CN111505865A - Direct type backlight module - Google Patents

Direct type backlight module Download PDF

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Publication number
CN111505865A
CN111505865A CN202010310010.0A CN202010310010A CN111505865A CN 111505865 A CN111505865 A CN 111505865A CN 202010310010 A CN202010310010 A CN 202010310010A CN 111505865 A CN111505865 A CN 111505865A
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CN
China
Prior art keywords
light
lamp
backlight module
adhesive
type backlight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010310010.0A
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Chinese (zh)
Inventor
张小齐
吴新理
覃威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Longli Technology Co Ltd
Original Assignee
Shenzhen Longli Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Longli Technology Co Ltd filed Critical Shenzhen Longli Technology Co Ltd
Priority to CN202010310010.0A priority Critical patent/CN111505865A/en
Publication of CN111505865A publication Critical patent/CN111505865A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133611—Direct backlight including means for improving the brightness uniformity

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention discloses a direct type backlight module which comprises an optical film group and an L ED lamp array arranged from top to bottom, wherein a L ED lamp comprises L ED chips, a transparent packaging structure and a light shielding structure, the transparent packaging structure packages L ED chips to form a plurality of light emergent surfaces, and the light shielding structure is arranged at the top of L ED lamps and is used for partially shielding the top of L ED lamps from emitting light.

Description

Direct type backlight module
Technical Field
The present disclosure relates to display devices, and particularly to a direct type backlight module.
Background
The liquid crystal panel of the liquid crystal display device does not emit light by itself. Therefore, the liquid crystal display device is provided with a backlight device as a surface light source device as a light source for illuminating the liquid crystal panel on the back side of the liquid crystal panel.
As a structure of such a backlight device, a direct type backlight device in which a plurality of light emitting diodes (L light emitting diodes: hereinafter referred to as "L ED elements") are arranged is known.
In recent years, L ED elements having high efficiency, high output and small size have been developed, and therefore, even if the number of L ED elements or L ED BARs used in a backlight device is reduced, the same brightness as that of the conventional backlight device can be obtained theoretically, and L ED BARs are formed by arranging a plurality of L ED elements into 1 electronic component.
For example, patent documents 1 and 2 disclose techniques for diffusing light emitted from L ED elements with cylindrical lenses in order to construct a backlight device that is inexpensive and can obtain uniform luminance.
In the prior art, patent document 1, japanese patent application laid-open No. 2006-286608, patent document 2, japanese patent application laid-open No. 2014-38697, the problem to be solved by the present invention is that, in the techniques described in patent documents 1 and 2, when light is transmitted from a medium of a cylindrical lens into the air, reflected light is generated inside the cylindrical lens which is a boundary surface thereof, and further, the divergence angle of light from an L ED element is increased as the divergence angle is increased.
On the other hand, with the ultra-thin development of liquid crystal display electronic products and the realization of higher High-Dynamic contrast (HDR), higher requirements are also put forward on the thickness of a backlight module of a liquid crystal display, in each optical film of the backlight module, a diffusion sheet is a main film for determining the thickness of the backlight module, and on one hand, if the thickness of the diffusion sheet is too thin, film arching and wrinkling phenomena can occur to influence the display effect, and on the other hand, if no diffusion film is arranged, problems of halo, glare, lamp eyes and the like can occur at the position of a lamp socket due to the fact that L ED is a point light source, and uniform display cannot be achieved.
Disclosure of Invention
The invention mainly solves the technical problem of providing a backlight device for improving the uniform light emission of a surface light source, and the utilization efficiency of light is improved.
In order to solve the technical problems, one technical scheme adopted by the invention is to provide a direct type backlight module, which comprises an optical film group and an L ED lamp array arranged from top to bottom, wherein a L ED lamp comprises a L ED chip, a transparent packaging structure and a light shielding structure, the transparent packaging structure packages the L ED chip to form a plurality of light-emitting surfaces, the light shielding structure is arranged at the top of the L ED lamp and is used for partially shielding the top of the L ED lamp from emitting light, the light shielding structure is a reflecting sheet, or the light shielding structure is a multilayer optical film and comprises N positive refractive index micro-layers with sequentially decreasing refractive indexes from top to bottom, so that the light-emitting rate at the top of the L ED lamp is reduced.
The direct type backlight module improves the light emitting uniformity and the light energy utilization efficiency of a surface light source through the arrangement of the transparent packaging structure and the light shielding structure, although the light emitted from each L ED light source has higher concentration degree, the diffusion angle can be enlarged through the reflection or scattering diffusion propagation to the light shielding structure, the problem of uneven brightness (Mura) is solved, and the uniform light emitting of the surface light source is realized.
In a preferred embodiment, the light shielding structure completely covers the top light-emitting surface of the L ED lamp so that the top of the L ED lamp does not emit light.
In a preferred embodiment, the light shielding structure is at least one of white oil of PCB, COB dam glue, black/gray ink, mixed cured product of encapsulation glue and silicon dioxide, mixed cured product of encapsulation glue and titanium dioxide, and white film with light scattering structure.
In a preferred embodiment, the light shielding structure is a white film with a light scattering structure, and the light shielding structure is fixed on the light emitting surface on the top of the L ED chip through optical glue.
In a preferred embodiment, the thickness of the light shielding structure near the top emission center of the L ED lamp is higher than the thickness of the light shielding structure far from the top emission center of the L ED lamp, so that the top emission of the L ED lamp has a central light extraction rate less than the peripheral light extraction rate.
In a preferred embodiment, the density of the light shielding structures near the top emission center of the L ED lamp is higher than the density of the light shielding structures far from the top emission center of the L ED lamp, so that the top emission of the L ED lamp has a central light extraction rate less than the peripheral light extraction rate.
In a preferred embodiment, the transparent encapsulation structure is a thermosetting encapsulation adhesive, and the thermosetting encapsulation adhesive comprises at least one of an epoxy encapsulation adhesive, a silicone encapsulation adhesive and a polyurethane encapsulation adhesive; or the packaging adhesive is a light-curing packaging adhesive, and the light-curing packaging adhesive comprises at least one of ultraviolet curing UV (ultraviolet) adhesive and infrared curing IR (infrared) adhesive.
Drawings
The invention and its advantages will be better understood by studying the following detailed description of specific embodiments, given by way of non-limiting example, and illustrated in the accompanying drawings, in which:
fig. 1 is an exploded view of a direct type backlight module according to embodiment 1 of the present invention.
Fig. 2 is a cross-sectional view of a direct type backlight module according to embodiment 1 of the present invention.
Fig. 3 is a structural view of L ED lamp of embodiment 1 of the present invention to show its general optical principle.
Fig. 4 is a top view of L ED lamp of embodiment 2 of the invention.
Fig. 5 is a structural view of L ED lamp of embodiment 3 of the present invention to show its general optical principle.
Fig. 6 is a structural view of L ED lamp of embodiment 4 of the present invention to show its general optical principle.
Fig. 7 is a multilayer optical film of a light-shielding structure of example 4 of the present invention, showing its general optical principle.
Detailed Description
Referring to the drawings, wherein like reference numbers refer to like elements throughout, the principles of the present invention are illustrated in an appropriate environment. The following description is based on illustrated embodiments of the invention and should not be taken as limiting the invention with regard to other embodiments that are not detailed herein.
The word "embodiment" is used herein to mean serving as an example, instance, or illustration. In addition, the articles "a" and "an" as used in this specification and the appended claims may generally be construed to mean "one or more" unless specified otherwise or clear from context to be directed to a singular form.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Further, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise direct contact of the first and second features through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Example 1
First, a method for manufacturing a direct type backlight module according to embodiment 1 of the present invention is described with reference to fig. 1-3, in which the direct type backlight module includes an array of optical film sets 101 and L ED lamps 102 and a substrate 103, the L ED lamp 102 includes a L ED chip 1021, a transparent encapsulation structure 1022, and a light shielding structure 1023, the transparent encapsulation structure 1022 encapsulates the L ED chip 1021 to form a plurality of light emitting surfaces, and the light shielding structure 1023 is disposed on top of the L ED lamp 102 to partially shield the L ED lamp 102 from emitting light.
The direct type backlight module of the embodiment improves the light emitting uniformity and the light energy utilization efficiency of the surface light source by the arrangement of the transparent packaging structure 1022 and the light shielding structure 1023, although the light emitted from each L ED light source has higher concentration degree, the diffusion angle can be enlarged by the diffusion propagation of reflection or scattering to the light shielding structure 1023, the problem of uneven brightness (Mura) is overcome, and the uniform light emitting of the surface light source is realized.
The light shielding structure 1023 completely covers the top light-emitting surface of the L ED lamp 102 so that no light is emitted from the top of the L ED lamp 102, the light shielding structure 1023 is PCB white oil with reflective property, and the light shielding structure 1023 is fixed on the top light-emitting surface of the L ED chip 1021 through optical cement.
The thickness of the light shielding structure 1023 near the top light emitting center of the L ED lamp 102 is higher than the thickness of the light shielding structure 1023 far from the top light emitting center of the L ED lamp 102, so that the light extraction rate of the top light emitting center of the L ED lamp 102 is smaller than the peripheral light extraction rate.
The transparent encapsulation structure 1022 is a thermosetting encapsulation adhesive, and the thermosetting encapsulation adhesive includes an epoxy encapsulation adhesive.
Example 2
Fig. 4 is a top view of the L ED lamp 102 of embodiment 2, only the differences between embodiment 2 and embodiment 1 will be described, and the descriptions of the similarities are omitted.
The density of the light shielding structures 1023 near the top light-emitting center of the L ED lamp 102 is higher than the density of the light shielding structures 1023 far from the top light-emitting center of the L ED lamp 102, so that the light extraction rate of the top light-emitting center of the L ED lamp 102 is smaller than the peripheral light extraction rate.
Example 3
Fig. 5 is a structural view of L ED lamp of embodiment 3, and only differences between embodiment 3 and embodiment 1 will be described below, and the description of the similarities will not be repeated here.
The light shielding structure 1023 is a sawtooth-shaped reflection sheet.
Example 3
Fig. 6 is a structural view of L ED lamp of embodiment 4, only differences between embodiment 3 and embodiment 1 will be described below, and the description of the similarities will not be repeated here.
As shown in fig. 7, the light shielding structures 1023 are an integrally formed multilayer optical film, which includes 4 positive refractive index microlayers 201, 202, 203, 204 arranged from top to bottom, and the refractive indexes n1, n2, n3, and n4 decrease in sequence, the structure design of the light shielding structures enables light to form optical deflection in a limited space so as to increase the light extraction rate in the peripheral area of the L ED lamp 102, and the top light extraction of the L ED chips 1021 is reflected or refracted and diffused by the light shielding structures 1023, as shown in fig. 7, after passing through a deflection path, the top light extraction rate of the L ED lamp can be reduced, and the light extraction and diffusion are increased at the side surfaces of the L ED lamp, so as to improve the light beam uniformity of visible light and improve the light extraction of a direct-type backlight module.
While the invention has been described above with reference to certain embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the various embodiments of the present disclosure may be used in any combination, provided that there is no structural conflict, and the combination is not exhaustively described in this specification for brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (7)

1. A direct type backlight module is characterized by comprising:
an array of L ED lamps and a set of optical films arranged from top to bottom;
the L ED lamp comprises a L ED chip, a transparent packaging structure and a shading structure;
the transparent packaging structure packages the L ED chip to form a plurality of light-emitting surfaces;
the light shielding structure is arranged on the top of the L ED lamp and is used for at least partially shielding top light of the L ED lamp;
the light shielding structure is a reflector plate, or the light shielding structure is a multilayer optical film and comprises N positive refractive index microlayers with the refractive indexes decreasing gradually from top to bottom, so that the light extraction rate of the top of the L ED lamp is reduced.
2. The direct-type backlight module of claim 1, wherein the light shielding structure completely covers the top light-emitting surface of the L ED lamps so that no light is emitted from the tops of the L ED lamps.
3. The direct-type backlight module according to claim 1, wherein the light shielding structure is at least one of PCB white oil, COB dam paste, black/gray ink, mixed cured product of packaging paste and silicon dioxide, mixed cured product of packaging paste and titanium dioxide, and white film with light scattering structure.
4. The direct-type backlight module as claimed in claim 3, wherein the light-shielding structure is a white film with light-scattering structures, and the light-shielding structure is fixed on the light-exiting surface on the top of the L ED chips by optical adhesive.
5. The direct-type backlight module of claim 1, wherein the thickness of the light shielding structure near the top light-emitting center of the L ED lamp is higher than the thickness of the light shielding structure far from the top light-emitting center of the L ED lamp, so that the light extraction rate of the top light-emitting center of the L ED lamp is smaller than that of the periphery light extraction rate.
6. The direct-type backlight module of claim 1, wherein the density of the light-shielding structures near the top light-emitting center of the L ED lamp is higher than that of the light-shielding structures far from the top light-emitting center of the L ED lamp, so that the light-extraction rate of the top light-emitting center of the L ED lamp is lower than that of the periphery light-extraction rate.
7. The direct-type backlight module according to claim 1, wherein the transparent encapsulation structure is a thermosetting encapsulation adhesive, and the thermosetting encapsulation adhesive comprises at least one of epoxy encapsulation adhesive, silicone encapsulation adhesive and polyurethane encapsulation adhesive; or the packaging adhesive is a light-curing packaging adhesive, and the light-curing packaging adhesive comprises at least one of ultraviolet curing UV (ultraviolet) adhesive and infrared curing IR (infrared) adhesive.
CN202010310010.0A 2020-04-20 2020-04-20 Direct type backlight module Pending CN111505865A (en)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112799251A (en) * 2020-12-28 2021-05-14 深圳市隆利科技股份有限公司 Direct type light emitting device
CN113219727A (en) * 2021-04-27 2021-08-06 福州大学 Mini LED backlight module
CN114464604A (en) * 2021-07-16 2022-05-10 荣耀终端有限公司 Backlight module, display device, electronic equipment and packaging method of backlight module
WO2022193094A1 (en) * 2021-03-15 2022-09-22 京东方科技集团股份有限公司 Manufacturing method for light-mixing plate, light-mixing plate and backlight module

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KR20150048578A (en) * 2013-10-28 2015-05-07 주식회사 루멘스 Light emitting device package, backlight unit, and illumination device
CN206480644U (en) * 2016-12-31 2017-09-08 蒋足辉 A kind of multilayer gradually changed refractive index silica gel packaging light emitting diode
CN107565008A (en) * 2017-08-16 2018-01-09 业成科技（成都）有限公司 LED point-like ray structures
CN209344123U (en) * 2018-12-17 2019-09-03 深圳市瑞丰光电子股份有限公司 A kind of LED package surface barrier structure
CN110379912A (en) * 2019-06-28 2019-10-25 佛山市国星光电股份有限公司 LED component, backlight module and display device
CN209765224U (en) * 2019-04-17 2019-12-10 深圳Tcl新技术有限公司 backlight module and display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150048578A (en) * 2013-10-28 2015-05-07 주식회사 루멘스 Light emitting device package, backlight unit, and illumination device
CN206480644U (en) * 2016-12-31 2017-09-08 蒋足辉 A kind of multilayer gradually changed refractive index silica gel packaging light emitting diode
CN107565008A (en) * 2017-08-16 2018-01-09 业成科技（成都）有限公司 LED point-like ray structures
CN209344123U (en) * 2018-12-17 2019-09-03 深圳市瑞丰光电子股份有限公司 A kind of LED package surface barrier structure
CN209765224U (en) * 2019-04-17 2019-12-10 深圳Tcl新技术有限公司 backlight module and display device
CN110379912A (en) * 2019-06-28 2019-10-25 佛山市国星光电股份有限公司 LED component, backlight module and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112799251A (en) * 2020-12-28 2021-05-14 深圳市隆利科技股份有限公司 Direct type light emitting device
WO2022193094A1 (en) * 2021-03-15 2022-09-22 京东方科技集团股份有限公司 Manufacturing method for light-mixing plate, light-mixing plate and backlight module
CN113219727A (en) * 2021-04-27 2021-08-06 福州大学 Mini LED backlight module
CN114464604A (en) * 2021-07-16 2022-05-10 荣耀终端有限公司 Backlight module, display device, electronic equipment and packaging method of backlight module

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Application publication date: 20200807

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