CN112389044A - PTFE high-frequency high-speed copper-clad plate and preparation method thereof - Google Patents

PTFE high-frequency high-speed copper-clad plate and preparation method thereof Download PDF

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Publication number
CN112389044A
CN112389044A CN202011312474.1A CN202011312474A CN112389044A CN 112389044 A CN112389044 A CN 112389044A CN 202011312474 A CN202011312474 A CN 202011312474A CN 112389044 A CN112389044 A CN 112389044A
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China
Prior art keywords
copper
clad plate
sheet
copper foil
paper
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CN202011312474.1A
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Chinese (zh)
Inventor
包晓剑
顾鑫
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Jiangsu Roda Electron Material Co ltd
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Jiangsu Roda Electron Material Co ltd
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Priority to CN202011312474.1A priority Critical patent/CN112389044A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/028—Paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof, belonging to the technical field of copper-clad plates. The PTFE high-frequency high-speed copper-clad plate and the preparation method thereof improve the flexibility, solve the problems of poor heat dissipation capability and easy bending damage of the copper-clad plate, improve the production quality of the copper-clad plate through integral detection, ensure the production performance and quality of the copper-clad plate, have strong bending resistance, good heat resistance, long service time and difficult surface expansion, prolong the service life of the copper-clad plate and can be suitable for the use of the high-frequency high-speed copper-clad plate.

Description

PTFE high-frequency high-speed copper-clad plate and preparation method thereof
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof.
Background
With the continuous development of the intelligent electronic information industry, nowadays, the penetration of computers, mobile communication, networks and the like to every corner of life makes the human society steadily move towards the direction of high informatization, and information processing and information communication constitute two major technical pillars in the development of the field of high informatization science and technology. In information processing technology mainly for high-level electronic computers, there are demands for higher speed, larger memory capacity, and smaller size of information processing: on the other hand, in the information communication technology, in order to ensure an increasing communication capacity, mobile communication represented by mobile phone, satellite communication, bluetooth technology, and the like is developed from analog signals to digital signals in the communication method, and in order to increase the number of channels and realize high performance and multi-functionalization, the use frequency is developed from the conventional lGHz to 2GHz, 3GHz, 6GHz, and higher, ultrahigh frequencies. Copper-clad plates are used as important components of electronic components, so that copper-clad plate materials with excellent high-frequency characteristics are widely applied: meanwhile, due to the application of the high-frequency copper-clad plate material in the high-tech fields of aviation, aerospace and the like, the requirement on the performance of the high-frequency copper-clad plate material is higher and higher, the existing copper-clad plate has poor heat dissipation capability and insufficient toughness, the problem of bending and cracking easily occurs, certain limitation is caused during use, and certain influence is brought to the use process of people.
Disclosure of Invention
The invention aims to provide a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof, which can improve the flexibility, solve the problems of poor heat dissipation capability and easy bending damage of the copper-clad plate, improve the production quality of the copper-clad plate through integral detection, ensure the production performance and quality of the copper-clad plate, have strong bending resistance, good heat resistance, long service time and difficult surface expansion, prolong the service life of the copper-clad plate, and can be suitable for the high-frequency high-speed copper-clad plate so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a high-speed copper-clad plate of PTFE high frequency, including the copper-clad plate body, the copper-clad plate body includes first substrate piece, first PTEE film piece, first kraft paper layer, first copper foil layer, second substrate piece, second PTEE film piece, second kraft paper layer and second copper foil layer, the top of first substrate piece sets up first copper foil layer, it is provided with first PTEE film piece to mix with between first copper foil layer and the first substrate piece, the below of first substrate piece is provided with first kraft paper layer, the below of first kraft paper layer sets up second PTEE film piece, the below of second PTEE film piece sets up the second substrate piece, the below of second substrate piece sets up second kraft paper layer, the low side of second kraft paper layer sets up the second copper foil layer.
Furthermore, the lower end of the copper-clad plate body is coated with a layer of radiating fins, and radiating raised grains are arranged on the lower surface of the radiating fins.
Furthermore, the first substrate sheet, the first PTEE film sheet, the first kraft layer, the first copper foil layer, the second substrate sheet, the second PTEE film sheet, the second kraft layer and the second copper foil layer are connected in a pressing mode.
Further, the copper-clad plate body 1 is prepared by the steps of batching, impregnation, cutting of base materials, cutting of auxiliary materials, pre-stacking combination, lamination forming, disassembly detection, integral cutting detection, packaging and warehousing, and the prepared materials comprise epoxy resin, a curing agent, an additive, fiber paper, glass fiber cloth, glass fiber paper and PTFE powder, and are prepared according to the following mass percentages: 25-78% of epoxy resin, 11-18% of curing agent, 8-16% of additive, 15-25% of fiber paper, 15-23% of glass fiber cloth, 15-28% of glass fiber paper and 13-36% of PTFE powder.
The invention provides another technical scheme: a preparation method of a PTFE high-frequency high-speed copper-clad plate comprises the following steps:
s1: preparing materials: selecting epoxy resin, a curing agent and an additive, firstly putting the curing agent into the epoxy resin for mixing, heating the mixed epoxy resin to 45-60 ℃, dissolving the curing agent in the epoxy resin, adding the additive after melting, uniformly stirring to obtain a fully fused glue solution, and standing the glue solution for a plurality of hours to allow the glue solution to react;
s2: impregnation: injecting the prepared resin glue solution into a glue tank of a gluing machine, selecting fiber paper, glass fiber cloth, glass fiber paper and the like as reinforced base materials, impregnating the resin glue solution, drying the resin glue solution by a baking oven of the gluing machine under the condition of 120-180 ℃, so that the resin is in a semi-cured state, and removing a solvent;
s3: cutting the base material: cutting the heated and dried base material into base material pieces with certain sizes;
s4: cutting auxiliary materials: selecting PTFE powder to prepare a PTEE film sheet in the cutting process of the base material, selecting kraft paper and copper foil, and respectively cutting the PTEE film sheet, the kraft paper and the copper foil to obtain a kraft paper cut piece, a copper foil cut piece and a PTEE film cut piece which have the same size as the base material sheet;
s5: pre-stacking combination: superposing the cut substrate sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet, and carrying out periphery finishing, wherein the corners of the base sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet are aligned;
s6: and (3) laminating and forming: covering a copper anchor with a prepared semi-finished laminated blank coated with gummed paper, placing copper plates up and down as a die, and then placing the die between heating plates of a press to perform high-temperature and high-pressure laminating molding;
s7: disassembling and detecting: taking out the copper foil substrate subjected to compression molding from a die of a press, inspecting the lamination molding quality of the copper foil substrate by using a detection device, entering the next procedure after the copper foil substrate is qualified, cleaning and splitting the copper foil substrate by using a copper plate cleaning agent after the copper foil substrate is unqualified to obtain an unlaminated auxiliary material, and performing pre-lamination combination and lamination molding again;
s8: and (4) integral cropping: cutting the copper foil substrate after the detection is qualified by the dimension of the copper foil substrate through an automatic cutting machine or a manual detection machine to obtain a completely formed copper clad laminate, and carrying out overall quality and appearance inspection on the copper clad laminate;
s9: packaging and warehousing: and installing cooling fins below the copper-clad plate with the cut size and qualified inspection, packaging after installation, and conveying and warehousing for storage through a mobile transport vehicle.
Further, in the step S1, a reaction kettle is used for fusing the raw resin in the compounding process, the epoxy resin is used as a main material, and after the raw resin is made into a resin shape, other resins, additives, solvents and the like are added into the reaction kettle for preparation, and finally, a resin glue solution capable of being directly sized is prepared.
Further, in S2, in the process of sizing, the semi-finished product of the sizing paper is continuously processed through two processes of dipping and drying by using a sizing machine, the process of sizing paper for the paper-based copper-clad plate is generally performed in a horizontal sizing machine, and the process of sizing cloth for the glass fiber cloth-based copper-clad plate is generally performed in a vertical sizing machine.
Further, in the step S6, the lamination forming process is completed through three different process control stages of pre-heating, hot-pressing and cooling, and the fiberglass cloth-based copper clad laminate is subjected to the pre-heating stage of pressing at a lower temperature and a lower pressure in the lamination process, and then the high pressure and the temperature increase are performed to complete the curing forming process of the laminate.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof.A bottom end of a copper-clad plate body is coated with a layer of radiating fin, the lower surface of the radiating fin is provided with radiating wavy grains, and a first substrate sheet, a first PTEE film sheet, a first kraft paper layer, a first copper foil layer, a second substrate sheet, a second PTEE film sheet, a second kraft paper layer and a second copper foil layer are connected in a pressing way.
Drawings
Fig. 1 is a cross-sectional view of the overall structure of the present invention.
FIG. 2 is a schematic structural diagram of a copper-clad plate body of the present invention.
Fig. 3 is a schematic view of the structure of the heat sink of the present invention.
FIG. 4 is a flow chart of the production process system of the present invention.
FIG. 5 is a flow chart of the production process of the present invention.
FIG. 6 is an algorithm chart of the production process of the present invention.
In the figure: 1. a copper-clad plate body; 11. a first substrate sheet; 12. a first piece of PTEE film; 13. a first kraft layer; 14. a first copper foil layer; 15. a second substrate sheet; 16. a second piece of PTEE film; 17. a second kraft layer; 18. a second copper foil layer; 2. a heat sink; 21. and a heat sink.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-3, a PTFE high-frequency high-speed copper-clad plate and a method for manufacturing the same, comprising a copper-clad plate body 1, wherein the copper-clad plate body 1 comprises a first substrate sheet 11, a first PTEE film sheet 12, a first kraft layer 13, a first copper foil layer 14, a second substrate sheet 15, a second PTEE film sheet 16, a second kraft layer 17 and a second copper foil layer 18, the first copper foil layer 14 is disposed above the first substrate sheet 11, the first PTEE film sheet 12 is sandwiched between the first copper foil layer 14 and the first substrate sheet 11, the first kraft layer 13 is disposed below the first substrate sheet 11, the second PTEE film sheet 16 is disposed below the first kraft layer 13, the second substrate sheet 15 is disposed below the second PTEE film sheet 16, the second kraft layer 17 is disposed below the second substrate sheet 15, the second kraft layer 18 is disposed at the lower end of the second kraft layer 17, and a heat sink 2 is coated at the lower end of the copper-clad plate body 1, 2 lower surfaces of fin are provided with heat dissipation raised grain 21, first substrate piece 11, first PTEE film piece 12, first kraft paper layer 13, first copper foil layer 14, second substrate piece 15, second PTEE film piece 16, pressfitting is connected between second kraft paper layer 17 and the second copper foil layer 18, through 1 hot briquetting with the copper-clad plate body, increase heat radiating area through heat dissipation raised grain 21, the curved surface sets up, improve the pliability, it is poor to have solved copper-clad plate heat dissipation ability, the problem of easy buckling damage.
Referring to fig. 4, the copper-clad plate body 1 is manufactured by the steps of material preparation, impregnation, substrate cutting, auxiliary material cutting, pre-stacking combination, lamination molding, disassembly detection, integral cutting detection, packaging and warehousing, and the manufactured material comprises epoxy resin, a curing agent, an additive, fiber paper, glass fiber cloth, glass fiber paper and PTFE powder, and is prepared according to the following mass percentages: 32% of epoxy resin, 12% of curing agent, 13% of additive, 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and 25% of PTFE powder.
Referring to fig. 5 to 6, in order to better show the process of the PTFE high-frequency high-speed copper-clad plate, the embodiment provides a method for preparing a PTFE high-frequency high-speed copper-clad plate, which includes the following steps:
s1: preparing materials: selecting 32% of epoxy resin, 12% of curing agent and 13% of additive, firstly putting the curing agent into the epoxy resin for mixing, heating the mixed epoxy resin to 45-60 ℃, dissolving the curing agent in the epoxy resin, adding the additive after melting, uniformly stirring to obtain fully fused glue solution, and standing the glue solution for a plurality of hours to allow the glue solution to react;
s2: impregnation: injecting the prepared resin glue solution into a glue tank of a gluing machine, selecting 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and the like as reinforced base materials, impregnating the resin glue solution, drying the resin glue solution by a drying oven of the gluing machine under the condition of 120-180 ℃, making the resin in a semi-cured state, and removing a solvent;
s3: cutting the base material: cutting the heated and dried base material into base material pieces with certain sizes;
s4: cutting auxiliary materials: selecting 25% of PTFE powder to prepare a PTEE film sheet in the cutting process of the base material, selecting kraft paper and copper foil, and respectively cutting the PTEE film sheet, the kraft paper and the copper foil to obtain a kraft paper cutting piece, a copper foil cutting piece and a PTEE film cutting piece which have the same size as the base material sheet;
s5: pre-stacking combination: superposing the cut substrate sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet, and carrying out periphery finishing, wherein the corners of the base sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet are aligned;
s6: and (3) laminating and forming: covering a copper anchor with a prepared semi-finished laminated blank coated with gummed paper, placing copper plates up and down as a die, and then placing the die between heating plates of a press to perform high-temperature and high-pressure laminating molding;
s7: disassembling and detecting: taking out the copper foil substrate subjected to compression molding from a die of a press, inspecting the lamination molding quality of the copper foil substrate by using a detection device, entering the next procedure after the copper foil substrate is qualified, cleaning and splitting the copper foil substrate by using a copper plate cleaning agent after the copper foil substrate is unqualified to obtain an unlaminated auxiliary material, and performing pre-lamination combination and lamination molding again;
s8: and (4) integral cropping: cutting the copper foil substrate after the detection is qualified by the dimension of the copper foil substrate through an automatic cutting machine or a manual detection machine to obtain a completely formed copper clad laminate, and carrying out overall quality and appearance inspection on the copper clad laminate;
s9: packaging and warehousing: and (3) installing cooling fins 2 below the copper-clad plate with the cut size and qualified inspection, packaging after installation, and conveying and warehousing for storage through a mobile transport vehicle.
Aiming at S1, the blending process needs to be carried out by a reaction kettle, epoxy resin is the main material, after the original resin is made into resin shape, other resin, auxiliary agent, solvent and the like are added into the reaction kettle for preparation, and finally resin glue solution capable of being directly glued is prepared, in the gluing process, semi-finished gluing paper is continuously processed by two processing processes of dipping and drying by a gluing machine, the gluing paper processing of the paper-based copper clad plate is generally carried out in a horizontal gluing machine, the gluing cloth processing of the glass fiber cloth-based copper clad plate is generally carried out in a vertical gluing machine, the lamination forming processing is completed by three different process control stages of preheating, hot pressing and cooling, in the lamination processing process, the preheating stage of pressing the glass fiber cloth-based copper clad plate is firstly carried out at lower temperature and lower pressure, then high pressure and temperature raising are carried out, and the curing forming processing of the finished plate is carried out, through integral detection, the production quality of the copper-clad plate is improved, and the production performance and quality of the copper-clad plate are ensured.
Example two:
a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof, the PTFE high-frequency high-speed copper-clad plate comprises a copper-clad plate body 1, the copper-clad plate body 1 comprises a first substrate sheet 11, a first PTEE film sheet 12, a first kraft paper layer 13, a first copper foil layer 14, a second substrate sheet 15, a second PTEE film sheet 16, a second kraft paper layer 17 and a second copper foil layer 18, the first copper foil layer 14 is arranged above the first substrate sheet 11, the first PTEE film sheet 12 is arranged between the first copper foil layer 14 and the first substrate sheet 11 in an inclusion manner, the first kraft paper layer 13 is arranged below the first substrate sheet 11, the second PTEE film sheet 16 is arranged below the first kraft paper layer 13, the second substrate sheet 15 is arranged below the second PTEE film sheet 16, the second kraft paper layer 17 is arranged below the second substrate sheet 15, the second copper foil layer 18 is arranged at the lower end of the second kraft paper layer 17, a heat dissipation fin 2 is coated at the lower surface of the copper-clad plate body 1, and heat dissipation wave patterns 21 are arranged on the lower surface of the heat dissipation, first substrate piece 11, first PTEE film piece 12, first kraft paper layer 13, first copper foil layer 14, second substrate piece 15, second PTEE film piece 16, pressfitting connection between second kraft paper layer 17 and the second copper foil layer 18, through with copper-clad plate body 1 hot briquetting, increase heat radiating area through heat dissipation raised grain 21, the curved surface sets up, improves the pliability, has solved the poor heat dissipation ability of copper-clad plate, the easy problem of buckling the damage.
The copper-clad plate body 1 is prepared by the steps of batching, impregnation, substrate cutting, auxiliary material cutting, pre-stacking combination, laminating forming, disassembling detection, integral cutting detection and packaging and warehousing, and the prepared material comprises epoxy resin, a curing agent, an additive, fiber paper, glass fiber cloth, glass fiber paper and PTFE powder, and is prepared according to the following mass percentage: 43% of epoxy resin, 15% of curing agent, 10% of additive, 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and 18% of PTFE powder.
In order to better show the process of the PTFE high-frequency high-speed copper-clad plate, the embodiment provides a preparation method of the PTFE high-frequency high-speed copper-clad plate, which comprises the following steps:
s1: preparing materials: selecting 43% of epoxy resin, 15% of curing agent and 10% of additive, firstly putting the curing agent into the epoxy resin for mixing, heating the mixed epoxy resin to 45-60 ℃, dissolving the curing agent in the epoxy resin, adding the additive after melting, uniformly stirring to obtain fully fused glue solution, and standing the glue solution for a plurality of hours to allow the glue solution to react;
s2: impregnation: injecting the prepared resin glue solution into a glue tank of a gluing machine, selecting 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and the like as reinforced base materials, impregnating the resin glue solution, drying the resin glue solution by a drying oven of the gluing machine under the condition of 120-180 ℃, making the resin in a semi-cured state, and removing a solvent;
s3: cutting the base material: cutting the heated and dried base material into base material pieces with certain sizes;
s4: cutting auxiliary materials: selecting 18% of PTFE powder to prepare a PTEE film sheet in the cutting process of the base material, selecting kraft paper and copper foil, and respectively cutting the PTEE film sheet, the kraft paper and the copper foil to obtain a kraft paper cutting piece, a copper foil cutting piece and a PTEE film cutting piece which have the same size as the base material sheet;
s5: pre-stacking combination: superposing the cut substrate sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet, and carrying out periphery finishing, wherein the corners of the base sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet are aligned;
s6: and (3) laminating and forming: covering a copper anchor with a prepared semi-finished laminated blank coated with gummed paper, placing copper plates up and down as a die, and then placing the die between heating plates of a press to perform high-temperature and high-pressure laminating molding;
s7: disassembling and detecting: taking out the copper foil substrate subjected to compression molding from a die of a press, inspecting the lamination molding quality of the copper foil substrate by using a detection device, entering the next procedure after the copper foil substrate is qualified, cleaning and splitting the copper foil substrate by using a copper plate cleaning agent after the copper foil substrate is unqualified to obtain an unlaminated auxiliary material, and performing pre-lamination combination and lamination molding again;
s8: and (4) integral cropping: cutting the copper foil substrate after the detection is qualified by the dimension of the copper foil substrate through an automatic cutting machine or a manual detection machine to obtain a completely formed copper clad laminate, and carrying out overall quality and appearance inspection on the copper clad laminate;
s9: packaging and warehousing: and (3) installing cooling fins 2 below the copper-clad plate with the cut size and qualified inspection, packaging after installation, and conveying and warehousing for storage through a mobile transport vehicle.
Aiming at S1, the blending process needs to be carried out by a reaction kettle, epoxy resin is the main material, after the original resin is made into resin shape, other resin, auxiliary agent, solvent and the like are added into the reaction kettle for preparation, and finally resin glue solution capable of being directly glued is prepared, in the gluing process, semi-finished gluing paper is continuously processed by two processing processes of dipping and drying by a gluing machine, the gluing paper processing of the paper-based copper clad plate is generally carried out in a horizontal gluing machine, the gluing cloth processing of the glass fiber cloth-based copper clad plate is generally carried out in a vertical gluing machine, the lamination forming processing is completed by three different process control stages of preheating, hot pressing and cooling, in the lamination processing process, the preheating stage of pressing the glass fiber cloth-based copper clad plate is firstly carried out at lower temperature and lower pressure, then high pressure and temperature raising are carried out, and the curing forming processing of the finished plate is carried out, through integral detection, the production quality of the copper-clad plate is improved, and the production performance and quality of the copper-clad plate are ensured.
Example three:
a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof, the PTFE high-frequency high-speed copper-clad plate comprises a copper-clad plate body 1, the copper-clad plate body 1 comprises a first substrate sheet 11, a first PTEE film sheet 12, a first kraft paper layer 13, a first copper foil layer 14, a second substrate sheet 15, a second PTEE film sheet 16, a second kraft paper layer 17 and a second copper foil layer 18, the first copper foil layer 14 is arranged above the first substrate sheet 11, the first PTEE film sheet 12 is arranged between the first copper foil layer 14 and the first substrate sheet 11 in an inclusion manner, the first kraft paper layer 13 is arranged below the first substrate sheet 11, the second PTEE film sheet 16 is arranged below the first kraft paper layer 13, the second substrate sheet 15 is arranged below the second PTEE film sheet 16, the second kraft paper layer 17 is arranged below the second substrate sheet 15, the second copper foil layer 18 is arranged at the lower end of the second kraft paper layer 17, a heat dissipation fin 2 is coated at the lower surface of the copper-clad plate body 1, and heat dissipation wave patterns 21 are arranged on the lower surface of the heat dissipation, first substrate piece 11, first PTEE film piece 12, first kraft paper layer 13, first copper foil layer 14, second substrate piece 15, second PTEE film piece 16, pressfitting connection between second kraft paper layer 17 and the second copper foil layer 18, through with copper-clad plate body 1 hot briquetting, increase heat radiating area through heat dissipation raised grain 21, the curved surface sets up, improves the pliability, has solved the poor heat dissipation ability of copper-clad plate, the easy problem of buckling the damage.
The copper-clad plate body 1 is prepared by the steps of batching, impregnation, substrate cutting, auxiliary material cutting, pre-stacking combination, laminating forming, disassembling detection, integral cutting detection and packaging and warehousing, and the prepared material comprises epoxy resin, a curing agent, an additive, fiber paper, glass fiber cloth, glass fiber paper and PTFE powder, and is prepared according to the following mass percentage: 52% of epoxy resin, 15% of curing agent, 14% of additive, 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and 20% of PTFE powder.
In order to better show the process of the PTFE high-frequency high-speed copper-clad plate, the embodiment provides a preparation method of the PTFE high-frequency high-speed copper-clad plate, which comprises the following steps:
s1: preparing materials: selecting 52% of epoxy resin, 15% of curing agent and 14% of additive, firstly putting the curing agent into the epoxy resin for mixing, heating the mixed epoxy resin to 45-60 ℃, dissolving the curing agent in the epoxy resin, adding the additive after melting, uniformly stirring to obtain fully fused glue solution, and standing the glue solution for a plurality of hours to allow the glue solution to react;
s2: impregnation: injecting the prepared resin glue solution into a glue tank of a gluing machine, selecting 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and the like as reinforced base materials, impregnating the resin glue solution, drying the resin glue solution by a drying oven of the gluing machine under the condition of 120-180 ℃, making the resin in a semi-cured state, and removing a solvent;
s3: cutting the base material: cutting the heated and dried base material into base material pieces with certain sizes;
s4: cutting auxiliary materials: selecting 20% of PTFE powder to prepare a PTEE film sheet in the cutting process of the base material, selecting kraft paper and copper foil, and respectively cutting the PTEE film sheet, the kraft paper and the copper foil to obtain a kraft paper cutting piece, a copper foil cutting piece and a PTEE film cutting piece which have the same size as the base material sheet;
s5: pre-stacking combination: superposing the cut substrate sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet, and carrying out periphery finishing, wherein the corners of the base sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet are aligned;
s6: and (3) laminating and forming: covering a copper anchor with a prepared semi-finished laminated blank coated with gummed paper, placing copper plates up and down as a die, and then placing the die between heating plates of a press to perform high-temperature and high-pressure laminating molding;
s7: disassembling and detecting: taking out the copper foil substrate subjected to compression molding from a die of a press, inspecting the lamination molding quality of the copper foil substrate by using a detection device, entering the next procedure after the copper foil substrate is qualified, cleaning and splitting the copper foil substrate by using a copper plate cleaning agent after the copper foil substrate is unqualified to obtain an unlaminated auxiliary material, and performing pre-lamination combination and lamination molding again;
s8: and (4) integral cropping: cutting the copper foil substrate after the detection is qualified by the dimension of the copper foil substrate through an automatic cutting machine or a manual detection machine to obtain a completely formed copper clad laminate, and carrying out overall quality and appearance inspection on the copper clad laminate;
s9: packaging and warehousing: and (3) installing cooling fins 2 below the copper-clad plate with the cut size and qualified inspection, packaging after installation, and conveying and warehousing for storage through a mobile transport vehicle.
Aiming at S1, the blending process needs to be carried out by a reaction kettle, epoxy resin is the main material, after the original resin is made into resin shape, other resin, auxiliary agent, solvent and the like are added into the reaction kettle for preparation, and finally resin glue solution capable of being directly glued is prepared, in the gluing process, semi-finished gluing paper is continuously processed by two processing processes of dipping and drying by a gluing machine, the gluing paper processing of the paper-based copper clad plate is generally carried out in a horizontal gluing machine, the gluing cloth processing of the glass fiber cloth-based copper clad plate is generally carried out in a vertical gluing machine, the lamination forming processing is completed by three different process control stages of preheating, hot pressing and cooling, in the lamination processing process, the preheating stage of pressing the glass fiber cloth-based copper clad plate is firstly carried out at lower temperature and lower pressure, then high pressure and temperature raising are carried out, and the curing forming processing of the finished plate is carried out, through integral detection, the production quality of the copper-clad plate is improved, and the production performance and quality of the copper-clad plate are ensured.
Example four:
a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof, the PTFE high-frequency high-speed copper-clad plate comprises a copper-clad plate body 1, the copper-clad plate body 1 comprises a first base material sheet 11, a first PTEE film sheet 12, a first kraft paper layer 13, a first copper foil layer 14, a second base material sheet 15, a second PTEE film sheet 16, a second kraft paper layer 17 and a second copper foil layer 18, the first copper foil layer 14 is arranged above the first base material sheet 11, the first copper foil layer 12 is arranged between the first copper foil layer 14 and the first base material sheet 11 in a mixed mode, the first kraft paper layer 13 is arranged below the first base material sheet 11, the second PTEE film sheet 16 is arranged below the first copper foil layer 13, the second copper-clad plate 15 is arranged below the second base material sheet 15, the second kraft paper layer 17 is arranged below the second kraft paper layer 17, and a heat sink 2 is coated on the low side of the copper-clad plate body 1, 2 lower surfaces of fin are provided with heat dissipation raised grain 21, first substrate piece 11, first PTEE film piece 12, first kraft paper layer 13, first copper foil layer 14, second substrate piece 15, second PTEE film piece 16, pressfitting is connected between second kraft paper layer 17 and the second copper foil layer 18, through 1 hot briquetting with the copper-clad plate body, increase heat radiating area through heat dissipation raised grain 21, the curved surface sets up, improve the pliability, it is poor to have solved copper-clad plate heat dissipation ability, the problem of easy buckling damage.
The copper-clad plate body 1 is prepared by the steps of batching, impregnation, substrate cutting, auxiliary material cutting, pre-stacking combination, laminating forming, disassembling detection, integral cutting detection and packaging and warehousing, and the prepared material comprises epoxy resin, a curing agent, an additive, fiber paper, glass fiber cloth, glass fiber paper and PTFE powder, and is prepared according to the following mass percentage: 62% of epoxy resin, 16% of curing agent, 14% of additive, 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and 30% of PTFE powder.
In order to better show the process of the PTFE high-frequency high-speed copper-clad plate, the embodiment provides a preparation method of the PTFE high-frequency high-speed copper-clad plate, which comprises the following steps:
s1: preparing materials: selecting 62% of epoxy resin, 16% of curing agent and 14% of additive, firstly putting the curing agent into the epoxy resin for mixing, heating the mixed epoxy resin to 45-60 ℃, dissolving the curing agent in the epoxy resin, adding the additive after melting, uniformly stirring to obtain fully fused glue solution, and standing the glue solution for a plurality of hours to allow the glue solution to react;
s2: impregnation: injecting the prepared resin glue solution into a glue tank of a gluing machine, selecting 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and the like as reinforced base materials, impregnating the resin glue solution, drying the resin glue solution by a drying oven of the gluing machine under the condition of 120-180 ℃, making the resin in a semi-cured state, and removing a solvent;
s3: cutting the base material: cutting the heated and dried base material into base material pieces with certain sizes;
s4: cutting auxiliary materials: selecting PTFE powder to prepare a PTEE film sheet in the cutting process of the base material, selecting kraft paper and copper foil, and respectively cutting the PTEE film sheet, the kraft paper and the copper foil to obtain a kraft paper cut piece, a copper foil cut piece and a PTEE film cut piece which have the same size as the base material sheet;
s5: pre-stacking combination: superposing the cut substrate sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet, and carrying out periphery finishing, wherein the corners of the base sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet are aligned;
s6: and (3) laminating and forming: covering a copper anchor with a prepared semi-finished laminated blank coated with gummed paper, placing copper plates up and down as a die, and then placing the die between heating plates of a press to perform high-temperature and high-pressure laminating molding;
s7: disassembling and detecting: taking out the copper foil substrate subjected to compression molding from a die of a press, inspecting the lamination molding quality of the copper foil substrate by using a detection device, entering the next procedure after the copper foil substrate is qualified, cleaning and splitting the copper foil substrate by using a copper plate cleaning agent after the copper foil substrate is unqualified to obtain an unlaminated auxiliary material, and performing pre-lamination combination and lamination molding again;
s8: and (4) integral cropping: cutting the copper foil substrate after the detection is qualified by the dimension of the copper foil substrate through an automatic cutting machine or a manual detection machine to obtain a completely formed copper clad laminate, and carrying out overall quality and appearance inspection on the copper clad laminate;
s9: packaging and warehousing: and (3) installing cooling fins 2 below the copper-clad plate with the cut size and qualified inspection, packaging after installation, and conveying and warehousing for storage through a mobile transport vehicle.
Aiming at S1, the blending process needs to be carried out by a reaction kettle, epoxy resin is the main material, after the original resin is made into resin shape, other resin, auxiliary agent, solvent and the like are added into the reaction kettle for preparation, and finally resin glue solution capable of being directly glued is prepared, in the gluing process, semi-finished gluing paper is continuously processed by two processing processes of dipping and drying by a gluing machine, the gluing paper processing of the paper-based copper clad plate is generally carried out in a horizontal gluing machine, the gluing cloth processing of the glass fiber cloth-based copper clad plate is generally carried out in a vertical gluing machine, the lamination forming processing is completed by three different process control stages of preheating, hot pressing and cooling, in the lamination processing process, the preheating stage of pressing the glass fiber cloth-based copper clad plate is firstly carried out at lower temperature and lower pressure, then high pressure and temperature raising are carried out, and the curing forming processing of the finished plate is carried out, through integral detection, the production quality of the copper-clad plate is improved, and the production performance and quality of the copper-clad plate are ensured.
Example five:
a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof, the PTFE high-frequency high-speed copper-clad plate comprises a copper-clad plate body 1, the copper-clad plate body 1 comprises a first base material sheet 11, a first PTEE film sheet 12, a first kraft paper layer 13, a first copper foil layer 14, a second base material sheet 15, a second PTEE film sheet 16, a second kraft paper layer 17 and a second copper foil layer 18, the first copper foil layer 14 is arranged above the first base material sheet 11, the first copper foil layer 12 is arranged between the first copper foil layer 14 and the first base material sheet 11 in a mixed mode, the first kraft paper layer 13 is arranged below the first base material sheet 11, the second PTEE film sheet 16 is arranged below the first copper foil layer 13, the second copper-clad plate 15 is arranged below the second base material sheet 15, the second kraft paper layer 17 is arranged below the second kraft paper layer 17, and a heat sink 2 is coated on the low side of the copper-clad plate body 1, 2 lower surfaces of fin are provided with heat dissipation raised grain 21, first substrate piece 11, first PTEE film piece 12, first kraft paper layer 13, first copper foil layer 14, second substrate piece 15, second PTEE film piece 16, pressfitting is connected between second kraft paper layer 17 and the second copper foil layer 18, through 1 hot briquetting with the copper-clad plate body, increase heat radiating area through heat dissipation raised grain 21, the curved surface sets up, improve the pliability, it is poor to have solved copper-clad plate heat dissipation ability, the problem of easy buckling damage.
The copper-clad plate body 1 is prepared by the steps of batching, impregnation, substrate cutting, auxiliary material cutting, pre-stacking combination, laminating forming, disassembling detection, integral cutting detection and packaging and warehousing, and the prepared material comprises epoxy resin, a curing agent, an additive, fiber paper, glass fiber cloth, glass fiber paper and PTFE powder, and is prepared according to the following mass percentage: 73% of epoxy resin, 18% of curing agent, 16% of additive, 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and 36% of PTFE powder.
In order to better show the process of the PTFE high-frequency high-speed copper-clad plate, the embodiment provides a preparation method of the PTFE high-frequency high-speed copper-clad plate, which comprises the following steps:
s1: preparing materials: selecting 73% of epoxy resin, 18% of curing agent and 16% of additive, firstly putting the curing agent into the epoxy resin for mixing, heating the mixed epoxy resin to 45-60 ℃, dissolving the curing agent in the epoxy resin, adding the additive after melting, uniformly stirring to obtain fully fused glue solution, and standing the glue solution for a plurality of hours to allow the glue solution to react;
s2: impregnation: injecting the prepared resin glue solution into a glue tank of a gluing machine, selecting 15% of fiber paper, 15% of glass fiber cloth, 15% of glass fiber paper and the like as reinforced base materials, impregnating the resin glue solution, drying the resin glue solution by a drying oven of the gluing machine under the condition of 120-180 ℃, making the resin in a semi-cured state, and removing a solvent;
s3: cutting the base material: cutting the heated and dried base material into base material pieces with certain sizes;
s4: cutting auxiliary materials: selecting 36% of PTFE powder to prepare a PTEE film sheet in the cutting process of the base material, selecting kraft paper and copper foil, and respectively cutting the PTEE film sheet, the kraft paper and the copper foil to obtain a kraft paper cutting piece, a copper foil cutting piece and a PTEE film cutting piece which have the same size as the base material sheet;
s5: pre-stacking combination: superposing the cut substrate sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet, and carrying out periphery finishing, wherein the corners of the base sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet are aligned;
s6: and (3) laminating and forming: covering a copper anchor with a prepared semi-finished laminated blank coated with gummed paper, placing copper plates up and down as a die, and then placing the die between heating plates of a press to perform high-temperature and high-pressure laminating molding;
s7: disassembling and detecting: taking out the copper foil substrate subjected to compression molding from a die of a press, inspecting the lamination molding quality of the copper foil substrate by using a detection device, entering the next procedure after the copper foil substrate is qualified, cleaning and splitting the copper foil substrate by using a copper plate cleaning agent after the copper foil substrate is unqualified to obtain an unlaminated auxiliary material, and performing pre-lamination combination and lamination molding again;
s8: and (4) integral cropping: cutting the copper foil substrate after the detection is qualified by the dimension of the copper foil substrate through an automatic cutting machine or a manual detection machine to obtain a completely formed copper clad laminate, and carrying out overall quality and appearance inspection on the copper clad laminate;
s9: packaging and warehousing: and (3) installing cooling fins 2 below the copper-clad plate with the cut size and qualified inspection, packaging after installation, and conveying and warehousing for storage through a mobile transport vehicle.
Aiming at S1, after the original resin is made into resin, other resin, auxiliary agent, solvent and the like are added into a reaction kettle for preparation, and finally resin glue solution capable of being directly glued is prepared, in the gluing process, semi-finished gluing paper is finished by using a gluing machine through two processing procedures of dipping and drying continuously, the gluing paper processing of the paper-based copper-clad plate is generally carried out in a horizontal gluing machine, the gluing cloth processing of the glass fiber cloth-based copper-clad plate is generally carried out in a vertical gluing machine, the lamination forming processing is finished through three different process control stages of pre-heating, hot pressing and cooling, the glass fiber cloth-based copper-clad plate is firstly pressed at a pre-heating stage at a lower temperature and a lower pressure in the lamination processing procedure, then high pressure and temperature raising are carried out, the curing forming processing of the plate is finished, and the production quality of the copper-clad plate is improved through integral detection, the performance and quality of copper clad laminate production are ensured.
The flexural strength, heat resistance and expansion properties of the above examples one to five were tested and the parameters obtained are shown in the following table:
Figure DEST_PATH_IMAGE002
from table one, it can be seen that: compared with a comparison group, the first embodiment and the second embodiment have poor bending resistance, are easy to break, are long in service time and easily cause the outer surface to be bulked, the third embodiment has medium overall bending resistance and can meet the use requirement, the fourth embodiment and the fifth embodiment have strong bending resistance and good heat resistance, the surface is not easy to expand after the service time is long, the service life of the copper-clad plate is prolonged, and the copper-clad plate can be suitable for being used in a high-frequency high-speed copper-clad plate.
In conclusion, the invention provides a PTFE high-frequency high-speed copper-clad plate and a preparation method thereof, the lower end of a copper-clad plate body 1 is coated with a layer of radiating fins 2, the lower surface of the radiating fins 2 is provided with radiating raised grains 21, a first substrate sheet 11, a first PTEE film sheet 12, a first kraft paper layer 13, a first copper foil layer 14, a second substrate sheet 15, a second PTEE film sheet 16, a second kraft paper layer 17 and a second copper foil layer 18 are connected in a pressing way, the radiating area is enlarged through the radiating raised grains 21 by hot-press molding the copper-clad plate body 1, the flexibility is improved through the curved surface arrangement, the problems of poor radiating capacity and easy bending damage of the copper-clad plate are solved, the quality of copper-clad plate production is improved through integral detection, the production performance and quality of the copper-clad plate are ensured, the bending resistance is strong, the heat resistance is good, the surface is not easy, can be suitable for the use of high-frequency and high-speed copper-clad plates.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.

Claims (8)

1. The PTFE high-frequency high-speed copper-clad plate is characterized in that: comprises a copper-clad plate body (1), wherein the copper-clad plate body (1) comprises a first base material sheet (11), a first PTEE film sheet (12), a first kraft layer (13) and a first copper foil layer (14), the solar cell panel comprises a second base material sheet (15), a second PTEE film sheet (16), a second PTEE film layer (17) and a second copper foil layer (18), wherein the first copper foil layer (14) is arranged above the first base material sheet (11), a first PTEE film sheet (12) is arranged between the first copper foil layer (14) and the first base material sheet (11) in a mixed mode, a first PTEE film sheet (13) is arranged below the first base material sheet (11), a second PTEE film sheet (16) is arranged below the first PTEE film sheet (13), a second base material sheet (15) is arranged below the second PTEE film sheet (16), a second paper layer (17) is arranged below the second base material sheet (15), and the second copper foil layer (18) is arranged at the low end of the second PTEE film sheet (17).
2. The PTFE high-frequency high-speed copper-clad plate according to claim 1, which is characterized in that: the low end of the copper-clad plate body (1) is coated with a layer of radiating fins (2), and radiating raised grains (21) are arranged on the lower surface of the radiating fins (2).
3. The PTFE high-frequency high-speed copper-clad plate according to claim 1, which is characterized in that: the first substrate sheet (11), the first PTEE film sheet (12), the first kraft layer (13), the first copper foil layer (14), the second substrate sheet (15), the second PTEE film sheet (16), the second kraft layer (17) and the second copper foil layer (18) are connected in a pressing mode.
4. The PTFE high-frequency high-speed copper-clad plate according to claim 1, which is characterized in that: the copper-clad plate body (1) is prepared by the steps of proportioning, impregnating, cutting pieces of a base material, cutting auxiliary materials, pre-stacking and combining, laminating and forming, disassembling and detecting, integrally cutting and detecting, packaging and warehousing, and the prepared materials comprise epoxy resin, a curing agent, an additive, fiber paper, glass fiber cloth, glass fiber paper and PTFE powder, and are prepared according to the following mass percentages: 25-78% of epoxy resin, 11-18% of curing agent, 8-16% of additive, 15-25% of fiber paper, 15-23% of glass fiber cloth, 15-28% of glass fiber paper and 13-36% of PTFE powder.
5. The preparation method of the PTFE high-frequency high-speed copper-clad plate according to claim 1, which is characterized by comprising the following steps: the method comprises the following steps:
s1: preparing materials: selecting epoxy resin, a curing agent and an additive, firstly putting the curing agent into the epoxy resin for mixing, heating the mixed epoxy resin to 45-60 ℃, dissolving the curing agent in the epoxy resin, adding the additive after melting, uniformly stirring to obtain a fully fused glue solution, and standing the glue solution for a plurality of hours to allow the glue solution to react;
s2: impregnation: injecting the prepared resin glue solution into a glue tank of a gluing machine, selecting fiber paper, glass fiber cloth, glass fiber paper and the like as reinforced base materials, impregnating the resin glue solution, drying the resin glue solution by a baking oven of the gluing machine under the condition of 120-180 ℃, so that the resin is in a semi-cured state, and removing a solvent;
s3: cutting the base material: cutting the heated and dried base material into base material pieces with certain sizes;
s4: cutting auxiliary materials: selecting PTFE powder to prepare a PTEE film sheet in the cutting process of the base material, selecting kraft paper and copper foil, and respectively cutting the PTEE film sheet, the kraft paper and the copper foil to obtain a kraft paper cut piece, a copper foil cut piece and a PTEE film cut piece which have the same size as the base material sheet;
s5: pre-stacking combination: superposing the cut substrate sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet, and carrying out periphery finishing, wherein the corners of the base sheet, the kraft paper cut sheet, the copper foil cut sheet and the PTEE film cut sheet are aligned;
s6: and (3) laminating and forming: covering a copper anchor with a prepared semi-finished laminated blank coated with gummed paper, placing copper plates up and down as a die, and then placing the die between heating plates of a press to perform high-temperature and high-pressure laminating molding;
s7: disassembling and detecting: taking out the copper foil substrate subjected to compression molding from a die of a press, inspecting the lamination molding quality of the copper foil substrate by using a detection device, entering the next procedure after the copper foil substrate is qualified, cleaning and splitting the copper foil substrate by using a copper plate cleaning agent after the copper foil substrate is unqualified to obtain an unlaminated auxiliary material, and performing pre-lamination combination and lamination molding again;
s8: and (4) integral cropping: cutting the copper foil substrate after the detection is qualified by the dimension of the copper foil substrate through an automatic cutting machine or a manual detection machine to obtain a completely formed copper clad laminate, and carrying out overall quality and appearance inspection on the copper clad laminate;
s9: packaging and warehousing: and (3) installing cooling fins (2) below the copper-clad plate with the cut size and qualified inspection, packaging after installation, and conveying and warehousing for storage through a mobile transport vehicle.
6. The preparation method of the PTFE high-frequency high-speed copper-clad plate according to claim 5, wherein the preparation method comprises the following steps: in S1, the raw resin is made into resin, then other resin, auxiliary agent, solvent and the like are added into the reaction kettle for preparation, and finally the resin glue solution which can be directly glued is prepared.
7. The preparation method of the PTFE high-frequency high-speed copper-clad plate according to claim 5, wherein the preparation method comprises the following steps: in S2, the sizing machine is used to continuously perform two processes of dipping and drying to obtain the semi-finished product of sizing paper, the horizontal sizing machine is used to process the sizing paper of the paper-based copper-clad plate, and the vertical sizing machine is used to process the sizing cloth of the glass fiber cloth-based copper-clad plate.
8. The preparation method of the PTFE high-frequency high-speed copper-clad plate according to claim 5, wherein the preparation method comprises the following steps: aiming at S6, the lamination forming process is completed through three different process control stages of pre-heating, hot-pressing and cooling, the glass fiber cloth-based copper-clad plate is firstly pressed at a lower temperature and a lower pressure in the lamination process, and then the high pressure and the temperature are added to complete the curing forming process of the plate.
CN202011312474.1A 2020-11-20 2020-11-20 PTFE high-frequency high-speed copper-clad plate and preparation method thereof Pending CN112389044A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113740135A (en) * 2021-10-14 2021-12-03 荣成碳纤维科技有限公司 Carbon fiber multifilament sample strip reinforcing method and device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113740135A (en) * 2021-10-14 2021-12-03 荣成碳纤维科技有限公司 Carbon fiber multifilament sample strip reinforcing method and device

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