CN210837716U - Projection display chip packaging structure and projector - Google Patents
Projection display chip packaging structure and projector Download PDFInfo
- Publication number
- CN210837716U CN210837716U CN201921758586.2U CN201921758586U CN210837716U CN 210837716 U CN210837716 U CN 210837716U CN 201921758586 U CN201921758586 U CN 201921758586U CN 210837716 U CN210837716 U CN 210837716U
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- conductive
- layer
- transparent
- conductive particles
- projection display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
Abstract
The utility model discloses a projection display chip packaging structure and projecting apparatus, projection display chip packaging structure includes: the display device comprises a circuit board, a transparent conductive layer, frame glue, a chip and conductive particles; the chip is arranged on the mounting surface of the circuit board; the transparent conducting layer is arranged on one side of the chip, which is opposite to the circuit board, and a liquid crystal layer is arranged between the chip and the transparent conducting layer; the frame glue is arranged at the periphery of the liquid crystal layer in a sealing way; the conductive particles are arranged inside the frame glue. The utility model discloses can avoid using electrically conductive silver thick liquid, reduce the encapsulation technology step, simplify packaging structure, improve encapsulation efficiency.
Description
Technical Field
The utility model relates to a projection display chip's encapsulation technical field especially relates to a projection display chip packaging structure and projecting apparatus.
Background
In the field of projection display, when a chip is packaged, a circuit board and a common electrode of the chip need to be connected, the common electrode and the circuit board are connected through conductive silver paste in the current method, the circuit board supplies power to the common electrode through the conductive silver paste, power is supplied in a conductive silver paste mode, the packaging process steps are more, the packaging structure is complex, and the packaging efficiency is lower.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
SUMMERY OF THE UTILITY MODEL
Therefore, aiming at the problems that the current mode of connecting the circuit board and the common electrode by adopting the conductive silver paste has more packaging process steps and a complex packaging structure, and the packaging efficiency is lower, the projection display chip packaging structure and the projector are necessary to be provided, the conductive silver paste can be avoided being used, the packaging process steps are reduced, the packaging structure is simplified, and the packaging efficiency is improved.
In order to achieve the above object, the utility model provides a projection display chip packaging structure, include:
the chip is arranged on the mounting surface of the circuit board;
the transparent conducting layer is arranged on one side, back to the circuit board, of the chip, and a liquid crystal layer is arranged between the chip and the transparent conducting layer;
the frame glue is arranged on the periphery of the liquid crystal layer in a sealing manner;
and the conductive particles are arranged inside the frame glue.
Optionally, the chip is provided with a conductive portion corresponding to the sealing position of the frame adhesive, the conductive particles abut against the transparent conductive layer and the conductive portion, and the conductive portion is electrically connected to the circuit board.
Optionally, opposite sides of the conductive particles may abut against the transparent conductive layer and the conductive portion, respectively, to deform the conductive particles.
Optionally, the conductive particles are spherical in structure.
Optionally, the diameter of the conductive particles is larger than the distance between the conductive part and the transparent conductive layer.
Optionally, the conductive particles are made of gold.
Optionally, a plurality of conductive particles are laid in a plane parallel to the transparent conductive layer in the frame adhesive, and the plurality of conductive particles are abutted against the transparent conductive layer and the conductive part.
Optionally, the frame glue is an epoxy resin glue.
Optionally, a transparent glass plate is arranged on the side, opposite to the liquid crystal layer, of the transparent conductive layer, and the transparent conductive layer is an indium tin oxide layer.
Furthermore, in order to achieve the above object, the present invention also provides a projector, which includes a housing and a projection display chip package structure as described above, the projection display chip package structure being disposed in the housing.
The utility model provides an among the technical scheme, the chip is installed at the installation face of circuit board, and the circuit board is provided with electrically conductive granule as the power for transparent conducting layer power supply in the frame glue on sealed liquid crystal layer, through electrically conductive granule's electric conductive property, with the power transmission in the circuit board to transparent conducting layer in, avoids adopting the mode of electrically conductive silver thick liquid, has reduced the packaging technology step, and packaging structure simplifies more, improves packaging efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the projection display chip package structure of the present invention.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a projection display chip package structure, including: the liquid crystal display panel comprises a circuit board 100, a chip 200, a transparent conductive layer 300, a liquid crystal layer 400, a frame glue 500 and conductive particles 600.
The circuit board 100 has a circuit laid on one side or both sides of the surface thereof for mounting various electronic components such as resistors, capacitors, etc., the chip 200 is soldered to the circuit board 100 on the side having the circuit laid, i.e., the mounting surface 110 of the circuit board 100 is provided with the chip 200, and the chip 200 and the circuit board 100 are electrically connected.
The transparent conductive layer 300 is arranged on the side of the chip 200 opposite to the circuit board 100, and a liquid crystal layer 400 is arranged between the chip 200 and the transparent conductive layer 300; the transparent conductive layer 300 functions as a common electrode, discharges a voltage, and the liquid crystal in the liquid crystal layer 400 changes an alignment manner according to the voltage of the common electrode.
The projection display has many kinds, which is illustrated by using LCOS (Liquid crystal on Silicon) projection display as an example, light is incident through the transparent conductive layer 300, in the Liquid crystal layer 400, the chip 200 realizes rearrangement of Liquid crystal molecules in the Liquid crystal layer 400 by controlling the voltage in the transparent conductive layer 300, reflection of the light is realized, and projection display is completed.
Since the liquid crystal in the liquid crystal layer 400 has a certain fluidity, the liquid crystal needs to be sealed, and the sealant 500 is disposed around the liquid crystal layer 400 in a sealing manner, so that the liquid crystal is prevented from flowing out.
The conductive particles 600 are disposed inside the sealant 500, and the conductive particles 600 directly transmit the electric power in the circuit board 100 to the transparent conductive layer 300, so as to avoid the conductive silver paste process and save the process steps.
The utility model provides an among the technical scheme, chip 200 installs the installation face 110 at circuit board 100, and circuit board 100 supplies power for transparent conducting layer 300 as the power, is provided with conductive particle 600 in the frame glue 500 of sealed liquid crystal layer 400, through conductive particle 600's electric conductive property, with the electric power transmission in the circuit board 100 to transparent conducting layer 300 in, avoids adopting the mode of electrically conductive silver thick liquid, has reduced the encapsulation technology step, and packaging structure simplifies more, improves encapsulation efficiency.
In one embodiment, a conductive portion (not shown) is disposed at a sealing position of the chip 200 corresponding to the sealant 500, the conductive particles 600 abut against the transparent conductive layer 300 and the conductive portion, and the conductive portion is electrically connected to the circuit board 100.
The conductive portion may be a metal sheet or a metal plate extending toward the circuit board 100, so as to connect the circuit board 100 and the conductive particles 600, or the conductive portion and the circuit board 100 are connected by a binding wire 800, so that power in the circuit board 100 sequentially passes through the binding wire 800, the conductive portion, and the conductive particles 600 to reach the transparent conductive layer 300, so as to supply power to the transparent conductive layer 300, where the binding wire 800 is an existing conductive wire, such as a copper wire.
In one embodiment, opposite sides of the conductive particle 600 may abut against the transparent conductive layer 300 and the conductive portion, respectively, to deform the conductive particle 600.
Specifically, the texture of the conductive particle 600 is soft, and under the abutting pressure of the transparent conductive layer 300 and the conductive portion, the conductive particle 600 is deformed under stress, and the deformed conductive particle 600 increases the abutting area with the transparent conductive layer 300 and the conductive portion, respectively. Adopt electrically conductive silver thick liquid to connect circuit board 100 and transparent conducting layer 300, the quality requirement to electrically conductive silver thick liquid is higher, and under the condition that silver content ratio is low, circuit contact failure easily appears, can't be the condition of public electrode power supply, leads to the unable work of product of production, and warp through electrically conductive granule 600 atress not only makes electrically conductive granule 600 position more firm, avoids appearing the condition of circuit contact failure moreover, has improved the stability of power supply.
In one embodiment, the conductive particles 600 are spherical structures, when the liquid crystal layer 400 is sealed, the conductive particles 600 are prone to rotate in the frame adhesive 500, different side surfaces of the conductive particles 600 may be abutted to the transparent conductive layer 300 and the conductive portion due to rotation of the conductive particles, when the distances between two opposite side surfaces of the conductive particles 600 are different, the conductive particles 600 may not be abutted to the transparent conductive layer 300 and the conductive portion, the distances between any two side surfaces of the conductive particles 600 in the spherical structures are the same, that is, the spherical diameters are fixed, and in time, the conductive particles 600 rotate in the frame adhesive 500, the distances between the conductive particles 600 abutted to the transparent conductive layer 300 and the conductive portion are not changed, so that the stability of electrical contact of chip packaging is further ensured.
In one embodiment, the diameter of the conductive particle 600 is larger than the distance between the conductive portion and the transparent conductive layer 300.
For example, the diameter of the conductive particle 600 is 2.2um, and the distance from the conductive portion to the transparent conductive layer 300 is 2.0um, wherein the conductive particle 600 is softer, and the diameter of the conductive particle 600 is greater than the distance from the conductive portion to the transparent conductive layer 300, or it is understood that the diameter of the conductive particle 600 is greater than the thickness of the liquid crystal layer 400, and the thickness range of the liquid crystal layer 400 is between 1.5um and 2.0um, which can ensure that the conductive particle 600 generates enough deformation under the abutting pressure action of the conductive portion and the transparent conductive layer 300, increase the abutting area between the conductive particle 600 and the conductive portion and the transparent conductive layer 300, and ensure the electrical contact effect.
In one embodiment, the conductive particles 600 are made of gold, wherein the chemical abbreviation of gold is Au, gold is an existing material, gold has excellent conductive performance, and the texture of gold is soft and is easy to deform under the action of an external force, so that the conductive particles 600 are easy to deform under the abutting action of the conductive portion and the transparent conductive layer, the packaging process is more labor-saving, and the packaging efficiency is improved.
In one embodiment, the plurality of conductive particles 600 are laid in the frame adhesive 500 in a plane parallel to the transparent conductive layer 300, and the plurality of conductive particles 600 are abutted against the transparent conductive layer 300 and the conductive portion.
For example, the diameter of the conductive particles 600 is 2.2um, the distance from the conductive portion to the transparent conductive layer 300 is 2.0um, that is, the height of the frame glue 500 is 2.0um, and in addition, the width of the frame glue 500 is 500um, so it can be known that more conductive particles 600 are arranged in a range of 500um width, and the conductive performance can be further improved under the conductive effect of more conductive particles 600.
In addition, the width of the frame adhesive 500 is in a range of 200um to 800um, for example, when the width of the frame adhesive 500 is 200um, the diameter of the conductive particles 600 is 2.0um, and the number of the conductive particles 600 arranged in a tiled manner may be 100, and when the width of the frame adhesive 500 is 800um, the diameter of the conductive particles 600 is 2.0um, and the number of the conductive particles 600 arranged in a tiled manner may be 400.
In one embodiment, the sealant 500 is an Epoxy Resin Adhesive (Epoxy Resin Adhesive) made of an Epoxy Resin as a main component, and the Epoxy Resin Adhesive is colorless and transparent, and can be cured at room temperature after the liquid crystal layer 400 is sealed, so as to ensure sealing tightness.
In one embodiment, the transparent conductive layer 300 is provided with a transparent glass plate 700 on a side facing away from the liquid crystal layer 400, and the transparent conductive layer 300 is an indium tin oxide layer, wherein the indium tin oxide layer is an existing material, and the indium tin oxide layer is plated on the lower surface of the transparent glass plate 700 by a film plating method, and the transparent glass plate 700 also plays a role in supporting and protecting the liquid crystal layer 400 and the chip 200, so as to prevent the liquid crystal layer 400 and the chip 200 from being damaged by an external force.
The utility model also provides a projector, projector include shell and projection display chip packaging structure, and projection display chip packaging structure sets up in the shell, wherein projection display chip packaging structure includes: the liquid crystal display panel comprises a circuit board 100, a chip 200, a transparent conductive layer 300, a liquid crystal layer 400, a frame glue 500 and conductive particles 600.
The circuit board 100 has a circuit laid on one side or both sides of the surface thereof for mounting various electronic components such as resistors, capacitors, etc., the chip 200 is soldered to the circuit board 100 on the side having the circuit laid, i.e., the mounting surface 110 of the circuit board 100 is provided with the chip 200, and the chip 200 and the circuit board 100 are electrically connected.
The transparent conductive layer 300 is arranged on the side of the chip 200 opposite to the circuit board 100, and a liquid crystal layer 400 is arranged between the chip 200 and the transparent conductive layer 300; the transparent conductive layer 300 functions as a common electrode, discharges a voltage, and the liquid crystal in the liquid crystal layer 400 changes an alignment manner according to the voltage of the common electrode.
Projection display's kind is more, explain with LCOS projection display as an example, light is incident through transparent conducting layer 300, in the liquid crystal layer 400, chip 200 is through controlling voltage in the transparent conducting layer 300, realize the rearrangement of liquid crystal body molecule in the liquid crystal layer 400, realize the reflection of light, accomplish projection display, it is circuit board 100 through conductive silver thick liquid lug connection transparent conducting layer 300 among the prior art, for the power supply of common electrode, but it is complicated to adopt conductive silver thick liquid technology, and the composition proportion of silver among the conductive silver thick liquid influences electric conductive property greatly, if the proportion of silver is lower, lead to contact failure.
Since the liquid crystal in the liquid crystal layer 400 has a certain fluidity, the liquid crystal needs to be sealed, and the sealant 500 is disposed around the liquid crystal layer 400 in a sealing manner, so that the liquid crystal is prevented from flowing out.
The conductive particles 600 are disposed inside the sealant 500, and the conductive particles 600 directly transmit the electric power in the circuit board 100 to the transparent conductive layer 300, so as to avoid the conductive silver paste process and save the process steps.
In the technical scheme of this embodiment, the chip 200 is mounted on the mounting surface 110 of the circuit board 100, the circuit board 100 supplies power to the transparent conductive layer 300 as a power source, the conductive particles 600 are arranged in the frame adhesive 500 for sealing the liquid crystal layer 400, and the electric power in the circuit board 100 is transmitted to the transparent conductive layer 300 through the conductive performance of the conductive particles 600, so that the adoption of a conductive silver paste manner is avoided, the packaging process steps are reduced, the packaging structure is simplified, and the packaging efficiency is improved.
The above is only the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all of which are in the utility model discloses a conceive, utilize the equivalent structure transform that the content of the specification and the attached drawings did, or directly/indirectly use all to include in other relevant technical fields the patent protection scope of the present invention.
Claims (10)
1. A projection display chip package structure, comprising:
the chip is arranged on the mounting surface of the circuit board;
the transparent conducting layer is arranged on one side, back to the circuit board, of the chip, and a liquid crystal layer is arranged between the chip and the transparent conducting layer;
the frame glue is arranged on the periphery of the liquid crystal layer in a sealing manner;
and the conductive particles are arranged inside the frame glue.
2. The packaging structure of claim 1, wherein a conductive portion is disposed at a position of the chip corresponding to the sealant of the frame adhesive, the conductive particles abut against the transparent conductive layer and the conductive portion, and the conductive portion is electrically connected to the circuit board.
3. The projection display chip package structure of claim 2, wherein opposite sides of the conductive particles are respectively abuttable against the transparent conductive layer and the conductive portion to deform the conductive particles.
4. The projection display chip package structure of claim 2, wherein the conductive particles are spherical structures.
5. The projection display chip package structure of claim 4, wherein the diameter of the conductive particles is larger than the distance between the conductive portion and the transparent conductive layer.
6. The packaging structure of claim 1, wherein the conductive particles are made of gold.
7. The packaging structure of claim 2, wherein a plurality of conductive particles are laid in a plane parallel to the transparent conductive layer in the frame adhesive, and the plurality of conductive particles are abutted against the transparent conductive layer and the conductive portion.
8. The packaging structure of any one of claims 1 to 7, wherein the frame glue is an epoxy glue.
9. The packaging structure of claim 1, wherein a transparent glass plate is disposed on the transparent conductive layer opposite to the liquid crystal layer, and the transparent conductive layer is an indium tin oxide layer.
10. A projector comprising a housing and a projection display chip package structure according to any one of claims 1 to 9, wherein the projection display chip package structure is disposed in the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921758586.2U CN210837716U (en) | 2019-10-17 | 2019-10-17 | Projection display chip packaging structure and projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921758586.2U CN210837716U (en) | 2019-10-17 | 2019-10-17 | Projection display chip packaging structure and projector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210837716U true CN210837716U (en) | 2020-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921758586.2U Active CN210837716U (en) | 2019-10-17 | 2019-10-17 | Projection display chip packaging structure and projector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210837716U (en) |
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2019
- 2019-10-17 CN CN201921758586.2U patent/CN210837716U/en active Active
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