TWM629368U - Light source module and display device - Google Patents

Light source module and display device Download PDF

Info

Publication number
TWM629368U
TWM629368U TW111200047U TW111200047U TWM629368U TW M629368 U TWM629368 U TW M629368U TW 111200047 U TW111200047 U TW 111200047U TW 111200047 U TW111200047 U TW 111200047U TW M629368 U TWM629368 U TW M629368U
Authority
TW
Taiwan
Prior art keywords
light
emitting
adhesive layer
opening
disposed
Prior art date
Application number
TW111200047U
Other languages
Chinese (zh)
Inventor
廖啟聲
盧敬州
徐明愷
Original Assignee
中強光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中強光電股份有限公司 filed Critical 中強光電股份有限公司
Publication of TWM629368U publication Critical patent/TWM629368U/en

Links

Images

Landscapes

  • Planar Illumination Modules (AREA)

Abstract

A light source module includes a light guide plate, a plurality of light-emitting elements and an adhesive layer. The light guide plate has a light incident surface and a light exit surface. The plurality of light-emitting elements are disposed beside the light incident surface. Each of the plurality of light-emitting elements has a light-emitting chip and a housing. The housing has a side wall. The side wall surrounds the light-emitting chip to form an opening. A top surface of the side wall faces the light incident surface. The adhesive layer is disposed between the top surface and the light incident surface and further extends between a part of the opening and the light incident surface. A display device of the invention using the light source module is also provided.

Description

光源模組及顯示裝置Light source module and display device

本創作是有關於一種光源模組,尤其是有關於一種能用於顯示裝置的光源模組以及使用此光源模組的顯示裝置。 This creation relates to a light source module, especially a light source module that can be used in a display device and a display device using the light source module.

一般液晶顯示裝置包括液晶顯示面板與背光模組,而且由於液晶顯示面板本身不發光,所以需要靠背光模組提供照明光源至液晶顯示面板。因此,背光模組的主要功能就是提供高輝度以及高均勻度的照明光源。 Generally, a liquid crystal display device includes a liquid crystal display panel and a backlight module, and since the liquid crystal display panel itself does not emit light, the backlight module needs to provide an illumination light source to the liquid crystal display panel. Therefore, the main function of the backlight module is to provide an illumination light source with high brightness and high uniformity.

背光模組包括導光板、發光二極體、背板等組件,並可分為側入式背光模組與直下式背光模組。在目前的側入式背光模組中,為了固定導光板與發光二極體之間相對位置的方式通常是將固定膠黏接於導光板及發光二極體的電路基板之間。 The backlight module includes components such as a light guide plate, a light-emitting diode, and a backplane, and can be divided into an edge-type backlight module and a direct-type backlight module. In the current edge-lit backlight module, in order to fix the relative position between the light guide plate and the light emitting diode, a fixing glue is usually bonded between the light guide plate and the circuit substrate of the light emitting diode.

然而,當固定膠配置時,若加貼過程未緊實易有氣泡產生,光線在進入導光板後遇到氣泡時會產生折射,並且部分的光線也會被固定膠吸收,進而造成顯示畫面亮暗不均的問題。 However, when the fixing glue is configured, if the sticking process is not tightened, bubbles are likely to be generated, and the light will be refracted when it encounters the bubbles after entering the light guide plate, and part of the light will also be absorbed by the fixing glue, which will cause the display screen to be bright. The problem of uneven darkness.

本「先前技術」段落只是用來幫助瞭解本創作內容,因此在「先前技術」中所揭露的內容可能包含一些沒有構成所屬技術領域中具有通常知識者所知道的習知技術。此外,在「先前技術」中所揭露的內容並不代表該內容或者本創作一個或多個實施例所要解決的問題,也不代表在本創作申請前已被所屬技術領域中具有通常知識者所知曉或認知。 This "Prior Art" paragraph is only used to help understand the content of the creation, so the content disclosed in the "Prior Art" may contain some that do not constitute the prior art known to those with ordinary knowledge in the art. In addition, the content disclosed in the "Prior Art" does not represent the content or the problem to be solved by one or more embodiments of the present invention, nor does it represent that it has been known by those with ordinary knowledge in the technical field before the application of the present invention. know or know.

本創作提供一種光源模組,能在固定發光元件與導光板之間相對位置的同時,減少出光亮暗不均的現象。 The present invention provides a light source module, which can reduce the phenomenon of uneven brightness and darkness while fixing the relative position between the light-emitting element and the light guide plate.

本創作提供一種顯示裝置,能減少顯示畫面亮暗不均的現象。 The present invention provides a display device that can reduce the phenomenon of uneven brightness and darkness of a display screen.

本創作的其他目的和優點可以從本創作所揭露的技術特徵中得到進一步的了解。 Other purposes and advantages of the present creation can be further understood from the technical features disclosed in the present creation.

為達上述之一或部分或全部目的或是其他目的,本創作一實施例所提供的光源模組包括導光板、多個發光元件以及黏合層。導光板具有入光面及出光面,入光面連接於出光面。多個發光元件配置於入光面旁。每個發光元件包括發光晶片及燈杯。燈杯具有側壁,側壁圍繞發光晶片以形成開口,且側壁的頂面面對入光面。黏合層配置於頂面與入光面之間並延伸至一部分的開口與入光面之間。 In order to achieve one or part or all of the above purposes or other purposes, the light source module provided by an embodiment of the present invention includes a light guide plate, a plurality of light emitting elements and an adhesive layer. The light guide plate has a light entrance surface and a light exit surface, and the light entrance surface is connected to the light exit surface. A plurality of light emitting elements are arranged beside the light incident surface. Each light-emitting element includes a light-emitting chip and a lamp cup. The lamp cup has a side wall, the side wall surrounds the light-emitting chip to form an opening, and the top surface of the side wall faces the light incident surface. The adhesive layer is disposed between the top surface and the light incident surface and extends between a part of the opening and the light incident surface.

在本創作的一實施例中,上述之頂面具有邊框以圍繞開口,邊框具有第一側邊、第二側邊、第三側邊及第四側邊,第一側邊與第二側邊相對,第三側邊與第四側邊相對,第一側邊及第二側邊垂直於出光面,第三側邊及第四側邊平行於出光面,黏合層至少配置於邊框的第一側邊及第二側邊。 In an embodiment of the present invention, the above-mentioned top surface has a frame to surround the opening, the frame has a first side, a second side, a third side and a fourth side, the first side and the second side Oppositely, the third side is opposite to the fourth side, the first side and the second side are perpendicular to the light-emitting surface, the third side and the fourth side are parallel to the light-emitting surface, and the adhesive layer is arranged at least on the first side of the frame. side and second side.

在本創作的一實施例中,上述之配置於邊框的第一側邊並延伸至一部分的開口的黏合層具有第一寬度,配置於邊框的第二側邊並延伸至一部分的開口的黏合層具有第二寬度,第一寬度加第二寬度為第三側邊的長度的1/4~1/3。 In an embodiment of the present invention, the above-mentioned adhesive layer disposed on the first side of the frame and extending to a part of the opening has a first width, and the adhesive layer disposed on the second side of the frame and extending to a part of the opening It has a second width, and the first width plus the second width is 1/4~1/3 of the length of the third side.

在本創作的一實施例中,上述之頂面具有邊框以圍繞開口,邊框具有第一側邊、第二側邊、第三側邊及第四側邊,第一側邊與第二側邊相 對,第三側邊與第四側邊相對,第一側邊及第二側邊垂直於出光面,第三側邊及第四側邊平行於出光面,黏合層至少配置於邊框的第三側邊及第四側邊。 In an embodiment of the present invention, the above-mentioned top surface has a frame to surround the opening, the frame has a first side, a second side, a third side and a fourth side, the first side and the second side Mutually Yes, the third side is opposite to the fourth side, the first side and the second side are perpendicular to the light-emitting surface, the third side and the fourth side are parallel to the light-emitting surface, and the adhesive layer is arranged at least on the third side of the frame. side and fourth side.

在本創作的一實施例中,上述之配置於邊框的第三側邊並延伸至一部分的開口的黏合層具有第三寬度,配置於邊框的第四側邊並延伸至一部分的開口的黏合層具有第四寬度,第三寬度加第四寬度為第一側邊的長度的1/4~1/3。 In an embodiment of the present invention, the above-mentioned adhesive layer disposed on the third side of the frame and extending to a part of the opening has a third width, and the adhesive layer disposed on the fourth side of the frame and extending to a part of the opening It has a fourth width, and the third width plus the fourth width is 1/4~1/3 of the length of the first side.

在本創作的一實施例中,上述之發光晶片具有出光角度範圍,發光晶片適於在出光角度範圍提供光線以在開口處形成發光區,黏合層未配置於發光區。 In an embodiment of the present invention, the above-mentioned light-emitting chip has a light-emitting angle range, the light-emitting chip is suitable for providing light within the light-emitting angle range to form a light-emitting area at the opening, and the adhesive layer is not disposed in the light-emitting area.

在本創作的一實施例中,上述之黏合層更配置於對應於任兩相鄰的發光元件之間的入光面。 In an embodiment of the present invention, the above-mentioned adhesive layer is further configured to correspond to the light incident surface between any two adjacent light-emitting elements.

在本創作的一實施例中,上述之黏合層在垂直於頂面的方向上的厚度為0.05mm~0.15mm。 In an embodiment of the present invention, the thickness of the above-mentioned adhesive layer in the direction perpendicular to the top surface is 0.05mm˜0.15mm.

在本創作的一實施例中,上述之黏合層具有透光性。 In an embodiment of the present invention, the above-mentioned adhesive layer has light transmittance.

為達上述之一或部分或全部目的或是其他目的,本創作一實施例所提供的顯示裝置包括顯示面板及上述的光源模組。顯示面板配置於光源模組的出光側。 To achieve one or part or all of the above purposes or other purposes, a display device provided by an embodiment of the present invention includes a display panel and the above-mentioned light source module. The display panel is arranged on the light-emitting side of the light source module.

本創作實施例的光源模組中,每一發光元件的側壁的頂面面對導光板的入光面,並且黏合層配置於頂面與入光面之間,能達到固定發光原件與導光板之間相對位置的效果。同時,由於黏合層並非如習知技術配置於導光板與發光元件的電路基板之間且靠近於發光元件,因此能夠減少光線進入導光板後被黏合層吸收的情況,進而減少出光亮暗不均的現象。此外,黏合層還延伸至一部分的開口與入光面之間,此處預留的黏合層的空 間可以避免導光板及發光元件在組裝過程中因為公差造成黏合不全的情況,確保固定導光板的效果不因公差而受到影響。本創作實施例的顯示裝置由於使用上述的光源模組,因此能減少顯示畫面亮暗不均的現象。 In the light source module of this creative embodiment, the top surface of the side wall of each light-emitting element faces the light-incident surface of the light guide plate, and the adhesive layer is disposed between the top surface and the light-incident surface, which can fix the light-emitting element and the light guide plate. The effect of the relative position between them. At the same time, since the adhesive layer is not disposed between the light guide plate and the circuit substrate of the light emitting element and is close to the light emitting element as in the prior art, it can reduce the absorption of light by the adhesive layer after entering the light guide plate, thereby reducing uneven light and dark. The phenomenon. In addition, the adhesive layer also extends between a part of the opening and the light incident surface, and the space of the adhesive layer reserved here is It can avoid the incomplete bonding of the light guide plate and the light-emitting element due to tolerance during the assembly process, and ensure that the effect of fixing the light guide plate is not affected by the tolerance. Since the display device of the present inventive embodiment uses the above-mentioned light source module, the phenomenon of uneven brightness and darkness of the display screen can be reduced.

為讓本創作之上述和其他目的、特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式,作詳細說明如下。 In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail in conjunction with the accompanying drawings.

1:顯示裝置 1: Display device

10:光源模組 10: Light source module

20:顯示面板 20: Display panel

100:導光板 100: light guide plate

110:入光面 110: light incident surface

120:出光面 120: light-emitting surface

200:發光元件 200: Light-emitting element

210:發光晶片 210: Luminous Chip

220:燈杯 220: Lamp Cup

221:側壁 221: Sidewall

222:頂面 222: top surface

223:邊框 223: Border

2231:第一側邊 2231: First side

2232:第二側邊 2232: Second side

2233:第三側邊 2233: Third side

2234:第四側邊 2234: Fourth side

230:發光基板 230: Light-emitting substrate

240:開口 240: Opening

300:黏合層 300: Adhesive layer

400:電路基板 400: circuit substrate

500:背板 500: Backplane

L:光線 L: light

L1、L2:長度 L1, L2: length

Ls:面光源 Ls: area light source

R:發光區 R: light-emitting area

T:厚度 T: Thickness

W1:第一寬度 W1: first width

W2:第二寬度 W2: Second width

W3:第三寬度 W3: third width

W4:第四寬度 W4: Fourth width

圖1為本創作一實施例的光源模組的立體示意圖。 FIG. 1 is a three-dimensional schematic diagram of a light source module according to an embodiment of the invention.

圖2為本創作一實施例的光源模組的局部剖面示意圖。 FIG. 2 is a schematic partial cross-sectional view of a light source module according to an embodiment of the invention.

圖3為本創作一實施例的黏合層配置於頂面的示意圖。 FIG. 3 is a schematic diagram of an adhesive layer disposed on a top surface according to an embodiment of the invention.

圖4A至圖4F為本創作的其他實施例之黏合層配置於邊框的示意圖。 4A to 4F are schematic diagrams of disposing the adhesive layer on the frame according to other embodiments of the present invention.

圖5A至圖5D為本創作的其他實施例之黏合層配置於入光面的示意圖。 5A to 5D are schematic diagrams of disposing the adhesive layer on the light incident surface according to other embodiments of the present invention.

圖6為本創作一實施例的顯示裝置的方塊示意圖。 FIG. 6 is a schematic block diagram of a display device according to an embodiment of the invention.

圖1為本創作一實施例的光源模組的立體示意圖。圖2為本創作一實施例的光源模組的局部剖面示意圖。圖3為本創作一實施例的黏合層配置於頂面的示意圖。請參考圖1至圖3,本實施例的光源模組10包括導光板100、多個發光元件200、黏合層300、電路基板400及背板500。電路基板400配置於背板500上。多個發光元件200配置於電路基板400上,且電性連接於電路基板400,電路基板400適於驅使這些發光元件200發光。導光板100例如是配置於電路基板400上,但不以此為限。如圖2所示,導光板100可以是部分配置於電路基板400上,或者電路基板400的面積也可以是大於導光板 100的面積,使得導光板100整體配置於電路基板400上。於另一實施例中,導光板100也可以是配置於背板500上。導光板100具有入光面110及出光面120,入光面110連接於出光面120。多個發光元件200配置於入光面110旁。黏合層300配置於多個發光元件200與入光面110之間。黏合層300例如是光學膠或固定膠帶等,本創作並不特別限制黏合層300的種類,只要其具有黏合光學元件的功能即可。較佳地,本實施例的黏合層300例如具有透光性,以減少對發光元件200所發出的光線L的遮蔽影響。圖1中為了清楚繪示黏合層300的結構以及相對位置,因此省略了電路基板400及背板500。 FIG. 1 is a three-dimensional schematic diagram of a light source module according to an embodiment of the invention. FIG. 2 is a schematic partial cross-sectional view of a light source module according to an embodiment of the invention. FIG. 3 is a schematic diagram of an adhesive layer disposed on a top surface according to an embodiment of the invention. Referring to FIGS. 1 to 3 , the light source module 10 of this embodiment includes a light guide plate 100 , a plurality of light emitting elements 200 , an adhesive layer 300 , a circuit substrate 400 and a backplane 500 . The circuit board 400 is disposed on the backplane 500 . The plurality of light emitting elements 200 are disposed on the circuit substrate 400 and are electrically connected to the circuit substrate 400 , and the circuit substrate 400 is suitable for driving these light emitting elements 200 to emit light. The light guide plate 100 is, for example, disposed on the circuit substrate 400 , but not limited thereto. As shown in FIG. 2 , the light guide plate 100 may be partially disposed on the circuit substrate 400 , or the area of the circuit substrate 400 may be larger than that of the light guide plate 100 , so that the light guide plate 100 is integrally disposed on the circuit substrate 400 . In another embodiment, the light guide plate 100 may also be disposed on the back plate 500 . The light guide plate 100 has a light incident surface 110 and a light exit surface 120 , and the light incident surface 110 is connected to the light exit surface 120 . The plurality of light emitting elements 200 are arranged beside the light incident surface 110 . The adhesive layer 300 is disposed between the plurality of light emitting elements 200 and the light incident surface 110 . The adhesive layer 300 is, for example, optical glue or fixing tape. The present invention does not particularly limit the type of the adhesive layer 300 as long as it has the function of bonding optical elements. Preferably, the adhesive layer 300 of this embodiment has, for example, light transmittance, so as to reduce the shading effect on the light L emitted by the light emitting element 200 . In FIG. 1 , in order to clearly illustrate the structure and relative position of the adhesive layer 300 , the circuit substrate 400 and the backplane 500 are omitted.

在本實施例中,發光元件200的數量僅為示意,本創作也不特別限制發光元件200的數量。黏合層300的數量例如是對應於發光元件200的數量,但不以此為限。在另一實施例中,也可以是單一個黏合層300對應於多個發光元件200。本實施例的每一發光元件200包括發光晶片210及燈杯220。發光晶片210及燈杯220配置於發光基板230上。燈杯220具有側壁221以及發光基板230。側壁221以及發光基板230共同形成一容置空間,且發光晶片210位於容置空間內且配置於發光基板230上。側壁221圍繞發光晶片210以形成開口240,且側壁221的頂面222面對導光板100的入光面110。意即,發光元件200是藉由燈杯220而配置於電路基板400上,發光晶片210透過發光基板230電連接至電路基板400。此外,具體而言,黏合層300是配置於頂面222與入光面110之間,並延伸至一部分的開口240與入光面110之間。黏合層300延伸配置於一部分的開口240與入光面110之間,是為了預留空間,以避免導光板100及發光元件200在組裝過程中因為公差造成黏合不全的情況,確保導光板100與發光元件200之間的黏合效果不因公差而受到影響。 In this embodiment, the number of the light-emitting elements 200 is only for illustration, and the present invention does not particularly limit the number of the light-emitting elements 200 . For example, the number of the adhesive layers 300 corresponds to the number of the light emitting elements 200 , but not limited thereto. In another embodiment, a single adhesive layer 300 may also correspond to a plurality of light emitting elements 200 . Each light-emitting element 200 in this embodiment includes a light-emitting chip 210 and a lamp cup 220 . The light-emitting chip 210 and the lamp cup 220 are disposed on the light-emitting substrate 230 . The lamp cup 220 has a side wall 221 and a light-emitting substrate 230 . The sidewalls 221 and the light-emitting substrate 230 together form an accommodating space, and the light-emitting chip 210 is located in the accommodating space and disposed on the light-emitting substrate 230 . The sidewall 221 surrounds the light-emitting chip 210 to form the opening 240 , and the top surface 222 of the sidewall 221 faces the light incident surface 110 of the light guide plate 100 . That is, the light-emitting element 200 is disposed on the circuit substrate 400 by the lamp cup 220 , and the light-emitting chip 210 is electrically connected to the circuit substrate 400 through the light-emitting substrate 230 . In addition, specifically, the adhesive layer 300 is disposed between the top surface 222 and the light incident surface 110 and extends between a part of the opening 240 and the light incident surface 110 . The adhesive layer 300 is extended between a part of the opening 240 and the light incident surface 110 to reserve space to avoid the incomplete adhesion of the light guide plate 100 and the light emitting element 200 due to tolerances during the assembly process. The adhesion effect between the light emitting elements 200 is not affected by the tolerance.

頂面222具有邊框223以圍繞開口240,換言之,發光元件200的發光面是由邊框223及開口240所組成,並且光線L自開口240出射,而黏合層300則是配置於邊框223並圍繞開口240。在本實施例中,邊框223及開口240例如皆為矩形,但不以此為限。邊框223具有第一側邊2231、第二側邊2232、第三側邊2233及第四側邊2234。第一側邊2231與第二側邊2232相對。第三側邊2233與第四側邊2234相對。第一側邊2231及第二側邊2232例如是垂直於出光面120,第三側邊2233及第四側邊2234例如是平行於出光面120。以圖3的視角而言,第一側邊2231位於邊框223的左側,第二側邊2232位於邊框223的右側,第三側邊2233位於邊框223的上側,第四側邊2234位於邊框223的下側。 The top surface 222 has a frame 223 to surround the opening 240. In other words, the light-emitting surface of the light-emitting element 200 is composed of the frame 223 and the opening 240, and the light L exits from the opening 240, and the adhesive layer 300 is disposed on the frame 223 and surrounds the opening. 240. In this embodiment, the frame 223 and the opening 240 are, for example, rectangular, but not limited thereto. The frame 223 has a first side 2231 , a second side 2232 , a third side 2233 and a fourth side 2234 . The first side 2231 is opposite to the second side 2232 . The third side edge 2233 is opposite to the fourth side edge 2234 . The first side 2231 and the second side 2232 are, for example, perpendicular to the light emitting surface 120 , and the third side 2233 and the fourth side 2234 are, for example, parallel to the light emitting surface 120 . From the perspective of FIG. 3 , the first side 2231 is located on the left side of the frame 223 , the second side 2232 is located on the right side of the frame 223 , the third side 2233 is located on the upper side of the frame 223 , and the fourth side 2234 is located on the upper side of the frame 223 . underside.

在本實施例中,黏合層300例如是配置於邊框223的第一側邊2231、第二側邊2232、第三側邊2233及第四側邊2234,但不以此為限。在其他實施例中,黏合層300也可以是配置於第一側邊2231、第二側邊2232、第三側邊2233及第四側邊2234中的至少其中之二。當黏合層300配置於邊框223的面積越大,表示黏合層300的黏合效果越佳,使得導光板100與發光元件200之間的黏接強度越高。若黏合層300僅配置於第一側邊2231、第二側邊2232、第三側邊2233及第四側邊2234中的其中之一側邊,則黏接強度不足,使得導光板100與發光元件200之間容易脫落。 In this embodiment, the adhesive layer 300 is, for example, disposed on the first side 2231 , the second side 2232 , the third side 2233 and the fourth side 2234 of the frame 223 , but not limited thereto. In other embodiments, the adhesive layer 300 may also be disposed on at least two of the first side 2231 , the second side 2232 , the third side 2233 and the fourth side 2234 . The larger the area of the adhesive layer 300 disposed on the frame 223 is, the better the adhesive effect of the adhesive layer 300 is, and the higher the adhesive strength between the light guide plate 100 and the light emitting element 200 is. If the adhesive layer 300 is only disposed on one of the first side 2231 , the second side 2232 , the third side 2233 and the fourth side 2234 , the adhesive strength is insufficient, so that the light guide plate 100 and the light-emitting The elements 200 are easily detached.

黏合層300在垂直於頂面222的方向上具有厚度T。當厚度T過小時,導光板100與發光元件200之間的黏接強度不足。相反地,當厚度T過大時,黏合層300可能會對光線L產生遮蔽的影響。在本創作一較佳的實施例中,厚度T為0.05mm~0.15mm。 The adhesive layer 300 has a thickness T in a direction perpendicular to the top surface 222 . When the thickness T is too small, the adhesive strength between the light guide plate 100 and the light emitting element 200 is insufficient. Conversely, when the thickness T is too large, the adhesive layer 300 may have a shielding effect on the light L. In a preferred embodiment of the present invention, the thickness T is 0.05mm~0.15mm.

發光元件200可為發光二極體,發光晶片210例如是直接自一片晶圓切割出的發光二極體晶片,但不以此為限,發光元件200也可以是其他種 類的發光元件。在本實施例中,發光晶片210具有出光角度範圍(如圖2所示),發光晶片210適於在出光角度範圍內提供光線L以在開口240處形成發光區R,並且黏合層300並未配置於發光區R。具體而言,發光區R的面積例如是小於或等於開口240的面積,藉由調整或使用不同的發光晶片210,可以改變其出光角度範圍,進而改變發光區R的面積。「發光區R」的定義為,發光晶片210所提供的光線L於開口240處主要通過的區域。換言之,在開口240的非發光區R的區域,仍會有部分光線L通過,同時在開口240的非發光區R的區域也是黏合層300所配置的區域。由於黏合層300並未配置於發光區R,並且當黏合層300具有透光性時,也可以使非發光區R的區域的部分光線L通過,因此本實施例的黏合層300在配置後能降低對發光元件200的出光效果的影響。 The light-emitting element 200 can be a light-emitting diode, and the light-emitting chip 210 is, for example, a light-emitting diode chip directly cut from a wafer, but not limited to this, and the light-emitting element 200 can also be of other types class of light-emitting elements. In this embodiment, the light-emitting chip 210 has a light-emitting angle range (as shown in FIG. 2 ), the light-emitting chip 210 is suitable for providing light L within the light-emitting angle range to form the light-emitting region R at the opening 240 , and the adhesive layer 300 does not It is arranged in the light-emitting area R. Specifically, the area of the light-emitting region R is, for example, smaller than or equal to the area of the opening 240 . By adjusting or using different light-emitting chips 210 , the light-emitting angle range can be changed, thereby changing the area of the light-emitting region R. The “light emitting area R” is defined as the area through which the light L provided by the light emitting chip 210 mainly passes through the opening 240 . In other words, in the non-light-emitting region R of the opening 240, some light L will still pass through, and the non-light-emitting region R of the opening 240 is also the region where the adhesive layer 300 is disposed. Since the adhesive layer 300 is not disposed in the light-emitting region R, and when the adhesive layer 300 has light transmittance, part of the light L in the non-light-emitting region R can pass through. Therefore, the adhesive layer 300 in this embodiment can be disposed after being disposed. The influence on the light emitting effect of the light emitting element 200 is reduced.

電路基板400例如是印刷電路板,可為硬板或軟板。硬板例如為金屬基印刷電路板(metal core printed circuit board,MCPCB)或銅箔電路基板(如FR4電路基板)。 The circuit substrate 400 is, for example, a printed circuit board, which can be a rigid board or a flexible board. The rigid board is, for example, a metal core printed circuit board (MCPCB) or a copper foil circuit substrate (eg, a FR4 circuit substrate).

本實施例的光源模組10中,每一發光元件200的側壁221的頂面222面對導光板100的入光面110,並且黏合層300配置於頂面222與入光面110之間,由於發光元件200已被固定於電路基板400上,此時可以是電路基板400固定於背板500上或是導光板100相對於與發光元件200黏貼的另一側固定於背板500,固定的方式可以是透過膠體等或機構等方式,因此間接能達到固定導光板100的效果。同時,由於黏合層300並非如習知技術配置於導光板與電路基板之間且靠近於發光元件,因此能夠減少光線進入導光板後被黏合層吸收的情況,進而減少出光亮暗不均的現象。此外,黏合層300還延伸至一部分的開口240與入光面110之間,此處預留的黏合層300的空間 可以避免導光板100及發光元件200在組裝過程中因為公差造成黏合不全的情況,確保固定導光板100的效果不因公差而受到影響。 In the light source module 10 of this embodiment, the top surface 222 of the side wall 221 of each light emitting element 200 faces the light incident surface 110 of the light guide plate 100 , and the adhesive layer 300 is disposed between the top surface 222 and the light incident surface 110 . Since the light-emitting element 200 has been fixed on the circuit substrate 400, the circuit substrate 400 can be fixed on the backplane 500 at this time, or the light guide plate 100 can be fixed on the backplane 500 relative to the other side of the light-emitting element 200. The method may be through a colloid or a mechanism, so the effect of fixing the light guide plate 100 can be achieved indirectly. At the same time, since the adhesive layer 300 is not disposed between the light guide plate and the circuit substrate and is close to the light-emitting element as in the prior art, it can reduce the absorption of light by the adhesive layer after entering the light guide plate, thereby reducing the phenomenon of uneven brightness and darkness . In addition, the adhesive layer 300 also extends between a part of the opening 240 and the light incident surface 110 , and the space for the adhesive layer 300 is reserved here. It is possible to avoid incomplete adhesion of the light guide plate 100 and the light emitting element 200 due to tolerances during the assembly process, and to ensure that the effect of fixing the light guide plate 100 is not affected by the tolerances.

為了達到上述效果,本實施例的黏合層300例如還具有以下設計。請再參考圖3,配置於邊框223的第一側邊2231並延伸至一部分的開口240的黏合層300具有第一寬度W1,配置於邊框223的第二側邊2232並延伸至一部分的開口240的黏合層300具有第二寬度W2。第一寬度W1加第二寬度W2例如為第三側邊2233的長度L1的1/4~1/3。需注意的是,由於第三側邊2233與第四側邊2234具有相同的長度L1,因此也可以視為第一寬度W1加第二寬度W2為第四側邊2234的長度L1的1/4~1/3。 In order to achieve the above effects, the adhesive layer 300 of this embodiment also has the following designs, for example. Please refer to FIG. 3 again, the adhesive layer 300 disposed on the first side 2231 of the frame 223 and extending to a part of the opening 240 has a first width W1, and is disposed on the second side 2232 of the frame 223 and extending to a part of the opening 240 The adhesive layer 300 has a second width W2. The first width W1 and the second width W2 are, for example, 1/4˜1/3 of the length L1 of the third side edge 2233 . It should be noted that since the third side 2233 and the fourth side 2234 have the same length L1, it can also be considered that the first width W1 plus the second width W2 is 1/4 of the length L1 of the fourth side 2234. ~1/3.

另一方面,配置於邊框223的第三側邊2233並延伸至一部分的開口240的黏合層300具有第三寬度W3,配置於邊框223的第四側邊2234並延伸至一部分的開口240的黏合層300具有第四寬度W4。第三寬度W3加第四寬度W4為第一側邊2231的長度L2的1/4~1/3。類似地,由於第一側邊2231與第二側邊2232具有相同的長度L2,因此也可以視為第三寬度W3加第四寬度W4為第二側邊2232的長度L2的1/4~1/3。 On the other hand, the adhesive layer 300 disposed on the third side 2233 of the frame 223 and extending to a part of the opening 240 has a third width W3, and the adhesive layer 300 disposed on the fourth side 2234 of the frame 223 and extending to a part of the opening 240 Layer 300 has a fourth width W4. The third width W3 and the fourth width W4 are 1/4˜1/3 of the length L2 of the first side 2231 . Similarly, since the first side 2231 and the second side 2232 have the same length L2, the third width W3 plus the fourth width W4 can also be regarded as 1/4~1 of the length L2 of the second side 2232 /3.

如上所述,本實施例的黏合層300例如是配置於邊框223的第一側邊2231、第二側邊2232、第三側邊2233及第四側邊2234,但不以此為限。圖4A至圖4F為本創作的其他實施例之黏合層配置於邊框的示意圖。請參考圖4A至圖4F,在其他實施例中,考量到黏結強度的情況下,黏合層300至少需配置於邊框223的四個側邊中的相對兩側邊,例如至少需配置於第一側邊2231及第二側邊2232(如圖4A),或者至少需配置於第三側邊2233及第四側邊2234(如圖4B)。「至少」的意思為最少或最低的限度。舉例而言,「至少需配置於第一側邊2231及第二側邊2232」,其範圍還包括了配置於第一側邊2231、第二側邊2232及第三側邊2233(如圖4C),配置於第一側 邊2231、第二側邊2232及第四側邊2234(如圖4D),以及配置於第一側邊2231、第二側邊2232、第三側邊2233及第四側邊2234。類似地,「至少需配置於第三側邊2233及第四側邊2234」,其範圍還包括了配置於第一側邊2231、第三側邊2233及第四側邊2234(如圖4E),配置於第二側邊2232、第三側邊2233及第四側邊2234(如圖4F),以及配置於第一側邊2231、第二側邊2232、第三側邊2233及第四側邊2234。此外,雖未詳細說明,上述配置於邊框223的側邊的黏合層300皆延伸至一部分的開口240。 As mentioned above, the adhesive layer 300 of this embodiment is, for example, disposed on the first side 2231 , the second side 2232 , the third side 2233 and the fourth side 2234 of the frame 223 , but not limited thereto. 4A to 4F are schematic diagrams of disposing the adhesive layer on the frame according to other embodiments of the present invention. Referring to FIGS. 4A to 4F , in other embodiments, considering the bonding strength, the adhesive layer 300 needs to be disposed on at least two opposite sides of the four sides of the frame 223 , for example, at least the first The side 2231 and the second side 2232 (as shown in FIG. 4A ), or at least the third side 2233 and the fourth side 2234 (as shown in FIG. 4B ) should be arranged. "At least" means the least or the least. For example, "at least the first side 2231 and the second side 2232 are required", and the range also includes the first side 2231, the second side 2232 and the third side 2233 (as shown in FIG. 4C ). ), arranged on the first side The side 2231 , the second side 2232 and the fourth side 2234 (as shown in FIG. 4D ) are arranged on the first side 2231 , the second side 2232 , the third side 2233 and the fourth side 2234 . Similarly, "at least the third side 2233 and the fourth side 2234 must be arranged", the scope also includes the arrangement on the first side 2231, the third side 2233 and the fourth side 2234 (as shown in Fig. 4E) , arranged on the second side 2232, the third side 2233 and the fourth side 2234 (as shown in FIG. 4F), and on the first side 2231, the second side 2232, the third side 2233 and the fourth side side 2234. In addition, although not described in detail, the above-mentioned adhesive layers 300 disposed on the sides of the frame 223 all extend to a part of the opening 240 .

在本實施例中,黏合層300僅配置於頂面222與入光面110之間,但不以此為限。圖5A至圖5D為本創作的其他實施例之黏合層配置於入光面的示意圖。請參考圖1、圖3及圖5A至圖5D,在其他實施例中,黏合層300例如還配置於對應於任兩相鄰的發光元件200之間的入光面110,並且其形狀可以依據設計需求調整。舉例而言,配置於對應於任兩相鄰發光元件200之間的入光面110之黏合層300,可以是從對應於發光元件200的邊框223的第二側邊2232以及相鄰的另一發光元件200的邊框223的第一側邊2231延伸至對應於任兩相鄰發光元件200之間的入光面110,並且從對應於發光元件200的邊框223的第三側邊2233延伸至相鄰的另一發光元件200的邊框223的第三側邊2233(如圖5A)。 In this embodiment, the adhesive layer 300 is only disposed between the top surface 222 and the light incident surface 110 , but not limited thereto. 5A to 5D are schematic diagrams of disposing the adhesive layer on the light incident surface according to other embodiments of the present invention. Please refer to FIG. 1 , FIG. 3 and FIGS. 5A to 5D , in other embodiments, the adhesive layer 300 is also disposed, for example, corresponding to the light incident surface 110 between any two adjacent light emitting elements 200 , and its shape can be determined according to Design needs adjustment. For example, the adhesive layer 300 corresponding to the light incident surface 110 between any two adjacent light emitting elements 200 may be formed from the second side 2232 of the frame 223 corresponding to the light emitting element 200 and the adjacent other The first side 2231 of the frame 223 of the light-emitting element 200 extends to the light incident surface 110 corresponding to any two adjacent light-emitting elements 200, and extends from the third side 2233 of the frame 223 corresponding to the light-emitting element 200 to the opposite side. The third side 2233 of the frame 223 of another adjacent light emitting element 200 (as shown in FIG. 5A ).

或者,也可以是從對應於發光元件200的邊框223的第二側邊2232以及相鄰的另一發光元件200的邊框223的第一側邊2231延伸至對應於任兩相鄰發光元件200之間的入光面110,並且從對應於發光元件200的邊框223的第四側邊2234延伸至相鄰的另一發光元件200的邊框223的第四側邊2234(如圖5B)。 Alternatively, it can also extend from the second side 2232 of the frame 223 corresponding to the light-emitting element 200 and the first side 2231 of the frame 223 of another adjacent light-emitting element 200 to the one corresponding to any two adjacent light-emitting elements 200 and extending from the fourth side 2234 of the frame 223 corresponding to the light-emitting element 200 to the fourth side 2234 of the frame 223 of another adjacent light-emitting element 200 (as shown in FIG. 5B ).

又或者,也可以是從對應於發光元件200的邊框223的第二側邊2232以及相鄰的另一發光元件200的邊框223的第一側邊2231延伸至對應於任兩 相鄰發光元件200之間的入光面110,並且分別從對應於發光元件200的邊框223的第三側邊2233及第四側邊2234延伸至相鄰的另一發光元件200的邊框223的第三側邊2233及第四側邊2234(如圖5C)。 Alternatively, it can also extend from the second side 2232 of the frame 223 corresponding to the light-emitting element 200 and the first side 2231 of the frame 223 of another adjacent light-emitting element 200 to any two The light incident surface 110 between adjacent light-emitting elements 200 extends from the third side 2233 and the fourth side 2234 corresponding to the frame 223 of the light-emitting element 200 to the adjacent frame 223 of another light-emitting element 200 respectively. The third side 2233 and the fourth side 2234 (as shown in FIG. 5C ).

又或者,黏合層300也可以是佈滿對應於任兩相鄰的發光元件200之間的入光面110(如圖5D)。上述僅為舉例說明的實施例,不代表本創作所限制的範圍。詳細而言,配置於對應於任兩相鄰發光元件200之間的入光面110之黏合層300的面積越大,可以提升黏合層300的黏接強度。但另一方面,面積越大則越容易吸收光線,因此造成出光面120對應於任兩相鄰發光元件200之間的區域出光時會有亮暗不均的情形。舉例來說,圖5D的配置於對應於任兩相鄰發光元件200之間的入光面110之黏合層300,其黏接強度相較於圖5A的黏合層300較大,然而圖5D的配置下,出光面120對應於任兩相鄰發光元件200之間的區域出光時會比圖5A的配置更容易有亮暗不均的現象。相反地,雖然圖5A的黏合層300的黏接強度較小,但在圖5A的配置下,出光面120對應於任兩相鄰發光元件200之間的區域出光時會比圖5D的配置更能降低亮暗不均的現象。 Alternatively, the adhesive layer 300 may also be covered corresponding to the light incident surface 110 between any two adjacent light emitting elements 200 (as shown in FIG. 5D ). The above-mentioned embodiments are merely illustrative, and do not represent the limited scope of the present invention. Specifically, the larger the area of the adhesive layer 300 corresponding to the light incident surface 110 between any two adjacent light-emitting elements 200 is, the greater the adhesive strength of the adhesive layer 300 can be. On the other hand, the larger the area, the easier it is to absorb light, so that the light-emitting surface 120 may have uneven brightness and darkness when the light-emitting surface 120 emits light in the region between any two adjacent light-emitting elements 200 . For example, the adhesive layer 300 corresponding to the light incident surface 110 between any two adjacent light-emitting elements 200 in FIG. 5D has a higher adhesive strength than the adhesive layer 300 in FIG. 5A . Under the configuration, when the light emitting surface 120 emits light corresponding to the region between any two adjacent light emitting elements 200, the phenomenon of uneven brightness and darkness is more likely to occur than the configuration shown in FIG. 5A. On the contrary, although the adhesive strength of the adhesive layer 300 of FIG. 5A is relatively low, in the configuration of FIG. 5A , the light-emitting surface 120 corresponding to the region between any two adjacent light-emitting elements 200 emits light more than the configuration of FIG. 5D . It can reduce the phenomenon of uneven brightness and darkness.

圖6為本創作一實施例的顯示裝置的方塊示意圖。請參照圖6,本實施例的顯示裝置1包括光源模組10以及顯示面板20,顯示面板20配置於光源模組10的出光側。顯示面板20可為液晶顯示面板或其他非自發光顯示面板。光源模組10用以提供面光源Ls至顯示面板20,以做為顯示光源。由於本實施例的光源模組10能在固定導光板100的同時,減少出光亮暗不均的現象,所以使用此光源模組10的顯示裝置1也能減少顯示畫面亮暗不均的現象。 FIG. 6 is a schematic block diagram of a display device according to an embodiment of the invention. Referring to FIG. 6 , the display device 1 of the present embodiment includes a light source module 10 and a display panel 20 , and the display panel 20 is disposed on the light emitting side of the light source module 10 . The display panel 20 may be a liquid crystal display panel or other non-self-luminous display panel. The light source module 10 is used for providing the surface light source Ls to the display panel 20 as a display light source. Since the light source module 10 of this embodiment can fix the light guide plate 100 while reducing the phenomenon of uneven brightness and darkness, the display device 1 using the light source module 10 can also reduce the phenomenon of uneven brightness and darkness of the display screen.

綜上所述,本創作實施例之光源模組中,每一發光元件的側壁的頂面面對導光板的入光面,並且黏合層配置於頂面與入光面之間,能達到 固定發光元件與導光板之間的相對位置的效果。同時,由於黏合層並非如習知技術配置於導光板與電路基板之間且靠近於發光元件,因此能夠減少光線進入導光板後被黏合層吸收的情況,進而減少出光亮暗不均的現象。此外,黏合層還延伸至一部分的開口與入光面之間,此處預留的黏合層的空間可以避免導光板及發光元件在組裝過程中因為公差造成黏合不全的情況,確保固定導光板的效果不因公差而受到影響。本創作實施例的顯示裝置由於使用上述的光源模組,因此能減少顯示畫面亮暗不均的現象。 To sum up, in the light source module of this creative embodiment, the top surface of the side wall of each light-emitting element faces the light incident surface of the light guide plate, and the adhesive layer is disposed between the top surface and the light incident surface, which can achieve The effect of fixing the relative position between the light-emitting element and the light guide plate. At the same time, since the adhesive layer is not disposed between the light guide plate and the circuit substrate and is close to the light-emitting element as in the prior art, it can reduce the absorption of light by the adhesive layer after entering the light guide plate, thereby reducing the phenomenon of uneven light and dark. In addition, the adhesive layer also extends between a part of the opening and the light incident surface. The space reserved for the adhesive layer here can avoid the incomplete adhesion of the light guide plate and the light-emitting element due to tolerances during the assembly process. The effect is not affected by tolerances. Since the display device of the present inventive embodiment uses the above-mentioned light source module, the phenomenon of uneven brightness and darkness of the display screen can be reduced.

雖然本創作已以實施例揭露如上,然其並非用以限定本創作,本創作所屬技術領域中具有通常知識者,在不脫離本創作之精神和範圍內,當可作些許之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present creation has been disclosed as above with examples, it is not intended to limit the present creation. Those with ordinary knowledge in the technical field to which the present creation belongs may make some changes and modifications without departing from the spirit and scope of the present creation. Therefore, the scope of protection of this creation should be determined by the scope of the appended patent application.

10:光源模組 10: Light source module

100:導光板 100: light guide plate

110:入光面 110: light incident surface

120:出光面 120: light-emitting surface

200:發光元件 200: Light-emitting element

210:發光晶片 210: Luminous Chip

220:燈杯 220: Lamp Cup

221:側壁 221: Sidewall

222:頂面 222: top surface

230:發光基板 230: Light-emitting substrate

240:開口 240: Opening

300:黏合層 300: Adhesive layer

400:電路基板 400: circuit substrate

500:背板 500: Backplane

L:光線 L: light

T:厚度 T: Thickness

Claims (10)

一種光源模組,包括: 一導光板,具有一入光面及一出光面,該入光面連接於該出光面; 多個發光元件,配置於該入光面旁,每一該些發光元件包括一發光晶片及一燈杯,該燈杯具有一側壁,該側壁圍繞該發光晶片以形成一開口,且該側壁的一頂面面對該入光面;以及 一黏合層,配置於該頂面與該入光面之間並延伸至一部分的該開口與該入光面之間。 A light source module, comprising: a light guide plate, which has a light incident surface and a light emitting surface, the light incident surface is connected to the light emitting surface; A plurality of light-emitting elements are arranged next to the light-incident surface, each of the light-emitting elements includes a light-emitting chip and a lamp cup, the lamp cup has a side wall, the side wall surrounds the light-emitting chip to form an opening, and the side wall has an opening. a top surface facing the light incident surface; and An adhesive layer is disposed between the top surface and the light incident surface and extends between a part of the opening and the light incident surface. 如請求項1所述之光源模組,其中該頂面具有一邊框以圍繞該開口,該邊框具有一第一側邊、一第二側邊、一第三側邊及一第四側邊,該第一側邊與該第二側邊相對,該第三側邊與該第四側邊相對,該第一側邊及該第二側邊垂直於該出光面,該第三側邊及該第四側邊平行於該出光面,該黏合層至少配置於該邊框的該第一側邊及該第二側邊。The light source module of claim 1, wherein the top surface has a frame surrounding the opening, and the frame has a first side, a second side, a third side and a fourth side, The first side is opposite to the second side, the third side is opposite to the fourth side, the first side and the second side are perpendicular to the light emitting surface, the third side and the The fourth side is parallel to the light-emitting surface, and the adhesive layer is disposed at least on the first side and the second side of the frame. 如請求項2所述之光源模組,其中配置於該邊框的該第一側邊並延伸至一部分的該開口的該黏合層具有一第一寬度,配置於該邊框的該第二側邊並延伸至一部分的該開口的該黏合層具有一第二寬度,該第一寬度加第二寬度為該第三側邊的長度的1/4 ~ 1/3。The light source module of claim 2, wherein the adhesive layer disposed on the first side of the frame and extending to a part of the opening has a first width, and is disposed on the second side of the frame and The adhesive layer extending to a part of the opening has a second width, and the first width plus the second width is 1/4˜1/3 of the length of the third side. 如請求項1所述之光源模組,其中該頂面具有一邊框以圍繞該開口,該邊框具有一第一側邊、一第二側邊、一第三側邊及一第四側邊,該第一側邊與該第二側邊相對,該第三側邊與該第四側邊相對,該第一側邊及該第二側邊垂直於該出光面,該第三側邊及該第四側邊平行於該出光面,該黏合層至少配置於該邊框的該第三側邊及該第四側邊。The light source module of claim 1, wherein the top surface has a frame surrounding the opening, and the frame has a first side, a second side, a third side and a fourth side, The first side is opposite to the second side, the third side is opposite to the fourth side, the first side and the second side are perpendicular to the light emitting surface, the third side and the The fourth side is parallel to the light emitting surface, and the adhesive layer is disposed at least on the third side and the fourth side of the frame. 如請求項4所述之光源模組,其中配置於該邊框的該第三側邊並延伸至一部分的該開口的該黏合層具有一第三寬度,配置於該邊框的該第四側邊並延伸至一部分的該開口的該黏合層具有一第四寬度,該第三寬度加第四寬度為該第一側邊的長度的1/4 ~ 1/3。The light source module of claim 4, wherein the adhesive layer disposed on the third side of the frame and extending to a part of the opening has a third width, and is disposed on the fourth side of the frame and The adhesive layer extending to a part of the opening has a fourth width, and the third width plus the fourth width is 1/4˜1/3 of the length of the first side. 如請求項1所述之光源模組,其中該發光晶片具有一出光角度範圍,該發光晶片適於在該出光角度範圍提供一光線以在該開口處形成一發光區,該黏合層未配置於該發光區。The light source module of claim 1, wherein the light-emitting chip has a light-emitting angle range, the light-emitting chip is suitable for providing a light within the light-emitting angle range to form a light-emitting area at the opening, and the adhesive layer is not disposed on the light-emitting area. 如請求項1所述之光源模組,其中該黏合層更配置於對應於任兩相鄰的該些發光元件之間的該入光面。The light source module according to claim 1, wherein the adhesive layer is further disposed corresponding to the light incident surface between any two adjacent light emitting elements. 如請求項1所述之光源模組,其中該黏合層在垂直於該頂面的方向上的厚度為0.05mm ~ 0.15mm。The light source module according to claim 1, wherein the thickness of the adhesive layer in the direction perpendicular to the top surface is 0.05mm˜0.15mm. 如請求項1所述之光源模組,其中該黏合層具有透光性。The light source module according to claim 1, wherein the adhesive layer has light transmittance. 一種顯示裝置,包括: 一光源模組,包括: 一導光板,具有一入光面及一出光面,該入光面連接於該出光面; 多個發光元件,配置於該入光面旁,每一該些發光元件包括一發光晶片及一燈杯,該燈杯具有一側壁,該側壁圍繞該發光晶片以形成一開口,且該側壁的一頂面面對該入光面;以及 一黏合層,配置於該頂面與該入光面之間並延伸至一部分的該開口與該入光面之間;以及 一顯示面板,配置於該光源模組的一出光側。 A display device, comprising: A light source module, including: a light guide plate, which has a light incident surface and a light emitting surface, the light incident surface is connected to the light emitting surface; A plurality of light-emitting elements are arranged next to the light-incident surface, each of the light-emitting elements includes a light-emitting chip and a lamp cup, the lamp cup has a side wall, the side wall surrounds the light-emitting chip to form an opening, and the side wall has an opening. a top surface facing the light incident surface; and an adhesive layer disposed between the top surface and the light incident surface and extending between a part of the opening and the light incident surface; and A display panel is disposed on a light-emitting side of the light source module.
TW111200047U 2021-09-24 2022-01-04 Light source module and display device TWM629368U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202122312326.6U CN215769279U (en) 2021-09-24 2021-09-24 Light source module and display device
CN202122312326.6 2021-09-24

Publications (1)

Publication Number Publication Date
TWM629368U true TWM629368U (en) 2022-07-11

Family

ID=80090362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111200047U TWM629368U (en) 2021-09-24 2022-01-04 Light source module and display device

Country Status (2)

Country Link
CN (1) CN215769279U (en)
TW (1) TWM629368U (en)

Also Published As

Publication number Publication date
CN215769279U (en) 2022-02-08

Similar Documents

Publication Publication Date Title
TWI414856B (en) Light-emitting device and display device using the light-emitting device
US20110096265A1 (en) Backlight unit and display device including the same
US9016919B2 (en) Lighting device, display device and television receiver
WO2011162016A1 (en) Led backlight device and liquid crystal display device
JP6662508B2 (en) Lighting module
US9016923B2 (en) Lighting device, display device, and television receiver
RU2468285C1 (en) Lighting device, display device and tv set
JP2019125519A (en) Luminaire and display device
JP2015011859A (en) Luminaire, display device, and television receiver
US11175446B1 (en) Backlight module and display device
WO2013039001A1 (en) Illumination device, display device, and television receiving device
CN112201739B (en) Light-emitting structure, backlight module, display module and display device
US20110205453A1 (en) Illumination device, surface illuminant device, display device, and television receiver
JP2013225373A (en) Lighting device, display device, and television receiving apparatus
TWI436132B (en) Backlight unit and display device using same
WO2012102193A1 (en) Lighting device, display device, and television reception device
WO2012066887A1 (en) Illuminating device and liquid crystal display device provided therewith
JP2016100268A (en) Planar lighting device
WO2012026164A1 (en) Illumination device and display device
WO2011077864A1 (en) Illumination device, display device, and television receiver
JP5347025B2 (en) Illumination device, display device, and television receiver
JP4521333B2 (en) Surface lighting device
TWM629368U (en) Light source module and display device
WO2013031674A1 (en) Illumination device, display device, and television reception device
JP6709768B2 (en) Area lighting device