CN107172807A - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
- Publication number
- CN107172807A CN107172807A CN201710433028.8A CN201710433028A CN107172807A CN 107172807 A CN107172807 A CN 107172807A CN 201710433028 A CN201710433028 A CN 201710433028A CN 107172807 A CN107172807 A CN 107172807A
- Authority
- CN
- China
- Prior art keywords
- layer
- copper foil
- prepreg
- foil layer
- interior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of printed circuit board, while the anti creepage trace performance of printed circuit board is met, to reduce the cost of manufacture of high CTI printed circuit boards.Printed circuit board includes：Top layer copper foil layer, bottom copper foil layer, the first layer of prepreg connected with the top layer copper foil layer, the second layer of prepreg connected with bottom copper foil layer；And it is located at layer of prepreg at least one between first layer of prepreg and second layer of prepreg；First layer of prepreg, the CTI values of second layer of prepreg are all higher than the CTI values of the interior layer of prepreg.
Description
Technical field
The present invention relates to electricity field, more particularly to a kind of printed circuit board.
Background technology
CTI values（Comparative Tracking Index, relative discharge index）It is able to take 50 drops for material surface
Electrolyte（0.1% aqueous ammonium chloride solution）Maximum voltage value without forming tracking, is the performance indications of resistance to electric leakage.
For the low copper-clad plate of CTI values, used for a long time under the adverse circumstances such as high pressure, high temperature, humidity, filth,
It is also easy to produce creepage trace.And for the high copper-clad plate of CTI values, it can not only be used under above-mentioned adverse circumstances for a long time,
It can also be used to make highly dense printed circuit board.
In each performance of copper-clad plate, anti creepage trace, as an important security reliability index, has been increasingly print
Circuit board designer processed and Complete set manufacturers are paid attention to.It is CTI values≤150V of existing common paper-based copper-coated board, common compound
The CTI values of base copper-clad plate and common glass fiber fabric base copper-clad plate can not meet electric equipment products more in the range of 175V ~ 225V
The use requirement of high security.Therefore, manufacturer makes prepreg using high CTI value material（Resin synthesized with carrier one
Plant flaked bonding material）And application is into copper-clad plate, to control creepage trace.
However, being applied in the prepreg for making high CTI value material to the pressing manufacturing process of multiple double face coppers
When middle, high CTI value requirement is met for multiple double face coppers for making pressing, thus by double face copper copper foil layer set half
Cured sheets need to be high CTI value material layer.Because the pressing structure of existing multiple double face coppers uses high CTI value material,
Cause the cost of manufacture of multiple double face coppers higher.
The content of the invention
Technical scheme：In view of above-mentioned, the present invention provides a kind of printed circuit board, to meet the resistance to leakage of printed circuit board
While electric marks rising property energy, the cost of manufacture of high CTI printed circuit boards is reduced.
The printed circuit board that the present invention is provided, including：
Top layer copper foil layer, bottom copper foil layer, the first layer of prepreg connected with the top layer copper foil layer and bottom copper foil layer phase
The second layer of prepreg connect；And
It is located at layer of prepreg at least one between first layer of prepreg and second layer of prepreg；
First layer of prepreg, the CTI values of second layer of prepreg are more than the CTI values of the interior layer of prepreg.
Further, interior copper foil layer, the interior copper are additionally provided between the top layer copper foil layer and the bottom copper foil layer
Layers of foil include with the top layer copper foil layer constitute copper foil layer in the first of first group of copper foil layer, with bottom copper foil layer composition the
Copper foil layer in the second of two groups of copper foil layers；
First group of copper foil layer is including interior described in the top layer copper foil layer being sequentially connected, first layer of prepreg, one
Copper foil layer in layer of prepreg and described first；
Second group of copper foil layer is including interior described in the bottom copper foil layer being sequentially connected, second layer of prepreg, one
Copper foil layer in layer of prepreg and described second；
The interior layer of prepreg is provided between first group of copper foil layer and second group of copper foil layer.
Further, it is being additionally provided with the 3rd group of copper foil layer in described first in copper foil layer and described second between copper foil layer,
The 3rd group of copper foil layer include being sequentially connected the 3rd in copper foil layer, described in two layers in copper foil in layer of prepreg and the 4th
Layer.
Further, it is being additionally provided with one layer described interior half in described first in copper foil layer and the described 3rd between copper foil layer admittedly
Change lamella.
Further, provided with one layer of interior semi-solid preparation between first group of copper foil layer and second group of copper foil layer
Lamella.
Further, the glass of first layer of prepreg, second layer of prepreg and the interior layer of prepreg
Glass state conversion temperature value is identical.
Further, first layer of prepreg and the interior layer of prepreg, described the are pressed using mixed pressure technique
Two layer of prepreg and the interior layer of prepreg.
Further, first layer of prepreg and second layer of prepreg are the first CTI values, and described interior half
Solidification lamella is the 2nd CTI values.
Further, the first CTI values are more than or equal to 600V, and the 2nd CTI values are more than or equal to 175V and are less than
250V。
Beneficial effect：Compared with prior art, the present invention is by top layer copper foil layer, bottom copper foil layer, the first prepreg
Layer, the second layer of prepreg and interior layer of prepreg structure setting, only need near set at outermost layer copper foil layer position compared with
The first layer of prepreg, the second layer of prepreg of high CTI value, it is ensured that the anti creepage trace performance of printed circuit board, together
When set the interior solidification lamella of relatively low CTI values to reduce cost in the first layer of prepreg, the second layer of prepreg.
Brief description of the drawings
Fig. 1 is the first embodiment structural representation of printed circuit board of the present invention；
Fig. 2 is the second embodiment structural representation of printed circuit board of the present invention；
Fig. 3 is the 3rd group of copper foil layer structural representation of the present invention.
Primary symbols explanation
Printed circuit board 1,2
Top layer copper foil layer 11,21
Bottom copper foil layer 12,22
First layer of prepreg 13,23
Second layer of prepreg 14,24
Interior layer of prepreg 15,25,26,27,32,33
Copper foil layer 28 in first
Copper foil layer 29 in second
Copper foil layer 31 in 3rd
Copper foil layer 34 in 4th
Specific examples below will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that the above objects, features and advantages of the present invention
Applying example, the present invention will be described in detail.It should be noted that in the case where not conflicting, embodiments herein and embodiment
In feature can be mutually combined.
Elaborate many details in the following description to facilitate a thorough understanding of the present invention, described embodiment only
Only it is a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
It is the first embodiment structural representation of printed circuit board of the present invention referring to Fig. 1.Printing provided by the present invention
Circuit board 1, including：Top layer copper foil layer 11, bottom copper foil layer 12, the first layer of prepreg 13, the second layer of prepreg 14 and interior
Layer of prepreg 15.
Wherein, the first layer of prepreg 13 connects with top layer copper foil layer 11, the second layer of prepreg 14 and bottom copper foil layer
12 connect.Layer of prepreg 15 is located between the first layer of prepreg 13 and the second layer of prepreg 14 in one.
First layer of prepreg 13, the CTI values of the second layer of prepreg 14 are all higher than the CTI values of interior layer of prepreg 15.
The first layer of prepreg 13 compared with high CTI value, the second prepreg are being set at outermost layer copper foil layer position
Layer 14 can ensure the anti creepage trace performance of printed circuit board 1, meet under the adverse circumstances such as high pressure, high temperature, humidity, filth
Use for a long time.The interior layer of prepreg of relatively low CTI values is set in the first layer of prepreg 13, the second layer of prepreg 14 simultaneously
15 to reduce cost.
It is understood that also be can be set between the first layer of prepreg 13 and the second layer of prepreg 14 in multilayer herein
Layer of prepreg 15.
It is understood that the first layer of prepreg 13 can be equal with the CTI values of the second layer of prepreg 14, also can not phase
Deng as long as it is more than the CTI values of interior layer of prepreg 15.
In the present embodiment, semi-solid preparation in one layer is set between the first layer of prepreg 13 and the second layer of prepreg 14
Lamella 15.
It is the second embodiment structural representation of printed circuit board of the present invention referring to Fig. 2.Printing provided by the present invention
Circuit board 2, on the basis of first embodiment structure, is additionally provided with interior copper between top layer copper foil layer 21 and bottom copper foil layer 22
Layers of foil, interior copper foil layer includes constituting copper foil layer 28 and bottom copper foil layer in the first of first group of copper foil layer with top layer copper foil layer 21
Copper foil layer 29 in the second of 22 second group of copper foil layer of composition.
In first group of copper foil layer, including the top layer copper foil layer 21, half solid in the first layer of prepreg 23, one being sequentially connected
Change copper foil layer 28 in lamella 25 and first.In second group of copper foil layer, including the bottom copper foil layer 22, the second half solid being sequentially connected
Copper foil layer 29 in layer of prepreg 26 and second in change lamella 24, one.
Layer of prepreg 27 in also one is provided between first group of copper foil layer and second group of copper foil layer.
In actual production process, copper foil layer often needs acidified processing to produce brown film, in favor of first group of copper foil
The overlapping connection of layer and second group of copper foil layer.For the layer of prepreg of low CTI values, layer of prepreg and the palm fibre of high CTI value
Changing film, to occur chemical reaction in contact more violent, and occurs the consequence brought of chemical reaction to cause whole printed circuit
The heat resistance reduction of plate, the hypodynamic risk of combination between first group of copper foil layer and second group of copper foil layer.Therefore, select herein
The interior layer of prepreg of relatively low CTI values, while reducing cost, it is ensured that the knot between first group of copper foil layer and second group of copper foil layer
With joint efforts.
It is understood that first group of copper foil layer, second group of copper foil layer herein can be considered double face copper, and two plates
It is stacked.
It is the 3rd group of copper foil layer structural representation of the present invention referring to Fig. 3.3rd group of copper foil layer is located at copper foil layer in first
And in second between copper foil layer, the 3rd group of copper foil layer include being sequentially connected the 3rd in copper foil layer 31, layer of prepreg in two layers
32nd, copper foil layer 34 in 33 and the 4th.There are three groups of copper foil layer requirements to printed circuit board, set interior the half of low two layers CTI values to consolidate
Change lamella to reduce cost, and do not interfere with the overall anti creepage trace performance of printed circuit board.
It is understood that can also be provided with the 4th group of copper foil layer, the between copper foil layer in copper foil layer and second in first
Five groups of copper foil layers ..., its structure can be identical with the 3rd group of copper foil layer.
In first layer of prepreg in one layer is being additionally provided with copper foil layer and the 3rd between copper foil layer.The second copper foil layer with
Layer of prepreg in one layer can be equally set between 4th copper foil layer.
The glass transition temperature value of first layer of prepreg, the second layer of prepreg and interior layer of prepreg is identical, with
Ensure the possibility of variation occurred in the uniformity of printed circuit board integral material, reduction process, and also be compliant with high CTI
It is worth the trend of materials application.
It is, of course, understood that the glassy state of the first layer of prepreg, the second layer of prepreg and interior layer of prepreg
Conversion temperature value can also be differed, can reduce production difficulty to a certain extent.
The printed circuit board of the present invention, can press the first layer of prepreg and interior layer of prepreg, the using mixed pressure technique
Two layer of prepreg and interior layer of prepreg.
First layer of prepreg is the first CTI values with the second layer of prepreg, and interior layer of prepreg is the 2nd CTI values.
Wherein, the first CTI values are more than or equal to 600V, to meet the requirement of anti creepage trace performance.2nd CTI values are more than or equal to 175V and small
In 250V.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the claim involved by limitation.This
Outside, it is clear that the word of " comprising " one is not excluded for other units or step, and odd number is not excluded for plural number.That is stated in system claims is multiple
Unit or system can also be realized by same unit or system by software or hardware.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted, although reference
The present invention is described in detail for preferred embodiment, it will be understood by those within the art that, can be to the present invention's
Technical scheme is modified or equivalent substitution, without departing from the spirit and scope of technical solution of the present invention.
Claims (9)
1. a kind of printed circuit board, it is characterised in that including：Top layer copper foil layer, bottom copper foil layer, with the top layer copper foil layer
The first layer of prepreg connected, the second layer of prepreg connected with bottom copper foil layer；And it is located at first prepreg
Layer and second layer of prepreg between at least one in layer of prepreg；First layer of prepreg, described the second half
The CTI values of solidification lamella are all higher than the CTI values of the interior layer of prepreg.
2. printed circuit board as claimed in claim 1, it is characterised in that in the top layer copper foil layer and the bottom copper foil layer
Between be additionally provided with interior copper foil layer, the interior copper foil layer includes constituting copper in the first of first group of copper foil layer with the top layer copper foil layer
Layers of foil and the bottom copper foil layer constitute copper foil layer in the second of second group of copper foil layer；First group of copper foil layer is included sequentially
The top layer copper foil layer that connects, first layer of prepreg, described in one in copper foil layer in layer of prepreg and described first；
Second group of copper foil layer is solid including described in the bottom copper foil layer being sequentially connected, second layer of prepreg, one interior half
Change copper foil layer in lamella and described second；Provided with described interior half between first group of copper foil layer and second group of copper foil layer
Solidify lamella.
3. printed circuit board as claimed in claim 2, it is characterised in that in copper in copper foil layer and described second in described first
Be additionally provided with the 3rd group of copper foil layer between layers of foil, the 3rd group of copper foil layer include being sequentially connected the 3rd in copper foil layer, two layers of institute
State copper foil layer in interior layer of prepreg and the 4th.
4. printed circuit board as claimed in claim 3, it is characterised in that in copper in copper foil layer and the described 3rd in described first
One layer of interior layer of prepreg is additionally provided between layers of foil.
5. printed circuit board as claimed in claim 2, it is characterised in that in first group of copper foil layer and second group of copper
Provided with one layer of interior layer of prepreg between layers of foil.
6. printed circuit board as claimed in claim 1, it is characterised in that first layer of prepreg, described the second half solid
The glass transition temperature value for changing lamella and the interior layer of prepreg is identical.
7. printed circuit board as claimed in claim 1, it is characterised in that first prepreg is pressed using mixed pressure technique
Layer and the interior layer of prepreg, second layer of prepreg and the interior layer of prepreg.
8. printed circuit board as claimed in claim 1, it is characterised in that first layer of prepreg and described the second half solid
It is the first CTI values to change lamella, and the interior layer of prepreg is the 2nd CTI values.
9. printed circuit board as claimed in claim 8, it is characterised in that the first CTI values are more than or equal to 600V, described the
Two CTI values are more than or equal to 175V and less than 250V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710433028.8A CN107172807A (en) | 2017-06-09 | 2017-06-09 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710433028.8A CN107172807A (en) | 2017-06-09 | 2017-06-09 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107172807A true CN107172807A (en) | 2017-09-15 |
Family
ID=59824825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710433028.8A Pending CN107172807A (en) | 2017-06-09 | 2017-06-09 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107172807A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323000A (en) * | 2018-01-23 | 2018-07-24 | 江西景旺精密电路有限公司 | A kind of high-level circuit plate and preparation method thereof |
| CN112644112A (en) * | 2020-12-17 | 2021-04-13 | 万奔电子科技股份有限公司 | Automobile intelligent central control multilayer board and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108323000A (en) * | 2018-01-23 | 2018-07-24 | 江西景旺精密电路有限公司 | A kind of high-level circuit plate and preparation method thereof |
| CN112644112A (en) * | 2020-12-17 | 2021-04-13 | 万奔电子科技股份有限公司 | Automobile intelligent central control multilayer board and preparation method thereof |
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Application publication date: 20170915 |
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