CN103287016A - Copper foil layer-clad laminate and preparation method thereof - Google Patents
Copper foil layer-clad laminate and preparation method thereof Download PDFInfo
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- CN103287016A CN103287016A CN2012100517555A CN201210051755A CN103287016A CN 103287016 A CN103287016 A CN 103287016A CN 2012100517555 A CN2012100517555 A CN 2012100517555A CN 201210051755 A CN201210051755 A CN 201210051755A CN 103287016 A CN103287016 A CN 103287016A
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Abstract
The invention discloses a copper foil layer-clad laminate. The copper foil layer-clad laminate comprises a mixed curing layer formed by hot-pressing a plurality of prepregs, and a copper foil attached to at least one side of the mixed curing layer, wherein the mixed curing layer comprises at least one first type of prepreg and one second type of prepreg, the first type of prepreg and the second type of prepreg comprise the glass fiber cloth and resin component, and the resin content in the second type of prepreg is less than that in the first type of prepreg. Through the overlaying and laminating of the first type of prepreg and the second type of prepreg, the resin content in the first type of prepreg is greater than that in the second type of prepreg. While maintaining that the resin content of the first type of prepreg is equal to that of the existing copper foil layer-clad laminate, the first type of prepreg and the copper foil are laminated on each other, and therefore, the dielectric constant of the whole copper foil layer-clad laminate is effectively improved without influencing the adhesion force between the copper foil and the laminate.
Description
Technical field
The present invention relates to the copper-clad laminate field, more particularly, relate to copper-clad laminate of a kind of high Copper Foil adhesive force and high-k and preparation method thereof.
Background technology
Copper-clad laminate uses in the PCB field of circuit boards in a large number, and its environmental work frequency is low-frequency range comparatively speaking.But in RF application, especially in the super material antenna applications field, copper-clad laminate is widely used in wherein gradually, because antenna is to be in high band (the existing P CB plate field relatively) working environment, therefore the copper-clad laminate relevant parameter is very big to the performance impact of super material antenna, as relevant parameters such as its dielectric constant pact, dielectric loss values.Except super material field of antenna, in super material field, copper-clad laminate is also by a large amount of application, and for example the procedure in functional super material processing technique is exactly: the copper-clad laminate etching need had large-scale metal micro structure.
No matter based on the etched super material antenna of copper-clad laminate, be applied to the medium substrate of functional super material, all improve copper-clad laminate based on existing laminate industry, in order to minimum industrialization cost it is applied in super material antenna and the super material field.In the selection of existing layer pressing plate, the laminate main component generally is made up of glass fabric and resin two parts.Wherein the dielectric constant of glass fabric is about 6.5, and dielectric loss is about 0.002; The dielectric constant of resin is generally 3-4, and dielectric loss is generally at 0.015-0.04.If make the substrate of high dielectric constant and low dielectric loss, just can realize by the prepreg of making low resin content.Yet the prepreg that resin content is more low, the laminate after the pressing and the adhesive force of Copper Foil are more poor.Copper Foil adhesive force size directly can have influence on the manufacturing procedure of super material antenna etch process or super material metal micro-structural, and then in a large amount of production processes, causes entire product yield severe exacerbation.
Summary of the invention
The technical problem to be solved in the present invention is, adhesive force between the Copper Foil of raising production copper-clad laminate and the laminate.Therefore, the invention provides the copper-clad laminate of a kind of high Copper Foil adhesive force and high-k.
Meanwhile, the present invention also provides a kind of preparation method of high Copper Foil adhesive force copper-clad laminate.
A kind of copper-clad laminate comprises:
One mixing cured layer is formed by the hot pressing of multi-disc prepreg;
Copper Foil is attached at least one side of described mixing cured layer; Wherein mixing cured layer comprises at least one first kind cured sheets and the second class cured sheets, described first kind cured sheets and the second class cured sheets include glass fabric and resin composition, and the resin content in the second class cured sheets is less than the resin content in the first kind cured sheets.
Further, described at least two second class cured sheets formation one that is laminated, first kind cured sheets is arranged at the second class cured sheets both sides of one pressing respectively.
Further, the described second class cured sheets has identical thickness with first kind cured sheets.
Further, the described second class cured sheets is identical or inequality.
Further, described first kind cured sheets thickness is identical or inequality.
Further, the second class cured sheets and the mutual lamination mixing of first kind cured sheets pressing in the described mixing cured layer form one, wherein mix the pressing formation one outside and are first kind cured sheets.
Further, described mixing cured layer comprises that the second class cured sheets is different with the thickness of first kind cured sheets.
Further, described mixing cured layer comprises that the thickness of first kind cured sheets is inequality.
A kind of manufacture method of copper-clad laminate comprises step as described below:
First kind prepreg is provided;
At the relative two sides pressing of first kind prepreg a slice second class prepreg at least;
At least one copper foil of two sides pressing with first kind prepreg and the second class prepreg pressing body.
A kind of manufacture method of copper-clad laminate comprises step as described below:
At least two first kind prepregs are provided;
Described at least two first kind prepregs are pressed into first kind laminate;
In the relative two sides of described first kind laminate respectively pressing at least a slice second class prepreg at the relative two sides pressing of first kind laminate a slice second class prepreg at least;
At least one copper foil of two sides pressing with first kind prepreg and the second class prepreg pressing body.
Prior art by above-mentioned copper-clad laminate structure and preparation method thereof, is pressed the mutual superposition pressing by first kind prepreg and the second class prepreg relatively, and wherein the resin content of first kind prepreg is greater than the resin content of the second class prepreg.The prepreg that resin content is more low, the laminate after the pressing and the adhesive force of Copper Foil are more poor.When the resin content of the resin content that keeps first kind prepreg and existing copper clad laminate is suitable, adopt first kind prepreg and Copper Foil to be laminated, therefore not influencing between Copper Foil and the laminate under the adhesion situation, effectively improved the dielectric constant of whole copper-clad laminate.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is the generalized section of copper-clad laminate of the present invention;
Fig. 2 is doublesided copperclad laminate one embodiment generalized section shown in Figure 1;
Fig. 3 is another embodiment generalized section of doublesided copperclad laminate shown in Figure 1;
Fig. 4 is doublesided copperclad laminate the 3rd embodiment generalized section shown in Figure 1;
Fig. 5 is the generalized section of the doublesided copperclad laminate second class embodiment of the present invention;
Fig. 6 is the generalized section of the singlesided copperclad laminate second class embodiment of the present invention;
Fig. 7 is doublesided copperclad laminate one specific embodiment generalized section shown in Figure 5;
Fig. 8 is another specific embodiment generalized section of singlesided copperclad laminate shown in Figure 5;
Fig. 9 is the flow chart of a kind of manufacture method of copper-clad laminate of the present invention;
Figure 10 is the flow chart of the another kind of manufacture method of copper-clad laminate of the present invention.
The specific embodiment
The present middle embodiment that describes in detail with reference to the accompanying drawings.For complete understanding the present invention, numerous details have been mentioned in the following detailed description.But it should be appreciated by those skilled in the art that the present invention can need not these details and realize.In other embodiments, be not described in detail known method.Process, assembly and circuit are in order to avoid unnecessarily make embodiment fuzzy.
See also Fig. 1, the generalized section of copper-clad laminate of the present invention.Copper-clad laminate 13 comprises Copper Foil 20 and by the mixing cured layer 2 of multi-disc prepreg hot pressing.Be attached with Copper Foil 20 on the described mixing cured layer of relative two sides.Described mixing cured layer 2 comprises at least one first kind cured sheets 21 and the second class cured sheets 22.Described first kind cured sheets 21 and the second class cured sheets 22 include glass fabric and resin composition, and glass fabric and resin content composition ratio in described first kind cured sheets 21 and the second class cured sheets 22 are inequality.Because the cured sheets that resin content is more low, the mixing cured layer 2 after the pressing is more poor with the adhesive force of Copper Foil 20.Therefore the resin component content in the second class cured sheets 22 is less than the resin component content in the first kind cured sheets 21.After making that so just the high first kind cured sheets 21 of resin content is laminated with Copper Foil 20, between described Copper Foil 20 and the mixing cured layer 2 bigger adhesive force is arranged.Comparatively speaking, the second class cured sheets, 22 glass fabric content height, its dielectric constant height, thereby the dielectric constant of a raising whole copper-clad laminate.Wherein the resin content of cured sheets of the present invention is at 35%-50%.Described mixing cured layer 2 comprises formations that is laminated of the multi-disc second class cured sheets 22, and described mixing cured layer 2 comprises two first kind cured sheets 21 and places mixing cured layer of 2 both sides.
In first kind embodiment of the present invention, see also Fig. 2, be copper-clad laminate one embodiment generalized section of the present invention.Mixing cured layer 2 comprises two second class cured sheets 22 formation one that is laminated, and two first kind cured sheets 21 are arranged at the second class cured sheets, 22 both sides of one pressing respectively.In other embodiments, described mixing cured layer 2 comprises that the second class cured sheets, 22 quantity that form one of being laminated are (the second class cured sheets, 22 quantity as shown in Figure 3 are 3) arbitrarily.
In first kind embodiment the 3rd embodiment, see also Fig. 4, be another embodiment generalized section of copper-clad laminate of the present invention.Different from the embodiment described above being wherein: the second class cured sheets 22 in the mixing cured layer 2 and first kind cured sheets 21 mutual lamination mixing pressings formation one.Mixing cured layer 2 both sides all still arrange first kind cured sheets 21, so that between described Copper Foil 20 and the mixing cured layer 2 stronger adhesive force is arranged.
Be understandable that for the ease of production equipment and the production technology based on single gauge thickness laminate, the described second class cured sheets 22 has identical thickness with first kind cured sheets 21.Above-mentioned introduction all be doublesided copperclad laminate, under some application scenarios, singlesided copperclad laminate and being widely applied, therefore the singlesided copperclad laminate structure is identical with the doublesided copperclad laminate structural principle, so singlesided copperclad laminate also belongs to the scope that requirement of the present invention is advocated.
Seeing also Fig. 5 and Fig. 6, is doublesided copperclad laminate generalized section and the singlesided copperclad laminate generalized section of the second class embodiment, one embodiment.With above-mentioned second class embodiment is different is: mixing cured layer 2 comprises that the thickness of the second class cured sheets 22 and first kind cured sheets 21 is along with application demand can be any thickness size.Wherein first kind cured sheets 21 and the second class cured sheets 22 are inequality.
Seeing also Fig. 7 and Fig. 8, is doublesided copperclad laminate generalized section and the singlesided copperclad laminate generalized section of second another embodiment of class embodiment.With Fig. 5 and different being of embodiment shown in Figure 6: close cured layer 2 and comprise that the thickness of first kind cured sheets 21 is inequality.
See also Fig. 9, the flow chart of a kind of manufacture method of invention copper-clad laminate.The step of copper-clad laminate is as follows in making the present invention:
S31: first kind prepreg is provided.Described first kind prepreg comprises glass fabric and resin composition, and wherein resin content is at 35%-45%.
S33: at the relative two sides pressing of first kind prepreg a slice second class prepreg at least.The described second class prepreg comprises glass fabric and resin composition, and wherein resin content is at 40%-50%.At the concrete prescription composition of implementing, the second class prepreg resin content is higher than the resin content of first kind prepreg, make that first kind cured sheets that resin content is high is laminated with Copper Foil after, between described Copper Foil and mixing cured layer bigger adhesive force is arranged.
S35: with at least one copper foil of two sides pressing of first kind prepreg and the second class prepreg pressing body.Above-mentioned process for pressing all carries out at the prepreg state.
See also Figure 10, the flow chart of the another kind of manufacture method of invention copper-clad laminate.The step of copper-clad laminate is as follows in making the present invention:
S51: at least two first kind prepregs are provided.Described first kind prepreg comprises glass fabric and resin composition, and wherein resin content is at 35%-45%.
S53: described at least two first kind prepregs are pressed into first kind laminate.
S55: in the relative two sides of described first kind laminate respectively pressing at least a slice second class prepreg at the relative two sides pressing of first kind laminate a slice second class prepreg at least.The described second class prepreg comprises glass fabric and resin composition, and wherein resin content is at 40%-50%.At the concrete prescription composition of implementing, the second class prepreg resin content is higher than the resin content of first kind prepreg, make that first kind cured sheets that resin content is high is laminated with Copper Foil after, between described Copper Foil and mixing cured layer bigger adhesive force is arranged.
S57: with at least one copper foil of two sides pressing of first kind prepreg and the second class prepreg pressing body.In concrete process for pressing, two sides difference pressing one copper foil as if with first kind prepreg and the second class prepreg pressing body then forms doublesided copperclad laminate.In like manner, if just with side difference pressing one copper foil of first kind prepreg and the second class prepreg pressing body, then form singlesided copperclad laminate.
By above-mentioned copper-clad laminate structure and preparation method thereof, press the mutual superposition pressing by first kind prepreg and the second class prepreg, wherein the resin content of first kind prepreg is greater than the resin content of the second class prepreg.The prepreg that resin content is more low, the laminate after the pressing and the adhesive force of Copper Foil are more poor.When the resin content of the resin content that keeps first kind prepreg and existing copper clad laminate is suitable, adopt first kind prepreg and Copper Foil to be laminated, therefore not influencing between Copper Foil and the laminate under the adhesion situation, effectively improved the dielectric constant of whole copper-clad laminate.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to the above-mentioned specific embodiment; the above-mentioned specific embodiment only is schematic; rather than it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (10)
1. a copper-clad laminate is characterized in that, comprising:
One mixing cured layer is formed by the hot pressing of multi-disc prepreg;
Copper Foil is attached at least one side of described mixing cured layer; Wherein mixing cured layer comprises at least one first kind cured sheets and the second class cured sheets, described first kind cured sheets and the second class cured sheets include glass fabric and resin composition, and the resin content in the second class cured sheets is less than the resin content in the first kind cured sheets.
2. copper-clad laminate according to claim 1 is characterized in that, described at least two second class cured sheets formation one that is laminated, and first kind cured sheets is arranged at the second class cured sheets both sides of one pressing respectively.
3. copper-clad laminate according to claim 2 is characterized in that, the described second class cured sheets has identical thickness with first kind cured sheets.
4. copper-clad laminate according to claim 2 is characterized in that, the described second class cured sheets thickness is identical or inequality.
5. copper-clad laminate according to claim 3 is characterized in that, described first kind cured sheets thickness is identical or inequality.
6. copper-clad laminate according to claim 1 is characterized in that, the second class cured sheets and the mutual lamination mixing of first kind cured sheets pressing in the described mixing cured layer form one, wherein mixes the pressing formation one outside and is first kind cured sheets.
7. copper-clad laminate according to claim 1 is characterized in that, described mixing cured layer comprises that the second class cured sheets is different with the thickness of first kind cured sheets.
8. according to claim 2 or 7 described copper-clad laminates, it is characterized in that described mixing cured layer comprises that the thickness of first kind cured sheets is inequality.
9. the manufacture method of a copper-clad laminate is characterized in that, comprises step as described below:
First kind prepreg is provided;
At the relative two sides pressing of first kind prepreg a slice second class prepreg at least;
At least one copper foil of two sides pressing with first kind prepreg and the second class prepreg pressing body.
10. the manufacture method of a copper-clad laminate is characterized in that, comprises step as described below:
At least two first kind prepregs are provided;
Described at least two first kind prepregs are pressed into first kind laminate;
In the relative two sides of described first kind laminate respectively pressing at least a slice second class prepreg at the relative two sides pressing of first kind laminate a slice second class prepreg at least;
At least one copper foil of two sides pressing with first kind prepreg and the second class prepreg pressing body.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210051755.5A CN103287016B (en) | 2012-03-01 | 2012-03-01 | Copper-clad laminate and preparation method thereof |
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| CN201210051755.5A CN103287016B (en) | 2012-03-01 | 2012-03-01 | Copper-clad laminate and preparation method thereof |
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| CN103287016A true CN103287016A (en) | 2013-09-11 |
| CN103287016B CN103287016B (en) | 2016-10-26 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106494033A (en) * | 2016-10-26 | 2017-03-15 | 江门市龙兴电子材料有限公司 | The reuse method of a kind of sampling material, cutting edge material and unqualified prepreg and the copper-clad plate of application the method manufacture |
| CN106494034A (en) * | 2016-10-26 | 2017-03-15 | 江门市龙兴电子材料有限公司 | A kind of method and copper-clad plate for producing copper-clad plate using unqualified prepreg |
| CN106658956A (en) * | 2017-02-14 | 2017-05-10 | 江苏普诺威电子股份有限公司 | Waterproof and ventilating sound aperture structure and processing technology therefor |
| CN109548279A (en) * | 2018-12-29 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Prepreg lamination design method |
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| CN101665017A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Prepreg having nonsymmetrical resin layer thickness and application thereof |
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| CN102149253A (en) * | 2010-12-29 | 2011-08-10 | 东莞生益电子有限公司 | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
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| CN1272424A (en) * | 1999-04-29 | 2000-11-08 | 北京化工大学 | Composite base laminated board covered with copper foil and its production method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106494033A (en) * | 2016-10-26 | 2017-03-15 | 江门市龙兴电子材料有限公司 | The reuse method of a kind of sampling material, cutting edge material and unqualified prepreg and the copper-clad plate of application the method manufacture |
| CN106494034A (en) * | 2016-10-26 | 2017-03-15 | 江门市龙兴电子材料有限公司 | A kind of method and copper-clad plate for producing copper-clad plate using unqualified prepreg |
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| CN109548279A (en) * | 2018-12-29 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Prepreg lamination design method |
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Effective date of registration: 20210428 Address after: 518057 2 / F, software building, No.9, Gaoxin Middle Road, Nanshan District, Shenzhen, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 518034. A, 18B, CIC international business center, 1061 Mei Xiang Road, Shenzhen, Guangdong, Futian District Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |