CN201341273Y - Multilayer printed circuit board with functional resin and metal foil composite - Google Patents
Multilayer printed circuit board with functional resin and metal foil composite Download PDFInfo
- Publication number
- CN201341273Y CN201341273Y CNU2008202066605U CN200820206660U CN201341273Y CN 201341273 Y CN201341273 Y CN 201341273Y CN U2008202066605 U CNU2008202066605 U CN U2008202066605U CN 200820206660 U CN200820206660 U CN 200820206660U CN 201341273 Y CN201341273 Y CN 201341273Y
- Authority
- CN
- China
- Prior art keywords
- layer
- functional resin
- copper foil
- multilayer printed
- glass fibre
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model belongs to electronic board technical field, in particular to a multilayer printed circuit board with functional resin and metal foil composite, which sequentially comprises a copper foil layer (1), a functional resin layer (2), a glass fiber prepreg layer (3), an inner core board layer (4), a glass fiber prepreg layer (3), a functional resin layer (2) and a copper foil layer (1) from top to bottom; as the multilayer printed circuit board adopts functional resin and metal foil composite, the structural defect of common multilayer board is solved; the functional coating requirement of multilayer board is realized and the relative creep track index is increased and the separation degree of copper foil is increased.
Description
Technical field:
The utility model belongs to the electron plate technical field, the multilayer printed wiring board of particularly a kind of functional resin and metal forming compound.
Background technology:
The structure of multilayer printed wiring board is by electrolytic copper foil or rolled copper foil, glass fibre prepreg and core material carry out matched combined according to needed dielectric insulation layer and production board thickness, send into then that laminating machine is hot-forming to form, as shown in Figure 1, the matched combined level of this plate is: the order that is arranged in order from top to bottom is copper foil layer 1, the glass fibre preimpregnation bed of material 2, core material 3, the glass fibre preimpregnation bed of material 2, copper foil layer 1, and there is following deficiency in the structure matched combined of this multilayer printed wiring board:
Along with the matrix resin of glass fibre prepreg and core material is different, the multi-layer sheet outer copper foil peel strength of making alters a great deal, for matrixes such as the epoxy resin-base that lies prostrate clarkes curing by more and more employing promises at present, polyphenylene oxide, hydrocarbon resins, the adhesion strength that occurs Copper Foil easily is on the low side, even can not reach the requirement of product standard.
The outer copper foil thickness that multi-layer sheet uses is more and more thinner, it is main that copper thickness is reduced to 18 microns (or 1/20Z) by 35 microns (or 10Z), 12 microns (or 1/30Z) even thinner Copper Foil use and increase, when usual manner adopts the direct matched combined of Copper Foil and glass fibre prepreg, because glass fibre prepreg surface ratio is more coarse, cause the position local deformation of copper foil surface correspondence easily, thereby the multiple-plate Copper Foil visual defects rate that causes making rises obviously, has reduced qualification rate.
When high frequency plate or high density interconnect multi-layer sheet used the Copper Foil of low profile degree, it was on the low side to face the Copper Foil peel strength equally, even can not reach the requirement of product standard.Multi-layer sheet producer is in order to improve the problems referred to above, the high alligatoring degree Copper Foil that adopts Copper Foil manufacturer to provide improves the Copper Foil adhesion strength, but the amplitude that improves is limited, still can not reach requirement under many situations, and multi-layer sheet uses high alligatoring degree Copper Foil etching risk not to the utmost when circuit is made to strengthen, and causes insulating reliability hidden danger.
Glass fibre prepreg and core material that multi-layer sheet uses adopt single matrix resin, though can realize the intrinsic characteristic of matrix resin, then there is deficiency and lacks effective and feasible method but obtain pointed functional coat, as realizing multi-layer sheet surface high relative discharge tracking index (CTI) function, improving Copper Foil peel strength function.
The utility model content:
The purpose of this utility model is the deficiency that exists at the conventional plate structure of multilayer printed wiring board, and a kind of a kind of functional resin of new matched combined structure and the multilayer printed wiring board of metal forming compound are provided.
To achieve these goals, the utility model adopts following matched combined structure: the order that is arranged in order from top to bottom is:
Copper foil layer;
The functional resin layer;
At least one layer of the glass fibre preimpregnation bed of material;
The core material layer;
At least one layer of the glass fibre preimpregnation bed of material;
The functional resin layer;
Copper foil layer;
The functional resin layer is coated on the copper foil layer, and promptly the functional resin layer contacts with the glass fibre preimpregnation bed of material, and above-mentioned sandwich construction is sent into laminating machine, and conventional method is hot-forming to be the multilayer printed wiring board of a kind of functional resin and metal forming compound.
The beneficial effects of the utility model are: the utility model adopts the multilayer printed wiring board of the structure of functional resin and metal forming compound, solved the deficiency that the multi-layer sheet conventional structure exists, comprise that the Copper Foil cohesive force is on the low side, the defect problem on multi-layer sheet manufacturing copper foil surface, realized the requirement of multi-layer sheet surface-functional coating, as improved relative discharge tracking index (CTI) level, increased the Copper Foil peel strength.
Description of drawings:
Fig. 1 is the structural representation of existing multilayer printed wiring board;
Fig. 2 is a structural representation of the present utility model.
Embodiment:
In order further to describe the utility model, illustrate with specific embodiment below in conjunction with accompanying drawing:
See Fig. 2, the structure that is combined from top to bottom is: copper foil layer 1, functional resin layer 2, the glass fibre preimpregnation bed of material 3, core material layer 4, the glass fibre preimpregnation bed of material 3, functional resin layer 2, copper foil layer 1, wherein functional resin layer 2 is coated on the copper foil layer 1, this sandwich construction is sent into laminating machine, and conventional method is hot-forming to be a kind of functional resin and metal forming compound multilayer printed wiring board.
The above only is preferred embodiment of the present utility model, so all equivalences of doing according to the described structure of the utility model patent claim, feature and principle change or modify, is included in the utility model patent claim.
Claims (5)
1, the multilayer printed wiring board of a kind of functional resin and metal forming compound, comprise copper foil layer (1), the glass fibre preimpregnation bed of material (3), core material layer (4), it is characterized in that: also comprise functional resin layer (2), be arranged in order from top to bottom the order be: copper foil layer (1), functional resin layer (2), the glass fibre preimpregnation bed of material (3), core material layer (4), the glass fibre preimpregnation bed of material (3), functional resin layer (2), copper foil layer (1).
2, the multilayer printed wiring board of a kind of functional resin according to claim 1 and metal forming compound is characterized in that: described functional resin layer (2) is coated on the copper foil layer (1).
3, the multilayer printed wiring board of a kind of functional resin according to claim 1 and metal forming compound is characterized in that: core material (4) is one deck at least, and is bonding with glass fibre prepreg (3) between the core material (4).
4, the multilayer printed wiring board of a kind of functional resin according to claim 1 and metal forming compound, it is characterized in that: the described glass fibre preimpregnation bed of material (3) is in core material layer (4) upper and lower surface, and the glass fibre preimpregnation bed of material (3) of upper and lower surface is at least one deck.
5, the multilayer printed wiring board of a kind of functional resin according to claim 1 and 2 and metal forming compound is characterized in that: functional resin layer (2) contacts with the glass fibre preimpregnation bed of material (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202066605U CN201341273Y (en) | 2008-12-31 | 2008-12-31 | Multilayer printed circuit board with functional resin and metal foil composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202066605U CN201341273Y (en) | 2008-12-31 | 2008-12-31 | Multilayer printed circuit board with functional resin and metal foil composite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201341273Y true CN201341273Y (en) | 2009-11-04 |
Family
ID=41236816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202066605U Expired - Lifetime CN201341273Y (en) | 2008-12-31 | 2008-12-31 | Multilayer printed circuit board with functional resin and metal foil composite |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201341273Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102014590A (en) * | 2010-12-18 | 2011-04-13 | 广东生益科技股份有限公司 | Production method of multi-layer printed circuit board and multi-layer printed circuit board |
-
2008
- 2008-12-31 CN CNU2008202066605U patent/CN201341273Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102014590A (en) * | 2010-12-18 | 2011-04-13 | 广东生益科技股份有限公司 | Production method of multi-layer printed circuit board and multi-layer printed circuit board |
| CN102014590B (en) * | 2010-12-18 | 2012-07-25 | 广东生益科技股份有限公司 | Production method of multi-layer printed circuit board and multi-layer printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206650912U (en) | High shielding EMI screened films | |
| CN101415296B (en) | Structure for covering copper plate | |
| CN102009514B (en) | Manufacturing method of sandwich plate | |
| CN101665017B (en) | Prepreg having nonsymmetrical resin layer thickness and application thereof | |
| CN109996400A (en) | A method of improving asymmetric folded structure pcb board and sticks up | |
| CN201341273Y (en) | Multilayer printed circuit board with functional resin and metal foil composite | |
| CN101460013A (en) | Composite article for functional resin and metal foil and multilayered printed circuit board manufacturing method using the same | |
| CN101868118B (en) | High-frequency circuit substrate and production method thereof | |
| CN201797646U (en) | Printed circuit board (PCB) structure capable for improving difference of dimensional stability of multilayer board | |
| CN201341272Y (en) | Copper-clad plate with high anti-creep track property | |
| CN208158981U (en) | Heavy copper circuit board | |
| CN103717016B (en) | A kind of anti-hierarchical process of silver-plated circuit board of multilayer high-frequency electrical | |
| CN110366330A (en) | FPC multi-layer board and technique based on high frequency FRCC Yu high frequency dual platen | |
| CN102909912A (en) | Insulating plate and preparation method thereof | |
| CN208128661U (en) | FPC multi-layer board based on high frequency FRCC Yu high frequency dual platen | |
| CN103578747A (en) | Integrally-arranged capacitor and manufacturing method thereof | |
| CN201501140U (en) | Prepreg with resin beds of asymmetric thicknesses | |
| CN202053608U (en) | Copper-clad plate with novel structure | |
| CN206100611U (en) | Printed circuit board of two blind holes in area | |
| CN203267351U (en) | Heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate | |
| CN217983388U (en) | Semiconductor substrate of LED thin film chip | |
| CN221010400U (en) | Buried hole PCB | |
| CN204810683U (en) | Flexible branching multilayer circuit board | |
| CN220441000U (en) | Epoxy double-sided aluminum foil plate | |
| TWI679121B (en) | Flexible printed circuits and method for preparing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091104 |