CN201341272Y - Copper-clad plate with high tracking resistance - Google Patents

Abstract

The utility model belongs to the technical field of the copper-clad plate, in particular to copper-clad plate with high tracking resistance characteristic, including at least one deck insulation board layer, at least one deck resin coated copper foil layer, resin coated copper foil layer and insulation board range upon range of hot briquetting have overcome the dry flower that the preimpregnation material that uses glass fiber cloth preimpregnation material or use other reinforcing material's preimpregnation material leads to or have revealed the problem of cloth line, thickness accuracy control difficulty, moreover resin coated copper foil material thin, make things convenient for the slim copper-clad plate that CTI is greater than or equal to 400V and single, two-sided or multilayer printed wiring board, long, the use is nimble, convenient management in addition to the material.

Description

A copper clad laminate with high tracking resistance

Technical field:

The utility model belongs to the technical field of copper-clad laminates, in particular to a copper-clad laminate with high tracking resistance.

Background technique:

In order to meet the increasingly stringent electrical safety requirements, electronic products have proposed high tracking resistance or high tracking index (CTI) performance requirements for substrate materials. At present, the level of CTI ≥ 400V has changed. It is becoming more and more common. In order to meet this development need, the traditional solution for copper-clad laminate substrates is to develop resin compositions with high CTI characteristics and impregnate reinforcing materials to produce high-CTI characteristics according to the conventional production process of copper-clad laminates. The prepreg glass fiber cloth prepreg is used, and then this high CTI prepreg is used to replace the ordinary prepreg as the fabric, covered with electrolytic copper foil and laminated to make a copper clad laminate, which meets the requirements of the comparative tracking index characteristics required by the substrate.

There are some disadvantages in the preparation of high CTI prepregs by using the traditional CCL production method of impregnating reinforcing materials with glue. Because the reinforcing materials of prepregs are not easy to soak, the copper clad laminates prepared by lamination are prone to dry flowers or exposed cloth lines. ; At the same time, the semi-curing degree of the prepreg is not easy to control, so that the fluidity of the prepreg is large during the molding process of the laminated copper clad laminate, which reduces the thickness control accuracy of the copper clad laminate; in addition, the prepreg using a reinforcing material The thickness is large, and it is very difficult to produce thin copper-clad laminates, and the storage period of this prepreg is relatively short, which is not conducive to management and control, and it is easy to cause material degradation, resulting in a low pass rate of the output copper-clad laminates and a short service life.

Utility model content:

The purpose of the utility model is to provide a copper clad laminate with high resistance to tracking and tracking for the deficiencies of the prior art.

In order to achieve the above object, the utility model adopts the following technical solutions:

A copper-clad laminate with high tracking resistance, comprising at least one side of a resin-coated copper foil layer and at least one insulation layer, and the resin-coated copper foil layer and the insulation layer are laminated and formed by thermocompression.

One side of the copper-clad laminate is a resin-coated copper foil layer.

Both sides of the copper-clad board are resin-coated copper foil layers, and the insulating plate layer is between the resin-coated copper foil layers.

The resin-coated copper foil layer is uniformly coated on one side of the copper foil with a resin composition layer with a CTI≥400V.

The thickness of the resin composition layer of the resin-coated copper foil layer is 30-100 microns.

The thickness of the copper foil layer of the resin-coated copper foil layer is 12-105 microns.

The beneficial effects of the utility model are as follows: the utility model comprises at least one layer of insulating board layer, at least one layer of resin-coated copper foil layer, and the resin-coated copper foil layer and the insulating board layer are laminated and hot-pressed, which overcomes the need to use glass fiber cloth prepreg Or the use of prepregs of other reinforcing materials can cause dry flowers or exposed cloth lines, and difficult control of thickness accuracy, and the resin-coated copper foil material is thin, which is convenient for making thin copper clad laminates with CTI ≥ 400V and single, double-sided or multiple multi-layer printed circuit board, and the material has a long storage period, flexible use and convenient management.

Description of drawings:

Fig. 1 is the cross-sectional structure schematic diagram of the utility model embodiment 1;

Fig. 2 is the cross-sectional structure schematic diagram of the utility model embodiment 2;

Fig. 3 is the schematic cross-sectional structure diagram of the utility model embodiment 3;

Fig. 4 is a schematic cross-sectional structure diagram of Embodiment 4 of the present utility model.

Detailed ways:

In order to describe the utility model further, illustrate with specific embodiment below in conjunction with accompanying drawing: See accompanying drawing 1～4,

A copper-clad laminate with high tracking resistance, comprising at least one side of a resin-coated copper foil layer (2) and at least one insulation layer (1), the resin-coated copper foil layer (2) and the insulation layer (1) ) laminated thermoforming. The insulating board layer 1 is one of epoxy glass fiber cloth prepreg, epoxy glass fiber paper prepreg core material or epoxy wood pulp paper prepreg. The resin-coated copper foil layer 2 is uniformly coated on one side of the copper foil layer 21 with a resin composition layer 22 with a CTI≥400V. The resin composition layer 22 of the resin-coated copper foil layer 2 has a thickness of 30-100 microns. The thickness of the copper foil layer 21 of the resin-coated copper foil layer 2 is 12-105 microns.

See Fig. 1, this is embodiment 1 of the present utility model, one side of described copper-clad board is coated with resin copper foil layer (2), and described insulating board layer (1) is epoxy glass fiber cloth prepreg insulating layer , the resin-coated copper foil layer (2) and the insulating plate layer (1) are laminated and hot-pressed. Take a sheet-shaped electrolytic copper foil layer (21) (product of Mitsui Metals Corporation, Malaysia) with a thickness of 35 microns and a size of 380 mm × 380 mm, and then evenly coat the prepared resin composition glue with CTI≥400V Cloth is placed on the roughened surface of the copper foil layer (21) to form a resin composition layer (22), and the coating amount is controlled at about 120 grams/square meter; then put into an oven for drying, the drying temperature is set at 155°C, and the drying time is After 5 minutes, the thickness of the resin composition layer (22) of the resin-coated copper foil layer (2) after drying was about 50 microns, and a resin-coated copper foil layer (2) with a CTI≥400V was obtained; the size of 3 sheets was 380 mm * 380 mm sheet-shaped epoxy glass fiber cloth prepreg insulation layer (1) is stacked neatly, and one side is stacked with a resin-coated copper foil layer (2), and the resin composition layer (22) and the prepreg insulation board The layers (1) are in contact, and after matching, put them into a hot press machine for lamination. The hot pressing temperature is between 175°C, the hot pressing pressure is about 30kgf/cm ² , and the hot pressing time is about 1 hour. After hot pressing, a single-sided copper clad laminate with CTI ≥ 400V is obtained.

See Fig. 2, this is embodiment 2 of the present utility model, both sides of described copper-clad board are all coated with resin copper foil layer (2), and insulating board layer (1) is between the copper foil layer (2) coated with resin. Take 2 pieces with a thickness of 35 microns, wherein the resin-coated copper foil layer (2) is made as in the above-mentioned embodiment 1. Stack 3 sheets of epoxy glass fiber cloth prepreg insulating board layer 1 with a size of 400 mm × 400 mm neatly, laminate the resin-coated copper foil layer (2) on both sides, and make the resin-coated copper foil layer The resin composition layer (22) of (2) is in contact with the prepreg insulating board layer (1), and after the matching is completed, it is placed in a hot press machine for lamination. The hot pressing temperature is between 175°C and the hot pressing pressure is about 30kgf/cm ² , The hot pressing time is about 1 hour. After hot pressing, a double-sided copper clad laminate with CTI ≥ 400V is obtained.

See Fig. 3, and this is embodiment 3 of the present utility model, and this is embodiment 3 of the present utility model, and described resin-coated copper foil layer 2 is two layers, and insulating plate layer (1) is coated with resin copper foil layer ( 2) Between. Take 2 pieces with a thickness of 12 microns, wherein the resin-coated copper foil layer (2) is made as in the above-mentioned embodiment 1. Stack 4 sheets of epoxy glass fiber cloth prepreg glass fiber cloth prepreg insulating board layer 1 with a size of 350 mm × 350 mm neatly, and laminate the resin-coated copper foil layer (2) on both sides, and make The resin composition layer (22) is in contact with the insulating board layer (1) epoxy glass fiber cloth prepreg glass fiber cloth prepreg, and after matching is completed, it is put into a hot press machine for lamination, and the hot pressing temperature is between 170°C. The pressing pressure is about 30kgf/cm ² , and the hot pressing time is about 1 hour. After hot pressing, a double-sided copper clad laminate with CTI ≥ 400V is obtained.

See accompanying drawing 4, this is embodiment 4 of the present utility model, described resin-coated copper foil layer 2 is two layers, and insulating board layer 1 is between the resin-coated copper foil layers 2. Take 2 pieces with a thickness of 105 microns, wherein the resin-coated copper foil layer (2) is made as in the above-mentioned embodiment 1. Stack 5 sheets of epoxy glass fiber cloth prepreg glass fiber cloth prepreg insulating board layer 1 with a size of 350 mm × 350 mm neatly, and laminate the resin-coated copper foil layer (2) on both sides to make the resin combination The material layer (22) is in contact with the insulation layer (1) epoxy glass fiber cloth prepreg glass fiber cloth prepreg, and after the matching is completed, it is placed in a hot press for lamination. The hot pressing temperature is between 180°C and the hot pressing pressure is About 30kgf/cm ² , hot pressing time about 1 hour. After hot pressing, the copper clad laminate with CTI ≥ 400V can be obtained.

Of course, the above-described embodiments are only preferred examples of the present utility model, and are not intended to limit the scope of implementation of the present utility model, so all equivalents done according to the structure, features and principles described in the scope of patent application for the present utility model Changes or modifications are all included in the patent scope of the utility model application.

Claims (6)

1. A copper-clad laminate with high tracking resistance, characterized in that it includes at least one side of a resin-coated copper foil layer (2) and at least one insulating layer (1), and a resin-coated copper foil layer (2) It is laminated with the insulation layer (1) and formed by thermocompression. 2. A copper-clad laminate with high tracking resistance according to claim 1, characterized in that: one side of the copper-clad laminate is a resin-coated copper foil layer (2). 3. A copper-clad laminate with high tracking resistance according to claim 1, characterized in that: both sides of the copper-clad laminate are resin-coated copper foil layers (2), and the insulating layer (1) is between resin-coated copper foil layers (2). 4. A copper-clad laminate with high tracking resistance according to claim 1, 2 or 3, characterized in that: the resin-coated copper foil layer (2) is on the copper foil layer (21) One side is evenly coated with a resin composition layer (22) with CTI ≥ 400V. 5. A copper-clad laminate with high tracking resistance according to claim 4, characterized in that: the resin composition layer (22) of the resin-coated copper foil layer (2) has a thickness of 30-100 Micron. 6. A copper-clad laminate with high tracking resistance according to claim 4, characterized in that: the thickness of the copper foil layer (21) of the resin-coated copper foil layer (2) is 12-105 microns .

Images