CN104974698A - Novel plastic adhesive - Google Patents
Novel plastic adhesive Download PDFInfo
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- CN104974698A CN104974698A CN201510419224.0A CN201510419224A CN104974698A CN 104974698 A CN104974698 A CN 104974698A CN 201510419224 A CN201510419224 A CN 201510419224A CN 104974698 A CN104974698 A CN 104974698A
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- parts
- novel plastic
- modified amine
- thinner
- mono
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Abstract
The invention discloses a novel plastic adhesive comprising the following components in parts by mass: 38-48 parts of epoxy resin, 8-18 parts of modified amine, 3-5 parts of a coupling agent, 5-8 parts of a diluent, 1-3 parts of quartz powder and 1-2 parts of a mono-epoxy compound. By virtue of the above way, the invention can provide the novel plastic adhesive which is high in adhesive strength, extremely small in shrinkage ratio, aging-resistant, yellowing-resistant and freeze-thaw-resistant after room-temperature reaction and curing, so that the novel plastic adhesive is very practical and can be widely applied to parts requiring adhesion of engineering plastics and the like.
Description
Technical field
The present invention relates to a kind of plasthetics, particularly relate to a kind of novel plastic glue paste.
Background technology
Existing plastics need scrappy plastic items to splice, and existing splicing adopts the mode of glue paste more, but the composition that glue paste of the prior art needs is too many, and not easily produces, the effect used is also bad, in use can cause the generation of problems of crack.
Summary of the invention
The technical problem that the present invention mainly solves is: after a kind of room temperature reaction how can be provided to solidify, bonding strength is high, shrinking percentage is minimum, ageing-resistant, color inhibition, freeze-thawing resistant, be very practical a glue paste, be applicable to the position that engineering plastics etc. need bonding widely.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of novel plastic glue paste, comprise: epoxy resin, modified amine, coupling agent, thinner, silica powder, mono-epoxy compound, wherein, calculate according to mass percent, epoxy resin accounts for 38-48 part, modified amine 8-18 part, coupling agent 3-5 part, thinner 5-8 part, silica powder 1-3 part, mono-epoxy compound 1-2 part.
In a preferred embodiment of the present invention, epoxy resin, modified amine, coupling agent, thinner, silicon powder, mono-epoxy compound, wherein, calculate according to mass percent, epoxy resin accounts for 30-38 part, modified amine 8-10 part, coupling agent 3-5 part, thinner 5-8 part, silicon powder 2-5 part, mono-epoxy compound 1-2 part.
In a preferred embodiment of the present invention, described modified amine is phenol aldehyde modified amine.
In a preferred embodiment of the present invention, described thinner is alcohol.
The invention has the beneficial effects as follows: after the solidification of this glue paste room temperature reaction, bonding strength is high, shrinking percentage is minimum, ageing-resistant, color inhibition, freeze-thawing resistant, is very practical a glue paste, is applicable to the position that engineering plastics etc. need bonding widely.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention provides following technical scheme.
A kind of novel plastic glue paste is provided in the present embodiment, comprise: epoxy resin, modified amine, coupling agent, thinner, silica powder, mono-epoxy compound, wherein, according to mass percent calculate, epoxy resin account for 38 parts, modified amine 18 parts, coupling agent 5 parts, thinner 8 parts, silica powder 3 parts, mono-epoxy compound 2 parts.
Preferably, epoxy resin account for 48 parts, modified amine 8 parts, coupling agent 3 parts, thinner 5 parts, silica powder 1 part, mono-epoxy compound 1 part.
Preferably, epoxy resin account for 40 parts, modified amine 10 parts, coupling agent 4 parts, thinner 6 parts, silica powder 2 parts, mono-epoxy compound 2 parts.
Preferably, epoxy resin account for 30 parts, modified amine 10 parts, coupling agent 5 parts, thinner 8 parts, silicon powder 5 parts, mono-epoxy compound 2 parts.
Epoxy resin account for 38 parts, modified amine 8 parts, coupling agent 3 parts, thinner 5 parts, silicon powder 2 parts, mono-epoxy compound 1 part.
Epoxy resin account for 33 parts, modified amine 9 parts, coupling agent 4 parts, thinner 6 parts, silicon powder 3 parts, mono-epoxy compound 2 parts.
Wherein, described modified amine is phenol aldehyde modified amine, and described thinner is alcohol.
The invention has the beneficial effects as follows: after the solidification of this glue paste room temperature reaction, bonding strength is high, shrinking percentage is minimum, ageing-resistant, color inhibition, freeze-thawing resistant, is very practical a glue paste, is applicable to the position that engineering plastics etc. need bonding widely.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a novel plastic glue paste, it is characterized in that, comprise: epoxy resin, modified amine, coupling agent, thinner, silica powder, mono-epoxy compound, wherein, calculate according to mass percent, epoxy resin accounts for 38-48 part, modified amine 8-18 part, coupling agent 3-5 part, thinner 5-8 part, silica powder 1-3 part, mono-epoxy compound 1-2 part.
2. novel plastic glue paste according to claim 1, it is characterized in that, comprise: epoxy resin, modified amine, coupling agent, thinner, silicon powder, mono-epoxy compound, wherein, calculate according to mass percent, epoxy resin accounts for 30-38 part, modified amine 8-10 part, coupling agent 3-5 part, thinner 5-8 part, silicon powder 2-5 part, mono-epoxy compound 1-2 part.
3. novel plastic glue paste according to claim 1 and 2, is characterized in that, described modified amine is phenol aldehyde modified amine.
4. novel plastic glue paste according to claim 1, is characterized in that, described thinner is alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510419224.0A CN104974698A (en) | 2015-07-17 | 2015-07-17 | Novel plastic adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510419224.0A CN104974698A (en) | 2015-07-17 | 2015-07-17 | Novel plastic adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104974698A true CN104974698A (en) | 2015-10-14 |
Family
ID=54271676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510419224.0A Pending CN104974698A (en) | 2015-07-17 | 2015-07-17 | Novel plastic adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104974698A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114395354A (en) * | 2022-01-25 | 2022-04-26 | 苏州英田电子科技有限公司 | Low-shrinkage epoxy structural adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101580684A (en) * | 2009-06-05 | 2009-11-18 | 烟台德邦科技有限公司 | Low-temperature fast curing underfill adhesive and preparation method thereof |
| CN102775952A (en) * | 2012-08-16 | 2012-11-14 | 三友（天津）高分子技术有限公司 | Plastic toy repairing adhesive and preparation method thereof |
-
2015
- 2015-07-17 CN CN201510419224.0A patent/CN104974698A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101580684A (en) * | 2009-06-05 | 2009-11-18 | 烟台德邦科技有限公司 | Low-temperature fast curing underfill adhesive and preparation method thereof |
| CN102775952A (en) * | 2012-08-16 | 2012-11-14 | 三友（天津）高分子技术有限公司 | Plastic toy repairing adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 马东卫: "《胶粘剂制备及应用》", 30 September 1998, 化学工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114395354A (en) * | 2022-01-25 | 2022-04-26 | 苏州英田电子科技有限公司 | Low-shrinkage epoxy structural adhesive |
| CN114395354B (en) * | 2022-01-25 | 2023-11-03 | 苏州英田电子科技有限公司 | Low-shrinkage epoxy structural adhesive |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151014 |