TWI554175B - Manufacturing method of copper clad laminate - Google Patents

Description

Copper foil substrate manufacturing method

This case is related to a method of manufacturing a copper foil substrate.

HDI (High Density Interconnect) is a high-density interconnect technology, which is one of the technologies used in printed circuit boards. HDI boards are mainly made with blind holes and buried holes. HDI boards are characterized by a high density of line distribution, but due to the increased line density, HDI boards are not able to form holes using conventional drilling methods, and non-mechanical drilling processes must be used. HDI boards can be used in smart phones, notebooks, tablets, digital cameras, automotive electronics, digital cameras and other electronic products.

The development trend of HDI boards is to develop in a thinner direction. When the thin substrate is used more and more frequently, if the HDI circuit board is still fabricated according to the existing single substrate, the circuit board will be easily damaged during the handling of the personnel. In addition, when the automation device is transmitting or manufacturing the circuit board, it is also easy to cause the card board or damage due to the thinness of the circuit board, thereby reducing the product yield. In addition, when the electroplating process is applied to the circuit board, the process capability is limited, and the opposite sides of the circuit board form a copper layer, and the copper layer cannot be formed only for the holed surface. Holes increase the cost of materials.

One aspect of the present invention is a method of fabricating a copper foil substrate.

According to an embodiment of the present invention, a method of fabricating a copper foil substrate includes the following steps. (a) pressing the first copper foil, the first support layer, the second copper foil, the third copper foil, the second support layer, and the fourth copper foil in this order. (b) forming a plurality of first blind holes and a plurality of second blind holes in the first support layer and the second support layer, respectively, such that a portion of the second copper foil and a portion of the third copper foil are exposed. (c) applying a plating treatment to the first copper foil, the bare second copper foil, the fourth copper foil, and the bare third copper foil such that the first copper foil and the bare second copper foil are covered by the first plating layer A first conductive layer is formed, and the fourth copper foil and the bare third copper foil are covered by the second plating layer to form a second conductive layer. (d) cutting the first conductive layer, the first support layer, the second support layer, and the second conductive layer outside the second copper foil and the third copper foil. (e) Separating the second copper foil from the third copper foil to form two copper foil substrates.

In one embodiment of the present invention, the method for fabricating the copper foil substrate further includes bonding the edge of the second copper foil to the edge of the third copper foil to make the first alignment hole of the second copper foil and the third copper foil The second alignment hole is aligned.

In one embodiment of the present invention, the method for fabricating the copper foil substrate further includes forming a through hole through the first copper foil, the first support layer, the second copper foil, the third copper foil, the second support layer, and the fourth copper foil. The axis of the perforation overlaps the axis of the first and second alignment holes.

In an embodiment of the invention, the first copper foil has a large area After the area of the first supporting layer, the area of the fourth copper foil is larger than the area of the second supporting layer, after the step (a), the manufacturing method further comprises cutting the first copper foil outside the first supporting layer and the second supporting The fourth copper foil on the outside of the layer.

In an embodiment of the invention, the first blind hole and the second blind hole are formed by laser.

In one embodiment of the present invention, the method for fabricating the copper foil substrate further includes cutting the first copper foil, the first support layer, the second support layer, and the fourth copper foil on the outer side of the second copper foil and the third copper foil. edge.

In an embodiment of the invention, the step (c) includes forming the first plating layer and the second plating layer in the first blind hole and the second blind hole, respectively.

In an embodiment of the invention, after the step (e), the method for fabricating the copper foil substrate further comprises: patterning the first conductive layer and the second copper foil of one of the copper foil substrates, and patterning the copper foil substrate The third copper foil and the second conductive layer.

In one embodiment of the present invention, the material of the first plating layer is the same as the material of the first copper foil, and the material of the second plating layer is the same as the material of the fourth copper foil.

In an embodiment of the invention, the material of the first support layer and the second support layer is glass fiber.

In the above embodiment of the present invention, the first copper foil, the bare second copper foil, the fourth copper foil, and the bare third copper foil may be simultaneously subjected to a plating treatment. In this way, the first copper foil and the bare second copper foil may be covered by the first plating layer to form a first conductive layer, and the fourth copper foil and the bare third copper foil may be covered by the second plating layer to form a second conductive layer together. Floor. After separating the second copper foil and the third copper foil, Two copper foil substrates can be formed. One of the copper foil substrates has a first conductive layer, a first support layer and a second copper foil, and the other copper foil substrate has a third copper foil, a second support layer and a second conductive layer. Therefore, the method for manufacturing the copper foil substrate of the present invention can increase the productivity and reduce the material cost of plating. In addition, the second copper foil and the third copper foil are unplated and are copper of the substrate, and have excellent etching uniformity in subsequent processes. Furthermore, the total thickness of the first copper foil, the first support layer, the second copper foil, the third copper foil, the second support layer and the fourth copper foil which are pressed together is thick, in addition to avoiding damage due to external force during handling. And in the production process, it is also less likely to be scrapped, thereby improving product yield.

100a, 100b‧‧‧ copper foil substrate

110‧‧‧First copper foil

112‧‧‧First plating

114‧‧‧First conductive layer

120‧‧‧First support layer

122‧‧‧First blind hole

130‧‧‧Second copper foil

132‧‧‧First registration hole

140‧‧‧third copper foil

142‧‧‧Second registration hole

150‧‧‧second support layer

152‧‧‧ second blind hole

160‧‧‧fourth copper foil

162‧‧‧Second plating

164‧‧‧Second conductive layer

170‧‧‧Viscos

180‧‧‧Perforation

L1-L1‧‧‧ line segment

L2-L2‧‧‧ line segment

S1~S5‧‧‧Steps

W‧‧‧Width

FIG. 1 is a flow chart showing a method of fabricating a copper foil substrate according to an embodiment of the present invention.

2 is a schematic view showing a first copper foil, a first supporting layer, a second copper foil, a third copper foil, a second supporting layer and a fourth copper foil pressed together according to an embodiment of the present invention.

Fig. 3 is a perspective view showing the second copper foil and the third copper foil of Fig. 2 before being bonded together.

FIG. 4 is a schematic view showing the first copper foil, the first supporting layer, the second copper foil, the third copper foil, the second supporting layer and the fourth copper foil in FIG. 2 being pressed together.

FIG. 5 is a schematic view showing the edge of the first copper foil, the first support layer, the second support layer and the fourth copper foil on the outer side of the second copper foil and the third copper foil in FIG. 4 .

FIG. 6 illustrates a first copper foil, a first support layer, and a second copper foil after the first support layer and the second support layer respectively form a plurality of first blind holes and a plurality of second blind holes. The third copper foil, the second supporting layer and the fourth copper foil are formed by perforation.

FIG. 7 is a schematic view showing the first copper foil, the bare second copper foil, the fourth copper foil and the bare third copper foil of FIG. 6 after being subjected to a plating treatment.

FIG. 8 is a schematic view showing the first conductive layer, the first supporting layer, the second supporting layer and the second conductive layer on the outside of the second copper foil and the third copper foil in FIG. 7 .

FIG. 9 is a schematic view showing the second copper foil of FIG. 8 separated from the third copper foil.

FIG. 10 is a schematic view showing the patterning of the first conductive layer, the second copper foil, the third copper foil and the second conductive layer in FIG. 9.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

FIG. 1 is a flow chart showing a method of fabricating a copper foil substrate according to an embodiment of the present invention. The method for producing a copper foil substrate includes the following steps. First, in step S1, the first copper foil, the first support layer, the second copper foil, the third copper foil, the second support layer, and the fourth copper foil are sequentially pressed. Next, in step S2, a plurality of first blind holes and a plurality of second blind holes are respectively formed on the first supporting layer and the first In the two supporting layers, a portion of the second copper foil and a portion of the third copper foil are exposed. Then in step S3, the first copper foil, the bare second copper foil, the fourth copper foil and the bare third copper foil are subjected to a plating treatment such that the first copper foil and the bare second copper foil are first The plating layer covers to form a first conductive layer, and the fourth copper foil and the bare third copper foil are covered by the second plating layer to form a second conductive layer. Next, in step S4, the first conductive layer, the first support layer, the second support layer, and the second conductive layer on the outside of the second copper foil and the third copper foil are cut away. Finally, in step S5, the second copper foil and the third copper foil are separated to form two copper foil substrates.

In the following description, each of the above steps will be described in detail.

2 is a view showing the first copper foil 110, the first support layer 120, the second copper foil 130, the third copper foil 140, and the second support layer 150 being pressed together with the fourth copper foil 160 according to an embodiment of the present invention. Schematic diagram. FIG. 3 is a perspective view showing the second copper foil 130 and the third copper foil 140 in the second drawing in advance. Referring to FIG. 2 and FIG. 3 simultaneously, the first copper foil 110, the first supporting layer 120, the second copper foil 130, the third copper foil 140, the second supporting layer 150 and the fourth copper foil 160 may be sequentially arranged. Thereafter, a first bonding process is performed to stack the first copper foil 110, the first supporting layer 120, the second copper foil 130, the third copper foil 140, the second supporting layer 150 and the fourth copper foil 160 into a mother having a large thickness. Board structure.

In the present embodiment, the material of the first support layer 120 and the second support layer 150 may be glass fiber, such as fiberglass cloth, but is not intended to limit the present invention. Further, the second copper foil 130 and the third copper foil 140 have substantially the same size, for example, both of 23.5" x 20.5" (length x width). The first support layer 120 and the second support layer 150 are substantially the same size, for example, 24" x 21" (length x width).

In addition, the second copper foil 130 has a first alignment hole 132, a third copper The foil 140 has a second alignment aperture 142. Before the pressing process, the edge of the second copper foil 130 may be adhered to the edge of the third copper foil 140 with the adhesive 170, so that the first alignment hole 132 and the third copper foil of the second copper foil 130 are formed. The second alignment holes 142 of 140 are aligned. In addition, the area of the first copper foil 110 is larger than the area of the first support layer 120, and the area of the fourth copper foil 160 is larger than the area of the second support layer 150. Therefore, after the first copper foil 110, the first support layer 120, the second copper foil 130, the third copper foil 140, the second support layer 150 and the fourth copper foil 160 of FIG. 2 are pressed together, the first copper foil is pressed. The edge of the first support layer 120 may protrude from the edge of the first support layer 120, and the edge of the fourth copper foil 160 may also protrude from the edge of the second support layer 150. In the present embodiment, the first copper foil 110 outside the first support layer 120 and the fourth copper foil 160 outside the second support layer 150 can be cut off to obtain the structure of FIG.

4 is a schematic view showing the first copper foil 110, the first support layer 120, the second copper foil 130, the third copper foil 140, the second support layer 150, and the fourth copper foil 160 of FIG. After the first copper foil 110, the first supporting layer 120, the second copper foil 130, the third copper foil 140, the second supporting layer 150 and the fourth copper foil 160 are pressed together, the second copper foil 110 can be cut along the line segment L1-L1 in the second The copper foil 130 and the first copper foil 110 on the outer side of the third copper foil 140, the first support layer 120, the second support layer 150 and the edge of the fourth copper foil 160 are obtained in the structure of Fig. 5. The structure width W outside the line segments L1-L1 is about 0.1", but is not intended to limit the present invention.

FIG. 5 illustrates the edge of the first copper foil 110, the first support layer 120, the second support layer 150, and the fourth copper foil 160 on the outer side of the second copper foil 130 and the third copper foil 140 in FIG. Schematic diagram. 6 shows the first support layer 120 and the second support layer 150 of FIG. 5 respectively forming a plurality of first blind holes 122 and a plurality of second blind holes 152, and the first copper foil 110 and the first support layer 120, the first A schematic view of the second copper foil 130, the third copper foil 140, the second supporting layer 150 and the fourth copper foil 160 forming the perforations 180. Referring to FIG. 5 and FIG. 6 , after the structure of FIG. 5 is formed, a first blind via 122 may be formed in the first support layer 120 , and a second blind via 152 may be formed in the second support layer 150 . As a result, part of the second copper foil 130 can be exposed from the first blind hole 122, and part of the third copper foil 140 can be exposed from the second blind hole 152. The first blind hole 122 and the second blind hole 152 may be formed by laser, but are not limited thereto.

In addition, in the embodiment, the through holes 180 penetrating through the first copper foil 110, the first support layer 120, the second copper foil 130, the third copper foil 140, the second support layer 150, and the fourth copper foil 160 may also be formed. . The axis of the through hole 180 overlaps the axis of the first alignment hole 132 of the second copper foil 130 and overlaps the axis of the second alignment hole 142 of the third copper foil 140. That is, the center of the through hole 180 is located in the first alignment hole 132 and the second alignment hole 142.

FIG. 7 is a schematic view showing the first copper foil 110, the bare second copper foil 130, the fourth copper foil 160, and the bare third copper foil 140 of FIG. Referring to FIG. 6 and FIG. 7 , after the first blind hole 122 and the second blind hole 152 are formed, the first copper foil 110 , the second copper foil 130 exposed from the first blind hole 122 , and the fourth copper may be The foil 160 is plated with the third copper foil 140 exposed from the second blind hole 152 such that the first copper foil 110 and the bare second copper foil 130 may be covered by the first plating layer 112, and the fourth copper foil 160 is exposed The third copper foil 140 may be covered by the second plating layer 162. In addition, the first plating layer 112 and the second plating layer 162 are respectively formed in the first blind hole 122 and the second blind hole 152, so that the first blind hole 122 and the second blind hole 152 are both filled.

In the embodiment, the material of the first plating layer 112 and the first copper The material of the foil 110 is the same, and the material of the second plating layer 162 is the same as that of the fourth copper foil 160. For example, the material of the first plating layer 112 and the second plating layer 162 is copper. As such, the first copper foil 110 and the first plating layer 112 may together form the first conductive layer 114, and the fourth copper foil 160 and the second plating layer 162 may together form the second conductive layer 164. In the following description, the first conductive layer 114 indicates that the first plating layer 112 is attached to the metal layer behind the first copper foil 110, and the second conductive layer 164 indicates that the second plating layer 162 is attached to the fourth copper foil 160. Metal layer.

FIG. 8 is a schematic view showing the first conductive layer 114, the first support layer 120, the second support layer 150 and the second conductive layer 164 on the outside of the second copper foil 130 and the third copper foil 140 in FIG. . Referring to FIG. 7 and FIG. 8 , after the first conductive layer 114 and the second conductive layer 164 are formed, the first conductive layer outside the second copper foil 130 and the third copper foil 140 may be cut along the line segment L2-L2. 114. The first supporting layer 120, the second supporting layer 150 and the second conductive layer 164. As a result, the sides of the second copper foil 130 and the third copper foil 140 can be exposed by the slits, as shown in FIG.

FIG. 9 is a schematic view showing the second copper foil 130 of FIG. 8 separated from the third copper foil 140. Referring to FIGS. 8 and 9 , the first conductive layer 114 , the first support layer 120 , the second support layer 150 , and the second conductive layer 164 to be removed outside the second copper foil 130 and the third copper foil 140 are removed. The second copper foil 130 may be separated from the third copper foil 140 to form two copper foil substrates 100a, 100b. The copper foil substrate 100a includes a first conductive layer 114, a first support layer 120 and a second copper foil 130, and the copper foil substrate 100b includes a second conductive layer 164, a second support layer 150 and a third copper foil 140.

Figure 10 shows the first conductive layer 114 and the second copper foil of Figure 9. 130. Schematic diagram of patterning of the third copper foil 140 and the second conductive layer 164. Referring to FIG. 9 and FIG. 10, after the copper foil substrates 100a and 100b are formed, the first conductive layer 114 and the second copper foil 130 on the upper and lower sides of the copper foil substrate 100a and the copper foil substrate 100b can be patterned. The third copper foil 140 on the side and the second conductive layer 164. "Patterning" may mean photolithography including exposure, development, and etching processes, but is not intended to limit the invention.

In this way, the patterned first conductive layer 114 and the second copper foil 130 can become the outer layer of the copper foil substrate 100a, and the patterned second conductive layer 164 and the third copper foil 140 can become the copper foil substrate 100b. Outer line.

Referring to FIG. 7 and FIG. 9 together, the copper foil substrate of the present invention can be simultaneously applied to the first copper foil 110, the exposed second copper foil 130, the fourth copper foil 160 and the bare third copper foil 140. Plating treatment. As such, the first copper foil 110 and the bare second copper foil 130 may be covered by the first plating layer 112 to form the first conductive layer 114 together, and the fourth copper foil 160 and the bare third copper foil 140 may be the second plating layer 162. The second conductive layer 164 is formed to cover together. After the second copper foil 130 and the third copper foil 140 are separated, two copper foil substrates 100a, 100b can be formed. That is, in the single plating process, the two copper foil substrates 100a, 100b are simultaneously plated, and the second copper foil 130 on the copper foil substrate 100a side and the third copper foil 140 on the copper foil substrate 100b side are not involved. plating. Therefore, the method for manufacturing the copper foil substrate of the present invention can increase the productivity and reduce the material cost of plating. In addition, the second copper foil 130 and the third copper foil 140 are not plated, and are copper of the substrate, and have excellent etching uniformity in a subsequent process (for example, the patterning process of FIG. 10). Furthermore, the first copper foil 110 after pressing, the first support layer 120, the second copper foil 130, and the third copper The overall thickness of the foil 140, the second supporting layer 150 and the fourth copper foil 160 is thick, in addition to avoiding damage due to external force during handling, and is less likely to be scrapped during the manufacturing process, thereby improving product yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

S1~S5‧‧‧Steps

Claims (10)

A method for manufacturing a copper foil substrate, comprising the steps of: (a) pressing a first copper foil, a first support layer, a second copper foil, a third copper foil, and a second support layer; And a fourth copper foil; (b) forming a plurality of first blind holes and a plurality of second blind holes respectively in the first support layer and the second support layer, so that the portion of the second copper foil and the portion The third copper foil is exposed; (c) applying a plating treatment to the first copper foil, the exposed second copper foil, the fourth copper foil, and the bare third copper foil, so that the first copper foil Forming a first conductive layer with the exposed second copper foil by a first plating layer, the fourth copper foil and the bare third copper foil being covered by a second plating layer to form a second conductive layer; d) longitudinally cutting the second conductive layer from the second copper foil and the outer side of the third copper foil to the second conductive layer to remove the first conductive outer side of the second copper foil and the third copper foil a layer, the first support layer, the second support layer and the second conductive layer such that a side of the second copper foil is exposed to a side of the third copper foil; and (e) The second copper foil and the third copper foil are formed to form two copper foil substrates, wherein one of the two copper foil substrates has the first conductive layer, the first support layer and the second copper foil, and the other The second conductive layer, the second support layer and the third copper foil are provided. The method for fabricating a copper foil substrate according to claim 1, further comprising: The edge of the second copper foil is attached to the edge of the third copper foil such that a first alignment hole of the second copper foil is aligned with a second alignment hole of the third copper foil. The method for fabricating a copper foil substrate according to claim 2, further comprising: forming a through hole through the first copper foil, the first support layer, the second copper foil, the third copper foil, and the second support layer And the fourth copper foil, wherein an axis of the perforation overlaps an axis of the first alignment hole and the second alignment hole. The method for fabricating a copper foil substrate according to claim 1, wherein the first blind holes and the second blind holes are formed by laser. The method for fabricating a copper foil substrate according to claim 1, wherein an area of the first copper foil is larger than an area of the first support layer, and an area of the fourth copper foil is larger than an area of the second support layer. (a), the manufacturing method further comprises: cutting the first copper foil outside the first support layer and the fourth copper foil outside the second support layer. The method for fabricating a copper foil substrate according to claim 5, further comprising: cutting the first copper foil outside the second copper foil and the third copper foil, the first supporting layer, and the second supporting layer The edge of the fourth copper foil. A method for producing a copper foil substrate according to claim 1, wherein The step (c) includes: forming the first plating layer and the second plating layer respectively in the first blind holes and the second blind holes. The method for fabricating a copper foil substrate according to claim 1, wherein after the step (e), the manufacturing method further comprises: patterning the first conductive layer and the second copper of one of the copper foil substrates Foil, and patterning the third copper foil of the other of the copper foil substrates and the second conductive layer. The method for fabricating a copper foil substrate according to claim 1, wherein the material of the first plating layer is the same as the material of the first copper foil, and the material of the second plating layer is the same as the material of the fourth copper foil. The method for fabricating a copper foil substrate according to claim 1, wherein the material of the first support layer and the second support layer is glass fiber.