CN208385445U - The LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer - Google Patents
The LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer Download PDFInfo
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- CN208385445U CN208385445U CN201821026816.1U CN201821026816U CN208385445U CN 208385445 U CN208385445 U CN 208385445U CN 201821026816 U CN201821026816 U CN 201821026816U CN 208385445 U CN208385445 U CN 208385445U
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Abstract
The utility model discloses a kind of LED module encapsulating structures of adjustable color multilayer long distance formula phosphor powder layer, the outer profile of its layer of silica gel is in the convex structure with two-layer epitaxial platform, internal plastic packaging LED chip, outer surface covers phosphor powder layer by dispensing, each layer of fluorescent glue is limited by the corresponding extension platform border of layer of silica gel, and phosphor powder layer is formed when stablizing static under surface tension and attraction of gravitation act on, phosphor powder layer wraps up the top of layer of silica gel and side, the outer profile of phosphor powder layer is in convex arc hemisphere, the structure realizes long distance formula excitation multilayered fluorescent powder, obtained phosphor powder layer tactical rule, thickness is uniform, and the light emitting region of LED chip side can be covered, with adjustable color, phosphor powder layer tactical rule, thickness is uniform, and chip sides light emitting region can be covered, only need an essence Spending enough dispensers can realize that the long distance formula of multilayered fluorescent powder, thickness are uniform, be enough the characteristics of covering the coating that chip sides shine.
Description
Technical field
The utility model relates to LED encapsulation technology fields, and in particular to a kind of adjustable color multilayer long distance formula phosphor powder layer
LED module encapsulating structure.
Background technique
LED (Light Emitting Diode), light emitting diode is a kind of solid state semiconductor devices, it can be straight
It connects and electric energy is converted into luminous energy.LED encapsulates the encapsulation for referring to luminescence chip, has relatively big difference compared to integrated antenna package.LED's
Encapsulation is not only required to protection wick, but also being capable of light transmission.So the encapsulation of LED has special want to encapsulating material
It asks.Encapsulating structure common at present is chip periphery encapsulation fluorescent powder and silica gel, and silica gel is mainly for the protection of LED chip and association
Electronic component, fluorescent powder be mainly used for excited white light (general blue-light LED chip go out light excite to obtain by yellow fluorescent powder it is white
Light).According to heat dissipation design, the requirement of light extraction efficiency, photochromic index, reliability, encapsulating structure is all kinds of.
Typical White-light LED package structure is: it fixed chip and completes to be electrically connected on LED support, in reflector,
Reflector cavity encapsulating fluorescent powder, fluorescent powder coating is in chip periphery.In the blue light that fluorescent powder periphery encapsulating silica gel, chip issue
White light is become by fluorescent powder excitation, white light or is directly scattered to outside bracket, or reflects the light of fixed colour temperature by reflective wall of cup.
Fluorescent powder is directly coated at chip periphery, it is meant that light is issued from chip touches fluorescent powder, this optical mode out
There are two types of disadvantages for formula: 1, some light is directly reflected back chip by fluorescent powder, this part light has upset the light of chip sending.2, core
Piece fever is directly conducted to phosphor powder layer, accelerates the heating of fluorescent powder, and directly damage reduces the fluorescent powder service life, causes LED light can
By property problem.
Newest fluorescent powder coating technology changes the encapsulation design of chip, phosphor powder layer for both of these problems, by core
Piece is isolated with phosphor powder layer, between chip and phosphor powder layer or is other translucent materials, or be vacuum etc..Here it is so-called remote
Away from formula phosphor powder layer coating technique.The coating of long distance formula phosphor powder layer is not uncommon for, and there are the relevant technologies patent application, long distance in each state
Formula phosphor powder layer coating technique carries out insulation package to chip and phosphor powder layer in industry there is no absolutely stringent technical standard
Technology can become long distance formula phosphor powder layer be coated with.
The existing long distance formula phosphor powder layer coating technique based on adjustable color LED module is mature far away, still unsolved to ask
Topic has: 1, thickness uniformly, the phosphor powder layer of regular shape；2, the phosphor powder layer in chip sides output optical zone domain is covered；3, without mold
Prepare phosphor powder layer；4, there was only single fluorescent bisque；5, it cannot achieve adjustable color.The skill that above-mentioned 5 problems are solved simultaneously
Art scheme generally requires that precision is high, processing procedures of complex procedures.
Summary of the invention
In view of the deficiencies of the prior art, the utility model is intended to provide a kind of adjustable color, phosphor powder layer tactical rule, thickness
Degree is uniform and can cover the LED module encapsulating structure of the adjustable color multilayer long distance formula phosphor powder layer of chip sides light emitting region.
To achieve the above objectives, the present invention adopts the following technical solutions:
The LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer, including substrate, LED chip, layer of silica gel,
First phosphor powder layer and the second phosphor powder layer, the LED chip is fixed on substrate, and layer of silica gel package LED chip is simultaneously fixed on
On substrate, the outer profile of layer of silica gel has first layer extension platform and second layer extension platform, and the first phosphor powder layer is located at silica gel
Above the second layer extension platform of layer and layer of silica gel is wrapped up, the second phosphor powder layer is located above the first layer extension platform of layer of silica gel
And the first phosphor powder layer is wrapped up, substrate, LED chip, layer of silica gel, the first phosphor powder layer and the second phosphor powder layer encapsulate to form difference
Array forms LED module again after the LED unit of colour temperature.
Further, the edge of the second layer extension platform of the bottom outer edge and layer of silica gel of first phosphor powder layer is flat
Together, the edge of first layer extension platform of the bottom outer edge with layer of silica gel of the second phosphor powder layer is concordant.
Further, the outer profile of first phosphor powder layer and the second phosphor powder layer is in convex cambered surface, and Internal periphery is in
Concave structure, concave structure are hemispherical, cylinder or Polygonal column shape, and the thickness of the first phosphor powder layer and the second phosphor powder layer is equal
It is even.
The utility model has the following beneficial effects:
The LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer, the foreign steamer of layer of silica gel
Exterior feature covers phosphor powder layer by dispensing in the convex structure with two-layer epitaxial platform, internal plastic packaging LED chip, outer surface, often
One layer of fluorescent glue is limited by the corresponding extension platform border of layer of silica gel, and is stablized under surface tension and attraction of gravitation effect
Phosphor powder layer is formed when static, phosphor powder layer wraps up the top of layer of silica gel and side, and the outer profile of phosphor powder layer is in convex
Arc hemisphere, the structure realize long distance formula excitation multilayered fluorescent powder, and obtained phosphor powder layer tactical rule, thickness is uniform, and
The light emitting region that LED chip side can be covered, overcomes how the coating LED encapsulation of long distance formula multilayered fluorescent powder carries out difficulty for dispensing glue
Topic, while designing by modular encapsulating structure and can solve the fluorescent powder coated uneven caused light out of traditional long distance
The array modularity design that different-colour LED package unit is realized on the basis of the low problem of uneven and aobvious finger, is set by circuit
The supply current size that meter adjusts LED unit realizes that the light that goes out of different-colour requires；It is advised with adjustable color, phosphor powder layer structure
Then, thickness is uniform and can cover chip sides light emitting region, only need the enough dispenser of precision that can realize that multilayer is glimmering
The long distance formula of light powder, thickness is uniform, is enough the characteristics of covering the coating that chip sides shine.
Detailed description of the invention
Fig. 1 is the schematic diagram of the LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer；
Fig. 2 is its layer of silica gel battle array of the LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer
The side view of column；
Fig. 3 is its layer of silica gel battle array of the LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer
The top view of column；
Fig. 4 is its layer of silica gel of the LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer
Prepare mold side view；
Fig. 5 is its layer of silica gel of the LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer
Demolding structure schematic diagram.
In figure: 10, substrate；20, LED chip；30, layer of silica gel；40, the first phosphor powder layer；50, the second phosphor powder layer；60,
First layer extension platform；70, second layer extension platform.
Specific embodiment
With reference to the accompanying drawing and specific embodiment, the utility model will be further described, in order to become apparent from geography
Solve the technical idea of the requires of the utility model protection.
The LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer as shown in Figs. 1-3, including
Substrate 10, LED chip 20, layer of silica gel 30, the first phosphor powder layer 40 and the second phosphor powder layer 50, LED chip 20 are fixed on substrate
On 10, layer of silica gel 30 is wrapped up LED chip 20 and is fixed on substrate 10, and the outer profile of layer of silica gel 30 has first layer extension platform
60 and second layer extension platform 70, the first phosphor powder layer 40 is located at 70 top of second layer extension platform of layer of silica gel 30 and wraps up silicon
Glue-line 30, the second phosphor powder layer 50 are located at 60 top of first layer extension platform of layer of silica gel 30 and wrap up the first phosphor powder layer 40,
Substrate 10, LED chip 20, layer of silica gel 30, the first phosphor powder layer 40 and the encapsulation of the second phosphor powder layer 50 form the LED of different-colour
Array forms LED module again after unit.
Wherein, the edge of the second layer extension platform 70 of the bottom outer edge Yu layer of silica gel 30 of the first phosphor powder layer 40 is flat
Together, the edge of first layer extension platform 60 of bottom outer edge with layer of silica gel 30 of the second phosphor powder layer 50 is concordant.
The outer profile of first phosphor powder layer 40 and the second phosphor powder layer 50 be in convex cambered surface, the concave structure of Internal periphery,
Concave structure is hemispherical, cylinder or Polygonal column shape, and the thickness of the first phosphor powder layer 40 and the second phosphor powder layer 50 is uniform.
The preparation method of the utility model LED module encapsulating structure, includes the following steps:
(1) die bond: 20 array of LED chip is fixed on substrate 10, then is placed in high temperature roaster and is carried out die bond adhesive curing；
(2) bonding wire: the lead on LED chip 20 and substrate 10 is welded using gold thread, independent LED unit is obtained and electrically draws
Foot；
(3) preparation of layer of silica gel 30: silica gel is injected mould by the mold that one shape of preparation is matched with array layer of silica gel 30
In tool, the LED unit for then obtaining step (2) is buckled on mold, and LED chip 20 submerges in silica gel completely, and one solidifies
The layer of silica gel 30 of one layer of convex structure with two-layer epitaxial platform is formed after demoulding in LED unit, layer of silica gel 30 wraps up LED
Chip 20；
(4) first layer dispensing: silica gel is added in fluorescent powder and obtains the fluorescent glue with mobility, by fluorescent glue decanting point
The LED unit for covering layer of silica gel 30 that step (3) obtains is placed on dispenser job platform, carries out a little by glue machine needle cylinder
Glue, fluorescent glue cover the upper surface of layer of silica gel 30 according to itself mobility, since fluorescent glue is viscous fluid, by layer of silica gel 30
The limitation of 70 boundary of second layer extension platform, and when stablizing static under surface tension and attraction of gravitation effect, form the
One phosphor powder layer 40, the first phosphor powder layer 40 wrap up the top of layer of silica gel 30 and side, the bottom surface of the first phosphor powder layer 40 with
70 upper surface of second layer extension platform is overlapped, and the outer profile of the first phosphor powder layer 40 is in convex cambered surface；
(5) first phosphor powder layers 40 solidify: the LED unit that dispensing is finished is placed in temperature control oven, dries at 80-150 DEG C
Roasting 1-2h completes the solidification of the first phosphor powder layer 40；
(6) second layer dispensing: silica gel is added in fluorescent powder and obtains the fluorescent glue with mobility, by fluorescent glue decanting point
Glue machine needle cylinder, it is enterprising that the LED unit for covering the first phosphor powder layer 40 that step (5) is obtained is placed on dispenser job platform
Row dispensing, fluorescent glue cover the upper surface of the first phosphor powder layer 40 according to itself mobility, since fluorescent glue is viscous fluid,
Limited by 60 boundary of first layer extension platform of layer of silica gel 30, and surface tension and attraction of gravitation effect under stablize it is static
The second phosphor powder layer 50 is formed, the second phosphor powder layer 50 wraps up the top of the first phosphor powder layer 40 and side, the second fluorescent powder
50 bottom surface of layer are overlapped with 60 upper surface of first layer extension platform, and the outer profile of the second phosphor powder layer 50 is in convex cambered surface；
(7) second phosphor powder layers 50 solidify: the LED unit that step (6) dispensing is finished is placed in temperature control oven, in 80-150
1-2h is toasted at DEG C, completes the encapsulating structure that the second phosphor powder layer 50 solidifies the LED unit to get same colour temperature；
(8) the step of type of the concentration and fluorescent powder that change fluorescent glue repeats (4)-(7), obtain different-colour goes out light
Effect.
The utility model introduces the dispensing technology for being typically used in non-long distance coating fluorescent powder, and first preparing outer profile is in have
The layer of silica gel 30 of two-layer epitaxial platform convex structure, then long distance dispensing is carried out, utilize the mobility, surface tension and silicon of fluorescent glue
The boundary of glue-line extension platform limits, directly obtain thickness it is uniform, it is hemispherical, the multilayered fluorescent powder that chip sides go out light can be covered
Layer obtains the LED unit for the fixation colour temperature that encapsulation finishes.
By changing the concentration of fluorescent glue and the type repetition above step of fluorescent powder, different-colour after being encapsulated
LED unit array.It is powered current control for LED array finally by circuit design, the LED of different-colour is issued
Light be combined light mixing, obtain mixed different-colour, realize the function of adjustable color.
Encapsulating structure design: first carrying out the silica gel plastic packaging of chip, then repeatedly puts fluorescent glue in Silica Surface, realizes multilayer
Long distance coats fluorescent powder.
Phosphor powder layer design: the light in order to surround chip sides sending, each layer of phosphor powder layer design are that thickness is equal
Even cambered surface.
Gluing process design: in order to make a little to form cambered surface in homogeneous thickness in the multilayered fluorescent glue on 30 surface of layer of silica gel, add
When work designs 30 structure of layer of silica gel, 30 root edge of layer of silica gel is made to have the laterally projecting formation two-layer epitaxial platform of multi-step shape, silicon
30 bottom surface of glue-line is circle, and laterally projecting top view is an annulus.The fluorescent glue on 30 surface of layer of silica gel is put at " annulus "
I.e. under the limitation on the boundary of the extension platform of layer of silica gel, relies on itself mobility, cover silicon under gravity and surface tension effects
30 surface of glue-line.Thickness of each layer of fluorescent adhesive layer at root edge is equal to the laterally projecting width of 30 root edge of corresponding silica gel layer.
After fluorescence adhesive curing, the multilayered fluorescent powder for obtaining a fixed colour temperature is coated with the LED unit hemispherical finished, and by changing
Become fluorescent glue repetition packaging technology and obtains the LED module of different-colour.
LED unit structure feature: being respectively LED chip 20, layer of silica gel 30, the first phosphor powder layer 40 and second from inside to outside
Phosphor powder layer 50, each layer of phosphor powder layer and 30 hemisphere bottom contact portion of layer of silica gel, each layer of phosphor powder layer thickness and silica gel
The width of 30 corresponding extension platform of layer is corresponding consistent, and LED chip 20 goes out light and initially passes through layer of silica gel 30 again by the double-deck fluorescent adhesive layer
Excitation.
The silica gel plastic packaging stage: the coating that fluorescent powder is first carried out with traditional handicraft is different then at phosphor powder layer periphery plastic packaging silica gel
Sample first carries out silica gel plastic packaging in chip periphery, to realize phosphor powder layer and chip isolation --- i.e. long distance setting phosphor powder layer.
It is enough to surround chip all directions in order to obtain and goes out light, Multi-layer phosphor powder in homogeneous thickness, needs special shape
Layer of silica gel 30 (plastic packaging has LED chip 20 in colloidal silica) carry fluorescent glue, the shape of colloidal silica according to the specification of chip and
Fluorescence glue amount determines.The plastic packaging of traditional silica gel is directly in fluorescent powder or chip periphery encapsulating silica gel, and present long distance dispensing is to silicon
Colloid shape has particular/special requirement, must first make colloidal silica in certain shape, then in conjunction with chip after solidify together.
As illustrated in figures 4-5, silica gel is injected in silica gel mould cavity, until filling.By the good LED array chip base of die bond
Seat, with chip towards the direction of silica gel mould cavity, above silica gel mould cavity, array chip submerges silica gel, chip for clinching
Pedestal is contacted with silica gel everywhere, is binded.Curing and demolding obtains the chip packaging array structure that encapsulating silica gel finishes, and is in root edge
There is laterally projecting irregular hemisphere, silica gel hemisphere includes chip, root edge has multi-step shape protrusion to form multilayer epitaxial platform.
Prepare the mold design of layer of silica gel 30: mold is one block of enough aluminium of thickness, digs out the cavity of an array, empty
Chamber is geometrically divided into two parts, and a part is lower body portions, and main part is hemi-spherical cavities, specification according to Chip scale and
Light requires to determine out.Another part is the negative area for being connected the upper limb of main part, and negative area is in annulus shape, depressed portions
The inner ring divided is overlapped with the upper limb of main part, the thickness pair of each layer of outer ring width and each layer of phosphor powder layer of negative area
It answers, specific width is determined according to fluorescence glue amount.
The LED module encapsulating structure of the utility model adjustable color multilayer long distance formula phosphor powder layer, layer of silica gel 30 it is outer
Profile is in the convex structure with two-layer epitaxial platform, and internal plastic packaging LED chip 20, outer surface covers fluorescent powder by dispensing
Layer, each layer of fluorescent glue are limited by the corresponding extension platform border of layer of silica gel 30, and are made in surface tension and attraction of gravitation
Phosphor powder layer is formed when stablizing static under, phosphor powder layer wraps up the top of layer of silica gel 30 and side, the foreign steamer of phosphor powder layer
Exterior feature is in convex arc hemisphere, which realizes long distance formula excitation multilayered fluorescent powder, obtained phosphor powder layer tactical rule, thickness
Degree uniformly, and can cover the light emitting region of 20 side of LED chip, how overcome long distance formula multilayered fluorescent powder coating LED encapsulation
Problem for dispensing glue is carried out, while can be fluorescent powder coated uneven in the traditional long distance of solution by the design of modular encapsulating structure
It is caused go out light it is uneven and aobvious refer to realizes that the array modularity of different-colour LED package unit is set on the basis of low problem
Meter realizes that the light that goes out of different-colour requires by the supply current size that circuit design adjusts LED unit；With adjustable color,
Phosphor powder layer tactical rule, thickness are uniform and can cover chip sides light emitting region, only need an enough dispenser of precision
It can realize that the long distance formula of multilayered fluorescent powder, thickness is uniform, is enough the characteristics of covering the coating that chip sides shine.
For those skilled in the art, it can make other each according to the above description of the technical scheme and ideas
Kind is corresponding to be changed and deforms, and all these change and deform the guarantor that all should belong to the utility model claims
Within the scope of shield.
Claims (3)
1. the LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer, it is characterised in that: including substrate (10), LED
Chip (20), layer of silica gel (30), the first phosphor powder layer (40) and the second phosphor powder layer (50), the LED chip (20) are fixed on
On substrate (10), layer of silica gel (30) package LED chip (20) is simultaneously fixed on substrate (10), and the outer profile of layer of silica gel (30) has
First layer extension platform (60) and second layer extension platform (70), the first phosphor powder layer (40) are located at the second layer of layer of silica gel (30)
It above extension platform (70) and wraps up layer of silica gel (30), the second phosphor powder layer (50) is located at outer Yangjing of first layer of layer of silica gel (30)
Above platform (60) and the first phosphor powder layer (40) are wrapped up, substrate (10), LED chip (20), layer of silica gel (30), the first phosphor powder layer
(40) and the second phosphor powder layer (50) encapsulation forms after the LED unit of different-colour that array forms LED module again.
2. the LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer as described in claim 1, feature exist
In: the edge of the second layer extension platform (70) of the bottom outer edge and layer of silica gel (30) of first phosphor powder layer (40) is flat
Together, the bottom outer edge of the second phosphor powder layer (50) is concordant with the edge of first layer extension platform (60) of layer of silica gel (30).
3. the LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer as described in claim 1, feature exist
In: the outer profile of first phosphor powder layer (40) and the second phosphor powder layer (50) is in convex cambered surface, the concave knot of Internal periphery
Structure, concave structure are hemispherical, cylinder or Polygonal column shape, the thickness of the first phosphor powder layer (40) and the second phosphor powder layer (50)
Uniformly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821026816.1U CN208385445U (en) | 2018-06-30 | 2018-06-30 | The LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer |
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| CN201821026816.1U CN208385445U (en) | 2018-06-30 | 2018-06-30 | The LED module encapsulating structure of adjustable color multilayer long distance formula phosphor powder layer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364605A (en) * | 2019-07-26 | 2019-10-22 | 佛山市国星半导体技术有限公司 | A kind of leakproof indigo plant flip LED chips and preparation method thereof, LED component |
| CN115579357A (en) * | 2022-12-07 | 2023-01-06 | 山西高科华兴电子科技有限公司 | Outdoor full-color surface-mounted LED structure and production method thereof |
-
2018
- 2018-06-30 CN CN201821026816.1U patent/CN208385445U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364605A (en) * | 2019-07-26 | 2019-10-22 | 佛山市国星半导体技术有限公司 | A kind of leakproof indigo plant flip LED chips and preparation method thereof, LED component |
| CN115579357A (en) * | 2022-12-07 | 2023-01-06 | 山西高科华兴电子科技有限公司 | Outdoor full-color surface-mounted LED structure and production method thereof |
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