KR100897668B1 - Fabricating Method of Printed Circuit Board using the Carrier - Google Patents

Abstract

The present invention is to reduce the production lead time by using a carrier having a rigid enough to prevent the bending of the printed circuit board formed on both sides, the printed circuit board formed on both sides, the size of the circuit pattern is formed, reducing the process lead time The present invention relates to a method for manufacturing a printed circuit board using a carrier, which can increase a height, prevent a defect of a printed circuit board due to a warpage of a carrier, and reduce a manufacturing cost of a printed circuit board.

Carriers, Printed Circuit Boards, Ultrasonics

Description

Fabrication Method of Printed Circuit Board using the Carrier

The present invention is to reduce the production lead time by using a carrier having a rigid enough to prevent the bending of the printed circuit board formed on both sides, the printed circuit board formed on both sides, the size of the circuit pattern is formed, reducing the process lead time The present invention relates to a method for manufacturing a printed circuit board using a carrier, which can increase a height, prevent a defect of a printed circuit board due to a warpage of a carrier, and reduce a manufacturing cost of a printed circuit board.

Recently, according to the development of the electronic industry, a thin printed circuit board (PCB) for thin and fine semiconductor devices of 0.3T or less is required.

However, current process lines usually produce printed circuit boards having a thickness of 0.8T or more, and thus there is a problem in that thin and fine multilayer printed circuit boards cannot be easily manufactured.

In order to solve this problem, a method of manufacturing a printed circuit board using a carrier has been proposed.

1A to 1K are cross-sectional views illustrating a method of manufacturing a printed circuit board using a carrier according to the prior art.

In the method of manufacturing a printed circuit board using a carrier according to the related art, first, as shown in FIG. 1A, a carrier 100 which is a composite metal plate having an adhesive 102 attached to the outermost circumference of two first metal plates 104. Prepare.

At this time, the adhesive 102 is attached to the outermost periphery of the first metal plate 104, that is, the dummy region where the circuit pattern is not formed, and is not attached to the circuit region where the circuit pattern is formed.

Here, the first metal plate 104 is made of copper foil, that is, copper (Cu).

Thereafter, as shown in FIG. 1B, the second metal plate 106 is plated on the first metal plate 104 with a different etching condition from the first metal plate 104.

At this time, nickel (Ni) is generally used as the second metal plate 106.

After plating the second metal plate 106 on the first metal plate 104, the first copper plating layer 108 is formed on the second metal plate 106 as shown in FIG. 1C.

In this case, the first copper plating layer 108 is formed through an electroless copper plating process and an electrolytic copper plating process.

After the first copper plating layer 108 is formed, the first copper plating layer 108 is etched to form the first circuit pattern 110 as shown in FIG. 1D.

In this case, the first circuit pattern 110 is formed only in the circuit region, and is formed by a general circuit pattern forming process.

After the first circuit pattern 110 is formed, an insulating layer 112 is stacked on the first circuit pattern 110 as shown in FIG. 1E.

Thereafter, as illustrated in FIG. 1F, a via hole 114 is formed in the insulating layer 112 so that the upper portion of the first circuit pattern 110 is exposed by using a CNC drill or a laser drill.

After the via hole 114 is formed, a second copper plating layer 116 is formed in the via hole 114 and the insulating layer 112 as shown in FIG. 1G through an electroless copper plating process and an electrolytic copper plating process.

After the second copper plating layer 116 is formed, the second copper plating layer 116 is etched through an image forming process to form a second circuit pattern 118 as shown in FIG. 1H.

Thereafter, the process of FIGS. 1E to 1H is repeated to form a multilayer printed circuit board 130 in which a plurality of circuit patterns 110, 118, and 118a and insulating layers 112 and 112a are stacked, as shown in FIG. 1I.

After the multilayer printed circuit board 130 is formed, the circuit area and the dummy area are separated using a router, that is, a cutter.

At this time, since the adhesive 102 is not attached to the circuit area, the two first metal plates 104 are separated as shown in FIG. 1J.

Thereafter, as shown in FIG. 1K, the first metal plate 104 and the second metal plate 106 are removed using an etching solution to form the multilayer printed circuit board 130.

At this time, since the first metal plate 104 and the second metal plate 106 are removed by different etching solutions, the first metal plate 104 is removed by etching the first etching solution, and then the second metal plate 106 is etching by the second etching solution. To remove it.

As described above, the method of manufacturing a printed circuit board using a carrier according to the related art increases the manufacturing cost of the printed circuit board since the carrier 100 is used as a one-time, as well as the two first metal plates using the adhesive 102. Since the bonding 104, the manufacturing cost according to the use of the adhesive 102 is increased, there is a problem that the process time for bonding the first metal plate 104 is increased.

In addition, in the method of manufacturing a printed circuit board using a carrier according to the related art, since the adhesive 102 is not used in the circuit area, the first metal plate 104 of the circuit area is dropped, so that the warpage of the first circuit board during the manufacturing of the printed circuit board is reduced. When the bending of 104 is generated, it is difficult to apply the process scale and there is a problem that a defect of the printed circuit board occurs.

Accordingly, in order to solve the above problems, a method of manufacturing a printed circuit board using a carrier according to an exemplary embodiment of the present invention includes a) preparing a carrier having a flat surface on both sides and having a size corresponding to a circuit area in which a circuit pattern is to be formed. Stacking a larger metal plate on both sides of the carrier; b) bonding the metal plate to surround the side of the carrier with ultrasonic waves; c) forming a first circuit pattern by forming a first copper plating layer on the metal plate, and then removing the first copper plating layer except for a portion where the first circuit pattern is to be formed in the circuit region; d) stacking an insulating layer on the metal plate such that the first circuit pattern is embedded therein; e) forming a via hole in the insulating layer to expose the first circuit pattern, and then forming a second copper plating layer on the inner wall of the via hole and the insulating layer; f) forming a second circuit pattern by removing the second copper plating layer except for the portion where the second circuit pattern is to be formed; And g) cutting the metal plate formed to surround the side of the carrier, and then removing the metal plate.

In the method of manufacturing a printed circuit board using a carrier according to an embodiment of the present invention, the carrier is made of any one of a metal material and an insulating material.

In the method of manufacturing a printed circuit board using a carrier according to an embodiment of the present invention, the first circuit pattern and the second circuit pattern are formed by etching the first copper plating layer and the second copper plating layer with a first etching solution.

In the method of manufacturing a printed circuit board using a carrier according to an embodiment of the present invention, the metal plate is etched and removed by a second etching solution having different etching conditions from the first etching solution.

In the method of manufacturing a printed circuit board using a carrier according to an embodiment of the present invention, the metal plate is made of either nickel or chromium.

In the method of manufacturing a printed circuit board using a carrier according to an embodiment of the present invention, the printed circuit board is formed to have four, six, eight, or more circuit layers by repeating steps d) to f). .

As described above, the present invention has a rigidity enough to prevent the bending of the printed circuit board is formed on both sides is flat, and the metal plate is laminated on both sides of the carrier formed to the size of the circuit area in which the circuit pattern is to be formed. After the printed circuit board is formed on the metal plate, the carrier can be permanently used instead of one-time, thereby reducing the manufacturing cost of the printed circuit board.

In addition, since the present invention does not use the adhesive used in the prior art, the manufacturing process of the composite metal plate using the adhesive is omitted, thereby reducing the process time and manufacturing cost due to the use of the adhesive as well as the process lead time according to the manufacturing of the composite metal plate. It can reduce the production efficiency can be improved.

In addition, the present invention is not only easy to apply the process scale of the printed circuit board because the empty space due to the adhesive is not formed as in the prior art, and even if the printed circuit board is formed in multiple layers, the carrier does not generate warpage. It is possible to prevent the defect of the printed circuit board due to the occurrence.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2L are cross-sectional views illustrating a method of manufacturing a printed circuit board using a carrier according to an exemplary embodiment of the present invention.

Method of manufacturing a printed circuit board using a carrier according to an embodiment of the present invention, first, as shown in Figure 2a has a rigid enough to prevent the bending of the printed circuit board formed on both sides is flat on both sides after Prepare the carrier 20.

Such a carrier 20 is composed of any one of an insulating material and a metal material, but is preferably made of an insulating material so that the metal plates stacked on both sides of the carrier 20 in the subsequent process are not bonded to the metal plate when they are joined by ultrasonic waves. .

In this case, the carrier 20 is formed to have a size as large as the circuit area where the circuit pattern is formed.

After preparing the carrier 20, the metal plate 22 is laminated on the carrier 20.

At this time, the metal plate 22 is made of a conductive material such as nickel (Ni), chromium (Cr), copper (Cu), and has a size that covers both sides and side surfaces of the carrier 20.

That is, the metal plate 22 larger than the size of the carrier 20 is laminated on the carrier 20.

The metal plate 22 is preferably made of a material different from the circuit pattern and etching conditions in order to separate the circuit pattern from the circuit pattern after fabrication of the printed circuit board.

That is, the metal plate 22 preferably uses nickel (Ni) or chromium (Cr) for smooth separation from the circuit pattern formed of copper (Cu).

After laminating the metal plates 22 on both sides of the carrier 20, ultrasonic metal is used to bond the metal plates 22 stacked on both sides of the carrier 20 as shown in FIG. 2B.

At this time, the metal plate 22 is bonded to the side of the carrier 20 to surround the side of the carrier 20.

Thereafter, as shown in FIG. 2C, the first copper plating layer 24 is formed on the metal plate 22.

In this case, the first copper plating layer 24 is formed on the metal plate 22 through an electroless copper plating process and an electrolytic copper plating process.

After the first copper plating layer 24 is formed, a photosensitive material such as a dry film or a photoresist is applied on the first copper plating layer 24, and then, except for a portion where the first circuit pattern is to be formed through an exposure and development process. Remove part of the photosensitive material.

Thereafter, the first copper plating layer 24 is etched with the first etching solution to remove the first copper plating layer 24 except for the portion where the first circuit pattern is to be formed, thereby removing the metal plate 22 as shown in FIG. 2D. The first circuit pattern 26 is formed thereon.

In this case, the first circuit pattern 26 is formed only on the circuit region where the carrier 20 is located.

That is, the first circuit pattern 26 is not formed on the portion of the metal plate 22 stacked on the carrier 20 that is larger than the size of the carrier 20, that is, the metal plate 22 formed to surround the side surface of the carrier 20. And is formed only on the metal plate 22 on which the carrier 20 is located.

After the first circuit pattern 26 is formed, an insulating layer 28 is stacked on the metal plate 22 so that the first circuit pattern 26 is embedded therein as shown in FIG. 2E.

Accordingly, the first circuit pattern 26 is embedded in the insulating layer 28.

After stacking the insulating layer 28, via holes 34 are formed in the insulating layer 28 by using a CNC drill or a laser drill to expose the first circuit pattern 26 as shown in FIG. 2F.

Thereafter, the second copper plating layer 30 is formed in the via hole 34 and the insulating layer 28 as shown in FIG. 2G through the electroless copper plating process and the electrolytic copper plating process.

After the second copper plating layer 30 is formed, a photosensitive material such as a dry film or a photoresist is applied onto the second copper plating layer 30, and then, except for a portion where the second circuit pattern is to be formed through an exposure and development process. Remove part of the photosensitive material.

Thereafter, the second copper plating layer 30 is etched with the first etching solution to remove the second copper plating layer 30 except for the portion where the second circuit pattern is to be formed, and the insulating layer 28 is shown in FIG. 2H. ) To form a second circuit pattern (32).

In this case, the second circuit pattern 32 is formed only on the circuit region where the carrier 20 is located.

That is, the second circuit pattern 32 is not formed in the portion of the metal plate 22 stacked on the carrier 20 that is larger than the size of the carrier 20, that is, a portion formed to surround the side surface of the carrier 20. It is formed only in the part where 20 is located.

After the second circuit pattern 32 is formed, the method shown in FIGS. 2E to 2H is repeated, and as shown in FIG. 2I, the circuit patterns 26, 32, and 32a and the insulating layers 28 and 28a are numerous. The stacked multilayer printed circuit board 40 is formed.

In this case, the multilayer printed circuit board 40 may be formed of two or more layers, for example, three layers, four layers, six layers, and eight layers, depending on the purpose and purpose of use thereof.

Thereafter, as illustrated in FIG. 2J, the metal plate 22 of the dummy area is cut and removed by using a cutting device such as a router or a cutter.

Here, the dummy region means a portion other than a circuit region in which the carrier 20 is located.

That is, the dummy region refers to a portion of the metal plate 22 laminated on both sides of the carrier 20 bonded to the side of the carrier 20.

At this time, when the insulating layer 28 is stacked in the dummy region, not only the metal plate 22 but also the insulating layer 28 is cut and removed by a cutting device.

Accordingly, the metal plate 22 is separated from the carrier 20 as shown in FIG. 2K.

Thereafter, the metal plate 22 is etched with a second etching solution different from the etching conditions of the first etching solution to remove the metal plate 22.

As a result, as shown in FIG. 2L, the multilayer printed circuit board 40 is formed.

As described above, the method of manufacturing a printed circuit board using a carrier according to an exemplary embodiment of the present invention has a rigidity enough to prevent warpage of a printed circuit board formed on both sides and is formed on both sides, and as much as a circuit region in which a circuit pattern is to be formed. By laminating the metal plate 22 on both sides of the carrier 20 formed to the size of the carrier 20, the printed circuit board is formed on the metal plate 22 so that the carrier 20 can be permanently used instead of one-time, thereby reducing the manufacturing cost of the printed circuit board. It becomes possible.

In addition, since the manufacturing method of the printed circuit board using the carrier according to the embodiment of the present invention does not use the adhesive as in the prior art, the manufacturing process of the composite metal plate using the adhesive is omitted, thereby reducing the process time and manufacturing cost due to the use of the adhesive. In addition, it is possible to reduce the process lead time according to the composite metal plate production to improve the production efficiency.

In addition, in the method of manufacturing a printed circuit board using a carrier according to an exemplary embodiment of the present invention, since a blank space is not formed due to an adhesive as in the prior art, the process scale of the printed circuit board may be easily applied, and the printed circuit board may be multilayered. Even if formed as described above, since the warpage of the carrier 20 does not occur, it is possible to prevent a defect of the printed circuit board due to the warpage of the carrier.

1A to 1K are cross-sectional views illustrating a method of manufacturing a printed circuit board using a carrier according to the prior art.

2A to 2L are cross-sectional views illustrating a method of manufacturing a printed circuit board using a carrier according to an exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

20, 100: carrier 22, 104, 106: metal plate

24, 30, 108, 116: copper plating layer 26, 32, 110, 118: circuit pattern

40, 130: printed circuit board 34, 114: via hole

Claims (6)

a) preparing a carrier having a flat surface on both sides and having a size corresponding to a circuit area in which a circuit pattern is to be formed, and then laminating a metal plate larger than the carrier on both sides of the carrier; b) bonding the metal plate to surround the side of the carrier with ultrasonic waves; c) forming a first circuit pattern by forming a first copper plating layer on the metal plate, and then removing the first copper plating layer except for a portion where the first circuit pattern is to be formed in the circuit region; d) stacking an insulating layer on the metal plate such that the first circuit pattern is embedded therein; e) forming a via hole in the insulating layer to expose the first circuit pattern, and then forming a second copper plating layer on the inner wall of the via hole and the insulating layer; f) forming a second circuit pattern by removing the second copper plating layer except for the portion where the second circuit pattern is to be formed; And g) cutting the metal plate formed to surround the side of the carrier and removing the metal plate. The method according to claim 1, The carrier is a method of manufacturing a printed circuit board using a carrier, characterized in that composed of any one of a metal material or an insulating material. delete delete The method according to claim 1, The metal plate is a method of manufacturing a printed circuit board using a carrier, characterized in that consisting of any one of nickel or chromium. The method according to claim 1, The printed circuit board is a method of manufacturing a printed circuit board using a carrier, characterized in that formed by repeating the steps d) to f).

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