CN113910738A - Copper-clad plate processing technology - Google Patents
Copper-clad plate processing technology Download PDFInfo
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- CN113910738A CN113910738A CN202111238825.3A CN202111238825A CN113910738A CN 113910738 A CN113910738 A CN 113910738A CN 202111238825 A CN202111238825 A CN 202111238825A CN 113910738 A CN113910738 A CN 113910738A
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- 238000012545 processing Methods 0.000 title claims abstract description 22
- 238000005516 engineering process Methods 0.000 title claims abstract description 14
- 239000003292 glue Substances 0.000 claims abstract description 53
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 238000005520 cutting process Methods 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000004513 sizing Methods 0.000 claims abstract description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000005553 drilling Methods 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 12
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 229930195733 hydrocarbon Natural products 0.000 claims description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 6
- 238000003892 spreading Methods 0.000 claims description 6
- 230000007480 spreading Effects 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 239000011265 semifinished product Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000010298 pulverizing process Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
- B32B2038/0016—Abrading
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/047—Perforating
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a processing technology of a copper-clad plate, which comprises the following steps: manufacturing resin glue solution of a copper-clad plate, preparing sizing paper of the copper-clad plate, laminating and forming the copper-clad plate, preparing low-temperature embrittlement glue, stacking the copper-clad plate, injecting the prepared low-temperature embrittlement glue into a glue spreader, smearing the low-temperature embrittlement glue on the surface of the first copper-clad plate through the glue spreader, after smearing is finished, superposing the other copper-clad plate on the surface of the first copper-clad plate, and carrying out bonding and stacking treatment on the plurality of copper-clad plates in the mode; cutting and drilling of copper-clad plates, separation of a plurality of copper-clad plates, a plurality of copper-clad plates after cutting and drilling are subjected to extreme cold treatment through liquid nitrogen, and low-temperature embrittlement glue among the plurality of copper-clad plates becomes brittle at a temperature lower than-30 ℃, so that the plurality of copper-clad plates are separated, the processed copper-clad plates can meet production requirements, and errors can be reduced when follow-up circuit arrangement is carried out on the copper-clad plates, and the yield can be improved.
Description
Technical Field
The invention belongs to the technical field of copper-clad plate processing, and particularly relates to a processing technology of a copper-clad plate.
Background
The copper clad laminate is divided into a rigid copper clad laminate and a flexible copper clad laminate according to the mechanical rigidity of the copper clad laminate, the copper clad laminate is an extremely important basic material of a printed circuit board, the printed circuit boards with different forms and different functions are manufactured by selectively carrying out processes of processing, etching, drilling, copper plating and the like on the copper clad laminate, the copper clad laminate is used as a substrate material in the manufacture of the printed circuit boards, the copper clad laminate mainly plays roles of interconnection, insulation and support on the printed circuit boards, and has great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in the circuits, so the performance, the quality, the processability, the manufacturing level, the manufacturing cost, the long-term reliability and the stability of the printed circuit boards are greatly dependent on the copper clad laminate.
The copper-clad plate is mainly used for manufacturing a printed circuit board for supporting, interconnecting and insulating electronic components, is called as an important basic material of the printed circuit board, and is an indispensable important electronic material for all electronic complete machines including all electronic products of aviation, aerospace, remote sensing, remote control, communication, computers, industrial control, household appliances, even advanced toys for children and the like.
However, in the existing processing process of the copper-clad plate, the copper-clad plate which is molded by preparation is often required to be cut and punched, and in the cutting and punching process of the copper-clad plate, the copper-clad plate with the same size and size cannot meet the standard size, and particularly, the copper-clad plate applied to aerospace causes easy appearance of subsequent circuit arrangement and phenomena of open circuit or unstable signal due to the existence of error, thereby reducing the yield of the production of the copper-clad plate.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a processing technology of a copper-clad plate.
In order to achieve the purpose, the invention provides the following technical scheme: a processing technology of a copper-clad plate comprises the following steps:
s1, manufacturing resin glue solution of the copper-clad plate, putting epoxy resin for producing the copper-clad plate into a reaction kettle, heating the epoxy resin in the reaction kettle, adding resin acid, resin alcohol and resin hydrocarbon into the reaction kettle to perform primary mixing treatment, and finally adding a fixing agent and a curing accelerator again to perform mixing and dissolving to obtain the copper-clad plate;
s2, preparing the sizing paper of the copper-clad plate, injecting the prepared mixed epoxy resin into a glue tank of a sizing machine, impregnating resin glue solution by taking fiber paper, glass fiber cloth, glass fiber paper and the like as reinforced base materials, and heating and drying the base materials at 120-180 ℃ by using a baking oven of the sizing machine to prepare semi-finished sizing paper;
s3, laminating and molding a copper-clad plate, namely coating a copper anchor on a prepared semi-finished product to form a laminated blank of gummed paper, putting copper plates up and down as moulds, then putting the mould between heating plates of a press, and performing high-temperature and high-pressure laminating and molding processing to press and mold the copper-clad plate;
s4, preparing low-temperature embrittlement glue, namely putting coumarone-indene resin into a pulverizer in sequence for pulverization, putting the pulverized coumarone-indene resin into a reaction kettle, and then putting ethylene-vinyl acetate copolymer, synthetic paraffin resin, talcum powder, 2, 6-di-tert-butyl-p-cresol, dibutyl phthalate and calcium carbonate into the reaction kettle for mixing and heating to prepare the low-temperature embrittlement glue;
s5, stacking the copper-clad plates, injecting the prepared low-temperature embrittlement glue into a glue spreader, spreading the low-temperature embrittlement glue on the surface of the first copper-clad plate through the glue spreader, after the spreading is finished, stacking the other copper-clad plate on the surface of the first copper-clad plate, performing bonding treatment through the low-temperature embrittlement glue, and performing bonding stacking treatment on the plurality of copper-clad plates in the mode;
s6, cutting and drilling the copper-clad plates, placing the copper-clad plates on a placing table of a cutting machine, sending the copper-clad plates into a prepreg cutting machine, setting parameters meeting production labels according to needs, cutting the copper-clad plates into copper-clad plates with corresponding sizes, and drilling the copper-clad plates by a drilling machine;
s7, separating the copper-clad plates, performing extreme cooling treatment on the cut and drilled copper-clad plates through liquid nitrogen, making the low-temperature embrittlement glue among the copper-clad plates brittle at the temperature lower than-30 ℃, and performing vibration treatment on the copper-clad plates through vibration equipment, so that the copper-clad plates are separated;
s8, cleaning the copper-clad plate, namely cleaning the separated low-temperature embrittlement glue remained on the copper-clad plate after embrittlement by using a polishing device, so as to finish cutting and punching of the copper-clad plate;
s9, packaging the copper-clad plate, and packaging the processed copper-clad plate into a box;
and S10, warehousing the copper-clad plate, namely warehousing the packaged copper-clad plate to finish the production of the copper-clad plate.
Preferably, the heating time of the reaction kettle in the S1 is 22-30 min, and the adding ratio of the resin acid, the resin alcohol and the resin hydrocarbon is 1:1.1: 1.5.
Preferably, the glue groove of the gluing machine in S2 needs to be ensured to be free of impurities before use, and the drying time of the drying oven of the gluing machine is 25-40 min.
Preferably, the press in S3 performs preheating treatment before heating the semi-finished gummed paper, the preheating time is 10 minutes, and the heating treatment is performed by adopting a gradual temperature rise manner.
Preferably, in the S4, the ratio of coumarone-indene resin, ethylene-vinyl acetate copolymer, synthetic paraffin resin, talc powder, 2, 6-di-tert-butyl-p-cresol, dibutyl phthalate and calcium carbonate is 0.4: 1: 0.08: 0.01: 0.05: 0.2, and the mixing and heating time in the reaction kettle is 35-40 min.
Preferably, when a plurality of copper-clad plates are superposed in the S5 process, the surfaces of the copper-clad plates need to be cleaned, so that when the copper-clad plates are bonded, no cavity or foreign matter exists
The invention has the technical effects and advantages that: compared with the prior art, the processing technology of the copper-clad plate provided by the invention has the advantages that the plurality of copper-clad plates are bonded together by using a certain glue, then the plurality of stacked and bonded copper-clad plates are cut, punched and the like according to the actual requirement, finally the low-temperature embrittling glue is embrittled through the extremely cold environment of liquid nitrogen, the plurality of bonded copper-clad plates are all separated through vibration equipment, the plurality of copper-clad plates with the same size and the like are obtained, the copper-clad plates are cut and punched in such a way, the processed copper-clad plates can be ensured to meet the production requirement, the errors can be reduced when the subsequent circuit arrangement is carried out on the copper-clad plates, and the yield can be improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A processing technology of a copper-clad plate comprises the following steps:
s1, manufacturing a resin glue solution of the copper-clad plate, namely putting epoxy resin for producing the copper-clad plate into a reaction kettle, heating the epoxy resin in the reaction kettle, adding resin acid, resin alcohol and resin hydrocarbon into the reaction kettle to carry out primary mixing treatment on the epoxy resin, and finally adding a fixing agent and a curing accelerator again to carry out mixing and dissolving to obtain the resin glue solution, wherein the heating time of the reaction kettle is 22-30 min, the adding ratio of the resin acid to the resin alcohol to the resin hydrocarbon is 1:1.1:1.5, and the reaction time is 22-30 min in resin synthesis reaction processing, so that the quality of the resin glue solution preparation can be improved;
s2, preparing the sizing paper of the copper-clad plate, injecting the prepared mixed epoxy resin into a glue tank of a sizing machine, impregnating resin glue solution by taking fiber paper, glass fiber cloth, glass fiber paper and the like as reinforced base materials, heating and drying at 120-180 ℃ by using a baking oven of the sizing machine to prepare semi-finished sizing paper, wherein the glue tank of the sizing machine needs to be free of impurities before use, and the drying time of the baking oven of the sizing machine is 25-40 min;
s3, laminating and molding the copper-clad plate, namely, coating a copper anchor on a prepared semi-finished product to form a laminated blank of gummed paper, putting the copper plate up and down as a mold, then placing the copper plate between heating plates of a press, and performing high-temperature and high-pressure laminating and molding processing to press and mold the copper-clad plate, wherein the press performs preheating treatment before heating the semi-finished product to form the gummed paper, the preheating time is 10 minutes, and the heating treatment is performed by adopting a gradual heating mode;
s4, preparing low-temperature embrittlement glue, namely, putting coumarone-indene resin into a pulverizer in sequence for pulverization, putting the pulverized coumarone-indene resin into a reaction kettle, then putting ethylene-vinyl acetate copolymer, synthetic paraffin resin, talcum powder, 2, 6-di-tert-butyl-p-cresol, dibutyl phthalate and calcium carbonate into the reaction kettle for mixing and heating, wherein the ratio of the coumarone-indene resin, the ethylene-vinyl acetate copolymer, the synthetic paraffin resin, the talcum powder, the 2, 6-di-tert-butyl-p-cresol, the dibutyl phthalate and the calcium carbonate is 0.4: 1: 0.08: 0.01: 0.05: 0.2, and the mixing and heating time in the reaction kettle is 35-40 min, so as to prepare the low-temperature embrittling glue;
s5, stacking the copper-clad plates, injecting the prepared low-temperature embrittlement glue into a glue spreader, spreading the low-temperature embrittlement glue on the surface of a first copper-clad plate through the glue spreader, after the spreading is finished, overlapping the other copper-clad plate on the surface of the first copper-clad plate, performing bonding treatment through the low-temperature embrittlement glue, bonding and stacking the plurality of copper-clad plates in the mode, and when the plurality of copper-clad plates are subjected to stacking treatment, cleaning treatment needs to be performed on the surfaces of the copper-clad plates to ensure that no cavities and foreign bodies exist when the copper-clad plates are bonded;
s6, cutting and drilling the copper-clad plates, placing the copper-clad plates on a placing table of a cutting machine, sending the copper-clad plates into a prepreg cutting machine, setting parameters meeting production labels according to needs, cutting the copper-clad plates into copper-clad plates with corresponding sizes, and drilling the copper-clad plates by a drilling machine;
s7, separating the copper-clad plates, and carrying out extreme cold treatment on the cut and drilled copper-clad plates through liquid nitrogen, wherein as shown in Table 1, the embrittlement range of the low-temperature embrittlement glue is gradually increased along with the temperature reduction, the low-temperature embrittlement glue among the copper-clad plates becomes seriously brittle at the temperature lower than-30 ℃ and the liquid nitrogen temperature is-196 ℃, so that the low-temperature embrittlement glue can finish embrittlement, and the copper-clad plates are subjected to vibration treatment through vibration equipment, so that the copper-clad plates are separated.
TABLE 1
S8, cleaning the copper-clad plate, namely cleaning the separated low-temperature embrittlement glue remained on the copper-clad plate after embrittlement by using a polishing device, so as to finish cutting and punching of the copper-clad plate;
s9, packaging the copper-clad plate, and packaging the processed copper-clad plate into a box;
and S10, warehousing the copper-clad plate, namely warehousing the packaged copper-clad plate to finish the production of the copper-clad plate.
In conclusion, the method cuts and punches the plurality of copper-clad plates which are overlapped and bonded together, finally enables the low-temperature embrittling glue to be embrittled through the extremely cold environment of liquid nitrogen, enables the plurality of copper-clad plates which are bonded together to be completely separated through vibration equipment, obtains the plurality of copper-clad plates with the same size and the like, cuts and punches the copper-clad plates in the mode, can ensure that the processed copper-clad plates can meet the production requirements, and can reduce errors and improve the yield when the subsequent circuit arrangement is carried out on the copper-clad plates.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. A copper-clad plate processing technology is characterized in that: the method comprises the following steps:
s1, manufacturing resin glue solution of the copper-clad plate, putting epoxy resin for producing the copper-clad plate into a reaction kettle, heating the epoxy resin in the reaction kettle, adding resin acid, resin alcohol and resin hydrocarbon into the reaction kettle to perform primary mixing treatment, and finally adding a fixing agent and a curing accelerator again to perform mixing and dissolving to obtain the copper-clad plate;
s2, preparing the sizing paper of the copper-clad plate, injecting the prepared mixed epoxy resin into a glue tank of a sizing machine, impregnating resin glue solution by taking fiber paper, glass fiber cloth, glass fiber paper and the like as reinforced base materials, and heating and drying the base materials at 120-180 ℃ by using a baking oven of the sizing machine to prepare semi-finished sizing paper;
s3, laminating and molding a copper-clad plate, namely coating a copper anchor on a prepared semi-finished product to form a laminated blank of gummed paper, putting copper plates up and down as moulds, then putting the mould between heating plates of a press, and performing high-temperature and high-pressure laminating and molding processing to press and mold the copper-clad plate;
s4, preparing low-temperature embrittlement glue, namely putting coumarone-indene resin into a pulverizer in sequence for pulverization, putting the pulverized coumarone-indene resin into a reaction kettle, and then putting ethylene-vinyl acetate copolymer, synthetic paraffin resin, talcum powder, 2, 6-di-tert-butyl-p-cresol, dibutyl phthalate and calcium carbonate into the reaction kettle for mixing and heating to prepare the low-temperature embrittlement glue;
s5, stacking the copper-clad plates, injecting the prepared low-temperature embrittlement glue into a glue spreader, spreading the low-temperature embrittlement glue on the surface of the first copper-clad plate through the glue spreader, after the spreading is finished, stacking the other copper-clad plate on the surface of the first copper-clad plate, performing bonding treatment through the low-temperature embrittlement glue, and performing bonding stacking treatment on the plurality of copper-clad plates in the mode;
s6, cutting and drilling the copper-clad plates, placing the copper-clad plates on a placing table of a cutting machine, sending the copper-clad plates into a prepreg cutting machine, setting parameters meeting production labels according to needs, cutting the copper-clad plates into copper-clad plates with corresponding sizes, and drilling the copper-clad plates by a drilling machine;
s7, separating the copper-clad plates, performing extreme cooling treatment on the cut and drilled copper-clad plates through liquid nitrogen, making the low-temperature embrittlement glue among the copper-clad plates brittle at the temperature lower than-30 ℃, and performing vibration treatment on the copper-clad plates through vibration equipment, so that the copper-clad plates are separated;
s8, cleaning the copper-clad plate, namely cleaning the separated low-temperature embrittlement glue remained on the copper-clad plate after embrittlement by using a polishing device, so as to finish cutting and punching of the copper-clad plate;
s9, packaging the copper-clad plate, and packaging the processed copper-clad plate into a box;
and S10, warehousing the copper-clad plate, namely warehousing the packaged copper-clad plate to finish the production of the copper-clad plate.
2. The copper-clad plate processing technology of claim 1, which is characterized in that: the heating time of the reaction kettle in the S1 is 22-30 min, and the adding ratio of the resin acid, the resin alcohol and the resin hydrocarbon is 1:1.1: 1.5.
3. The copper-clad plate processing technology of claim 1, which is characterized in that: and in the S2, the glue groove of the gluing machine needs to be ensured to be free of impurities before use, and the drying time of the drying oven of the gluing machine is 25-40 min.
4. The copper-clad plate processing technology of claim 1, which is characterized in that: and the S3 medium press performs preheating treatment before heating the semi-finished gummed paper, the preheating time is 10 minutes, and the heating treatment is performed by adopting a gradual temperature rise mode.
5. The copper-clad plate processing technology of claim 1, which is characterized in that: the ratio of coumarone-indene resin, ethylene-vinyl acetate copolymer, synthetic paraffin resin, talcum powder, 2, 6-di-tert-butyl-p-cresol, dibutyl phthalate and calcium carbonate in S4 is 0.4: 1: 0.08: 0.01: 0.05: 0.2, and the mixing and heating time in the reaction kettle is 35-40 min.
6. The copper-clad plate processing technology of claim 1, which is characterized in that: and in the S5, when the plurality of copper-clad plates are subjected to superposition processing, the surfaces of the copper-clad plates need to be cleaned so as to ensure that no cavity or foreign matter exists when the copper-clad plates are bonded.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115007622A (en) * | 2022-04-14 | 2022-09-06 | 南京师范大学 | Ultrasonic-assisted crystalline silicon cell glass separation and EVA (ethylene-vinyl acetate) recovery method |
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