JPS5774377A - Method of peeling off adhesive tape from adhesive tape-converted metallic material - Google Patents
Method of peeling off adhesive tape from adhesive tape-converted metallic materialInfo
- Publication number
- JPS5774377A JPS5774377A JP15188180A JP15188180A JPS5774377A JP S5774377 A JPS5774377 A JP S5774377A JP 15188180 A JP15188180 A JP 15188180A JP 15188180 A JP15188180 A JP 15188180A JP S5774377 A JPS5774377 A JP S5774377A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- metallic material
- peeling
- adhesive
- converted metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To peel off completely and easily an adhesive tape from a metallic material without fier of causing environmental pollution, by cooling an adhesive tape- covered metallic material below a specified temp.
CONSTITUTION: An adhesive tape-covered metallic material is immersed in liquid nitrogen or methanol contg. dry ice to cool said material below the glass transition point of an adhesive of the adhesive tape, whereby the adhesive is made brittle and the adhesive tape is peeled off from the surface of the metallic material of it- self.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15188180A JPS5774377A (en) | 1980-10-28 | 1980-10-28 | Method of peeling off adhesive tape from adhesive tape-converted metallic material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15188180A JPS5774377A (en) | 1980-10-28 | 1980-10-28 | Method of peeling off adhesive tape from adhesive tape-converted metallic material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5774377A true JPS5774377A (en) | 1982-05-10 |
Family
ID=15528236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15188180A Pending JPS5774377A (en) | 1980-10-28 | 1980-10-28 | Method of peeling off adhesive tape from adhesive tape-converted metallic material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5774377A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03109476A (en) * | 1989-09-22 | 1991-05-09 | Sekisui Chem Co Ltd | Tacky agent and tacky sheet |
JP2007002199A (en) * | 2005-06-27 | 2007-01-11 | Somar Corp | Cold-release type adhesive composition, cold-release type adhesive sheet and method for processing film by using the same |
JP2007009168A (en) * | 2005-06-28 | 2007-01-18 | Seagate Technology Llc | Attachment through adhesion of first member to second member |
JP2008174595A (en) * | 2007-01-16 | 2008-07-31 | Somar Corp | Cooling-and-peeling type self-adhesive composition and cooling-and-peeling type self-adhesive sheet using the same |
JP2013173913A (en) * | 2011-11-10 | 2013-09-05 | Nitto Denko Corp | Method of detaching plates |
JP2013209667A (en) * | 2013-06-12 | 2013-10-10 | Somar Corp | Cooling-and-peeling type pressure sensitive adhesive composition and cooling-and-peeling type pressure sensitive adhesive sheet using the same |
JP2013227427A (en) * | 2012-04-25 | 2013-11-07 | Daicel Corp | Adhesive sheet and peeling method |
JP2018062544A (en) * | 2016-10-11 | 2018-04-19 | Dic株式会社 | Adhesive sheet and method for dismantling article |
CN113910738A (en) * | 2021-10-25 | 2022-01-11 | 惠州市炬能量电子科技有限公司 | Copper-clad plate processing technology |
JP2023518098A (en) * | 2020-04-09 | 2023-04-27 | ティッセンクルップ スチール ヨーロッパ アーゲー | LAMINATE STACK MANUFACTURING METHOD, LAMINATE STACK, AND ELECTRICAL MACHINE |
WO2024106460A1 (en) * | 2022-11-17 | 2024-05-23 | 東亞合成株式会社 | Peeling method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5198731A (en) * | 1975-01-22 | 1976-08-31 | ||
JPS5328046A (en) * | 1976-07-13 | 1978-03-15 | Nii Upurabureniaipuroizubuodos | Apparatus for electroochemical processing |
-
1980
- 1980-10-28 JP JP15188180A patent/JPS5774377A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5198731A (en) * | 1975-01-22 | 1976-08-31 | ||
JPS5328046A (en) * | 1976-07-13 | 1978-03-15 | Nii Upurabureniaipuroizubuodos | Apparatus for electroochemical processing |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03109476A (en) * | 1989-09-22 | 1991-05-09 | Sekisui Chem Co Ltd | Tacky agent and tacky sheet |
JP2007002199A (en) * | 2005-06-27 | 2007-01-11 | Somar Corp | Cold-release type adhesive composition, cold-release type adhesive sheet and method for processing film by using the same |
JP2007009168A (en) * | 2005-06-28 | 2007-01-18 | Seagate Technology Llc | Attachment through adhesion of first member to second member |
JP2008174595A (en) * | 2007-01-16 | 2008-07-31 | Somar Corp | Cooling-and-peeling type self-adhesive composition and cooling-and-peeling type self-adhesive sheet using the same |
JP2013173913A (en) * | 2011-11-10 | 2013-09-05 | Nitto Denko Corp | Method of detaching plates |
JP2013227427A (en) * | 2012-04-25 | 2013-11-07 | Daicel Corp | Adhesive sheet and peeling method |
JP2013209667A (en) * | 2013-06-12 | 2013-10-10 | Somar Corp | Cooling-and-peeling type pressure sensitive adhesive composition and cooling-and-peeling type pressure sensitive adhesive sheet using the same |
JP2018062544A (en) * | 2016-10-11 | 2018-04-19 | Dic株式会社 | Adhesive sheet and method for dismantling article |
JP2023518098A (en) * | 2020-04-09 | 2023-04-27 | ティッセンクルップ スチール ヨーロッパ アーゲー | LAMINATE STACK MANUFACTURING METHOD, LAMINATE STACK, AND ELECTRICAL MACHINE |
CN113910738A (en) * | 2021-10-25 | 2022-01-11 | 惠州市炬能量电子科技有限公司 | Copper-clad plate processing technology |
WO2024106460A1 (en) * | 2022-11-17 | 2024-05-23 | 東亞合成株式会社 | Peeling method |
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