taper structure, and its vertex of a cone orientation the chip.
Optionally, the package assembly further includes a base, and the chip is fixed to the base.
Optionally, the base includes a die attach area and a dispensing area, the chip is fixed to the die attach area, the bottom of the first lens is located in the dispensing area, and the bottom of the first lens is connected to the dispensing area.
Optionally, the packaging assembly further comprises an ink substrate coated on the base.
Optionally, the material of the surrounding surface is silica gelatin.
Optionally, the contact interface is made of silica gelatin and white glue.
Optionally, the second lens is made of white glue.
Optionally, the second lens is provided with diffusing particles.
In a second aspect, an embodiment of the present invention provides a packaging method for manufacturing the above-mentioned packaged assembly, the method is manufactured by a double-valve asynchronous dispenser, the double-valve asynchronous dispenser includes a first nozzle and a second nozzle, and the method includes the following steps:
fixing the chip, namely fixing the chip in the die bonding area of the base;
dispensing for the first time, adding liquid silicon gelatin in the double-valve asynchronous dispenser, dispensing the liquid silicon gelatin to the dispensing area of the base through the first nozzle, and forming the hemispherical first lens due to liquid fluidity to cover the chip;
the second dispensing is carried out, liquid white glue is added into the double-valve asynchronous dispenser, the liquid white glue is dispensed to the outer surface of the first lens through the second nozzle, a hemispherical second lens is formed due to liquid fluidity, and the contact interface is in an inverted cone structure due to liquid concentration difference and osmosis of the two lenses;
and (5) curing the adhesive layer, namely placing the base subjected to adhesive dispensing in a hot box for high-temperature curing.
Optionally, in the step of curing the adhesive layer, the baking temperature is 120 ℃ to 150 ℃, and the baking time is 30min to 60 min.
In an embodiment of the invention, the package assembly includes a chip, a first lens and a second lens, the first lens covers the chip, the second lens is connected to an outer surface of the first lens, the first lens includes a surrounding surface and a contact interface, the surrounding surface surrounds the chip, the contact interface is a connection surface of the first lens and the second lens, the contact interface is in an inverted cone structure, and a cone top of the contact interface faces the chip. By the mode, when the chip emits light, part of the light is emitted from the surrounding surface, part of the light enters the contact interface, the light entering the contact interface is reflected for multiple times and then emitted from the surrounding surface, and the emission angle is opened, so that better uniform light mixing is realized in a fixed light mixing distance.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a package assembly provided in an embodiment of the present application;
fig. 2 is a cross-sectional view of a package assembly provided by an embodiment of the present application;
fig. 3 is a schematic structural diagram of a double-valve asynchronous dispenser provided in an embodiment of the present application;
fig. 4 is a flowchart of a packaging method provided in an embodiment of the present application;
fig. 5 is an illumination simulation diagram of a package assembly provided by an embodiment of the present application;
referring to fig. 1 to 3, 100 is a package assembly, 11 is a first lens, 12 is a second lens, 13 is a chip, 111 is an enclosing surface, 112 is a contact interface, 500 is a double-valve asynchronous dispenser, 200 is a first dispenser, 300 is a second dispenser, 21 is a first piezoelectric valve, 22 is a first nozzle structure, 23 is a first temperature control structure, 31 is a second piezoelectric valve, 32 is a second nozzle structure, and 33 is a second temperature control structure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a packaging assembly and a packaging method thereof, wherein a structure which is in an inverted cone shape after solidification is formed through concentration difference and osmosis between two colloids made of liquid materials, so that light mixing uniformity of the packaging structure is realized, meanwhile, manufacturing time is saved, and detailed description is provided below.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of a package assembly according to an embodiment of the present disclosure, and fig. 2 is a cross-sectional view of the package assembly according to the embodiment of the present disclosure.
The package assembly 100 of the embodiment of the present application includes a first lens 11, a second lens 12 and a chip 13, the first lens 11 covers the chip 13, and the second lens 12 is disposed on an outer surface of the first lens 11.
Further, the first lens 11 includes an enclosing surface 111 and a contact interface 112, the enclosing surface 111 encloses the chip 13, the contact interface 112 is connected to a top position of the enclosing surface 111, and the contact interface 112 shields the chip 13.
In the embodiment of the present application, the surrounding surface 111 is made of silicon gelatin, and the contact interface 112 is made of silicon gelatin and white glue.
In the embodiment of this application, the surrounding surface 111 is incomplete hemisphere, encloses and establishes the chip 13, the contact interface 112 is the back taper structure, connect in the top position of surrounding surface 111, and, the contact interface 112 with the chip 13 is located relative position, be used for with the light that the chip 13 sent reflects, opens luminous angle, realizes the even purpose of mixed light.
Optionally, during the process of manufacturing the first lens 11, the combination of the surrounding surface 111 and the contact interface 112 first presents a complete hemispherical shape, and then the portion of the contact interface 112 of the first lens 11 is recessed downward to present an inverted cone-shaped structure due to the concentration difference and the penetration of the silica gelatin and the white glue.
The second lens 12 is connected to the top of the outer surface of the first lens 11, is located at a position opposite to the contact interface 112, and is made of white glue, and diffusion particles are arranged in the white glue on the second lens 12 and used for diffusing light rays emitted by the chip 13.
The second lens 12 has a complete hemispherical structure, or the second lens 12 has a curved structure, and in the embodiment of the present application, the shapes of the first lens 11 and the second lens 12 are not limited.
Optionally, when the first lens 11 is manufactured, a silicone gelatin is dispensed by dispensing to form a hemispherical structure, then a white glue is dispensed on the first lens 11 in a liquid state by dispensing to form a hemispherical structure, at a position where the first lens 11 contacts the second lens 12, due to the presence of the silicone gelatin and the white glue, the concentration of the silicone gelatin is different from that of the white glue, and a penetration effect is performed, so that the contact position is recessed, thereby obtaining the inverted conical structure with a lower concentration, and after curing, the first lens 11 and the second lens 12 are obtained.
The chip 13 is a circuit element provided with an LED lamp, and the chip 13 is used for connecting an external circuit and emitting light.
Optionally, in some embodiments, the package assembly 100 further includes a base (not shown), the base includes a die attach area (not shown) and a dispensing area (not shown), the chip 13 is fixed on the die attach area, the first lens 11 is connected to the dispensing area, specifically, the bottom of the first lens 11 is connected to the dispensing area, and the second lens 12 is far away from the dispensing area.
Optionally, in some embodiments, the package assembly 100 further includes an ink substrate (not shown) coated on the substrate.
The encapsulation subassembly 100 of the embodiment of the application, first lens 11 covers chip 13, second lens 12 connect in the top of first lens 11's surface, first lens 11 includes surrounding surface 111 reaches contact surface 112, contact surface 112 orientation chip 13's direction is sunken in order to be the back taper structure, works as the chip sends light, and partial light gets into surrounding surface 111, partial light gets into contact surface 112's light takes place the reflection, reflects extremely on the ink substrate, and reflects once more and follow surrounding surface 111 jets out to open emission angle, make in fixed mixed light distance, realize even thoughtlessly shining.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a double-valve asynchronous dispenser according to an embodiment of the present application, where the double-valve asynchronous dispenser 500 is used to manufacture the package assembly 100.
The double-valve asynchronous dispenser 500 comprises a first dispensing device 200 and a second dispensing device 300 which are connected, wherein the first dispensing device 200 is used for dispensing and preparing the first lens 11, and the second dispensing device 300 is used for dispensing and preparing the second lens 12.
In fact, it can be considered that the first dispensing device 200 is loaded with one kind of glue material, and the second dispensing device 300 is loaded with another kind of glue material.
In the embodiment of the present application, the first dispensing device 200 contains silica gelatin, and the second dispensing device 300 contains white glue.
Further, the first dispensing device 200 at least includes a first piezoelectric valve 21, a first nozzle structure 22 and a first temperature control structure 23, the first piezoelectric valve 21 and the first temperature control structure 23 are respectively connected to the first nozzle structure 22, and the first piezoelectric valve 21 and the first nozzle structure 22 are pneumatically connected to each other.
The first piezoelectric valve 21 is used to control whether the first nozzle structure 22 discharges glue, and may be controlled automatically by a program or manually.
The first nozzle structure 22 includes a first glue inlet (not shown), a first nozzle (not shown), and a first striker (not shown), wherein the first striker controls whether the first nozzle discharges glue, when the first striker ascends, the first nozzle discharges glue, and conversely, when the first striker descends, the first nozzle does not discharge glue.
Optionally, the first piezoelectric valve 21 controls the rising and falling of the first striker to further control whether the first nozzle discharges the glue, and the first piezoelectric valve 21 controls the glue discharging time and the glue discharging amount to control the required glue dispensing amount.
The first temperature control structure 23 is a temperature control structure, that is, the temperature of dispensing is controlled.
Optionally, in some embodiments, the first glue dispensing device 200 further includes a needle tube for storing glue, i.e., a material for glue dispensing.
Further, the second dispensing device 300 at least includes a second piezoelectric valve 31, a second nozzle structure 32 and a second temperature control structure 33, the second piezoelectric valve 31 and the second temperature control structure 33 are respectively connected to the second nozzle structure 32, wherein the second piezoelectric valve 31 is pneumatically connected to the second nozzle structure 32.
The second piezoelectric valve 31 is used for controlling whether the second nozzle structure 32 discharges glue, and may be controlled automatically by a program or manually.
The second nozzle structure 32 includes a second glue inlet (not shown), a second nozzle (not shown), and a second striker (not shown), wherein the second striker controls whether the second nozzle discharges glue, when the second striker ascends, the second nozzle discharges glue, and conversely, when the second striker descends, the second nozzle does not discharge glue.
Optionally, the second piezoelectric valve 31 controls the second striker to ascend and descend, so as to control whether the second nozzle discharges glue, and the first piezoelectric valve 21 controls glue discharging time and glue discharging amount to control a required glue dispensing amount.
The second temperature control structure 33 is a temperature control structure, i.e. controls the dispensing temperature.
Optionally, in some embodiments, the second dispensing device 300 further includes a needle tube for storing the glue material, i.e., the material for dispensing.
Optionally, the double-valve asynchronous dispenser 500 may independently drive the first dispensing device 200 to move the second dispensing device 300 on the X axis and the Y axis.
In some embodiments, during the preparation of the package assembly 100, the first temperature control structure 23 and the second temperature control structure 33 both detect and control the dispensing temperature, when the predetermined dispensing temperature is reached, the dual-valve asynchronous dispenser 500 controls the first nozzle structure 22 to move to a predetermined position, the first piezoelectric valve 21 controls the first plunger to ascend, the first nozzle to discharge glue, the silicone gelatin is dispensed on the predetermined position to form a hemispherical structure, then the first piezoelectric valve 21 controls the first plunger to descend, the first nozzle does not discharge glue, the set dispensing time and dispensing parameters such as pulse point are completed to control the required dispensing amount, the dispensing of the first dispensing apparatus 200 is completed, the dual-valve asynchronous dispenser 500 controls the first nozzle structure 22 to move to other positions, and controls the second dispensing apparatus 300 to move to a predetermined position, that is, the position opposite to the hemispherical structure, the second piezoelectric valve 31 controls the second striker to ascend, the second nozzle discharges glue, white glue is dispensed on the hemispherical structure to form another hemispherical structure, then the second piezoelectric valve 31 controls the second striker to descend, the second nozzle does not discharge glue, the set glue discharging time and the set glue dispensing parameters such as pulse point are completed to control the required glue discharging amount, and the glue dispensing of the second glue dispensing device 300 is completed.
Referring to fig. 4, fig. 4 is a flowchart of a packaging method according to an embodiment of the present application, where the method includes the following steps:
101. and (5) fixing the chip.
And the chip is fixed on the die bonding area of the base, and an LED lamp is arranged on the chip and used for emitting light.
102. And dispensing for the first time.
In the embodiment of this application, the process of first time point is glued is made through foretell double-valve asynchronous point gum machine add liquid silica gelatin in the double-valve asynchronous point gum machine, through first nozzle will liquid silica gelatin point arrive the base the point gum district, because liquid mobility, the formation is hemispherical first lens covers the chip.
Specifically, liquid silicone gelatin is added into a needle tube of the first dispensing device, when a preset dispensing temperature is reached, the double-valve asynchronous dispensing machine controls the first nozzle structure to move to the position above the base, the first piezoelectric valve controls the first striker to ascend, and the liquid silicone gelatin flows out of the first nozzle and is dispensed to the dispensing area of the base to form a hemispherical structure, namely, the hemispherical first lens is formed to cover the chip.
103. And dispensing for the second time.
In the embodiment of this application, the process of second time point is glued is made through foretell double-valve asynchronous point gum machine add liquid white glue in the double-valve asynchronous point gum machine, through the second nozzle is got liquid white glue point to the surface of first lens, because liquid mobility forms hemispherical second lens, because liquid concentration difference and infiltration, make contact interface is the back taper structure, and the concentration of this back taper structure is lower.
Specifically, after the hemispherical first lens is formed, liquid white glue is added into a needle tube of the second dispensing device, the double-valve asynchronous dispensing machine controls the second nozzle structure to move above the first lens, the second piezoelectric valve controls the second striker to ascend, the liquid white glue flows out of the second nozzle structure to reach the top of the first lens and forms a hemispherical structure, namely, the hemispherical second lens is formed, and at the contact position of the first lens and the second lens, the reverse taper structure is formed due to concentration difference and osmosis of the two kinds of liquid glue.
Optionally, in some embodiments, the second dispensing device adds white glue and diffusion particles.
104. And (5) curing the glue layer.
And placing the base subjected to glue dispensing in a hot box, and carrying out high-temperature curing to obtain the solid packaging assembly.
In the embodiment of the present application, the baking temperature is set to 120 ℃ to 150 ℃, and the baking time is set to 30min to 60 min.
The utility model provides a packaging method for make the encapsulation subassembly, the encapsulation subassembly first lens cover the chip, the second lens connect in the top of the surface of first lens, first lens include the surrounding surface reaches contact surface, contact surface orientation the direction of chip is sunken in order to be the back taper structure, works as the chip sends light, and partial light gets into the surrounding surface, partial light gets into contact surface's light takes place the reflection, reflects extremely on the ink substrate, and reflects once more and follows the surrounding surface jets out to open emission angle, make in fixed thoughtlessly light distance, realize evenly mixing better.
Referring to fig. 5, fig. 5 is an illumination simulation diagram of a package assembly according to an embodiment of the present application, in which an abscissa represents a position of a light spot in a horizontal direction and an ordinate represents a position of the light spot in a vertical direction.
It can be known from the figure that the light emitting angle of the illumination is opened, and the high-quality uniform light mixing can be realized in the fixed light mixing distance.
The packaging assembly 100 of the embodiment of the application comprises a first lens 11, a second lens 12 and a chip 13, wherein the first lens 11 covers the chip 13, the second lens 12 is connected to the top of the first lens 11, the first lens 11 comprises an enclosing surface 111 and a contact interface 112, the contact interface 112 and the chip 13 are located at opposite positions and face the chip 13 is sunken to be in an inverted cone-shaped structure, when the chip 13 emits light, partial light is emitted from the enclosing surface 111, partial light enters the contact interface 112 and enters the light of the contact interface 112 after being reflected for multiple times, the enclosing surface 111 emits light, an emission angle is opened, and uniform light mixing is better achieved in a fixed light mixing distance.
The package assembly and the package method provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are described herein by applying specific examples, and the description of the above embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A package assembly, comprising: chip, first lens and second lens, first lens cover the chip, the second lens connect in the surface of first lens, first lens is including surrounding surface and contact surface, surrounding surface encloses and establishes the chip, contact surface does first lens with the connection face of second lens, contact surface is the back taper structure, and its vertex of a cone orientation the chip.
2. The package of claim 1, further comprising a base to which the die is attached.
3. The package assembly of claim 2, wherein the base includes a die attach region and a dispensing region, the die is attached to the die attach region, the bottom of the first lens is located at the dispensing region, and the bottom of the first lens is connected to the dispensing region.
4. The package assembly of claim 2, further comprising an ink substrate coated on the base.
5. The package of claim 1, wherein the enclosure surface is formed of silicone gelatin.
6. The package assembly of claim 1, wherein the contact interface is made of silicone gelatin and white glue.
7. The package assembly of claim 1, wherein the second lens is made of white glue.
8. The package of claim 1, wherein the second lens has diffusing particles disposed thereon.
9. A packaging method for making the package assembly of any of claims 1 to 8, wherein the method is made by a double valve asynchronous dispenser comprising a first nozzle and a second nozzle, the method comprising the steps of:
fixing the chip, namely fixing the chip in the die bonding area of the base;
dispensing for the first time, adding liquid silicon gelatin in the double-valve asynchronous dispenser, dispensing the liquid silicon gelatin to the dispensing area of the base through the first nozzle, and forming the hemispherical first lens due to liquid fluidity to cover the chip;
the second dispensing is carried out, liquid white glue is added into the double-valve asynchronous dispenser, the liquid white glue is dispensed to the outer surface of the first lens through the second nozzle, a hemispherical second lens is formed due to liquid fluidity, and the contact interface is in an inverted cone structure due to liquid concentration difference and osmosis of the two lenses;
and (5) curing the adhesive layer, namely placing the base subjected to adhesive dispensing in a hot box for high-temperature curing.
10. The method of claim 9, wherein the curing of the adhesive layer is performed at a baking temperature of 120 ℃ to 150 ℃ for 30min to 60 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111540041.6A CN114220901A (en) | 2021-12-15 | 2021-12-15 | Packaging assembly and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111540041.6A CN114220901A (en) | 2021-12-15 | 2021-12-15 | Packaging assembly and packaging method thereof |
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| CN114220901A true CN114220901A (en) | 2022-03-22 |
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| CN202111540041.6A Pending CN114220901A (en) | 2021-12-15 | 2021-12-15 | Packaging assembly and packaging method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270713A (en) * | 2011-07-28 | 2011-12-07 | 深圳市聚飞光电股份有限公司 | LED (light emitting diode) packaging method and LED |
| KR20120017703A (en) * | 2010-08-19 | 2012-02-29 | 서울반도체 주식회사 | Lens and light-emitting device having the same |
| CN103456871A (en) * | 2013-09-23 | 2013-12-18 | 电子科技大学 | Fluorescent powder coating structure for improving uniformity of pc-LEDs spatial photochromism |
| CN104421834A (en) * | 2013-08-28 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Compound lens and manufacturing method thereof and light source device using same |
| CN210398448U (en) * | 2019-08-21 | 2020-04-24 | 深圳市兆驰节能照明股份有限公司 | Four-side light-emitting light source with large light-emitting angle and backlight module |
| CN111701805A (en) * | 2020-06-29 | 2020-09-25 | 深圳市佳思特光电设备有限公司 | Inverted direct-connection type double-dispensing mechanism and dispensing method thereof |
| CN213240753U (en) * | 2020-09-18 | 2021-05-18 | 深圳Tcl新技术有限公司 | Backlight module and display device thereof |
-
2021
- 2021-12-15 CN CN202111540041.6A patent/CN114220901A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120017703A (en) * | 2010-08-19 | 2012-02-29 | 서울반도체 주식회사 | Lens and light-emitting device having the same |
| CN102270713A (en) * | 2011-07-28 | 2011-12-07 | 深圳市聚飞光电股份有限公司 | LED (light emitting diode) packaging method and LED |
| CN104421834A (en) * | 2013-08-28 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Compound lens and manufacturing method thereof and light source device using same |
| CN103456871A (en) * | 2013-09-23 | 2013-12-18 | 电子科技大学 | Fluorescent powder coating structure for improving uniformity of pc-LEDs spatial photochromism |
| CN210398448U (en) * | 2019-08-21 | 2020-04-24 | 深圳市兆驰节能照明股份有限公司 | Four-side light-emitting light source with large light-emitting angle and backlight module |
| CN111701805A (en) * | 2020-06-29 | 2020-09-25 | 深圳市佳思特光电设备有限公司 | Inverted direct-connection type double-dispensing mechanism and dispensing method thereof |
| CN213240753U (en) * | 2020-09-18 | 2021-05-18 | 深圳Tcl新技术有限公司 | Backlight module and display device thereof |
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