JP4954246B2 - Copper-clad laminate and manufacturing method thereof - Google Patents

Description

  The present invention relates to a copper clad laminate and a method for manufacturing the same, and more particularly to a copper clad laminate capable of minimizing the generation of foreign matters due to glass fibers and a method for producing the same.

  A normal copper clad laminate is used as a raw material for a semiconductor package or a printed circuit board. One surface of an insulating material such as polyimide or FR4 (heat resistant glass woven epoxy resin substrate). Alternatively, copper foil is attached to both sides.

  FIG. 1 shows a cross-sectional view of a conventional double-sided copper-clad laminate.

  As shown in FIG. 1, a double-sided copper clad laminate 10 according to the prior art has a structure in which copper foil layers 18a and 18b are attached to both sides of a prepreg 16 in which a glass fiber 14 is impregnated with a resin 12.

  Here, the resin 12 which is the basic material of the copper-clad laminate is excellent in electrical characteristics, but has a drawback that the mechanical strength is not sufficient and the dimensional change due to temperature is about 10 times larger than that of the metal. , A material to maintain the basic characteristics of printed circuit boards, which are electrical insulation, mechanical strength, rigidity, and dimensional safety. It is made by weaving a fiber bundle made of short fibers with a diameter of 5-9 μm. Glass fiber 14 is used as a reinforcing substrate.

  On the other hand, FIG. 2 shows a perspective view for explaining a method for manufacturing a double-sided copper-clad laminate according to the prior art.

  As shown in FIG. 2, in the double-sided copper clad laminate 10 according to the prior art, after preparing one or more prepregs 16 in which a glass fiber 14 is impregnated with a resin 12, copper foil layers 18a and 18b are arranged on both sides. Manufactured by pressure lamination in the state.

  However, the double-sided copper-clad laminate 10 according to the prior art breaks the glass fiber 14 exposed on the side surface and generates foreign matter, and other foreign matter adheres to the site where the glass fiber 14 is separated. There was a problem that caused persistent failure. In particular, the glass fiber 14 exposed on the side surface in a desmear process for forming a surface roughness for improving the adhesive strength with the insulating layer further laminated on the copper foil layers 18a and 18b of the double-sided copper clad laminate 10. However, there is a problem that foreign matter is generated.

  Furthermore, with recent trend toward miniaturization and high integration of printed circuit boards, foreign substances have a great influence on the reliability and yield of the entire printed circuit board and the package board including the printed circuit board. As a raw material, there is a demand for a structure and a manufacturing method of a copper-clad laminate that can minimize the generation of foreign matters.

  The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a copper-clad laminate capable of minimizing the generation of foreign matters due to side exposure of glass fibers, and the production thereof. It is to provide a method.

  To achieve the above object, a copper clad laminate according to a preferred embodiment of the present invention includes a prepreg in which glass fiber is impregnated with a first resin; a second resin formed on both sides of the prepreg; and the prepreg. And a copper foil layer formed on one or both surfaces of the second resin.

  The prepreg may be impregnated with an organic filler or an inorganic filler.

  The first resin and the second resin may be an epoxy resin, a poly resin, or a bismaleimide resin.

  The prepreg via formation region may be formed of a third resin not including glass fibers.

  In order to achieve the above object, a method for producing a copper clad laminate according to another embodiment of the present invention includes: (A) preparing a prepreg in which glass fiber is impregnated with a first resin; (B) A step of sequentially arranging a second resin having a hollow portion of the same size as the prepreg on one or both sides of the prepreg, and a copper foil layer having a size covering the prepreg and the second resin; and (C) Pressurizing and laminating the prepreg, the second resin, and the copper foil layer.

  The prepreg may be impregnated with an organic filler or an inorganic filler.

  The first resin and the second resin may be an epoxy resin, a poly resin, or a bismaleimide resin.

  The prepreg via formation region may be formed of a third resin not including glass fibers.

  As described above, according to the present invention, since both side surface portions of the copper clad laminate are made of the second resin not containing glass fiber, the copper clad laminate that can minimize the generation of foreign matters due to the exposure of the glass fiber. A board and a method for manufacturing the same will be provided.

  In addition, according to the present invention, since the via formation region of the prepreg is made of the third resin not containing glass fiber, copper that can minimize the generation of foreign matter due to the exposure of the glass fiber when processing the via hole. A tension laminate and a method for manufacturing the same will be provided.

  Moreover, according to this invention, the simple manufacturing method which can manufacture the double-sided copper clad laminated board comprised by 2nd resin and 3rd resin in a side part and a via formation area, respectively is provided.

It is sectional drawing of the double-sided copper clad laminated board by a prior art. It is a perspective view explaining the manufacturing method of the double-sided copper clad laminated board by a prior art. 1 is a cross-sectional view of a copper clad laminate according to a preferred embodiment of the present invention. It is sectional drawing which shows the modification of the copper clad laminated board shown in FIG. It is a perspective view explaining the manufacturing method of the copper clad laminated board by the suitable Example of this invention.

  Objects, specific advantages and novel features of the present invention will be more clearly understood from the following detailed description and preferred embodiments with reference to the accompanying drawings. In the present specification, terms such as “first”, “second” do not indicate a specific quantity, order or importance, but are used to distinguish components from each other. In adding the reference numerals to the components in each drawing, the same components are denoted by the same reference numerals as much as possible even if they are illustrated in other drawings. Further, in the description of the present invention, when it is determined that a specific description of a related known technique can unnecessarily obscure the gist of the present invention, a detailed description thereof will be omitted.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 3 is a cross-sectional view of a copper clad laminate according to a preferred embodiment of the present invention. Hereinafter, with reference to the figure, the copper clad laminated board 100a by a present Example is demonstrated.

  As shown in FIG. 3, the copper clad laminate 100a according to the present embodiment has a second resin 102b that does not contain glass fibers formed on both side surfaces B of a prepreg 106 in which a glass fiber 104 is impregnated with a first resin 102a. Copper foil layers 108a and 108b are formed on one or both surfaces of the prepreg 106 and the second resin 102b.

  Here, the 2nd resin 102b does not contain glass fiber, but is arrange | positioned in the side surface part B at the same height as the prepreg 106. FIG. That is, since the glass fiber 104 included in the prepreg region A is not exposed to the outside by the second resin 102b that does not include the glass fiber, the generation of foreign matter is minimized.

  At this time, the glass fiber 104 is used as a material for maintaining electrical insulation, mechanical strength, rigidity, and dimensional safety, which are basic characteristics of the printed circuit board, but the glass fiber 104 is not included. Since the second resin 102b can affect the reliability of the printed circuit board 100a, the side surface portion B on which the second resin 102b is formed is a dummy area (Dummy region) or a cutting region (singulation region) of the printed circuit board. It is preferable that

  Moreover, although the general insulating material of 1st resin and the said 2nd resin copper clad laminated board can be used, an epoxy resin, a poly resin, or a bismaleimide resin is used, for example.

  In addition to the glass fiber 104, the prepreg 106 may contain an organic filler or an inorganic filler as a reinforcing material.

  FIG. 3 shows a double-sided copper-clad laminate 100a in which copper foil layers 108a and 108b are laminated on both sides of the second resin 102b and the prepreg 106, but the copper foil is only on one side of the second resin 102b and the prepreg 106. A structure in which the layers 108a and 108b are stacked is also included in the scope of the present invention.

  4 is a cross-sectional view showing a modification of the copper-clad laminate shown in FIG. Hereinafter, the copper clad laminate 100b according to this embodiment will be described with reference to FIG.

  As shown in FIG. 4, the copper clad laminate 100b according to the present embodiment has the same structure as the copper clad laminate 100a shown in FIG. 3, but the via formation region V of the prepreg 106 includes a third glass fiber. It is formed of resin 102c.

  That is, in the subsequent process, the region where the via hole is processed by mechanical drilling or laser drilling is formed of the third resin 102c not containing glass fiber, and the problem of the glass fiber 104 being detached in the via hole processing process is prevented. It has a structure that can.

  Here, the via formation region formed of the third resin 102c is preferably formed to be larger than the actual via hole processing region, so that the glass fiber 104 is not exposed by the via hole.

  FIG. 5 is a perspective view for explaining a method of manufacturing a copper clad laminate according to a preferred embodiment of the present invention. Hereinafter, with reference to the figure, the manufacturing method of the copper clad laminated board by a present Example is demonstrated.

  As shown in FIG. 5, a prepreg 106 in which a glass fiber 104 is impregnated with a first resin 102a is prepared, and has a hollow portion having the same size as that of the prepreg 106 on one or both sides, but does not contain glass fibers. 2 resin 102b, and copper foil layers 108a and 108b having a size covering the prepreg 106 and the second resin 102b are arranged in order, and are manufactured by pressurizing under a predetermined heat and pressure.

  That is, the method for manufacturing a copper clad laminate according to the prior art is applied as it is, but according to a preferred embodiment of the present invention, a simple method of pressurizing and laminating a hollow portion of the second resin 102b larger than the prepreg 106 is heated. A copper clad laminate is produced.

  On the other hand, although not shown in FIG. 5, in the copper clad laminate 100b according to the second preferred embodiment of the present invention, the glass fiber 104 is impregnated with the first resin 102a and the via forming region V has the first hollow portion. The formed prepreg 106 is prepared, and the second resin 102b having a second hollow portion having the same size as the prepreg 106 excluding the first hollow portion on one or both sides thereof but not containing glass fiber, and the prepreg 106 and The copper foil layers 108a and 108b having a size covering the second resin 102b are sequentially arranged, and are manufactured under a predetermined heat and pressure.

  The present invention has been described in detail on the basis of specific embodiments. However, this is for specifically explaining the present invention, and the carrier member for manufacturing a substrate according to the present invention and the substrate manufacturing method using the same are as follows. However, the present invention is not limited thereto, and modifications and improvements can be made by those having ordinary knowledge in the field within the technical idea of the present invention.

  All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific protection scope of the present invention should be clearly determined by the claims.

  The present invention is applicable to a copper-clad laminate that minimizes the generation of foreign matter due to side exposure of glass fibers and a method for manufacturing the same.

100a, 100b: Copper-clad laminate, 102a: first resin, 102b: second resin, 102c: third resin, 104: glass fiber, 106: prepreg, 108a, 108b: copper foil layer, V: via formation region .

Claims (4)

(A) preparing a prepreg in which glass fiber is impregnated with a first resin;
(B) arranging a second resin having a hollow portion having the same size as that of the prepreg on one or both surfaces of the prepreg, and a copper foil layer having a size covering the prepreg and the second resin; (C) pressing and laminating the prepreg, the second resin, and the copper foil layer;
The manufacturing method of a copper clad laminated board characterized by including. The method for producing a copper clad laminate according to claim 1 , wherein the prepreg is impregnated with an organic filler or an inorganic filler. The method for manufacturing a copper-clad laminate according to claim 1 , wherein the first resin and the second resin are epoxy resin, poly resin, or bismaleimide resin. The method for producing a copper-clad laminate according to claim 1 , wherein the prepreg via formation region is formed of a third resin not containing glass fibers.

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