CN114158202A

CN114158202A - Method for manufacturing and electroplating circuit board

Info

Publication number: CN114158202A
Application number: CN202111439244.6A
Authority: CN
Inventors: 杨坤
Original assignee: Guangdong Ellington Electronics Technology Co ltd
Current assignee: Guangdong Ellington Electronics Technology Co ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-03-08

Abstract

The invention discloses a method for manufacturing and electroplating a circuit board, which comprises the following steps: the method comprises the following steps: providing a core plate; step two: pressing a thick copper foil layer with thicker thickness on one surface of the core plate by using a first bonding layer, and pressing a thin copper foil layer with thinner thickness on the other surface of the core plate by using a second bonding layer; step three: drilling blind holes penetrating through the thick copper foil layer, the first bonding layer, the core plate and the second bonding layer by using a laser drilling machine to form a circuit board blank; step four: placing the two circuit board blanks in a thin plate electroplating clamp in a back-to-back stacking manner, so that the blind holes of the two circuit board blanks face outwards; step five: carrying out copper deposition treatment on the blind hole to enable the surface of the blind hole to be covered with a chemical copper layer; step six: and simultaneously electroplating the two circuit board blanks to form an electroplated layer on the surface of the circuit board blank with the blind hole.

Description

Method for manufacturing and electroplating circuit board

Technical Field

The invention relates to a manufacturing and electroplating method of a circuit board.

Background

At present, when an ultrathin circuit board with the thickness of less than 0.2mm is electroplated, the circuit board is too thin and is easy to bend and buckle during electroplating, so that the yield is low. In addition, in order to avoid bending and buckling of the circuit board as much as possible, additional auxiliary supporting tools are often added to the clamp, the operation is complicated, the production capacity needs to be occupied, and the production efficiency of the electroplating process is seriously influenced.

Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by those skilled in the art.

Disclosure of Invention

The invention overcomes the defects of the technology and provides a manufacturing and electroplating method of a circuit board.

In order to achieve the purpose, the invention adopts the following technical scheme:

a method of manufacturing and plating a circuit board comprising the steps of:

the method comprises the following steps: providing a core plate 1;

step two: a thick copper foil layer 3 with a thicker thickness is pressed on one surface of the core plate 1 by utilizing a first bonding layer 2, and a thin copper foil layer 5 with a thinner thickness is pressed on the other surface of the core plate 1 by utilizing a second bonding layer 4;

step three: drilling a blind hole 6 penetrating through the thick copper foil layer 3, the first bonding layer 2, the core plate 1 and the second bonding layer 4 by using a laser drilling machine to form a circuit board blank;

step four: placing the two circuit board blanks in a thin plate electroplating clamp in a back-to-back stacking manner, and enabling the blind holes 6 of the two circuit board blanks to face outwards;

step five: carrying out copper deposition treatment on the blind hole 6 to enable the surface of the blind hole to be covered with a chemical copper layer 7;

step six: and simultaneously electroplating the two circuit board blanks to form an electroplated layer 8 on the surface of the circuit board blank with the blind hole 6.

Preferably, the thickness of the thick copper foil layer 3 is 1OZ, and the thickness of the thin copper foil layer 5 is 1/3 OZ.

Preferably, the first adhesive layer 2 and the second adhesive layer 4 are both PP sheets.

Preferably, the blind via 6 is also filled with the plating layer 8 after the plating is completed in step six.

Compared with the prior art, the invention has the beneficial effects that:

the electroplating method can simultaneously electroplate the two circuit board blanks by stacking the two circuit board blanks back to back in the clamp and enabling the surface with the blind hole to be electroplated to face outwards, thereby greatly improving the production efficiency of the electroplating process. In addition, because two circuit board blanks are stacked in the clamp together back to back, the thickness of a workpiece in the clamp is doubled by phase change, so that the probability of bending and creasing the circuit board blanks can be effectively reduced, and the yield is improved. Meanwhile, because the two circuit board blanks are stacked back to back, and the surfaces which are contacted with each other inwards can not be electroplated, when the circuit board blanks are manufactured, a thick copper foil layer and a thin copper foil layer can be respectively laminated on the two surfaces of the core board through asymmetrical lamination, the surface of the thick copper foil layer is electroplated, and the thin copper foil layer is used as a stacking contact surface, so that the using amount of the copper foil can be reduced, and the economic benefit is improved.

Drawings

Fig. 1 is a schematic view of the core board after the copper foil layer is laminated.

Fig. 2 is a schematic view of the blind hole of the present application.

Fig. 3 is a schematic diagram of the case of stacking two circuit board blanks back to back for copper deposition.

Fig. 4 is a schematic diagram of the case when two circuit board blanks are stacked back to back for electroplating.

Detailed Description

The features of the present invention and other related features are further described in detail below by way of examples to facilitate understanding by those skilled in the art:

as shown in fig. 1 to 4, a method for manufacturing and plating a circuit board includes the steps of:

the method comprises the following steps: providing a core plate 1;

As mentioned above, in the electroplating method, two circuit board blanks are stacked in the clamp back to back during electroplating, and the side to be electroplated with the blind holes 6 faces outwards, so that the two circuit board blanks can be electroplated simultaneously, and the production efficiency of the electroplating process is greatly improved. In addition, because two circuit board blanks are stacked in the clamp together back to back, the thickness of a workpiece in the clamp is doubled by phase change, so that the probability of bending and creasing the circuit board blanks can be effectively reduced, and the yield is improved. Meanwhile, because the two circuit board blanks are stacked back to back, and the surfaces which are contacted with each other inwards can not be electroplated, when the circuit board blanks are manufactured, the thick copper foil layer 3 and the thin copper foil layer 5 can be respectively laminated on the two surfaces of the core plate 1 through asymmetric lamination, the thick copper foil layer 3 is electroplated, and the thin copper foil layer 5 is used as a stacking contact surface, so that the copper foil consumption can be reduced, and the economic benefit is improved.

As shown in fig. 1 to 4, preferably, the thick copper foil layer 3 has a thickness of 1OZ, and the thin copper foil layer 5 has a thickness of 1/3 OZ.

As shown in fig. 1 to 4, it is preferable that the first adhesive layer 2 and the second adhesive layer 4 are both PP sheets.

As shown in fig. 4, preferably, the blind via 6 is also filled with the plating layer 8 after the plating is completed in step six.

As described above, the present invention is a method for manufacturing and electroplating a circuit board, and all technical solutions that are the same as or similar to the present invention should be considered as falling within the scope of the present invention.

Claims

1. A method for manufacturing and electroplating a circuit board is characterized by comprising the following steps:

the method comprises the following steps: providing a core plate (1);

step two: a thick copper foil layer (3) with thicker thickness is pressed on one surface of the core plate (1) by utilizing a first bonding layer (2), and a thin copper foil layer (5) with thinner thickness is pressed on the other surface of the core plate (1) by utilizing a second bonding layer (4);

step three: drilling a blind hole (6) penetrating through the thick copper foil layer (3), the first bonding layer (2), the core board (1) and the second bonding layer (4) by using a laser drilling machine to form a circuit board blank;

step four: placing the two circuit board blanks in a thin plate electroplating clamp in a back-to-back stacking manner, and enabling the blind holes (6) on the two circuit board blanks to face outwards;

step five: carrying out copper deposition treatment on the blind hole (6) to enable the surface of the blind hole to be covered with a chemical copper layer (7);

step six: and simultaneously electroplating the two circuit board blanks to form an electroplated layer (8) on the surface of the circuit board blank with the blind hole (6).

2. A method of manufacturing and plating a circuit board according to claim 1 wherein said thick copper foil layer (3) has a thickness of 1OZ and said thin copper foil layer (5) has a thickness of 1/3 OZ.

3. A method of manufacturing and plating a circuit board according to claim 1, characterized in that the first adhesive layer (2) and the second adhesive layer (4) are both PP sheets.

4. A method of manufacturing and plating a circuit board according to claim 1 wherein said blind via (6) is also filled with a plating layer (8) after completion of step six plating.