KR20150042064A - Method for manufacturing single-layer pcb - Google Patents

Abstract

According to the present invention, the present invention provides a method for manufacturing a single layer PCB which includes the steps of: providing a carrier; stacking a first insulation layer on the upper and lower sides of the carrier and forming a first hole on the stacked first insulation layer; forming a first via and a circuit pattern by stacking a first plating layer on the first insulation layer and the first hole; stacking a second insulation layer on the circuit pattern and the first insulation layer and forming a second hole on the upper side of the circuit pattern; forming a second via by stacking a second plating layer on the second hole; and removing the carrier.

Description

METHOD FOR MANUFACTURING SINGLE-LAYER PCB [0001]

The present invention relates to a method of manufacturing a single-layer printed circuit board.

In general, a printed circuit board can be classified into a single-layer printed circuit board, a double-sided printed circuit board, a multilayer printed circuit board, and the like depending on a processing method. Depending on the material, a printed circuit board made of phenol, It can be classified as printed circuit board.

The single-layer printed circuit board according to the related art is basically manufactured by including a plurality of processes such as exposure, development, etching, and cleaning, and is complicated in process and forms a pattern by exposure, etching, development, Most of the metal is etched and there is a problem such as waste of raw materials. In addition, since the single layer printed circuit board according to the related art uses an epoxy material as the core layer, it is difficult to manufacture a thin printed circuit board.

A related art is Korean Patent Laid-Open Publication No. 2011-0072666 (published on Jun. 29, 2011, a single-layer printed circuit board and a manufacturing method thereof).

According to an embodiment of the present invention, a carrier dummy layer is used to manufacture a single-layer printed circuit board, thereby solving the difficulty of manufacturing a single-layer printed circuit board of a thin plate and manufacturing a printed circuit board having vias formed on the top and bottom of the circuit pattern A method for manufacturing a single-layer printed circuit board is provided.

According to an embodiment of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing a carrier; stacking a first insulating layer on the upper and lower portions of the carrier; forming a first hole in each of the stacked first insulating layers; A method for manufacturing a semiconductor device, comprising the steps of: laminating a first plating layer on a first insulating layer to form a first via and a circuit pattern; laminating a second insulating layer on the first insulating layer and the circuit pattern; Forming a second via layer by laminating a second plating layer on the second hole, and removing the carrier. The method of manufacturing a single-layer printed circuit board includes the steps of:

The carrier may include a copper foil layer stacked on top and bottom.

The removing the carrier may include removing the portion of the carrier excluding the copper foil layer, and removing the copper foil layer by etching.

The step of forming the circuit pattern may include forming a circuit pattern by laminating a dry film on a part of the first plating layer and etching the remaining part of the first plating layer on which the dry film is not laminated.

Further, the present invention may further include a step of removing the dry film after the step of forming the circuit pattern.

According to embodiments of the present invention, a carrier dummy layer is used to manufacture a single-layer printed circuit board through a single-layer printed circuit board manufacturing method, thereby solving the difficulty of manufacturing a single-layer printed circuit board of a thin plate, A single-layer printed circuit board on which vias are formed can be manufactured.

FIGS. 1 to 11 sequentially illustrate a process for manufacturing a single-layer printed circuit board according to an embodiment of the present invention. FIG.
12 illustrates a single-layer printed circuit board fabricated by a method of manufacturing a single-layer printed circuit board in accordance with an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, embodiments of a method for manufacturing a single-layer printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals designate like or corresponding components, A duplicate description will be omitted.

1 to 11 are views sequentially showing a method of manufacturing a single-layer printed circuit board according to an embodiment of the present invention. FIG. 12 is a cross-sectional view illustrating a method of manufacturing a single-layer printed circuit board according to an embodiment of the present invention. Lt; RTI ID = 0.0 > a < / RTI >

As shown in FIG. 1, in the method of manufacturing a single-layer printed circuit board according to the present invention, the carrier 100 may be used when manufacturing a product having a certain thickness or less. It is possible to complete the single printed circuit board 1000 through a post-process by separating the product from the carrier 100 after the product is manufactured up to a certain thickness by placing a thin foil on the upper and lower portions of the carrier 100.

When a very thin sheet is directly introduced into a facility, it is almost impossible to manufacture a product due to substrate breakage. Therefore, it may be preferable to apply the present invention to a thin sheet.

2, the first insulating layer 200 is laminated on the carrier 100, and the first insulating layer 200 is exposed and developed to form a first hole 210 in which the first via is to be formed I make it. At this time, the first insulating layer 200 may be formed of a polymer resin.

A first hole 210 is formed in the first insulating layer 200 and then a seed line for plating is formed in the first insulating layer 200 and the first hole 210, . The surface of the first insulating layer 200 and the first hole 210 may be subjected to pretreatment to form roughness, followed by deposition or chemical plating to form a seed line.

As shown in FIG. 4, a seed line is formed and then a first via layer and a first plating layer 300 of a predetermined thickness are formed on the seed line through plating.

As shown in FIG. 5, a dry film 400 is stacked on the first plating layer 300. At this time, the dry film 400 may be stacked only on the upper part of the first plating layer 300 corresponding to the circuit pattern. As shown in FIG. 6, after the dry film 400 is laminated, the remaining portion of the first plating layer 300 is removed through etching. The remaining first plating layer 300 may be a circuit pattern.

7, a method of manufacturing a single-layer printed circuit board according to the present invention includes forming a circuit pattern, removing the dry film 400, and forming a first insulation layer 200 and a second insulation Layer 500 may be stacked. A second hole 510 in which the second via 600 is to be formed is formed in the second insulating layer 500. The second insulating layer 500 may also be formed of a polymer resin, and the second hole 510 may be formed through exposure and development.

8, a second via hole 600 is formed in a second hole 510 formed through exposure and development. That is, a second plating layer 600, which is a conductive layer, is formed by plating a predetermined amount on the second hole 510, which is an opening above the circuit pattern, or a second plating layer 600, which is a conductive layer, is formed through paste bonding can do. At this time, by forming the roughness through the preprocessing, a stronger bonding force can be formed.

9 is a view showing a process of removing a part of the carrier 100. Fig. That is, it includes separating and removing the portion 101 of the carrier 100 excluding the copper foil layer 102. 10 may be manufactured as a single layer substrate of an upper substrate and a lower substrate by separating the portion 101 excluding the copper foil layer 102 in the carrier.

As shown in FIG. 11, the attached copper foil layer 102 of the upper substrate and the lower substrate may be removed by etching. At this time, a portion of the second via 600 together with the copper foil layer 102 may be removed by etching.

12 shows a single-layer printed circuit board 1000 that has been completed through the above-described processes. The sum of the thickness of the portion of the first via removed by etching and the thickness of the copper foil layer 102 is larger than that of the second via 600 ) May be formed similar to a portion removed by etching.

Etching proceeds to the entire product, so that when the copper foil layer 102 is removed by etching, the second vias 600 are also removed by etching, and furthermore, the copper foil 102 is removed and then the first via is removed by etching And at this time, the second via 600 can be further removed by etching.

When manufacturing a single-layer printed circuit board using the method of manufacturing a single-layer printed circuit board according to the present invention, two vias formed at the top and bottom of one circuit pattern and circuit pattern as shown in FIG. 12 can be obtained. In addition, it is possible to manufacture a single-layer printed circuit board which can overcome the manufacturing limit of the equipment and can solve the decrease in rigidity of the thin plate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

100: Carrier
101: part excluding the copper foil layer
102: copper foil layer
200: first insulating layer
210: first hole
300: First plating layer
400: dry film
500: second insulating layer
510: second hole
600: second plating layer, second via
1000: Single layer printed circuit board

Claims (5)

Providing a carrier;
Stacking a first insulating layer on upper and lower portions of the carrier and forming first holes in the first insulating layers;
Depositing a first plating layer on the first hole and the first insulating layer to form a first via and a circuit pattern;
Depositing a second insulating layer on the first insulating layer and the circuit pattern, and forming a second hole on the circuit pattern;
Depositing a second plating layer on the second hole to form a second via; And
And removing the carrier. ≪ RTI ID = 0.0 > 11. < / RTI >
The method according to claim 1,
The carrier
And a copper foil layer laminated on the upper and lower sides.
3. The method of claim 2,
Wherein removing the carrier comprises:
Separating and removing a portion of the carrier excluding the copper foil layer;
And removing the copper foil layer by etching.
The method of claim 3,
Wherein forming the circuit pattern comprises:
Wherein a dry film is laminated on a part of the first plating layer and a remaining part of the first plating layer on which the dry film is not laminated is etched to form a circuit pattern.
5. The method of claim 4,
Further comprising the step of removing the dry film after the step of forming the circuit pattern.

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