CN214727056U - High-punching-shearing phenolic paper-based copper-clad laminate - Google Patents
High-punching-shearing phenolic paper-based copper-clad laminate Download PDFInfo
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- CN214727056U CN214727056U CN202023129102.3U CN202023129102U CN214727056U CN 214727056 U CN214727056 U CN 214727056U CN 202023129102 U CN202023129102 U CN 202023129102U CN 214727056 U CN214727056 U CN 214727056U
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Abstract
The utility model discloses a high punching shearing phenolic paper base copper clad laminate, which comprises a laminate substrate and a copper foil surface sheet, the copper foil surface sheet is arranged on the outer wall of the upper end of the laminated substrate, mounting holes are respectively penetrated through the vertical inner parts of the copper foil surface sheet and the laminated substrate close to the four corners, the vertical inner parts of the laminated substrate close to the four corners are respectively provided with an inner reinforcing mechanism, by adding a novel internal reinforcing mechanism in the vertical inner part of the phenolic paper-based copper clad laminate close to the four corners, each internal stiffening means not only serves to stiffen the connection to each layer within the laminate substrate, meanwhile, the copper foil surface sheet can be more firmly bonded and fixed on the outer wall of the upper end of the laminated substrate, thereby can very big increase whole phenolic aldehyde paper base copper clad laminate's stability in use and fastness, also can increase whole phenolic aldehyde paper base copper clad laminate's life simultaneously.
Description
Technical Field
The utility model belongs to the technical field of cover copper foil laminated board is relevant, concretely relates to high punching shear nature phenolic paper base covers copper foil laminated board.
Background
The copper clad laminate is a plate material prepared by soaking electronic glass fiber cloth or other reinforced materials with resin, covering one side or two sides with copper foil and hot pressing, which is called copper clad laminate for short, and various printed circuit boards with different forms and different functions are prepared by selectively processing, etching, drilling, copper plating and other procedures on the copper clad laminate to prepare different printed circuits, which mainly play the roles of interconnection, insulation and support for the printed circuit boards and have great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in the circuits, therefore, the performance, quality, processability, manufacturing level, manufacturing cost, long-term reliability and stability of the printed circuit boards are greatly determined by the copper clad laminate, the cotton pulp paper is soaked with modified phenolic or flame-retardant phenolic resin and is baked by flood baking, and the single side is covered with copper foil, hot pressing and cutting, the dielectric ceramic has good dielectric property, heat resistance, cold punching property and self-extinguishing property, good dimensional stability, small warpage and low price, and is suitable for being used as a printed circuit board in televisions, radio recorders and household appliances.
The prior phenolic paper-based copper clad laminate technology has the following problems: the existing phenolic paper-based copper-clad laminate is mainly prepared by mutually laminating and compounding copper foils, epoxy resin and phenolic paper, and the phenolic paper-based copper-clad laminate prepared by adopting a plurality of different laminating and compounding can easily generate the condition of layering between materials of each layer under the action of larger pressure, so that the service stability and the service life of the whole phenolic paper-based copper-clad laminate can be influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high punching shear nature phenolic paper base covers copper foil laminated board to the phenolic paper base that proposes in solving above-mentioned background art and adopts the lamination complex to make with multiple difference covers copper foil laminated board and then can appear the condition of layering appearing between every layer of material easily receiving under great pressure effect, then can influence the stability in use and the problem of life of whole phenolic paper base covers copper foil laminated board like this.
In order to achieve the above object, the utility model provides a following technical scheme: the high-punching-shearing-property phenolic paper-based copper-clad laminate comprises a laminated substrate and a copper foil surface sheet, wherein the copper foil surface sheet is arranged on the outer wall of the upper end of the laminated substrate, mounting holes are respectively formed in the vertical interiors of the copper foil surface sheet and the laminated substrate close to four corners, internal reinforcing mechanisms are respectively arranged in the vertical interiors of the laminated substrate close to the four corners, the laminated substrate comprises an epoxy resin bonding layer A, a phenolic paper layer A, an epoxy resin bonding layer B and a phenolic paper layer B, the lower end of the epoxy resin bonding layer A is provided with the phenolic paper layer A, the upper end of the epoxy resin bonding layer A is fixedly connected with the copper foil surface sheet, the lower end of the phenolic paper layer A is provided with the epoxy resin bonding layer B, the lower end of the epoxy resin bonding layer B is provided with the phenolic paper layer B, and the internal reinforcing mechanisms comprise a circular sheet type diffusion hole, a filling type epoxy resin and a cylindrical type filling hole, the lower extreme in wafer formula diffusion hole is provided with cylinder formula filling hole, wafer formula diffusion hole sets up inside epoxy adhesive linkage A upper segment, epoxy adhesive linkage A, phenolic paper layer A, epoxy adhesive linkage B and phenolic paper layer B are run through to cylinder formula filling hole is vertical, the inside in wafer formula diffusion hole and cylinder formula filling hole is provided with filled epoxy.
Preferably, the outer wall of the lower end of the copper foil surface sheet is completely attached and fixed with the outer wall of the upper end of the epoxy resin bonding layer A, and the outer wall of the upper end of the copper foil surface sheet is a mirror-surface smooth outer wall.
Preferably, the copper foil surface sheet and the laminated substrate can be bent at a small angle after being laminated and compounded, and the copper foil surface sheet and the peripheral outer wall of the laminated substrate are respectively vertically aligned.
Preferably, the epoxy resin bonding layer A and the epoxy resin bonding layer B as well as the phenolic paper layer A and the phenolic paper layer B are respectively identical in material composition, shape and size, and the thicknesses of the epoxy resin bonding layer A and the epoxy resin bonding layer B are smaller than those of the phenolic paper layer A and the phenolic paper layer B.
Preferably, the filled epoxy resin is the same as the epoxy resin bonding layer A and the epoxy resin bonding layer B in material composition, and the filled epoxy resin is respectively bonded and fixed with the epoxy resin bonding layer A, the phenolic paper layer A, the epoxy resin bonding layer B and the phenolic paper layer B in the wafer type diffusion hole and the cylindrical filling hole.
Compared with the prior art, the utility model provides a high punching shearing nature phenolic paper base covers copper foil laminate possesses following beneficial effect:
1. the utility model discloses a novel internal strengthening mechanism is added in the vertical inner part of the phenolic paper base copper-clad laminate close to four corners, and each internal strengthening mechanism not only can play the role of reinforcing and connecting each layer in the laminated substrate, but also can lead the copper foil surface sheet to be bonded and fixed on the outer wall of the upper end of the laminated substrate more firmly, thereby greatly increasing the use stability and firmness of the whole phenolic paper base copper-clad laminate and simultaneously increasing the service life of the whole phenolic paper base copper-clad laminate;
2. the utility model discloses an inside strengthening mechanism is mainly by circle piece formula diffusion hole, filled type epoxy and cylinder formula filling hole constitute, wherein the vertical epoxy adhesive linkage A that runs through in cylinder formula filling hole, phenol-formaldehyde ply A, epoxy adhesive linkage B and phenol-formaldehyde ply B, circle piece formula diffusion hole then sets up inside the first section of epoxy adhesive linkage A, and the cross sectional area in circle piece formula diffusion hole is far greater than the cross sectional area in cylinder formula filling hole, and it has filled type epoxy to fill in the inside packing in circle piece formula diffusion hole and cylinder formula filling hole, and filled type epoxy then can respectively with the copper foil table piece after solidifying, epoxy adhesive linkage A, phenol-formaldehyde ply A, epoxy adhesive linkage B and phenol-formaldehyde ply B bond fixedly, then can make the table piece like this, epoxy adhesive linkage A, phenol-formaldehyde ply A, epoxy adhesive linkage B and phenol-formaldehyde ply B laminate after compound each other through filled type epoxy reinforcement after connecting Can bond more firmly and tightly, thereby greatly increasing the use strength and the use stability of the whole phenolic paper base copper clad laminate.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:
FIG. 1 is a schematic view of the external three-dimensional structure of the high punching and shearing phenolic paper-based copper-clad laminate provided by the present invention;
fig. 2 is a schematic structural view of a lamination mode of the laminated substrate according to the present invention;
FIG. 3 is a schematic view of the vertical cross-sectional structure of the high punching and shearing phenolic paper-based copper clad laminate provided by the present invention;
fig. 4 is a schematic view of a vertical cross-sectional structure of the internal reinforcing mechanism provided by the present invention;
in the figure: 1. mounting holes; 2. laminating the substrate; 3. a copper foil surface sheet; 4. an epoxy resin bonding layer A; 5. a phenolic paper layer A; 6. an epoxy resin bonding layer B; 7. a phenolic paper layer B; 8. an internal reinforcement mechanism; 9. a wafer-type diffusion hole; 10. a filled epoxy resin; 11. and (5) filling the hole in a cylindrical mode.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the high-punching-shearing-performance phenolic paper-based copper-clad laminate comprises a laminate substrate 2 and a copper foil surface sheet 3, wherein the copper foil surface sheet 3 is installed on the outer wall of the upper end of the laminate substrate 2, mounting holes 1 penetrate through vertical inner parts, close to four corners, of the copper foil surface sheet 3 and the laminate substrate 2, the outer wall of the lower end of the copper foil surface sheet 3 is completely attached and fixed with the outer wall of the upper end of an epoxy resin bonding layer A4, the outer wall of the upper end of the copper foil surface sheet 3 is a mirror-surface-type smooth outer wall, internal reinforcing mechanisms 8 are arranged inside the laminate substrate 2, close to the four corners, of the laminate substrate 2, the laminate substrate 2 comprises an epoxy resin bonding layer A4, a phenolic paper layer A5, an epoxy resin bonding layer B6 and a phenolic paper layer B7, small-angle bending operation can be carried out after the copper foil surface sheet 3 and the laminate substrate 2 are laminated and compounded, the copper foil surface sheet 3 and the peripheral outer walls of the laminate substrate 2 are respectively vertically flush, the epoxy resin bonding layer A4 and the epoxy resin bonding layer B6, the phenolic paper layer A5 and the phenolic paper layer B7 are respectively in material composition and shape and size are respectively Similarly, the thicknesses of the epoxy resin bonding layer A4 and the epoxy resin bonding layer B6 are smaller than those of the phenolic paper layer A5 and the phenolic paper layer B7, the filled epoxy resin 10, the epoxy resin bonding layer A4 and the epoxy resin bonding layer B6 are the same in material composition, and the filled epoxy resin 10 is bonded and fixed with the epoxy resin bonding layer A4, the phenolic paper layer A5, the epoxy resin bonding layer B6 and the phenolic paper layer B7 respectively in the wafer type diffusion hole 9 and the cylindrical type filling hole 11. Therefore, the epoxy resin can be bonded with various materials, and the combination of the epoxy resin and the phenolic paper can increase the use stability and firmness of the whole high-punching-shearing-property phenolic paper-based copper-clad laminate, thereby greatly increasing the service life of the whole high-punching-shearing-property phenolic paper-based copper-clad laminate, the lower end of the epoxy resin bonding layer A4 is provided with a phenolic paper layer A5, the upper end of the epoxy resin bonding layer A4 is fixedly connected with the copper foil surface sheet 3, the lower end of the phenolic paper layer A5 is provided with an epoxy resin bonding layer B6, the lower end of the epoxy resin bonding layer B6 is provided with a phenolic paper layer B7, the internal reinforcing mechanism 8 comprises a disc-type diffusion hole 9, a filling-type epoxy resin 10 and a cylindrical-type filling hole 11, the lower end of the disc-type diffusion hole 9 is provided with a cylindrical-type filling hole 11, the disc-type diffusion hole 9 is arranged in the upper half section of the epoxy resin bonding layer A4, and the cylindrical-type filling hole 11 vertically penetrates through the epoxy resin bonding layer A4, Phenol-formaldehyde paper layer A5, epoxy adhesive linkage B6 and phenol-formaldehyde paper layer B7, the inside of wafer formula diffusion hole 9 and cylinder formula filling hole 11 is provided with filled epoxy 10, each inside strengthening mechanism 8 not only can play the effect of consolidating the connection to each layer in the inside of laminate substrate 2, also can make copper foil table 3 can be more firm the bonding fix on laminate substrate 2's upper end outer wall simultaneously, thereby can be very big increase whole phenol-formaldehyde paper base copper clad laminate's stability in use and fastness.
The utility model discloses a theory of operation and use flow: the utility model discloses after having installed, when using high punching shear nature phenolic paper base copper clad laminate in production, at first need produce as the laminated substrate 2 of main panel, and when producing laminated substrate 2, need be epoxy adhesive linkage A4, phenolic paper layer A5, epoxy adhesive linkage B6 and phenolic paper layer B7 top-down laminating and placing, then with the mode of lamination epoxy adhesive linkage A4, phenolic paper layer A5, epoxy adhesive linkage B6 and phenolic paper layer B7 laminating complex be off-the-shelf laminated substrate 2, and then need place the upper end of laminated substrate 2 to copper foil table 3 after laminated substrate 2 makes, copper foil table 3 then can laminate each other with the epoxy adhesive linkage A4 of laminated substrate 2 this moment, then with the mode of laminating complex copper foil table 3 complex in the upper end of laminated substrate 2, thereby make laminated substrate 2 and copper foil table 3 form into a firm whole and form into complete high punching shear nature phenolic paper base copper clad laminate 3 And (4) the foil laminated board, namely the complete high-punching shearing phenolic paper base copper clad foil laminated board can be put into use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. High punching shearing nature phenolic paper base copper clad laminate, including laminated substrate (2) and copper foil surface piece (3), its characterized in that: the copper foil surface sheet (3) is arranged on the outer wall of the upper end of the laminated substrate (2), the copper foil surface sheet (3) and the laminated substrate (2) are provided with mounting holes (1) through the vertical inner parts close to the four corners, the laminated substrate (2) is provided with inner reinforcing mechanisms (8) close to the vertical inner parts of the four corners, the laminated substrate (2) comprises an epoxy resin bonding layer A (4), a phenolic paper layer A (5), an epoxy resin bonding layer B (6) and a phenolic paper layer B (7), the lower end of the epoxy resin bonding layer A (4) is provided with the phenolic paper layer A (5), the upper end of the epoxy resin bonding layer A (4) is fixedly connected with the copper foil surface sheet (3), the lower end of the phenolic paper layer A (5) is provided with the epoxy resin bonding layer B (6), the lower end of the epoxy resin bonding layer B (6) is provided with the phenolic paper layer B (7), the internal reinforcing mechanism (8) comprises a wafer type diffusion hole (9), filled epoxy resin (10) and a cylindrical filling hole (11), the cylindrical filling hole (11) is arranged at the lower end of the wafer type diffusion hole (9), the wafer type diffusion hole (9) is arranged in the upper half section of an epoxy resin bonding layer A (4), the cylindrical filling hole (11) vertically penetrates through the epoxy resin bonding layer A (4), a phenolic paper layer A (5), an epoxy resin bonding layer B (6) and a phenolic paper layer B (7), and the filled epoxy resin (10) is arranged in the wafer type diffusion hole (9) and the cylindrical filling hole (11).
2. The high punch shear phenolic paper-based copper clad laminate of claim 1, wherein: the lower end outer wall of copper foil table (3) and the upper end outer wall of epoxy adhesive linkage A (4) are complete to be laminated and fixed, the upper end outer wall of copper foil table (3) is mirror surface type smooth outer wall.
3. The high punch shear phenolic paper-based copper clad laminate of claim 1, wherein: the copper foil surface sheet (3) and the laminated substrate (2) can be subjected to small-angle bending operation after lamination and compounding, and the peripheral outer walls of the copper foil surface sheet (3) and the laminated substrate (2) are respectively vertically aligned.
4. The high punch shear phenolic paper-based copper clad laminate of claim 1, wherein: the epoxy resin adhesive layer A (4) and the epoxy resin adhesive layer B (6) as well as the phenolic paper layer A (5) and the phenolic paper layer B (7) are respectively identical in material composition, shape and size, and the thicknesses of the epoxy resin adhesive layer A (4) and the epoxy resin adhesive layer B (6) are smaller than those of the phenolic paper layer A (5) and the phenolic paper layer B (7).
5. The high punch shear phenolic paper-based copper clad laminate of claim 1, wherein: the material composition of filled epoxy resin (10) is the same as that of epoxy resin bonding layer A (4) and epoxy resin bonding layer B (6), and the filled epoxy resin (10) is uniformly bonded and fixed with epoxy resin bonding layer A (4), phenolic paper layer A (5), epoxy resin bonding layer B (6) and phenolic paper layer B (7) in wafer type diffusion hole (9) and cylindrical filling hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023129102.3U CN214727056U (en) | 2020-12-22 | 2020-12-22 | High-punching-shearing phenolic paper-based copper-clad laminate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023129102.3U CN214727056U (en) | 2020-12-22 | 2020-12-22 | High-punching-shearing phenolic paper-based copper-clad laminate |
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| CN214727056U true CN214727056U (en) | 2021-11-16 |
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| CN202023129102.3U Active CN214727056U (en) | 2020-12-22 | 2020-12-22 | High-punching-shearing phenolic paper-based copper-clad laminate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828389A (en) * | 2022-05-07 | 2022-07-29 | 深圳市易迅达电子科技有限责任公司 | OIS motor rigid-flex board |
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2020
- 2020-12-22 CN CN202023129102.3U patent/CN214727056U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828389A (en) * | 2022-05-07 | 2022-07-29 | 深圳市易迅达电子科技有限责任公司 | OIS motor rigid-flex board |
| CN114828389B (en) * | 2022-05-07 | 2023-07-28 | 深圳市易迅达电子科技有限责任公司 | OIS motor soft and hard combination board |
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