CN213403620U - Corrosion-resistant and oxidation-resistant circuit board - Google Patents
Corrosion-resistant and oxidation-resistant circuit board Download PDFInfo
- Publication number
- CN213403620U CN213403620U CN202022398001.XU CN202022398001U CN213403620U CN 213403620 U CN213403620 U CN 213403620U CN 202022398001 U CN202022398001 U CN 202022398001U CN 213403620 U CN213403620 U CN 213403620U
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- Prior art keywords
- layer
- corrosion
- circuit board
- heat
- resistant
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- 238000005260 corrosion Methods 0.000 title claims abstract description 65
- 230000003647 oxidation Effects 0.000 title claims description 8
- 238000007254 oxidation reaction Methods 0.000 title claims description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 38
- 238000000576 coating method Methods 0.000 claims abstract description 38
- 239000005011 phenolic resin Substances 0.000 claims abstract description 15
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 15
- NBVXSUQYWXRMNV-UHFFFAOYSA-N Fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 239000011153 ceramic matrix composite Substances 0.000 claims abstract description 11
- 230000003014 reinforcing Effects 0.000 claims description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000002241 glass-ceramic Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 230000003078 antioxidant Effects 0.000 abstract description 4
- 239000003963 antioxidant agent Substances 0.000 abstract description 4
- 235000006708 antioxidants Nutrition 0.000 abstract description 4
- 239000004698 Polyethylene (PE) Substances 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000002349 favourable Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 210000003666 Nerve Fibers, Myelinated Anatomy 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002035 prolonged Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model discloses a corrosion-resistant anti-oxidant circuit board, comprising a base layer, the top of basic unit bonds there is the enhancement layer, the top coating of enhancement layer has first anti-corrosion coating, first anti-corrosion coating includes ceramic matrix composite coating and phenolic resin layer, the bottom of basic unit bonds there is the heat-conducting layer, and the bottom of heat-conducting layer bonds there is the heat-conducting plate layer, be provided with the second anti-corrosion coating between the top of heat-conducting plate layer and the surface of heat-conducting layer. The utility model discloses a under the effect of mutually supporting between first anti-corrosion coating, ceramic matrix composite coating, phenolic resin layer, second anti-corrosion coating and fluorocarbon resin layer and the PE rete, very big improvement the corrosion resisting property of this circuit board, and then the effectual life who improves this circuit board, it is relatively poor to have solved the corrosion protection of current circuit board, and then the life that leads to the circuit board reduces, can not satisfy the problem of people's user demand.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a corrosion-resistant anti-oxidant circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, the PCB board, aluminium base board, the high frequency board, thick copper board, the impedance board, PCB, ultra-thin circuit board, printing (copper etching technique) circuit board etc. the circuit board makes the circuit miniaturation, the intuitionistic, play an important role with electrical apparatus overall arrangement to fixed circuit's batch production and optimization, however, the corrosion resistance of current circuit board is relatively poor, and then the life that leads to the circuit board reduces, can't satisfy people's user demand.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a corrosion-resistant anti-oxidant circuit board possesses corrosion-resistant effectual advantage, and it is relatively poor to have solved the corrosion resistance of current circuit board, and then leads to the life of circuit board to reduce, can not satisfy people's user demand's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a corrosion-resistant anti-oxidant circuit board, includes the basic unit, the top of basic unit bonds and has the enhancement layer, the top coating of enhancement layer has first anti-corrosion coating, first anti-corrosion coating includes ceramic matrix composite coating and phenolic resin layer, the bottom of basic unit bonds and has the heat-conducting layer, and the bottom of heat-conducting layer bonds and has the heat-conducting plate layer, be provided with second anti-corrosion coating between the top of heat-conducting plate layer and the surface of heat-conducting layer, second anti-corrosion coating includes fluorocarbon resin layer and PE rete.
Preferably, the reinforcing layer is formed by interweaving glass fibers and ceramic fibers in a warp-weft mode.
Preferably, the bottom of the phenolic resin layer is coated on the top of the reinforcing layer, and the bottom of the ceramic matrix composite coating is coated on the top of the phenolic resin layer.
Preferably, the top of the fluorocarbon resin layer is coated on the surface of the heat conducting layer, the top of the PE film layer is bonded to the bottom of the fluorocarbon resin layer, and the bottom of the PE film layer is bonded to the surface of the heat conducting plate layer.
Preferably, the heat conducting layer is made of heat conducting silicone rubber, and the heat conducting plate layer is made of aluminum alloy.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a setting of first anti-corrosion coating, because ceramic matrix composite coating and phenolic resin layer in the first anti-corrosion coating all possess splendid corrosion resistance and waterproof performance, and then can form splendid double-deck anticorrosion sealing effect at the top of this circuit board, ceramic matrix composite coating possesses splendid wear resistance simultaneously, the effectual loss that reduces first anti-corrosion coating and receive the friction and cause, simultaneously through the setting of second anti-corrosion coating, because fluorocarbon resin layer and PE rete in the second anti-corrosion coating all possess good corrosion resistance and waterproof performance, and then can form good anticorrosion sealing effect at the bottom of this circuit board, under the effect of whole cooperation, the anticorrosion performance of this circuit board has greatly been improved, and then the life of this circuit board has effectively been improved, the corrosion protection nature of having solved current circuit board is relatively poor, thereby reducing the service life of the circuit board and failing to meet the use requirements of people.
2. The utility model discloses a setting of enhancement layer, the effectual performance that has improved this circuit board bending resistance, through the setting of heat-conducting layer and heat conduction sheet layer, be favorable to the quick heat of this circuit board inside to the external world to conduct, the effectual heat dispersion that improves this circuit board.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a first corrosion protection layer according to the present invention;
fig. 3 is a schematic structural view of a second anti-corrosion layer according to the present invention.
In the figure: 1. a first anti-corrosion layer; 11. a ceramic matrix composite coating; 12. a phenolic resin layer; 2. a reinforcing layer; 3. a base layer; 4. a heat conductive layer; 5. a second anti-corrosion layer; 51. a fluorocarbon resin layer; 52. a PE film layer; 6. a heat conducting plate layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1-3, a corrosion-resistant and oxidation-resistant circuit board comprises a base layer 3, a reinforcing layer 2 is bonded on the top of the base layer 3, the bending resistance of the circuit board is effectively improved by the arrangement of the reinforcing layer 2, the reinforcing layer 2 is formed by interweaving glass fibers and ceramic fibers, a first anti-corrosion layer 1 is coated on the top of the reinforcing layer 2, the first anti-corrosion layer 1 comprises a ceramic-based composite coating 11 and a phenolic resin layer 12, the bottom of the phenolic resin layer 12 is coated on the top of the reinforcing layer 2, the bottom of the ceramic-based composite coating 11 is coated on the top of the phenolic resin layer 12, a heat conduction layer 4 is bonded on the bottom of the base layer 3, a heat conduction plate layer 6 is bonded on the bottom of the heat conduction layer 4, the heat inside the circuit board is rapidly conducted to the outside by the arrangement of the heat conduction layer, the material of the heat conduction layer 4 comprises heat conduction silicone adhesive, the material of the heat conduction plate layer 6 comprises aluminum alloy, a second anti-corrosion layer 5 is arranged between the top of the heat conduction plate layer 6 and the surface of the heat conduction layer 4, the second anti-corrosion layer 5 comprises a fluorocarbon resin layer 51 and a PE (polyethylene) film layer 52, the top of the fluorocarbon resin layer 51 is coated on the surface of the heat conduction layer 4, the top of the PE film layer 52 is adhered to the bottom of the fluorocarbon resin layer 51, the bottom of the PE film layer 52 is adhered to the surface of the heat conduction plate layer 6, through the arrangement of the first anti-corrosion layer 1, because the ceramic-based composite coating 11 and the phenolic resin layer 12 in the first anti-corrosion layer 1 both have excellent corrosion resistance and waterproof performance, further, an excellent double-layer anti-corrosion sealing effect can be formed at the top of the circuit board, meanwhile, the ceramic-based composite coating 11 has excellent wear resistance, the loss caused by, simultaneously through the setting of second anti-corrosion coating 5, because fluorocarbon resin layer 51 and PE rete 52 in the second anti-corrosion coating 5 all possess good corrosion-resistant and waterproof performance, and then can form good anticorrosion sealed effect in the bottom of this circuit board, under whole complex effect, very big improvement the corrosion resisting property of this circuit board, and then the effectual life who improves this circuit board, it is relatively poor to have solved the corrosion protection of current circuit board, and then lead to the life of circuit board to reduce, the problem that people's user demand can not be satisfied.
The standard parts used in this document are commercially available, all the components in this document are customized according to the description of the specification and the drawings, and the connection relationship and specific structure between the layers in this document are all performed by the prior art, such as by mechanical methods, by adhesives, by various welding methods (such as thermal welding, ultrasonic welding, flux, welding, and fusion welding), and no specific description is made here.
When in use, through the arrangement of the first anti-corrosion layer 1, because the ceramic matrix composite coating 11 and the phenolic resin layer 12 in the first anti-corrosion layer 1 both have excellent corrosion resistance and waterproof performance, and further can form an excellent double-layer anti-corrosion sealing effect on the top of the circuit board, and simultaneously the ceramic matrix composite coating 11 has excellent wear resistance, the loss caused by friction of the first anti-corrosion layer 1 is effectively reduced, and simultaneously through the arrangement of the second anti-corrosion layer 5, because the fluorocarbon resin layer 51 and the PE film layer 52 in the second anti-corrosion layer 5 both have excellent corrosion resistance and waterproof performance, and further can form an excellent anti-corrosion sealing effect on the bottom of the circuit board, under the action of integral cooperation, the anti-corrosion performance of the circuit board is greatly improved, and further the service life of the circuit board is effectively prolonged, through the arrangement of the reinforcing layer 2, the effectual performance that has improved this circuit board bending resistance, through heat-conducting layer 4 and heat conduction plate layer 6's setting, be favorable to the quick outside conduction of the inside heat of this circuit board, the effectual heat dispersion that improves this circuit board.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A corrosion-resistant oxidation-resistant circuit board comprises a base layer (3), and is characterized in that: the top of basic unit (3) bonds and has enhancement layer (2), the top coating of enhancement layer (2) has first anti-corrosion coating (1), first anti-corrosion coating (1) includes ceramic matrix composite coating (11) and phenolic resin layer (12), the bottom of basic unit (3) bonds and has heat-conducting layer (4), and the bottom of heat-conducting layer (4) bonds and has heat conduction sheet layer (6), be provided with second anti-corrosion coating (5) between the top of heat conduction sheet layer (6) and the surface of heat-conducting layer (4), second anti-corrosion coating (5) include fluorocarbon resin layer (51) and PE rete (52).
2. The corrosion-resistant and oxidation-resistant circuit board according to claim 1, wherein: the reinforcing layer (2) is formed by interweaving glass fibers and ceramic fibers in a warp-weft mode.
3. The corrosion-resistant and oxidation-resistant circuit board according to claim 1, wherein: the bottom of the phenolic resin layer (12) is coated on the top of the reinforcing layer (2), and the bottom of the ceramic matrix composite coating (11) is coated on the top of the phenolic resin layer (12).
4. The corrosion-resistant and oxidation-resistant circuit board according to claim 1, wherein: the top of fluorocarbon resin layer (51) coats in the surface of heat-conducting layer (4), the bottom of fluorocarbon resin layer (51) is bonded to the top of PE rete (52), the surface of heat-conducting plate layer (6) is bonded to the bottom of PE rete (52).
5. The corrosion-resistant and oxidation-resistant circuit board according to claim 1, wherein: the heat conducting layer (4) is made of heat conducting silicone rubber, and the heat conducting plate layer (6) is made of aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022398001.XU CN213403620U (en) | 2020-10-23 | 2020-10-23 | Corrosion-resistant and oxidation-resistant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022398001.XU CN213403620U (en) | 2020-10-23 | 2020-10-23 | Corrosion-resistant and oxidation-resistant circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213403620U true CN213403620U (en) | 2021-06-08 |
Family
ID=76190502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022398001.XU Active CN213403620U (en) | 2020-10-23 | 2020-10-23 | Corrosion-resistant and oxidation-resistant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213403620U (en) |
-
2020
- 2020-10-23 CN CN202022398001.XU patent/CN213403620U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |