CN201341272Y - Copper-clad plate with high anti-creep track property - Google Patents
Copper-clad plate with high anti-creep track property Download PDFInfo
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- CN201341272Y CN201341272Y CNU2008202066592U CN200820206659U CN201341272Y CN 201341272 Y CN201341272 Y CN 201341272Y CN U2008202066592 U CNU2008202066592 U CN U2008202066592U CN 200820206659 U CN200820206659 U CN 200820206659U CN 201341272 Y CN201341272 Y CN 201341272Y
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Abstract
The utility model belongs to copper-clad plate technical field, in particular to a copper-clad plate with high anti-creep track property, which comprises at least an insulation plate layer, at least a resin coated copper foil layer, wherein the resin coated copper foil layer is superposed with the insulation plate layer through thermal compression so that the problems that glass fiber cloth prepreg or prepreg of other reinforced material is used to cause dried flower situation or dew cloth grains and hard control of thickness and accuracy are overcome; besides, the resin coated copper foil material is thin and is convenient in fabricating thin copper-clad copper plate with CTI more than or equal to 400V or single surface, dual-surface or multilayer printed circuit boards; meanwhile, the copper-clad plate with high anti-creep track property has long storage time, is convenient in use and management.
Description
Technical field:
The utility model belongs to the copper-clad plate technical field, particularly a kind of copper-clad plate with high anti creepage trace characteristic.
Background technology:
In order to adapt to more and more stricter electrical security requirement, electronic product has proposed the performance requirement of high proof tracking or high anti creepage trace index (CTI) to baseplate material, the hierarchy level of CTI 〉=400V of claiming has at present become more and more general, in order to satisfy this development need, the traditional solution of copper-clad plate base material is the old process of manufacturing according to copper-clad plate, exploitation has the resin combination lay-up of high CTI characteristic and produces the prepreg glass fabric prepreg with high CTI characteristic, adopt this high CTI prepreg to replace common prepreg then and be covered with electrodeposited copper foil layer compacting as lining and make copper-clad plate, reach the requirement of the needed relatively tracking index characteristic of substrate.
Traditional copper-clad plate mode of production of above-mentioned employing glue lay-up prepares high CTI prepreg and has some shortcomings, because the reinforcing material of prepreg is not easy to soak into, causes using the copper-clad plate of its lamination preparation to be prone to dried flower or war proclamation line problem; The semi-solid preparation degree of prepreg is not easy control simultaneously, makes prepreg mobile big in laminates copper-clad plate forming process, has reduced the thickness control accuracy of copper-clad plate; Also have, used the prepreg thickness of reinforcing material big, it is very difficult to produce slim copper-clad plate, and the storage period of this prepreg is also shorter, is unfavorable for management control, easily causes the material degradation, makes that the copper-clad plate qualification rate of output is low, and useful life is short.
The utility model content:
The purpose of this utility model is at the deficiencies in the prior art, and a kind of copper-clad plate with high anti creepage trace characteristic is provided.
For achieving the above object, the utility model adopts following technical scheme:
A kind of copper-clad plate with high anti creepage trace characteristic comprises that at least one side is resin coated copper foil layer and one deck layer of insulation board at least, and resin coated copper foil layer and layer of insulation board are superimposed hot-forming.
The one side of described copper-clad plate is the resin coated copper foil layer.
Two faces of described copper-clad plate all are the resin coated copper foil layer, and layer of insulation board is between the resin coated copper foil layer.
Described resin coated copper foil layer is for evenly applying the resin combination layer of last layer CTI 〉=400V in the one side of Copper Foil.
The resin combination layer thickness of described resin coated copper foil layer is 30～100 microns.
The copper foil layer thickness of described resin coated copper foil layer is 12～105 microns.
The utility model beneficial effect is: the utility model comprises at least one deck layer of insulation board, one deck resin coated copper foil layer at least, resin coated copper foil layer and layer of insulation board are superimposed hot-forming, overcome the problem of dried flower that the prepreg that uses the glass fabric prepreg or use other reinforcing materials causes or war proclamation line, thickness and precision control difficulty, and described resin coated copper foil material is thin, convenient slim copper-clad plate and single, double or the multilayer printed wiring board of making CTI 〉=400V, and the material storage period long, use flexibly, convenient management.
Description of drawings:
Fig. 1 is the cross section structure schematic diagram of the utility model embodiment 1;
Fig. 2 is the cross section structure schematic diagram of the utility model embodiment 2;
Fig. 3 is the cross section structure schematic diagram of the utility model embodiment 3;
Fig. 4 is the cross section structure schematic diagram of the utility model embodiment 4.
Embodiment:
In order further to describe the utility model, illustrate with specific embodiment below in conjunction with accompanying drawing: see accompanying drawing 1～4,
A kind of copper-clad plate with high anti creepage trace characteristic comprises that at least one side is resin coated copper foil layer (2) and one deck layer of insulation board (1) at least, and resin coated copper foil layer (2) and layer of insulation board (1) are superimposed hot-forming.Described layer of insulation board 1 is an epoxy glass cloth prepreg, a kind of in epoxy glass paper prepreg core material or the epoxy wood pulp paper prepreg.Described resin coated copper foil layer 2 is for evenly applying the resin combination layer 22 of last layer CTI 〉=400V in the one side of copper foil layer 21.The thickness of the resin combination layer 22 of described resin coated copper foil layer 2 is 30～100 microns.The thickness of the copper foil layer 21 of described resin coated copper foil layer 2 is 12～105 microns.
See Fig. 1, this is embodiment 1 of the present utility model, and the one side of described copper-clad plate is resin coated copper foil layer (2), and described layer of insulation board (1) is an epoxy glass cloth prepreg insulating barrier, and resin coated copper foil layer (2) is superimposed hot-forming with layer of insulation board (1).Get 1 thickness and be 35 microns, size and be 380 millimeters * 380 millimeters sheet electrodeposited copper foil layer (21) (company of Malaysian Mitsui Metal Co., Ltd. product), resin combination composition glue liquid with CTI 〉=400V of making is uniformly coated on the alligatoring face of copper foil layer (21) then, form resin combination layer (22), coating weight be controlled at about 120 grams/square metre; Put into oven drying then, baking temperature is set 155 ℃, and 5 minutes drying times, resin combination layer (22) thickness of dried resin coated copper foil layer (2) is about 50 microns, has made the resin coated copper foil layer (2) of CTI 〉=400V; 3 big little be that the epoxy glass cloth prepreg insulating barrier (1) of 380 millimeters * 380 millimeters sheets stacks neatly, one side stacks resin coated copper foil layer (2), and resin combination layer (22) is contacted with prepreg layer of insulation board (1), put into the hot press lamination after finishing collocation, between 175 ℃ of the hot pressing temperatures, the about 30kgf/cm of hot pressing pressure
2, about 1 hour of hot pressing time.After hot-forming, promptly get the single-side coated copper plate of CTI 〉=400V.
See Fig. 2, this is embodiment 2 of the present utility model, and the two sides of described copper-clad plate all is a resin coated copper foil layer (2), and layer of insulation board (1) is between resin coated copper foil layer (2).Getting 2 thickness is 35 microns, wherein the making of resin coated copper foil layer (2) such as above-mentioned embodiment 1.3 big little be that the epoxy glass cloth prepreg layer of insulation board 1 of 400 millimeters * 400 millimeters sheets stacks neatly, the superimposed resin coated copper foil layer (2) on its two sides, and the resin combination layer (22) of resin coated copper foil layer (2) is contacted with prepreg layer of insulation board (1), put into the hot press lamination after finishing collocation, between 175 ℃ of the hot pressing temperatures, the about 30kgf/cm of hot pressing pressure
2, about 1 hour of hot pressing time.After hot-forming, promptly get the double face copper of CTI 〉=400V.
See Fig. 3, this is embodiment 3 of the present utility model, and this is embodiment 3 of the present utility model, and described resin coated copper foil layer 2 is two-layer, and layer of insulation board (1) is between resin coated copper foil layer (2).Getting 2 thickness is 12 microns, wherein the making of resin coated copper foil layer (2) such as above-mentioned embodiment 1.4 big little be that the epoxy glass cloth prepreg glass fabric prepreg layer of insulation board 1 of 350 millimeters * 350 millimeters sheets stacks neatly, the superimposed resin coated copper foil layer (2) on the two sides, and resin combination layer (22) is contacted with layer of insulation board (1) epoxy glass cloth prepreg glass fabric prepreg, put into the hot press lamination after finishing collocation, between 170 ℃ of the hot pressing temperatures, the about 30kgf/cm of hot pressing pressure
2, about 1 hour of hot pressing time.After hot-forming, promptly get the double face copper of CTI 〉=400V.
See accompanying drawing 4, this is embodiment 4 of the present utility model, and described resin coated copper foil layer 2 is two-layer, and layer of insulation board 1 is between resin coated copper foil layer 2.Getting 2 thickness is 105 microns, wherein the making of resin coated copper foil layer (2) such as above-mentioned embodiment 1.5 big little be that the epoxy glass cloth prepreg glass fabric prepreg layer of insulation board 1 of 350 millimeters * 350 millimeters sheets stacks neatly, the superimposed resin coated copper foil layer in two sides (2), resin combination layer (22) is contacted with layer of insulation board (1) epoxy glass cloth prepreg glass fabric prepreg, put into the hot press lamination after finishing collocation, between 180 ℃ of the hot pressing temperatures, the about 30kgf/cm of hot pressing pressure
2, about 1 hour of hot pressing time.After hot-forming, promptly get the copper-clad plate of CTI 〉=400V.
Certainly, the embodiment of the above, it is preferred embodiments of the present utility model, be not to limit the utility model practical range, so all equivalences of doing according to the described structure of the utility model claim, feature and principle change or modify, and are included in the utility model claim.
Claims (6)
1, a kind of copper-clad plate with high anti creepage trace characteristic is characterized in that: comprise that at least one side is resin coated copper foil layer (2) and one deck layer of insulation board (1) at least, resin coated copper foil layer (2) and layer of insulation board (1) are superimposed hot-forming.
2, a kind of copper-clad plate with high anti creepage trace characteristic according to claim 1 is characterized in that: the wherein one side of described copper-clad plate is resin coated copper foil layer (2).
3, a kind of copper-clad plate with high anti creepage trace characteristic according to claim 1 is characterized in that: the two sides of described copper-clad plate all is a resin coated copper foil layer (2), and layer of insulation board (1) is between resin coated copper foil layer (2).
4, according to claim 1 or 2 or 3 described a kind of copper-clad plates with high anti creepage trace characteristic, it is characterized in that: described resin coated copper foil layer (2) is for evenly applying the resin combination layer (22) of last layer CTI 〉=400V in the one side of copper foil layer (21).
5, a kind of copper-clad plate with high anti creepage trace characteristic according to claim 4 is characterized in that: resin combination layer (22) thickness of described resin coated copper foil layer (2) is 30～100 microns.
6, a kind of copper-clad plate with high anti creepage trace characteristic according to claim 4 is characterized in that: copper foil layer (21) thickness of described resin coated copper foil layer (2) is 12～105 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202066592U CN201341272Y (en) | 2008-12-31 | 2008-12-31 | Copper-clad plate with high anti-creep track property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202066592U CN201341272Y (en) | 2008-12-31 | 2008-12-31 | Copper-clad plate with high anti-creep track property |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201341272Y true CN201341272Y (en) | 2009-11-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202066592U Expired - Lifetime CN201341272Y (en) | 2008-12-31 | 2008-12-31 | Copper-clad plate with high anti-creep track property |
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| Country | Link |
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| CN (1) | CN201341272Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102009506A (en) * | 2010-07-16 | 2011-04-13 | 广东生益科技股份有限公司 | Double-surface flexible copper-clad plate and manufacturing method thereof |
| CN102529232A (en) * | 2011-12-30 | 2012-07-04 | 广东生益科技股份有限公司 | Double-sided copper-clad plate and manufacturing method thereof |
| CN107172807A (en) * | 2017-06-09 | 2017-09-15 | 深圳中富电路有限公司 | A kind of printed circuit board |
| CN114683637A (en) * | 2020-12-30 | 2022-07-01 | 广东生益科技股份有限公司 | Organic fiber paper-based metal foil-clad laminated board and preparation method and application thereof |
-
2008
- 2008-12-31 CN CNU2008202066592U patent/CN201341272Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102009506A (en) * | 2010-07-16 | 2011-04-13 | 广东生益科技股份有限公司 | Double-surface flexible copper-clad plate and manufacturing method thereof |
| CN102529232A (en) * | 2011-12-30 | 2012-07-04 | 广东生益科技股份有限公司 | Double-sided copper-clad plate and manufacturing method thereof |
| CN102529232B (en) * | 2011-12-30 | 2014-08-13 | 广东生益科技股份有限公司 | Double-sided copper-clad plate and manufacturing method thereof |
| CN107172807A (en) * | 2017-06-09 | 2017-09-15 | 深圳中富电路有限公司 | A kind of printed circuit board |
| CN114683637A (en) * | 2020-12-30 | 2022-07-01 | 广东生益科技股份有限公司 | Organic fiber paper-based metal foil-clad laminated board and preparation method and application thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091104 |
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| CX01 | Expiry of patent term |