CN209765224U - backlight module and display device - Google Patents
backlight module and display device Download PDFInfo
- Publication number
- CN209765224U CN209765224U CN201920522298.0U CN201920522298U CN209765224U CN 209765224 U CN209765224 U CN 209765224U CN 201920522298 U CN201920522298 U CN 201920522298U CN 209765224 U CN209765224 U CN 209765224U
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- China
- Prior art keywords
- light
- backlight module
- led chip
- packaging adhesive
- bracket
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
Abstract
The utility model discloses a backlight module and a display device, which comprises a bracket and a holding tank arranged on the bracket, and an LED chip arranged at the bottom of the accommodating groove, wherein the accommodating groove is also internally provided with packaging adhesive, the bottom surface of the packaging adhesive covers the light-emitting surface of the LED chip, the top surface of the packaging adhesive is spherical and protrudes relative to the top surface of the bracket, so that the emergent angle of the light rays emitted by the LED chip to the spherical surface of the packaging adhesive can be increased, the LED chip can be focused, the relative incident angle of the incident light emitted by the LED chip to the spherical top surface of the packaging adhesive and the packaging adhesive is reduced, the total reflected light is reduced, and the light loss is reduced, therefore, the light-emitting brightness of the LED chips is improved, the using number of the LED chips is reduced, and the purpose of effectively controlling the backlight display cost is achieved.
Description
Technical Field
The utility model relates to a display device technical field especially relates to a backlight module and display device.
Background
The backlight structure of the liquid crystal TV at present mainly comprises two forms of side-in type backlight and direct type backlight, the traditional direct type backlight adopts an LED as a luminous source, and the light field of the LED is subjected to secondary optical distribution through a lens, so that the purposes of enlarging the luminous angle and homogenizing the light field are achieved. The LED is taken as a photoelectric device with high luminous efficiency and long service life, and is widely applied to backlight modules of TVs, mobile phones and the like at present. In TV applications, the LED light incident mode is divided into side-in type and direct type backlight, and od (optical distance) thickness is a key index for evaluating a direct type machine, which means the distance from the reflector plate to the lower surface of the diffuser plate. An important parameter of a direct type backlight is the pitch value, i.e. the LED-to-LED spacing. As shown in fig. 1, the conventional backlight structure includes an LED holder 100, the LED holder 100 has a groove, an LED chip 200 is installed in the groove 300, and glue is disposed in the groove 300, the top surface of the glue is a plane, so that the LED light emitting angle is about 120 degrees, wherein, for the LED chip 200, a light represents a small angle outgoing light, b light represents a large angle outgoing light, c light represents a large angle outgoing light, a light, the outgoing angles of b light and c light three are sequentially increased, if the conventional LED is directly applied to the ultra-thin OD direct type design of the super-multi-partition, because the light emitting angle is small, the pitch value is not large, and the total reflection light is large, the light loss, which results in low brightness, 65 inches may need tens of thousands or even hundreds of thousands of beads, and the cost is greatly increased.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
the to-be-solved technical problem of the utility model lies in, to prior art's above-mentioned defect, provide a backlight unit and display device, aim at promoting LED's luminous angle and luminous luminance to enlarge pitch value, reduce cost.
the utility model provides a technical scheme that technical problem adopted as follows:
The utility model provides a backlight module, its includes the support, sets up holding tank on the support, and set up the LED chip of holding tank bottom, wherein, still be provided with the encapsulation in the holding tank and glue, the bottom surface that the encapsulation was glued covers the play plain noodles of LED chip, the top surface that the encapsulation was glued is spherical and for the top surface of support is outstanding.
The backlight module is characterized in that the support is a transparent support.
The backlight module is characterized in that the support is internally provided with reflective particles.
The backlight module is characterized in that the packaging adhesive is injection molding silica gel.
The backlight module further comprises a PCB, a reflecting layer is arranged on the PCB, and the support and the reflecting layer are arranged on the same side of the PCB.
The backlight module further comprises an optical membrane, a quantum dot membrane and a diffusion plate, wherein the optical membrane, the quantum dot membrane, the diffusion plate and the support are sequentially arranged in the direction close to the PCB.
The backlight module is characterized in that red quantum dots and green quantum dots are arranged in the quantum dot film.
The backlight module comprises red quantum dots and green quantum dots, wherein the red quantum dots and the green quantum dots respectively comprise one or more of III-V group compounds, II-VI group compounds, all-inorganic perovskite cesium lead halide quantum dots and organic-inorganic hybrid perovskite materials.
The backlight module comprises a backlight module, wherein the optical film comprises one or more of a diffusion sheet, a brightness enhancement sheet and a MicroLENS.
A display device comprises the backlight module.
Has the advantages that: the utility model discloses in the encapsulation is glued and is covered with the lens form LED chip's play plain noodles, and will the encapsulation is glued and is surpassed the surface of support sets up to spherical surface, can with the LED chip incides the exit angle increase of spherical surface light is glued in the encapsulation, can be right again the LED chip plays the spotlight effect, will the LED chip launches the encapsulation glue the spherical top surface incident light with the relative incident angle that the encapsulation was glued diminishes, reduces the light of total reflection, reduces light loss, thereby promotes LED chip's light-emitting luminance. Through the improvement of the light-emitting angle and the light-emitting brightness of the LED chips, the use number of the LED chips is reduced while the super-multi-partition backlight is realized, and the purpose of effectively controlling the backlight display cost is achieved.
Drawings
FIG. 1 is a schematic diagram of a backlight structure as described in the prior art;
FIG. 2 is a schematic structural view of an example of the bracket according to the present invention;
Fig. 3 is a schematic diagram illustrating the LED chip, the packaging adhesive and the support in a first preferred embodiment of the present invention;
Fig. 4 is a schematic diagram illustrating the LED chip, the packaging adhesive and the support in a second preferred embodiment of the present invention;
Fig. 5 is a schematic diagram of the distribution of the bracket on the PCB board in the present invention;
Fig. 6 is a schematic structural diagram of the backlight module according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention will be described in further detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
please refer to fig. 2-6. The utility model provides a backlight module, as shown in fig. 2, fig. 3 and fig. 4, which comprises a bracket 1, an accommodating groove 2 arranged on the bracket 1, and an LED chip 3 arranged at the bottom of the accommodating groove 2; the accommodating groove 2 is formed by sinking downwards from the top surface of the support 1, a packaging adhesive 4 is further arranged in the accommodating groove 2, and the packaging adhesive 4 fills up the area except the LED chip 3 in the accommodating groove 2, so that the bottom surface of the packaging adhesive 4 can cover the light-emitting surface of the LED chip 3, and meanwhile, the top surface of the packaging adhesive 4 protrudes relative to the top surface of the support 1, namely, the top surface of the packaging adhesive 4 is positioned outside the accommodating groove 2; further, the top surface of the packaging adhesive 4 is spherical.
The utility model discloses in 4 are glued in the encapsulation and cover with the lens form LED chip 3's play plain noodles, and will 4 surpass are glued in the encapsulation the surface of support 1 sets up to spherical surface, can with 3 incidences of LED chip 4's spherical surface light's exit angle increase is glued in the encapsulation, can be right again LED chip 3 plays the spotlight effect, will 3 launch of LED chip 4 the incident light of the spherical top surface that 4 was glued in the encapsulation with 4's relative incident angle diminishes is glued in the encapsulation, reduces the light of total reflection, reduces light loss, thereby promotes LED chip 3's light-emitting luminance. Through the promotion of LED chip 3 light-emitting angle and light-emitting luminance, when realizing that super many subregion are shaded, reduce LED chip 3's use quantity reaches the purpose of effective control display cost in a poor light.
LED chip 3 is blue light GaN chip, the wavelength of LED chip 3 transmitted light is 430nm ~ 470nm the support 1 passes through holding tank 2 is to LED chip 3 with packaging glue 4 plays overall dimension control, protection and corresponding optical action.
In the first preferred embodiment of the present invention, the bracket 1 is a transparent bracket, and specifically, as shown in fig. 3, a1, b1, and c1 in fig. 3 are respectively a schematic view of a typical light path emitted from the LED chip 3, and for the LED chip 3, an exit angle of a1 light, an exit angle of b1 light, and an exit angle of c1 light are sequentially increased. a1 light represents small angle light, which passes through the packaging adhesive 4, and the brightness of the central area of the top surface of the packaging adhesive 4 is improved due to the light condensation effect of the packaging adhesive 4; the b1 light represents a large-angle light, and compared with the planar design of the top surface of the conventional adhesive in fig. 1, the relative incident angle between the b1 light and the packaging adhesive 4 is reduced, that is, the total reflected light is reduced, so that the light loss is reduced, and the light-emitting brightness of the LED chip 3 is greatly improved; the light ray of c1 represents a large-angle light ray, and due to the adoption of the transparent support, the light ray of c1 can be directly emitted from the transparent support, and the light-emitting angle of the LED chip 3 is increased to about 150 degrees relative to the prior art.
In the second preferred embodiment of the present invention, as shown in fig. 4, the support 1 is a non-transparent support, and reflective particles are disposed in the non-transparent support. In fig. 4, a2, b2, and c2 are schematic diagrams of typical light paths emitted by the LED chip 3, respectively, and with respect to the spherical surface of the encapsulant 4, an exit angle of a2 light, an exit angle of b2 light, and an exit angle of c2 light are sequentially increased, and a2 light is the same as a1 light, and a b2 light is the same as a b1 light, so that the light-emitting luminance of the LED chip 3 is effectively improved by the a2 light and the b2 light. The exit angle of the c2 light is the same as the exit angle of the c1 light, and both belong to large-angle light, and the c2 light is reflected after irradiating the inner wall of the accommodating groove 2, so that the absorption loss and the large-angle transmission loss of the non-transparent support to the light absorption are reduced, and therefore, the brightness gain of the LED chip 3 in the embodiment is higher than that of the LED chip 3 in the first embodiment; meanwhile, compared with the conventional LED in the figure 1, due to the design of the spherical surface of the packaging adhesive 4, the total reflection of the large-angle light irradiated on the spherical surface of the packaging adhesive 4 is reduced, the emergent light brightness is increased, and compared with the conventional LED in the figure 1, the actually measured brightness is increased by more than 15%, and the emergent light angle is increased to 125 degrees in a small range.
In the utility model, the material of the bracket 1 can be selected as required, and when the backlight module needs a large angle and a large pitch, the transparent bracket in the first embodiment is adopted; when the backlight module needs to have higher brightness and the light emitting angle is slightly larger than that of a conventional LED, the non-transparent bracket with the reflective particles in the second embodiment is adopted.
The packaging adhesive 4 fills the area of the accommodating groove 2 except the LED chip 3, and further, the edge of the spherical top surface of the packaging adhesive 4 is in contact with the support, so that light rays emitted to the opening of the accommodating groove 2 need to be emitted through the spherical top surface of the packaging adhesive 4.
The shape of the bracket 1 can be a 1608 common bracket shape, a 2835 common bracket shape or a 3030 common bracket shape, so that the existing common bracket shape can be directly used when the bracket 1 is manufactured, a mold does not need to be manufactured again, and the production cost is further reduced.
The accommodating groove 2 is in a circular truncated cone shape, the width of the bottom of the accommodating groove 2 is smaller than the width of the opening of the accommodating groove, and the LED chip 3 is located at the bottom of the accommodating groove. Because the bottom width of holding tank 2 is less, makes 1 bottom thickness of support is big, thereby strengthens 1's support intensity guarantees LED chip 3 the encapsulation is glued 4 and is in the stability that sets up in holding tank 2, and guarantees 2 self's of holding tank intensity.
Because the width of the opening direction of the accommodating groove 2 is larger than the width of the bottom of the accommodating groove, and the packaging adhesive 4 is positioned at one side of the opening of the accommodating groove 2, the packaging adhesive 4 can more comprehensively cover the light-emitting surface of the LED chip 3, so that the increase of the light-emitting angle of the LED chip 3 is ensured.
Encapsulation is glued 4 and is injection moulding silica gel, and its viscosity is high, easily moulding, encapsulation is glued 4's spherical top surface and can be through control injection moulding silica gel's gluey volume adopts the point to glue technology and realizes, in order to guarantee backlight unit whole optics looks the homogeneity of effect.
The backlight module further comprises a PCB (printed circuit board) 5 and a reflecting layer, the support 1 and the reflecting layer are arranged on the PCB 5, the support 1 and the reflecting layer are located on the same side of the PCB 5, and the LED chip 3 is electrically connected with the PCB 5. The reflecting layer can be a sprayed white ink layer or a common reflecting membrane; the reflecting layer can reflect the light emitted from the support 1 to the opening direction of the accommodating groove 2, so that the light emitted from the LED chip 3 is fully utilized. As shown in fig. 5, the supports 1 are arranged on the PCB 5 in an array, in a preferred embodiment, a distance X between two adjacent columns of supports 1 is 8mm, and a distance Y between two adjacent rows of supports 1 is 8 mm; specifically, the row pitch and the column pitch of the bracket 1 arranged on the PCB 5 can be adjusted according to the size of the PCB 5 and the size of the bracket 1.
The utility model discloses in PCB board 5 can be aluminium base panel or BT panel or FR4 panel, use the tin cream in the invention will support 1 welds on PCB board 5, when adopting the tin cream that traditional SMT (surface mounting technology) is commonly used, the temperature of reflow soldering is preferred more than 250 ℃, when adopting transparent support, consider the temperature toleration problem of transparent support, SMT is preferred to use low temperature tin cream, and the temperature of reflow soldering is preferred to be set up to 170 ℃ ~ 200 ℃.
As shown in fig. 6, the backlight module further includes an optical film 8, a quantum dot film 7 and a diffusion plate 6, wherein the optical film 8, the quantum dot film 7, the diffusion plate 6 and the bracket 1 are sequentially disposed along a direction close to the PCB 5, the quantum dot film 7 is used to increase a color gamut of the backlight module, and a distance between the reflection layer and the diffusion plate 6 is 3mm ~ 8mm, preferably 8 mm.
The utility model discloses in be provided with red quantum dot and green quantum dot in the quantum dot diaphragm 7, red quantum dot with green quantum dot all includes III-V clan compound, II-VI clan compound, in full inorganic perovskite cesium lead halogen quantum dot and the organic-inorganic hybridization perovskite material one or more. Specifically, the III-V group compound includes CdSe, CdTe, CaSe, MgTe, SrSe, ZnSe, ZnTe, SrTe, MgSe, CaTe, BaSe, BaTe, ZnS, CaS, MgS, SrS, BaS and CdS; the II-VI compound comprises GaAs, InN, GaN, GaP, InP and InAs; the all-inorganic perovskite cesium lead halide quantum dot comprises CsPbX3(wherein, X = Cl, Br, I); the organic-inorganic hybrid perovskite material comprises CH3NH3PbX3(wherein, X = Cl, Br, I).
The red quantum dots are preferably 4nm ~ 9nm in size, the peak wavelength of the red light excited by the red quantum dots is 620nm ~ 650nm 35650 nm, the green quantum dots are preferably 2nm ~ 6nm in size, and the peak wavelength of the green light excited by the green quantum dots is 510nm ~ 550 nm.
The optical film 8 comprises one or more of a diffusion sheet, a brightness enhancement sheet and a Micro LENS, when the optical film 8 comprises multiple diffusion sheets, multiple brightness enhancement sheets, Micro LENS and DBEF (brightness enhancement film), only one PET substrate is used, and the diffusion sheets, the brightness enhancement sheets and the Micro LENS are sequentially stacked and arranged on the PET substrate, so that the number of the PET substrates is reduced, the thickness of the optical film 8 is smaller, and the wrinkle resistance of the optical film 8 is improved.
The utility model also provides a display device, it includes as above backlight unit.
To sum up, the utility model provides a backlight module and display device, it includes the support, sets up holding tank on the support, and set up the LED chip of holding tank bottom, still be provided with the encapsulation in the holding tank and glue, the bottom surface that the encapsulation was glued covers the play plain noodles of LED chip, the top surface that the encapsulation was glued is spherical and for the top surface of support is outstanding. The utility model discloses in the encapsulation is glued and is covered with the lens form LED chip's play plain noodles, and will the encapsulation is glued and is surpassed the surface of support sets up to spherical surface, can with the LED chip incides the exit angle increase of spherical surface light is glued in the encapsulation, can be right again the LED chip plays the spotlight effect, will the LED chip launches the encapsulation glue the spherical top surface incident light with the relative incident angle that the encapsulation was glued diminishes, reduces the light of total reflection, reduces light loss, thereby promotes LED chip's light-emitting luminance. Through the improvement of the light-emitting angle and the light-emitting brightness of the LED chips, the use number of the LED chips is reduced while the super-multi-partition backlight is realized, and the purpose of effectively controlling the backlight display cost is achieved.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides a backlight module, its includes the support, sets up holding tank on the support, and set up the LED chip of holding tank bottom, its characterized in that, still be provided with the encapsulation in the holding tank and glue, the bottom surface that the encapsulation was glued covers the play plain noodles of LED chip, the top surface that the encapsulation was glued is spherical and for the top surface of support is outstanding.
2. A backlight module according to claim 1, wherein the frame is a transparent frame.
3. A backlight module according to claim 1, wherein reflective particles are disposed within the frame.
4. The backlight module as claimed in claim 1, wherein the encapsulant is injection-molded silicone.
5. The backlight module as claimed in claim 1, further comprising a PCB board, wherein the PCB board is provided with a reflective layer, and the bracket and the reflective layer are disposed on the same side of the PCB board.
6. The backlight module as claimed in claim 5, further comprising an optical film, a quantum dot film and a diffusion plate, wherein the optical film, the quantum dot film, the diffusion plate and the bracket are sequentially disposed in a direction close to the PCB.
7. The backlight module as claimed in claim 6, wherein red quantum dots and green quantum dots are disposed in the quantum dot film.
8. The backlight module of claim 7, wherein the red quantum dots and the green quantum dots each comprise one or more of group iii-v compounds, group ii-vi compounds, all-inorganic perovskite cesium lead halide quantum dots, and organic-inorganic hybrid perovskite materials.
9. The backlight module as set forth in claim 6 wherein the optical film comprises one or more of a diffuser, a brightness enhancing sheet and a MicroLENS.
10. A display device comprising a backlight module according to any one of claims 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920522298.0U CN209765224U (en) | 2019-04-17 | 2019-04-17 | backlight module and display device |
| PCT/CN2020/080698 WO2020211597A1 (en) | 2019-04-17 | 2020-03-23 | Backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920522298.0U CN209765224U (en) | 2019-04-17 | 2019-04-17 | backlight module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209765224U true CN209765224U (en) | 2019-12-10 |
Family
ID=68759748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920522298.0U Active CN209765224U (en) | 2019-04-17 | 2019-04-17 | backlight module and display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN209765224U (en) |
| WO (1) | WO2020211597A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020125606A1 (en) * | 2018-12-18 | 2020-06-25 | 深圳Tcl新技术有限公司 | Backlight module |
| CN111505865A (en) * | 2020-04-20 | 2020-08-07 | 深圳市隆利科技股份有限公司 | Direct type backlight module |
| WO2020211597A1 (en) * | 2019-04-17 | 2020-10-22 | 深圳Tcl新技术有限公司 | Backlight module and display device |
| WO2022001048A1 (en) * | 2020-06-30 | 2022-01-06 | 惠州视维新技术有限公司 | Bead, backlight module, and display device |
| CN114089565A (en) * | 2021-12-06 | 2022-02-25 | 武汉创维光显电子有限公司 | Light emitting assembly and backlight module |
| CN114464604A (en) * | 2021-07-16 | 2022-05-10 | 荣耀终端有限公司 | Backlight module, display device, electronic equipment and packaging method of backlight module |
| CN114460779A (en) * | 2022-03-03 | 2022-05-10 | 深圳创维－Rgb电子有限公司 | LED lamp panel, backlight module, display device and LED lamp panel manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114267770A (en) * | 2021-12-21 | 2022-04-01 | 武汉华星光电技术有限公司 | Backlight module and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006947A (en) * | 2003-07-01 | 2004-01-08 | Sharp Corp | Lighting display device and its manufacturing method |
| CN100481546C (en) * | 2007-11-26 | 2009-04-22 | 佛山市国星光电股份有限公司 | Power LED with glue-filling formed bottom and manufacturing method thereof |
| CN101452987A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for applying guidance type light emitting diode device |
| CN101639181A (en) * | 2009-08-07 | 2010-02-03 | 广东昭信光电科技有限公司 | Direct type backlighting system |
| CN105759500A (en) * | 2016-03-16 | 2016-07-13 | 深圳Tcl新技术有限公司 | Quantum dot backlight module and liquid crystal television |
| CN209765224U (en) * | 2019-04-17 | 2019-12-10 | 深圳Tcl新技术有限公司 | backlight module and display device |
-
2019
- 2019-04-17 CN CN201920522298.0U patent/CN209765224U/en active Active
-
2020
- 2020-03-23 WO PCT/CN2020/080698 patent/WO2020211597A1/en active Application Filing
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020125606A1 (en) * | 2018-12-18 | 2020-06-25 | 深圳Tcl新技术有限公司 | Backlight module |
| US11181773B2 (en) | 2018-12-18 | 2021-11-23 | Shenzhen Tcl New Technology Co., Ltd. | Backlight module |
| WO2020211597A1 (en) * | 2019-04-17 | 2020-10-22 | 深圳Tcl新技术有限公司 | Backlight module and display device |
| CN111505865A (en) * | 2020-04-20 | 2020-08-07 | 深圳市隆利科技股份有限公司 | Direct type backlight module |
| WO2022001048A1 (en) * | 2020-06-30 | 2022-01-06 | 惠州视维新技术有限公司 | Bead, backlight module, and display device |
| CN114464604A (en) * | 2021-07-16 | 2022-05-10 | 荣耀终端有限公司 | Backlight module, display device, electronic equipment and packaging method of backlight module |
| CN114089565A (en) * | 2021-12-06 | 2022-02-25 | 武汉创维光显电子有限公司 | Light emitting assembly and backlight module |
| CN114089565B (en) * | 2021-12-06 | 2022-11-25 | 武汉创维光显电子有限公司 | Light emitting assembly and backlight module |
| CN114460779A (en) * | 2022-03-03 | 2022-05-10 | 深圳创维－Rgb电子有限公司 | LED lamp panel, backlight module, display device and LED lamp panel manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020211597A1 (en) | 2020-10-22 |
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