CN215769279U - Light source module and display device - Google Patents

Abstract

A light source module comprises a light guide plate, a plurality of light emitting elements and an adhesive layer. The light guide plate is provided with a light incident surface and a light emergent surface, and the light incident surface is connected with the light emergent surface. The light emitting elements are arranged beside the light incident surface. Each light emitting element comprises a light emitting chip and a lamp cup. The lamp cup is provided with a side wall, the side wall surrounds the light-emitting chip to form an opening, and the top surface of the side wall faces the light incident surface. The adhesive layer is arranged between the top surface and the light incident surface and extends to a part of the opening and the light incident surface. The utility model also provides a display device using the light source module. The light source module and the display device can fix the relative position between the light-emitting element and the light guide plate and reduce the phenomena of uneven brightness and uneven brightness of a display picture.

Description

Light source module and display device

Technical Field

The present invention relates to a light source module, and more particularly, to a light source module for a display device and a display device using the same.

Background

In general, a liquid crystal display device includes a liquid crystal display panel and a backlight module, and since the liquid crystal display panel itself does not emit light, the backlight module is required to provide an illumination light source to the liquid crystal display panel. Therefore, the main function of the backlight module is to provide an illumination source with high luminance and high uniformity.

The backlight module includes light guide plate, light emitting diode, back plate and other components, and may be divided into side-in type backlight module and direct type backlight module. In the conventional side-in type backlight module, a fixing adhesive is generally adhered between the light guide plate and the circuit board of the light emitting diode in order to fix the relative position between the light guide plate and the light emitting diode.

However, when the fixing glue is disposed, if the attaching process is not compact and bubbles are easily generated, light rays can be refracted when encountering the bubbles after entering the light guide plate, and part of the light rays can be absorbed by the fixing glue, thereby causing the problem of uneven brightness of the display picture.

The background section is provided to facilitate an understanding of the present disclosure, and thus the disclosure in the background section may include other art that is not known to those of skill in the art. Furthermore, the statements contained in the "background" section do not represent a representation of the claimed subject matter or the problems associated with one or more embodiments of the present disclosure, nor are they intended to be known or appreciated by those skilled in the art prior to the present disclosure.

SUMMERY OF THE UTILITY MODEL

The utility model provides a light source module, which can reduce the phenomenon of uneven brightness while fixing the relative position between a light-emitting element and a light guide plate.

The utility model provides a display device, which can reduce the phenomenon of uneven brightness of a display picture.

Other objects and advantages of the present invention will be further understood from the technical features disclosed in the present invention.

In order to achieve one or a part of or all of the above or other objects, an embodiment of the utility model provides a light source module including a light guide plate, a plurality of light emitting elements, and an adhesive layer. The light guide plate is provided with a light incident surface and a light emergent surface, and the light incident surface is connected with the light emergent surface. The light emitting elements are arranged beside the light incident surface. Each light emitting element comprises a light emitting chip and a lamp cup. The lamp cup is provided with a side wall, the side wall surrounds the light-emitting chip to form an opening, and the top surface of the side wall faces the light incident surface. The adhesive layer is arranged between the top surface and the light incident surface and extends to a part of the opening and the light incident surface.

In order to achieve one or a part of or all of the above or other objects, a display device provided in an embodiment of the utility model includes a display panel and the light source module. The display panel is configured on the light emitting side of the light source module.

In the light source module of the embodiment of the utility model, the top surface of the side wall of each light-emitting element faces the light incident surface of the light guide plate, and the bonding layer is arranged between the top surface and the light incident surface, so that the effect of fixing the relative position between the light-emitting element and the light guide plate can be achieved. Meanwhile, the adhesive layer is not arranged between the light guide plate and the circuit substrate of the light-emitting element and close to the light-emitting element as in the prior art, so that the condition that light is absorbed by the adhesive layer after entering the light guide plate can be reduced, and the phenomenon of uneven brightness is further reduced. In addition, the adhesive layer also extends to a part of the opening and the light incident surface, and the reserved space of the adhesive layer can avoid incomplete adhesion of the light guide plate and the light emitting element due to tolerance in the assembling process, so that the effect of fixing the light guide plate is not influenced due to the tolerance. The display device of the embodiment of the utility model can reduce the phenomenon of uneven brightness of the display picture because of using the light source module.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic perspective view of a light source module according to an embodiment of the utility model.

Fig. 2 is a partial cross-sectional view of a light source module according to an embodiment of the utility model.

Fig. 3 is a schematic view illustrating an adhesive layer disposed on a top surface according to an embodiment of the utility model.

Fig. 4A to 4F are schematic views illustrating an adhesive layer disposed on a frame according to another embodiment of the utility model.

Fig. 5A to 5D are schematic views illustrating an adhesive layer disposed on a light incident surface according to another embodiment of the utility model.

Fig. 6 is a block diagram of a display device according to an embodiment of the utility model.

Detailed Description

Fig. 1 is a schematic perspective view of a light source module according to an embodiment of the utility model. Fig. 2 is a partial cross-sectional view of a light source module according to an embodiment of the utility model. Fig. 3 is a schematic view illustrating an adhesive layer disposed on a top surface according to an embodiment of the utility model. Referring to fig. 1 to 3, a light source module 10 of the present embodiment includes a light guide plate 100, a plurality of light emitting elements 200, an adhesive layer 300, a circuit substrate 400 and a back plate 500. The circuit substrate 400 is disposed on the backplate 500. The light-emitting elements 200 are disposed on the circuit substrate 400 and electrically connected to the circuit substrate 400, and the circuit substrate 400 is used for driving the light-emitting elements 200 to emit light. The light guide plate 100 is disposed on the circuit board 400, for example, but not limited thereto. As shown in fig. 2, the light guide plate 100 may be partially disposed on the circuit substrate 400, or the area of the circuit substrate 400 may be larger than that of the light guide plate 100, so that the light guide plate 100 is entirely disposed on the circuit substrate 400. In another embodiment, the light guide plate 100 may also be disposed on the back plate 500. The light guide plate 100 has a light incident surface 110 and a light emitting surface 120, and the light incident surface 110 is connected to the light emitting surface 120. The light emitting elements 200 are disposed beside the light incident surface 110. The adhesive layer 300 is disposed between the light emitting elements 200 and the light incident surface 110. The adhesive layer 300 is, for example, an optical adhesive, a fixing tape, or the like, and the present invention does not particularly limit the kind of the adhesive layer 300 as long as it has a function of adhering an optical element. Preferably, the adhesive layer 300 of the present embodiment has light transmittance, for example, to reduce the shielding effect on the light L emitted by the light emitting element 200. In fig. 1, the structure and relative position of the adhesive layer 300 are shown for clarity, and thus the circuit substrate 400 and the back plate 500 are omitted.

In the present embodiment, the number of the light emitting elements 200 is merely an illustration, and the present invention does not particularly limit the number of the light emitting elements 200. The number of the adhesive layers 300 is, for example, the number corresponding to the number of the light emitting elements 200, but is not limited thereto. In another embodiment, a single adhesive layer 300 may correspond to a plurality of light emitting elements 200. Each light emitting device 200 of the present embodiment includes a light emitting chip 210 and a lamp cup 220. The light emitting chip 210 and the lamp cup 220 are disposed on the light emitting substrate 230. The lamp cup 220 has a sidewall 221 and a light emitting substrate 230. The sidewall 221 and the light-emitting substrate 230 together form an accommodating space, and the light-emitting chip 210 is located in the accommodating space and disposed on the light-emitting substrate 230. The sidewall 221 surrounds the light emitting chip 210 to form the opening 240, and a top surface 222 of the sidewall 221 faces the light incident surface 110 of the light guide plate 100. That is, the light emitting device 200 is disposed on the circuit board 400 through the lamp cup 220, and the light emitting chip 210 is electrically connected to the circuit board 400 through the light emitting substrate 230. Specifically, the adhesive layer 300 is disposed between the top surface 222 and the light incident surface 110, and extends to a portion between the opening 240 and the light incident surface 110. The adhesive layer 300 is disposed between a portion of the opening 240 and the light incident surface 110 in an extending manner, so as to reserve a space, so as to avoid incomplete adhesion caused by tolerance during the assembly process of the light guide plate 100 and the light emitting device 200, and ensure that the adhesion effect between the light guide plate 100 and the light emitting device 200 is not affected by tolerance.

The top surface 222 has a frame 223 surrounding the opening 240, in other words, the light emitting surface of the light emitting device 200 is composed of the frame 223 and the opening 240, and the light L exits from the opening 240, and the adhesive layer 300 is disposed on the frame 223 and surrounds the opening 240. In the present embodiment, the frame 223 and the opening 240 are, for example, rectangular, but not limited thereto. The frame 223 has a first side 2231, a second side 2232, a third side 2233, and a fourth side 2234. The first side 2231 is opposite the second side 2232. The third side 2233 is opposite the fourth side 2234. The first side 2231 and the second side 2232 are, for example, perpendicular to the light emitting surface 120, and the third side 2233 and the fourth side 2234 are, for example, parallel to the light emitting surface 120. In the view of fig. 3, the first side 2231 is located on the left side of the frame 223, the second side 2232 is located on the right side of the frame 223, the third side 2233 is located on the upper side of the frame 223, and the fourth side 2234 is located on the lower side of the frame 223.

In the present embodiment, the adhesive layer 300 is disposed on the first side 2231, the second side 2232, the third side 2233 and the fourth side 2234 of the frame 223, but not limited thereto. In other embodiments, the adhesive layer 300 may be disposed on at least two of the first side 2231, the second side 2232, the third side 2233, and the fourth side 2234. The larger the area of the adhesive layer 300 disposed on the frame 223 is, the better the adhesive effect of the adhesive layer 300 is, so that the bonding strength between the light guide plate 100 and the light emitting element 200 is higher. If the adhesive layer 300 is disposed on only one of the first side 2231, the second side 2232, the third side 2233, and the fourth side 2234, the adhesive strength is insufficient, and the light guide plate 100 and the light emitting element 200 are likely to fall off.

The adhesive layer 300 has a thickness T in a direction perpendicular to the top surface 222. When the thickness T is too small, the adhesive strength between the light guide plate 100 and the light emitting element 200 is insufficient. Conversely, when the thickness T is too large, the adhesive layer 300 may have a shielding effect on the light L. In a preferred embodiment of the present invention, the thickness T is 0.05mm to 0.15 mm.

The light emitting device 200 may be a light emitting diode, and the light emitting chip 210 is, for example, a light emitting diode chip directly cut from a wafer, but is not limited thereto, and the light emitting device 200 may also be another kind of light emitting device. In the present embodiment, the light emitting chip 210 has a light emitting angle range (as shown in fig. 2), the light emitting chip 210 is used for providing the light L within the light emitting angle range to form the light emitting region R at the opening 240, and the adhesive layer 300 is not disposed in the light emitting region R. Specifically, the area of the light-emitting region R is, for example, smaller than or equal to the area of the opening 240, and the light-emitting angle range can be changed by adjusting or using different light-emitting chips 210, so as to change the area of the light-emitting region R. The "light emitting region R" is defined as the region where the light L provided by the light emitting chip 210 mainly passes through the opening 240. In other words, a part of the light L still passes through the non-light-emitting region R of the opening 240, and the non-light-emitting region R of the opening 240 is also the region where the adhesive layer 300 is disposed. Since the adhesive layer 300 is not disposed in the light emitting region R, and when the adhesive layer 300 has light transmittance, a part of the light L in the non-light emitting region R can also pass through, the adhesive layer 300 of the embodiment can reduce the influence on the light emitting effect of the light emitting element 200 after the adhesive layer 300 is disposed.

The circuit substrate 400 is, for example, a printed circuit board, and may be a hard board or a flexible board. The hard board is, for example, a Metal Core Printed Circuit Board (MCPCB) or a copper foil circuit board (e.g., FR4 circuit board).

In the light source module 10 of the present embodiment, the top surface 222 of the sidewall 221 of each light emitting element 200 faces the light incident surface 110 of the light guide plate 100, and the adhesive layer 300 is disposed between the top surface 222 and the light incident surface 110, because the light emitting element 200 is fixed on the circuit substrate 400, the circuit substrate 400 may be fixed on the back plate 500 at this time, or the light guide plate 100 may be fixed on the back plate 500 relative to the other side adhered to the light emitting element 200, and the fixing manner may be a manner such as a glue or a mechanism, so that the effect of fixing the light guide plate 100 can be indirectly achieved. Meanwhile, since the adhesive layer 300 is not disposed between the light guide plate and the circuit board and close to the light emitting device as in the prior art, the absorption of light by the adhesive layer after entering the light guide plate can be reduced, and the phenomenon of uneven brightness can be reduced. In addition, the adhesive layer 300 further extends to a portion between the opening 240 and the light incident surface 110, and the space reserved in the adhesive layer 300 can avoid incomplete adhesion of the light guide plate 100 and the light emitting element 200 due to tolerance in the assembling process, thereby ensuring that the effect of fixing the light guide plate 100 is not affected by the tolerance.

In order to achieve the above-described effects, the adhesive layer 300 of the present embodiment also has the following design, for example. Referring to fig. 3 again, the adhesive layer 300 disposed on the first side 2231 of the frame 223 and extending to a portion of the opening 240 has a first width W1, and the adhesive layer 300 disposed on the second side 2232 of the frame 223 and extending to a portion of the opening 240 has a second width W2. The first width W1 plus the second width W2 is, for example, 1/4-1/3 of the length L1 of the third side 2233. It should be noted that, since the third side 2233 and the fourth side 2234 have the same length L1, the first width W1 plus the second width W2 can be 1/4 to 1/3 of the length L1 of the fourth side 2234.

On the other hand, the adhesive layer 300 disposed on the third side 2233 of the frame 223 and extending to a portion of the opening 240 has a third width W3, and the adhesive layer 300 disposed on the fourth side 2234 of the frame 223 and extending to a portion of the opening 240 has a fourth width W4. The third width W3 plus the fourth width W4 is 1/4-1/3 of the length L2 of the first side W1. Similarly, the first side W1 and the second side 2232 have the same length L2, and therefore the third width W3 plus the fourth width W4 can be considered to be 1/4-1/3 of the length L2 of the second side 2232.

As described above, the adhesive layer 300 of the present embodiment is disposed on the first side 2231, the second side 2232, the third side 2233 and the fourth side 2234 of the frame 223, but is not limited thereto. Fig. 4A to 4F are schematic views illustrating an adhesive layer disposed on a frame according to another embodiment of the utility model. Referring to fig. 4A to 4F, in other embodiments, the adhesive layer 300 is disposed on at least two opposite sides of the four sides of the frame 223, such as at least the first side 2231 and the second side 2232 (as shown in fig. 4A), or at least the third side 2233 and the fourth side 2234 (as shown in fig. 4B), in consideration of the adhesive strength. The term "at least" means the minimum or minimal. For example, "at least disposed on the first side 2231 and the second side 2232" includes, but is not limited to, disposed on the first side 2231, the second side 2232, and the third side 2233 (see fig. 4C), disposed on the first side 2231, the second side 2232, and the fourth side 2234 (see fig. 4D), and disposed on the first side 2231, the second side 2232, the third side 2233, and the fourth side 2234. Similarly, "at least disposed on the third side 2233 and the fourth side 2234" includes the first side 2231, the third side 2233, and the fourth side 2234 (see fig. 4E), the second side 2232, the third side 2233, and the fourth side 2234 (see fig. 4F), and the first side 2231, the second side 2232, the third side 2233, and the fourth side 2234. In addition, although not described in detail, the adhesive layer 300 disposed on the side of the frame 223 extends to a portion of the opening 240.

In the present embodiment, the adhesive layer 300 is only disposed between the top surface 222 and the light incident surface 110, but is not limited thereto. Fig. 5A to 5D are schematic views illustrating an adhesive layer disposed on a light incident surface according to another embodiment of the utility model. Referring to fig. 1, fig. 3 and fig. 5A to fig. 5D, in other embodiments, the adhesive layer 300 is further disposed on the light incident surface 110 corresponding to between any two adjacent light emitting elements 200, and the shape thereof may be adjusted according to design requirements. For example, the adhesive layer 300 disposed on the light incident surface 110 corresponding to the space between any two adjacent light emitting devices 200 may extend from the second side 2232 corresponding to the frame 223 of the light emitting device 200 and the first side 2231 of the frame 223 of another adjacent light emitting device 200 to the light incident surface 110 corresponding to the space between any two adjacent light emitting devices 200, and extend from the third side 2233 corresponding to the frame 223 of the light emitting device 200 to the third side 2233 of the frame 223 of another adjacent light emitting device 200 (see fig. 5A).

Alternatively, the light-emitting element may extend from the second side 2232 corresponding to the frame 223 of the light-emitting element 200 and the first side 2231 of the frame 223 of another adjacent light-emitting element 200 to the light incident surface 110 corresponding to the space between any two adjacent light-emitting elements 200, and extend from the fourth side 2234 corresponding to the frame 223 of the light-emitting element 200 to the fourth side 2234 of the frame 223 of another adjacent light-emitting element 200 (as shown in fig. 5B).

Alternatively, the light-emitting elements may extend from the second side 2232 of the frame 223 corresponding to the light-emitting element 200 and the first side 2231 of the frame 223 of another adjacent light-emitting element 200 to the light incident surface 110 corresponding to the space between any two adjacent light-emitting elements 200, and extend from the third side 2233 and the fourth side 2234 of the frame 223 corresponding to the light-emitting element 200 to the third side 2233 and the fourth side 2234 of the frame 223 of another adjacent light-emitting element 200, respectively (see fig. 5C).

Alternatively, the adhesive layer 300 may also be fully distributed on the light incident surface 110 corresponding to the space between any two adjacent light emitting devices 200 (see fig. 5D). The foregoing is illustrative of embodiments only and is not intended to represent the scope of the present invention. In detail, the larger the area of the adhesive layer 300 disposed on the light incident surface 110 corresponding to any two adjacent light emitting elements 200 is, the adhesive strength of the adhesive layer 300 can be improved. On the other hand, the larger the area is, the easier the light is to be absorbed, so that the light emitting surface 120 may have uneven brightness when emitting light corresponding to the area between any two adjacent light emitting elements 200. For example, the adhesive layer 300 of fig. 5D disposed on the light incident surface 110 between any two adjacent light emitting devices 200 has a larger adhesive strength than the adhesive layer 300 of fig. 5A, but in the arrangement of fig. 5D, the light emitting surface 120 corresponding to the area between any two adjacent light emitting devices 200 is more prone to have uneven brightness when emitting light than the arrangement of fig. 5A. On the contrary, although the adhesive strength of the adhesive layer 300 in fig. 5A is smaller, under the configuration in fig. 5A, the light-emitting surface 120 corresponding to the region between any two adjacent light-emitting elements 200 can emit light more effectively to reduce the phenomenon of uneven brightness than the configuration in fig. 5D.

Fig. 6 is a block diagram of a display device according to an embodiment of the utility model. Referring to fig. 6, the display device 1 of the present embodiment includes a light source module 10 and a display panel 20, wherein the display panel 20 is disposed on a light emitting side of the light source module 10. The display panel 20 may be a liquid crystal display panel or other non-self-emissive display panel. The light source module 10 is used to provide a surface light source Ls to the display panel 20 as a display light source. Since the light source module 10 of the present embodiment can reduce the uneven brightness while fixing the light guide plate 100, the display device 1 using the light source module 10 can also reduce the uneven brightness of the display screen.

In summary, in the light source module of the embodiments of the utility model, the top surface of the sidewall of each light emitting element faces the light incident surface of the light guide plate, and the adhesive layer is disposed between the top surface and the light incident surface, so as to achieve the effect of fixing the relative position between the light emitting element and the light guide plate. Meanwhile, the adhesive layer is not arranged between the light guide plate and the circuit substrate and is close to the light-emitting element as in the prior art, so that the condition that light is absorbed by the adhesive layer after entering the light guide plate can be reduced, and the phenomenon of uneven brightness is further reduced. In addition, the adhesive layer also extends to a part of the opening and the light incident surface, and the reserved space of the adhesive layer can avoid incomplete adhesion of the light guide plate and the light emitting element due to tolerance in the assembling process, so that the effect of fixing the light guide plate is not influenced due to the tolerance. The display device of the embodiment of the utility model can reduce the phenomenon of uneven brightness of the display picture because of using the light source module.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the utility model as defined by the appended claims.

Description of reference numerals:

1 display device

10 light source module

20 display panel

100 light guide plate

110 incident light surface

120, light-emitting surface

200 light emitting element

210 light emitting chip

220 lamp cup

221 side wall

222 top surface of

223 frame

2231 the first side edge

2232 second side edge

2233 third side edge

2234 the fourth side edge

230 light emitting substrate

240 opening (c)

300 adhesive layer

400 circuit board

500 back plate

L is light

L1, L2 Length

Ls surface light source

R is luminous zone

T is thickness

W1 first Width

W2 second Width

W3 third Width

W4 fourth Width.

Claims (10)

1. A light source module, comprising a light guide plate, a plurality of light emitting elements, and an adhesive layer, wherein:

the light guide plate is provided with a light incident surface and a light emergent surface, and the light incident surface is connected with the light emergent surface;

the light-emitting elements are arranged beside the light incident surface, each light-emitting element comprises a light-emitting wafer and a lamp cup, each lamp cup is provided with a side wall, the side wall surrounds the light-emitting wafer to form an opening, and the top surface of the side wall faces the light incident surface; and

the adhesive layer is arranged between the top surface and the light incident surface and extends to a part of the gap between the opening and the light incident surface.

2. The light source module as claimed in claim 1, wherein the top surface has a frame surrounding the opening, the frame has a first side, a second side, a third side and a fourth side, the first side is opposite to the second side, the third side is opposite to the fourth side, the first side and the second side are perpendicular to the light emitting surface, the third side and the fourth side are parallel to the light emitting surface, and the adhesive layer is at least disposed on the first side and the second side of the frame.

3. The light source module of claim 2, wherein the adhesive layer disposed on the first side of the bezel and extending over a portion of the opening has a first width, and the adhesive layer disposed on the second side of the bezel and extending over a portion of the opening has a second width, the first width plus the second width being 1/4-1/3 of a length of the third side.

4. The light source module as claimed in claim 1, wherein the top surface has a frame surrounding the opening, the frame has a first side, a second side, a third side and a fourth side, the first side is opposite to the second side, the third side is opposite to the fourth side, the first side and the second side are perpendicular to the light emitting surface, the third side and the fourth side are parallel to the light emitting surface, and the adhesive layer is at least disposed on the third side and the fourth side of the frame.

5. The light source module of claim 4, wherein the adhesive layer disposed on the third side of the bezel and extending to a portion of the opening has a third width, and the adhesive layer disposed on the fourth side of the bezel and extending to a portion of the opening has a fourth width, the third width plus the fourth width being 1/4-1/3 of the length of the first side.

6. The light source module as claimed in claim 1, wherein the light emitting die has a light emitting angle range, the light emitting die is configured to provide light in the light emitting angle range to form a light emitting region at the opening, and the bonding layer is not disposed in the light emitting region.

7. The light source module of claim 1, wherein the adhesive layer is further disposed on the light incident surface between any two adjacent light emitting elements.

8. The light source module of claim 1, wherein the adhesive layer has a thickness of 0.05mm to 0.15mm in a direction perpendicular to the top surface.

9. The light source module according to claim 1, wherein the adhesive layer has a light-transmitting property.

10. A display device, comprising a light source module and a display panel, wherein:

the light source module includes a light guide plate, a plurality of light emitting elements, and an adhesive layer, wherein:

the light guide plate is provided with a light incident surface and a light emergent surface, and the light incident surface is connected with the light emergent surface;

the light-emitting elements are arranged beside the light incident surface, each light-emitting element comprises a light-emitting wafer and a lamp cup, each lamp cup is provided with a side wall, the side wall surrounds the light-emitting wafer to form an opening, and the top surface of the side wall faces the light incident surface; and

the adhesive layer is arranged between the top surface and the light incident surface and extends to a part of the opening between the light incident surface and the adhesive layer; and

the display panel is configured on the light emitting side of the light source module.

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