201032998 六、發明說明： 本申請案係主張2009年3月12曰所提申之韓國專利申 請案號10-2009-0021227的優先權，其標題為「銅箔基板及 其製法」’其内容皆併於本申請案以作整體參酌。 【發明所屬之技術領域】 本發明係關於一種銅箔基板及其製法，尤指一種可將 玻璃纖維導致異質物生成之可能降至最低之銅箔基板及其 製法。 【先前技術】 典型上’鋼箔基板係作為半導體封裝或印刷電路板之 基材，其係由絕緣材料，如聚亞酿胺或FR4 (财熱玻璃纖 維及環氧樹脂基板）’及黏著於該絕緣材料一側或兩側之銅 薄膜所構成。 圖1係習知雙側銅笛基板之剖視圖。 如圖1所示，該習知雙側銅箔基板10包括：_預浸 材16,其係由填充有樹脂12之玻璃纖維14所構成；及銅 薄層18a、18b ’其係黏附於預浸材16之兩側。 於本文中’雖然樹脂12(為銅箔基板之基本材料）具有 優異之電性，但其有機械強度不足，且其尺寸隨溫度變化 係為金屬尺寸變化之10倍大等缺點。據此，為了確保印 刷電路板所需之基本特性（電性絕緣' 高機械強度與硬度、 及尺寸穩定性），故使用玻璃纖維14 (藉由編織短纖維捆而 201032998 製得’每一纖維直徑為5 - 9 g m)作為強化成分。 圖2係習知雙侧銅箔基板之製作流程示意圖。 如圖2所示，該習知雙側銅箔基板1〇之製作方式為： 製備一個以上預浸材16，其中每一預浸材係由填充有樹脂 12之玻璃纖維14所構成；將兩銅薄層iga、設置於預 浸材16之最外兩側；而後進行壓合。 然而’該習知雙側銅猪基板1 〇卻有「由銅箱基板1 〇 鲁 側表面顯露之玻璃纖維14受損而產生異質物」之問題， 且移除受損玻璃纖維14之玻璃區域處會再黏附其他異質 物，如此將會接連導致瑕疵發生。尤其是，於除渣步驟中 (對銅猪基板進行表面粗糙化’以改善銅箔基板之銅薄層 18a、18b與設置於銅薄層i8a、18b上之絕緣層間的黏著 力）’由銅箔基板側表面顯露之玻璃纖維14會有受損及剝 離的問題’因而會產生異質物。 此外，由於近來印刷電路板微型化及高積集化之趨 勢，故異質物將對印刷電路板及封裝基板（其中包括有印刷 ® 電路板）之可靠度及產量造成重大的影響。基於此原因，急 需發展一種可將異質物降至最少之銅箔基板（為製備印刷 電路板所需之基材），及其製備方法。 【發明内容】 據此，鑑於相關領域所發生之上述問題，本發明提供 一種銅箔基板及其製備方法，俾能將玻璃纖維由銅猪基板 側表面顯露而導致異質物生成之可能降至最低。 5 201032998 於一態樣中，本發明提供一種銅箔基板，其包括：一 預浸材，其係由填充有第一樹脂之玻璃纖維所構成；第二 樹脂，其係形成於該預浸材之兩側表面；以及一銅薄層， 其係形成於包括第二樹脂之該預浸材之至少一側上。 該預浸材可填充有有機或無機填充料。 該第一及第二樹脂可為環氧樹脂、聚亞醯胺樹脂、或 雙馬來酿亞胺樹脂（bismaleimide resin)。 預浸材之通孔區可包括不含玻璃纖維之第三樹脂。 於另一態樣中，本發明提供一種銅箔基板之製法，其 包括：（A)製備一預浸材，其係由填充有第一樹脂之玻璃纖 維所構成；（B)接著將第二樹脂及銅薄層設置於該預浸材之 至少一側上，其中該第二樹脂具有與預浸材相同尺寸之開 口，而該銅薄層之尺寸足以完全覆蓋預浸材及第二樹脂； 以及（C)壓合該預浸材、第二樹脂及銅薄層，以形成薄板。 該預浸材可填充有有機或無基填充料。 該第一及第二樹脂可為環氧樹脂、聚亞醯胺樹脂、或 雙馬來酿亞胺樹脂（bismaleimide resin)。 預浸材之通孔區（via region)可包括不含玻璃纖維之第 三樹脂。 【實施方式】 藉由以下具體實施例之詳細敘述及隨附圖式，可更加 清楚瞭解本發明之各種目的、特徵及優點。 201032998 使用於本案說明書及申請專利範圍之術語及用詞不應 2般或子典中之字義’而應根據發明者藉由該術語 來適《疋義其概念之原則’來解釋本發明技術領域之意義 與概办，以描述其所知實施本發明之最佳方法。 於下述詳細描述中，應注意的是，「第一」及「第二」 其類似用s5]並非指特定數量順序或含義其僅是用來 «表不同組成元件。此外’關於參考符號，應注意的是， φ 使用於所有不同圖式中的相同參考符號係指相同或相似元 件另外，於本發明敘述中，不再贅述相關領域已知技術， 以免模糊本發明之特點。 參考隨附圖式’下文將更加詳細敘述本發明之具體實 施例。 圖3係本發明一具體實施例之銅箔基板剖視圖。參考隨 附圖式’下文將詳述本實施例之銅箔基板1〇〇&。 如圖3所示，本實施例之銅箔基板1〇〇&包括：一預浸材 • 1 〇6，其係由填充有第一樹脂丨〇2a之玻璃纖維i 所構成； 第二樹脂102b，其係形成於預浸材106之兩側表面區B上， 且不含玻璃纖維；以及銅薄層108a、l〇8b，其係形成於包 3該第一樹脂102b之預浸材106之一側或兩側上。 於本文中’該第二樹脂l〇2b不含玻璃纖維，且注滿預 浸材106。因此’藉由不含玻璃纖維之第二樹脂⑺儿，包含 於預浸材區A中之玻璃纖維104將不會顯露於外，故可將異 質物生成之可能降至最低。 7 201032998 玻璃纖維10 4係確保印刷電路板基本特性（電性絕緣、 高機械強度與硬度、及尺寸穩定性）之成分。據此，由於不 含玻璃纖維107之第二樹脂102b對印刷電路板100a可靠度 會有不利之影響，故形成第二樹脂l〇2b之側表面區域B可作 為製成印刷電路板之空瞻區或單離（singulation)區。 第一及第二樹脂可為一般用於製作銅箔基板之絕緣材 料，如環氧樹脂、聚亞醯胺樹脂、或雙馬來醯亞胺樹脂 (bismaleimide resin) 〇 除了玻璃纖維104外，預浸材106更可包括有機填充料 或無機填充料，以作為強化材料。 雖然圖3繪示之雙側銅箔基板100a包括：預浸材106 ; 第二樹脂102b ;及銅薄層108a，108b，設置於包含第二樹脂 102b之預浸材106之兩側上，但應了解的是，本發明範疇亦 應包括另一銅箔基板，其係包括：預浸材106;第二樹脂 102b ;及銅薄層108a、108b，僅設置於包含第二樹脂102b 之預浸材106之一側上。 圖4係另一銅箔基板剖視圖，其係圖3所示之實施例的 修飾。參考隨附圖式，下文將詳述本實施例之修飾後之銅 箔基板100b。 如圖4所示，除了藉由不含玻璃纖維之第三樹脂102c 形成預浸材106之通孔區V外，該修飾後之銅箔基板100b大 致結構與圖3所示之銅箔基板相同。 更具體地說，藉由不含玻璃纖維之第三樹脂102c，形 成預浸材106之通孔區（通孔係透過後續之機械鑽孔或雷射 201032998 鑽孔步驟形成），藉此可避免後續形成通孔步驟中玻璃纖維 104顯露於外之問題。 據此’由第三樹脂l〇2c所形成之每一通孔區v尺寸可大 於對應之通孔尺寸，俾使玻璃纖維1〇4不會透過通孔而顯 露。 圖5係顯示本發明一實施例之銅箔基板製程放大示意 圖。參考隨附圖式，下文將詳述本發明一實施例之銅箔基 板製作方法。 如圖5所示，該實施例之銅箔基板1〇〇3製備方法為：首 先，提供預浸材106，其係由填充有第一樹脂1〇2a之玻璃纖 維104所構成；將含有開口之第二樹脂1〇2b (其開口尺寸與 預浸材106相同，且不含玻璃纖維）及銅薄層1〇8a、1〇8b(其 大小可完成覆蓋預浸材106及第二樹脂1 〇2b)設置於預浸材 106之一侧或兩側；而後，於預定溫度及壓力下，進行壓合。 換言之，本實施例之銅箔基板1〇〇a係藉由簡單製程製 備，其步驟大致與習知步驟相同，惟不同處在於，加熱第 一樹脂102b (其面積大於預浸材丨〇6),以軟化開口區，並與 預浸材106麼合。 此外，未繪示於圖5，本發明修飾後之銅箔基板l〇〇b 製作方法為：首先，提供預浸材1〇6(係由填充有第一樹脂 102a之玻璃纖維1 〇4所構成，且具有對應通孔區v之第一開 口）’將第二樹脂l〇2b (包括第二開口，除了第一開口外， 第一開孔尺寸與預浸材相同1〇6，且不包含玻璃纖維）及銅 薄層l〇8a、1_ (其大小可完成覆蓋醫材丨黯第二樹脂 9 201032998 102b)設置於預浸材106之一側或兩侧；再於預定溫度及壓 力下進行壓合。 如上所述，於本發明之銅箔基板及其製備方法中，由 於不含玻璃纖維之第二樹脂形成於銅箔基板之兩側表面 區，故可將玻璃纖維顯露導致異質物生成之可能降至最低。 此外’於本發明之銅箔基板及其製備方法中，由於不 含玻璃纖維之第三樹脂形成於預浸材之通孔區，故可將通 孔製作時玻璃纖維外露導致異質物生成之可能降至最低。 另外，於本發明中，可簡單製得雙側銅箔基板，其中 該雙側銅箔基板包括：第二樹酯所形成之側表面區，及第 三樹脂所形成之通孔區。 雖然為了描述目的而揭露本發明較佳實施例，但本領 域熟悉技術之人士皆可知悉各種可能之修飾、添加及置 換’其皆未恃離如隨附申請專利範圍所述之本發明範_及 精神。據此，應可瞭解的是，各種修飾、添加及置換皆落 於本發明之範疇中。 【圖式簡單說明】 參考隨附圖式’下述詳細描述將使本發明之上述及其他目 的、特徵及優點更加清楚。 圖1係習知雙側銅箔基板之剖視圖。 圓2係習知雙側銅箔基板之製作流程示意圖。 圖3係本發明一具體實施例之銅箔基板剖視圖。 圖4係修飾圖3所示之實施例後之銅箔基板剖視圖。 201032998 圖5係本發明一實施例之銅箔基板製程放大示意圖。 【主要元件符號說明】 10 雙側銅箔基板12 樹脂 14, 104 玻璃纖維 16, 106 預浸材 18a, 18b, 108a, 108b 銅薄層 100a, 100b 銅箔基板 102a 第一樹脂 102b 第一樹月旨 102c 第三樹脂 A 預浸材區 B 兩側表面區 V 通孔區201032998 VI. The invention is based on the priority of Korean Patent Application No. 10-2009-0021227, filed on March 12, 2009, entitled "copper foil substrate and its preparation method" And in this application for the overall consideration. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper foil substrate and a method for producing the same, and more particularly to a copper foil substrate which can minimize the possibility of formation of foreign matter by glass fibers and a method for producing the same. [Prior Art] Typically, a steel foil substrate is used as a substrate for a semiconductor package or a printed circuit board, which is made of an insulating material such as polyacrylamide or FR4 (Fuel Glass Fiber and Epoxy Substrate) and adhered thereto. The copper material is formed on one side or both sides of the insulating material. 1 is a cross-sectional view of a conventional two-sided copper whistle substrate. As shown in FIG. 1, the conventional double-sided copper foil substrate 10 includes: a prepreg 16 which is composed of glass fibers 14 filled with a resin 12; and a copper thin layer 18a, 18b which is adhered to the pre-preg Both sides of the dip material 16. Herein, although the resin 12 (which is a basic material of a copper foil substrate) has excellent electrical properties, it has insufficient mechanical strength, and its dimensional change with temperature is a disadvantage of 10 times the change in metal size. Accordingly, in order to ensure the basic characteristics (electrical insulation 'high mechanical strength and hardness, and dimensional stability) required for the printed circuit board, the glass fiber 14 (made of woven short fiber bundles and 201032998) is used for each fiber. The diameter is 5 - 9 gm) as a strengthening component. 2 is a schematic view showing the manufacturing process of a conventional double-sided copper foil substrate. As shown in FIG. 2, the conventional double-sided copper foil substrate 1 is manufactured by: preparing one or more prepregs 16, wherein each prepreg is composed of glass fibers 14 filled with a resin 12; A thin layer of copper iga is disposed on the outermost sides of the prepreg 16 and then pressed. However, the conventional double-sided copper pig substrate 1 has the problem of "damage of the glass fiber 14 exposed by the surface of the copper plate substrate 1 and the foreign matter is generated", and the glass region of the damaged glass fiber 14 is removed. Other heterogeneous substances will adhere to the site, which will cause sputum to occur in succession. In particular, in the slag removal step (surface roughening of the copper pig substrate 'to improve the adhesion between the copper thin layers 18a, 18b of the copper foil substrate and the insulating layers provided on the copper thin layers i8a, 18b) The glass fiber 14 exposed on the side surface of the foil substrate has a problem of damage and peeling, and thus a foreign matter is generated. In addition, due to the recent miniaturization and high integration of printed circuit boards, foreign matter will have a significant impact on the reliability and yield of printed circuit boards and package substrates, including printed ® boards. For this reason, there is an urgent need to develop a copper foil substrate (a substrate required for preparing a printed circuit board) which can minimize foreign matter, and a preparation method thereof. SUMMARY OF THE INVENTION Accordingly, in view of the above problems occurring in the related art, the present invention provides a copper foil substrate and a method for preparing the same, which can minimize the possibility that the glass fiber is exposed from the side surface of the copper pig substrate to cause generation of foreign matter. . 5 201032998 In one aspect, the present invention provides a copper foil substrate comprising: a prepreg composed of glass fibers filled with a first resin; and a second resin formed on the prepreg Both sides of the surface; and a thin layer of copper formed on at least one side of the prepreg including the second resin. The prepreg can be filled with an organic or inorganic filler. The first and second resins may be an epoxy resin, a polyimide resin, or a bismaleimide resin. The through-hole region of the prepreg may include a third resin that does not contain glass fibers. In another aspect, the invention provides a method for preparing a copper foil substrate, comprising: (A) preparing a prepreg composed of glass fibers filled with a first resin; (B) then second a resin and a thin layer of copper disposed on at least one side of the prepreg, wherein the second resin has an opening of the same size as the prepreg, and the copper layer is of a size sufficient to completely cover the prepreg and the second resin; And (C) pressing the prepreg, the second resin, and the copper thin layer to form a thin plate. The prepreg can be filled with an organic or non-based filler. The first and second resins may be an epoxy resin, a polyimide resin, or a bismaleimide resin. The via region of the prepreg may include a third resin that does not contain glass fibers. The various objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims. 201032998 The terms and words used in the present specification and the scope of the patent application should not be used in the general term or in the sub-laws. The technical field of the present invention should be interpreted according to the inventor's application of the term to the principle of the concept. The meaning and generality of the present invention are described to describe the best methods for carrying out the invention. In the following detailed description, it should be noted that the "first" and "second" similar uses of s5] do not refer to a specific order of quantity or meaning that they are only used to «table different components. In addition, with regard to the reference symbols, it should be noted that the same reference numerals are used for the same or similar elements in all the different drawings. In addition, in the description of the present invention, the related art in the related art will not be described again, so as not to obscure the present invention. The characteristics. Specific embodiments of the invention are described in more detail below with reference to the accompanying drawings. Figure 3 is a cross-sectional view of a copper foil substrate in accordance with an embodiment of the present invention. The copper foil substrate 1 〇〇 & of the present embodiment will be described in detail below with reference to the accompanying drawings. As shown in FIG. 3, the copper foil substrate 1A of the present embodiment includes: a prepreg material; 1 〇6, which is composed of a glass fiber i filled with a first resin 丨〇 2a; 102b, which is formed on both side surface regions B of the prepreg 106 and does not contain glass fibers; and a copper thin layer 108a, 108b formed on the prepreg 106 of the first resin 102b of the package 3. On one side or on both sides. Herein, the second resin 10b contains no glass fibers and is filled with the prepreg 106. Therefore, by the second resin (7) containing no glass fibers, the glass fibers 104 contained in the prepreg region A will not be exposed, so that the possibility of generation of foreign matter can be minimized. 7 201032998 Fiberglass 10 4 is a component that ensures the basic characteristics of printed circuit boards (electrical insulation, high mechanical strength and hardness, and dimensional stability). Accordingly, since the second resin 102b containing no glass fiber 107 adversely affects the reliability of the printed circuit board 100a, the side surface area B of the second resin 102b can be formed as an open view of the printed circuit board. Zone or singulation zone. The first and second resins may be insulating materials generally used for making copper foil substrates, such as epoxy resin, polyamidamine resin, or bismaleimide resin, in addition to glass fiber 104, The dipping material 106 may further comprise an organic filler or an inorganic filler as a reinforcing material. Although the double-sided copper foil substrate 100a illustrated in FIG. 3 includes: a prepreg 106; a second resin 102b; and a copper thin layer 108a, 108b disposed on both sides of the prepreg 106 including the second resin 102b, but It should be understood that the scope of the present invention should also include another copper foil substrate comprising: a prepreg 106; a second resin 102b; and a thin copper layer 108a, 108b disposed only in the prepreg comprising the second resin 102b. One side of the material 106. Figure 4 is a cross-sectional view of another copper foil substrate, which is a modification of the embodiment shown in Figure 3. Referring to the drawings, the modified copper foil substrate 100b of the present embodiment will be described in detail below. As shown in FIG. 4, the modified copper foil substrate 100b has the same general structure as the copper foil substrate shown in FIG. 3 except that the through-hole region V of the prepreg 106 is formed by the third resin 102c containing no glass fibers. . More specifically, the via hole region of the prepreg 106 is formed by the third resin 102c containing no glass fiber (the through hole is formed by a subsequent mechanical drilling or laser 201032998 drilling step), thereby avoiding The problem that the glass fiber 104 is exposed outside in the subsequent step of forming the through hole. Accordingly, the size of each of the via regions v formed by the third resin 10c can be larger than the corresponding via size, so that the glass fibers 1〇4 are not exposed through the via holes. Fig. 5 is a schematic enlarged plan view showing a process of a copper foil substrate according to an embodiment of the present invention. Referring to the drawings, a method of fabricating a copper foil substrate according to an embodiment of the present invention will be described in detail below. As shown in FIG. 5, the copper foil substrate 1〇〇3 of this embodiment is prepared by first providing a prepreg 106 composed of glass fibers 104 filled with a first resin 1〇2a; The second resin 1〇2b (having the same opening size as the prepreg 106 and containing no glass fiber) and the copper thin layer 1〇8a, 1〇8b (the size of which can cover the prepreg 106 and the second resin 1) 〇2b) is disposed on one side or both sides of the prepreg 106; and then, is pressed at a predetermined temperature and pressure. In other words, the copper foil substrate 1A of the present embodiment is prepared by a simple process, and the steps thereof are substantially the same as the conventional steps except that the first resin 102b is heated (the area is larger than the prepreg 丨〇6). To soften the open area and to match the prepreg 106. In addition, not shown in FIG. 5, the modified copper foil substrate 10b of the present invention is prepared by first providing a prepreg 1〇6 (by the glass fiber 1 〇4 filled with the first resin 102a). Constructing, and having a first opening corresponding to the through-hole region v), the second resin 10b (including the second opening, except for the first opening, the first opening size is the same as the prepreg 1〇6, and a glass fiber layer and a thin layer of copper 8a, 1_ (the size of which can cover the medical material, the second resin 9 201032998 102b) is disposed on one side or both sides of the prepreg 106; and then at a predetermined temperature and pressure Press fit. As described above, in the copper foil substrate of the present invention and the method for producing the same, since the second resin containing no glass fiber is formed on both side surface regions of the copper foil substrate, the glass fiber may be exposed to cause a possibility of generation of foreign matter. To the lowest. In addition, in the copper foil substrate of the present invention and the preparation method thereof, since the third resin containing no glass fiber is formed in the through hole region of the prepreg, the possibility of the formation of foreign matter may be caused by the exposure of the glass fiber during the production of the through hole. Minimized. Further, in the present invention, the double-sided copper foil substrate can be easily produced, wherein the double-sided copper foil substrate comprises a side surface region formed by the second resin and a via hole region formed by the third resin. Although the preferred embodiment of the present invention has been disclosed for the purpose of illustration, it will be understood by those skilled in the art that various modifications, additions and substitutions may be made without departing from the scope of the invention as set forth in the appended claims. And spirit. Accordingly, it should be understood that various modifications, additions and substitutions are within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent. 1 is a cross-sectional view of a conventional double-sided copper foil substrate. Circular 2 is a schematic diagram of the production process of a conventional double-sided copper foil substrate. Figure 3 is a cross-sectional view of a copper foil substrate in accordance with an embodiment of the present invention. Fig. 4 is a cross-sectional view showing the copper foil substrate after the embodiment shown in Fig. 3 is modified. 201032998 FIG. 5 is a schematic enlarged view showing the process of a copper foil substrate according to an embodiment of the present invention. [Main component symbol description] 10 Double-sided copper foil substrate 12 Resin 14, 104 Glass fiber 16, 106 Prepreg 18a, 18b, 108a, 108b Copper thin layer 100a, 100b Copper foil substrate 102a First resin 102b First tree month Purpose 102c Third resin A prepreg area B side surface area V through hole area