CN105585976A - Adhesive material with high adhesion performance - Google Patents

Adhesive material with high adhesion performance Download PDF

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Publication number
CN105585976A
CN105585976A CN201610147316.2A CN201610147316A CN105585976A CN 105585976 A CN105585976 A CN 105585976A CN 201610147316 A CN201610147316 A CN 201610147316A CN 105585976 A CN105585976 A CN 105585976A
Authority
CN
China
Prior art keywords
parts
sizing material
adhesive material
coumarone
vinyl acetate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610147316.2A
Other languages
Chinese (zh)
Inventor
周志强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU HUAZHOU TAPES CO Ltd
Original Assignee
SUZHOU HUAZHOU TAPES CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU HUAZHOU TAPES CO Ltd filed Critical SUZHOU HUAZHOU TAPES CO Ltd
Priority to CN201610147316.2A priority Critical patent/CN105585976A/en
Publication of CN105585976A publication Critical patent/CN105585976A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/08Copolymers of ethene
    • C09J123/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853Vinylacetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses an adhesive material with high adhesion performance. The adhesive material is prepared from, by weight, 100-120 parts of ethylene vinyl acetate copolymer, 20-30 parts of coumarone-indene resin, 15-20 parts of butyl phenol resin, 45-55 parts of barium sulfate and 2-7 parts of talcum powder. Adhesive tape is coated with the adhesive material. In this way, adhesion performance is very high because the adhesive material generates mechanical adhesion force, physical adsorption force, chemical bonding force and other forces on the connection face of the adhesive tape and an object to be glued, and the adhesive material is particularly suitable for being used on materials which are very difficult to bond.

Description

A kind of sizing material with high bonding property
Technical field
The present invention relates to adhesive tape and related raw material thereof and production field, particularly relate to a kind of sizing material with high bonding property.
Background technology
On tape surface, scribble one deck sticker, could make adhesive tape can cling article, sticker is the earliest from animal and plant. At 19th-century, rubber is the main component of sticker, and the modern times are the various polymer of extensive use. The sticker using on existing adhesive tape is that sizing material bonding property is bad, especially can not well glued joint for some difficult sticky materials.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of sizing material with high bonding property, can carry out extraordinary splicing.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of sizing material with high bonding property is provided, the raw material components of described sizing material comprises ethylene-vinyl acetate copolymer, coumarone-indene resin, butylphenol resin, barium sulfate and talcum powder, described sizing material is in weight portion, the raw material components comprising is: ethylene-vinyl acetate copolymer 100-120 part, coumarone-indene resin 20-30 part, butylphenol resin 15-20 part, barium sulfate 45-55 part, talcum powder 2-7 part, described sizing material is coated on adhesive tape.
In a preferred embodiment of the present invention, described sizing material is in weight portion, and the raw material components comprising is: 110 parts of ethylene-vinyl acetate copolymers, 25 parts of coumarone-indene resins, 17 parts of butylphenol resins, 50 parts, barium sulfate, 5 parts of talcum powder.
In a preferred embodiment of the present invention, the softening temperature of described sizing material is 80-90 DEG C.
In a preferred embodiment of the present invention, described sizing material is in weight portion, and the raw material components comprising is: 100 parts of ethylene-vinyl acetate copolymers, 30 parts of coumarone-indene resins, 20 parts of butylphenol resins, 45 parts, barium sulfate, 7 parts of talcum powder.
The invention has the beneficial effects as follows: the sizing material with high bonding property of the present invention,, be particularly useful for using on the material of very difficult bonding at adhesive tape with treat that producing the power such as mechanical bond power, physical absorption power and Chemical bonding on the joint face of sticky thing produces very strong bonding property by sizing material.
Detailed description of the invention
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiment. Based on the embodiment in the present invention, those of ordinary skill in the art, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment mono-:
A kind of sizing material with high bonding property is provided, and the raw material components of described sizing material comprises ethylene-vinyl acetate copolymer, coumarone-indene resin, butylphenol resin, barium sulfate and talcum powder. Described sizing material is in weight portion, and the raw material components comprising is: 110 parts of ethylene-vinyl acetate copolymers, 25 parts of coumarone-indene resins, 17 parts of butylphenol resins, 50 parts, barium sulfate, 5 parts of talcum powder, described sizing material is coated on adhesive tape. The softening temperature of wherein said sizing material is 85 DEG C.
Embodiment bis-:
A kind of sizing material with high bonding property is provided, and the raw material components of described sizing material comprises ethylene-vinyl acetate copolymer, coumarone-indene resin, butylphenol resin, barium sulfate and talcum powder. Described sizing material is in weight portion, and the raw material components comprising is: 100 parts of ethylene-vinyl acetate copolymers, 30 parts of coumarone-indene resins, 20 parts of butylphenol resins, 45 parts, barium sulfate, 7 parts of talcum powder, described sizing material is coated on adhesive tape. The softening temperature of wherein said sizing material is 90 DEG C.
Embodiment tri-:
A kind of sizing material with high bonding property is provided, and the raw material components of described sizing material comprises ethylene-vinyl acetate copolymer, coumarone-indene resin, butylphenol resin, barium sulfate and talcum powder. Described sizing material is in weight portion, and the raw material components comprising is: 120 parts of ethylene-vinyl acetate copolymers, 20 parts of coumarone-indene resins, 15 parts of butylphenol resins, 55 parts, barium sulfate, 2 parts of talcum powder, described sizing material is coated on adhesive tape. The softening temperature of wherein said sizing material is 80 DEG C.
The invention has the beneficial effects as follows:
One, by sizing material at adhesive tape with treat that producing the power such as mechanical bond power, physical absorption power and Chemical bonding on the joint face of sticky thing produces very strong bonding property;
The sizing material two, with high bonding property is applicable to make on the material of very difficult bonding.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (4)

1. one kind has the sizing material of high bonding property, it is characterized in that, the raw material components of described sizing material comprises ethylene-vinyl acetate copolymer, coumarone-indene resin, butylphenol resin, barium sulfate and talcum powder, described sizing material is in weight portion, the raw material components comprising is: ethylene-vinyl acetate copolymer 100-120 part, coumarone-indene resin 20-30 part, butylphenol resin 15-20 part, barium sulfate 45-55 part, talcum powder 2-7 part, described sizing material is coated on adhesive tape.
2. the sizing material with high bonding property according to claim 1, it is characterized in that, described sizing material is in weight portion, and the raw material components comprising is: 110 parts of ethylene-vinyl acetate copolymers, 25 parts of coumarone-indene resins, 17 parts of butylphenol resins, 50 parts, barium sulfate, 5 parts of talcum powder.
3. the sizing material with high bonding property according to claim 1, is characterized in that, the softening temperature of described sizing material is 80-90 DEG C.
4. the sizing material with high bonding property according to claim 1, it is characterized in that, described sizing material is in weight portion, and the raw material components comprising is: 100 parts of ethylene-vinyl acetate copolymers, 30 parts of coumarone-indene resins, 20 parts of butylphenol resins, 45 parts, barium sulfate, 7 parts of talcum powder.
CN201610147316.2A 2016-03-16 2016-03-16 Adhesive material with high adhesion performance Pending CN105585976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610147316.2A CN105585976A (en) 2016-03-16 2016-03-16 Adhesive material with high adhesion performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610147316.2A CN105585976A (en) 2016-03-16 2016-03-16 Adhesive material with high adhesion performance

Publications (1)

Publication Number Publication Date
CN105585976A true CN105585976A (en) 2016-05-18

Family

ID=55925892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610147316.2A Pending CN105585976A (en) 2016-03-16 2016-03-16 Adhesive material with high adhesion performance

Country Status (1)

Country Link
CN (1) CN105585976A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107365564A (en) * 2017-08-23 2017-11-21 和平世家钟表有限公司 A kind of novel glue and preparation method and application
CN113910738A (en) * 2021-10-25 2022-01-11 惠州市炬能量电子科技有限公司 Copper-clad plate processing technology

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85109217A (en) * 1985-12-01 1987-06-17 成都科技大学 Hot melting adhesive for polyolefin
US20060134374A1 (en) * 2004-12-16 2006-06-22 Mohawk Carpet Corporation Vinyl polymer adhesives with post-consumer recycled glass powder filler
CN104694046A (en) * 2013-12-07 2015-06-10 招远鲁娃婴幼儿用品有限公司 Adhesive for manufacturing toys

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85109217A (en) * 1985-12-01 1987-06-17 成都科技大学 Hot melting adhesive for polyolefin
US20060134374A1 (en) * 2004-12-16 2006-06-22 Mohawk Carpet Corporation Vinyl polymer adhesives with post-consumer recycled glass powder filler
CN104694046A (en) * 2013-12-07 2015-06-10 招远鲁娃婴幼儿用品有限公司 Adhesive for manufacturing toys

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107365564A (en) * 2017-08-23 2017-11-21 和平世家钟表有限公司 A kind of novel glue and preparation method and application
CN113910738A (en) * 2021-10-25 2022-01-11 惠州市炬能量电子科技有限公司 Copper-clad plate processing technology

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160518

RJ01 Rejection of invention patent application after publication