CN110505769B - Positioning and pressing method for manufacturing mixed pressing plate - Google Patents
Positioning and pressing method for manufacturing mixed pressing plate Download PDFInfo
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- CN110505769B CN110505769B CN201910877949.2A CN201910877949A CN110505769B CN 110505769 B CN110505769 B CN 110505769B CN 201910877949 A CN201910877949 A CN 201910877949A CN 110505769 B CN110505769 B CN 110505769B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a positioning and pressing method for manufacturing a mixed pressing plate, belonging to the technical field of manufacturing methods, and the method comprises the following steps: the method comprises the following steps: material confirmation: selecting materials which are FR4 material plates, a main high-frequency material plate, an auxiliary high-frequency material plate, a main prepreg and an auxiliary prepreg, and combing the requirements in detail by professional engineers after receiving the final requirements provided by customers; this kind of location pressfitting method of thoughtlessly pressing board preparation, the inner chamber bottom that possesses the heater, cooperation mould fluting multiunit jube all around, can be built-in back application of force to the high frequency material board, strike off the prepreg that excessive overflow goes out the jube when heating, when effectual improvement heats the speed of solidification, can guarantee to get rid of the prepreg of excess, avoid secondary treatment, the process of the reverse built-in secondary pressfitting of cooperation, make the compression strength of two-layer high frequency material board close, the combination thickness is close mutually, both ends are heated, good stability, anti hemming ability reinforce.
Description
Technical Field
The invention discloses a positioning and pressing method for manufacturing a mixed pressing plate, and particularly relates to the technical field of manufacturing methods.
Background
The high-speed development of electronic communication technology is a necessary process of modern construction, and in order to realize high-speed and high-fidelity transmission of signals, high-frequency printed circuit boards are increasingly used in communication equipment; the high-frequency plate has excellent electrical property and chemical stability, and can be widely applied to communication equipment such as wireless antennas, base station receiving antennas, power amplifiers, components (shunts, current combiners and filters), radar systems, navigation systems and the like.
The design of the multilayer high-frequency plate is based on the factors of saving cost, improving bending strength, controlling electromagnetic interference and the like, and the multilayer high-frequency plate is often in the form of a mixed pressing plate and is called as the mixed pressing plate.
At present, mix the in-process of clamp plate combination, because FR4 material board and high frequency material board exist the difference on the material, if the excessive condition appears in the semi-solid solution that the combination in-process used coordinately, and under the unable effective circumstances that promotes of speed to the combination solidification, there is the concave-convex face in the laminating process that very easily makes FR4 material board and high frequency material board, lead to the stability can reduce, the turn-up condition takes place often, the unable pressure receiving degree of guaranteeing the material board of conventional pressfitting process is close simultaneously, combination thickness receives the influence, the stability of using has further been reduced.
Disclosure of Invention
The invention aims to provide a positioning and pressing method for manufacturing a mixed pressing plate, which aims to solve the problems that in the existing mixed pressing plate combining process proposed in the background art, due to the material difference between an FR4 material plate and a high-frequency material plate, if excessive amount of semi-solidifying liquid is used in the combining process, and the speed of combination and solidification cannot be effectively increased, concave-convex surfaces exist in the jointing process of the FR4 material plate and the high-frequency material plate, so that the stability is reduced, the curling condition frequently occurs, and meanwhile, the conventional pressing process cannot ensure that the compression force degrees of the material plates are close, the combination thickness is influenced, and the use stability is further reduced.
In order to achieve the purpose, the invention provides the following technical scheme: a positioning and pressing method for manufacturing a mixed pressing plate comprises the following steps:
the method comprises the following steps: material confirmation: selecting materials which are FR4 material plates, a main high-frequency material plate, an auxiliary high-frequency material plate, a main prepreg and an auxiliary prepreg, combing the requirements in detail by professional engineers after receiving the final requirements provided by the customer, and manufacturing a product PPT for the customer to review;
step two: molding a mold: selecting a mode of pressing in a die at room temperature, fixing two sides of the die respectively after selecting the die to prevent shaking, and slotting a plurality of groups of barriers on four sides of the die respectively, wherein a heater is fixed at the bottom of an inner cavity bottom plate of the die through screws, and the inner cavity bottom plate is in threaded connection with the die;
step three: entering a mold: selecting the main high-frequency material plate, placing the main high-frequency material plate on the top of the inner cavity bottom plate, and applying force to four corners of the main high-frequency material plate for 8-16 min at the pressure of 10kg/cm2；
Step four: fixing a base layer: laying a semi-solidified liquid on the top of the main high-frequency material plate, selecting the main semi-solidified sheet to be flatly laid on the top of the semi-solidified liquid, standing for 3-5 min under the condition that the temperature of the bottom of the inner cavity is raised to 20-25 ℃, drying by matching with an external drying device, and simultaneously pressing under the matching of the pressure of 5kg/cm2Pressing for 10-15 min, scraping the semi-solidified liquid overflowing out of the partition fence, and gradually heating the inner cavity bottom plate to 25-30 ℃;
step five: and (3) laminating and fixing: laying the prepreg on the top of the main prepreg again by using the prepreg, and selecting the FR4 material plate to ensure that the prepreg is a composite boardThe bottom of the FR4 material plate is contacted with the top of the semi-solidified liquid, four corners of the plate are exerted with force, the force application time is 2min to 5min, and the pressure is 3kg/cm2Then applying force at the central point for 5-10 min under a pressure of 5kg/cm2；
Step six: fixing the top layer: matching a semi-solidified solution on the top of the FR4 material plate to bond the auxiliary semi-solidified plate, applying force at four corners for 5-8 min under the pressure of 6kg/cm2Laying a prepreg on the top of the auxiliary prepreg, taking four corners of the auxiliary high-frequency material plate to contact with the top of the auxiliary prepreg, matching a pressing plate with the mold to press, wherein the pressure is 12kg/cm2Continuously scraping the semi-solidified liquid overflowing out of the partition fence, wherein the temperature of the inner cavity bottom plate is gradually increased to 35-45 ℃ for 45-65 min;
step seven: molding: after the whole is taken out, reversely pressing the die again, and continuously applying force with the pressure of 12kg/cm2And keeping the temperature of the inner cavity bottom plate at 45-50 ℃ for 30-50 min, and taking out to obtain the mixed pressing plate.
Preferably, the thickness of the FR4 material plate, the thickness of the main high-frequency material plate, the thickness of the auxiliary high-frequency material plate, the thickness of the main prepreg and the thickness of the auxiliary prepreg are 2.2 +/-0.22 mm, the size of the main prepreg and the size of the auxiliary prepreg are 80 x 200mm, and the surface treatment mode is gold deposition.
Preferably, the height of the mold is greater than the total height of the FR4 material plate, the primary high-frequency material plate, the secondary high-frequency material plate, the primary prepreg, and the secondary prepreg.
Preferably, the bottom of the inner cavity is made of a heat-conducting metal plate, and the heater is provided with a temperature adjusting knob.
Preferably, the FR4 material plate is an epoxy resin and glass fiber cloth laminated plate, and the main high-frequency material plate and the secondary high-frequency material plate are PTFE materials or ceramic fillers and glass fiber cloth laminated plates.
Compared with the prior art, the invention has the beneficial effects that: this kind of location pressfitting method of mixed pressboard preparation, usable inner chamber bottom that possesses the heater, cooperation mould multiunit jube of slotting all around, can be carrying out built-in back application of force to high frequency material board, strike off the prepreg liquid that the excessive overflow goes out the jube when heating, when the speed of solidification is heated in effectual improvement, can guarantee to get rid of the prepreg liquid of excess, avoid secondary treatment, in high frequency material board and FR4 material board combination, the process of the reverse built-in secondary pressfitting of cooperation, make the compression degree of two-layer high frequency material board close, the combination thickness when effectual assurance layer connects is close, both ends are heated, good stability, anti hemming ability reinforce.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that: a positioning and pressing method for manufacturing a mixed pressing plate comprises the following steps:
the method comprises the following steps: material confirmation: selecting materials which are FR4 material plates, a main high-frequency material plate, an auxiliary high-frequency material plate, a main prepreg and an auxiliary prepreg, combing the requirements in detail by professional engineers after receiving the final requirements provided by the customer, and manufacturing a product PPT for the customer to review;
step two: molding a mold: selecting a mode of pressing in a die at room temperature, fixing two sides of the die after selecting the die to prevent shaking, respectively grooving a plurality of groups of barriers on four sides of the die, fixing a heater at the bottom of an inner cavity bottom plate of the die through screws, and connecting the inner cavity bottom plate and the die in a threaded mode;
step three: entering a mold: selecting a main high-frequency material plate, placing the main high-frequency material plate on the top of the inner cavity bottom plate, and applying force to four corners of the main high-frequency material plate for 8-16 min at the pressure of 10kg/cm2；
Step four: fixing a base layer: in a main high-frequency material plateLaying a semi-solidified liquid on the top, selecting a main semi-solidified sheet to be flatly laid on the top of the semi-solidified liquid, standing for 3-5 min under the condition that the temperature of the bottom of an inner cavity is raised to 20-25 ℃, drying by matching with an external drying device, and simultaneously pressing under the pressure of 5kg/cm2Pressing for 10-15 min, scraping the semi-solidified liquid overflowing out of the partition fence, and gradually heating the cavity bottom plate to 25-30 ℃;
step five: and (3) laminating and fixing: the prepreg is paved on the top of the main prepreg again, an FR4 material plate is selected, the bottom of the FR4 material plate is in contact with the top of the prepreg, force is applied to four corners, the force application time is 2-5 min, and the pressure is 3kg/cm2Then applying force at the central point for 5-10 min under a pressure of 5kg/cm2；
Step six: fixing the top layer: matching a semi-curing liquid on the top of an FR4 material plate to bond an auxiliary semi-curing plate, applying force at four corners for 5-8 min under the pressure of 6kg/cm2And laying a prepreg on the top of the auxiliary prepreg, taking four corners of the auxiliary high-frequency material plate to contact with the top of the auxiliary prepreg, and pressing with a press plate and a mould under the pressure of 12kg/cm2Continuously scraping the semi-solidified liquid overflowing out of the partition fence, gradually increasing the temperature of the inner cavity bottom plate to 35-45 ℃, and keeping for 45-65 min;
step seven: molding: after the whole is taken out, reversely pressing the die again, and continuously applying force with the pressure of 12kg/cm2And keeping the temperature of the inner cavity bottom plate at 45-50 ℃ for 30-50 min, and taking out to obtain the mixed pressing plate.
Wherein, FR4 material board, main high frequency material board, vice high frequency material board, the thickness of main prepreg and vice prepreg is 2.2 + -0.22 mm, the size is 80X 200mm, the surface treatment mode is heavy gold, the height of mould is greater than FR4 material board, main high frequency material board, vice high frequency material board, the overall height of main prepreg and vice prepreg, the material of inner chamber bottom is heat conduction metal sheet, the heater possesses the knob that adjusts the temperature, FR4 material board is epoxy and glass fiber cloth pressfitting panel, main high frequency material board, vice high frequency material board are PTFE material or ceramic filler and glass fiber cloth pressfitting panel.
Examples
The method comprises the following steps: material confirmation: selecting materials which are FR4 material plates, a main high-frequency material plate, an auxiliary high-frequency material plate, a main prepreg and an auxiliary prepreg, combing the requirements in detail by professional engineers after receiving the final requirements provided by the customer, and manufacturing a product PPT for the customer to review;
step two: molding a mold: selecting a mode of pressing in a die at room temperature, fixing two sides of the die after selecting the die to prevent shaking, respectively grooving a plurality of groups of barriers on four sides of the die, fixing a heater at the bottom of an inner cavity bottom plate of the die through screws, and connecting the inner cavity bottom plate and the die in a threaded mode;
step three: entering a mold: selecting a main high-frequency material plate, placing the main high-frequency material plate on the top of the inner cavity bottom plate, and applying force to four corners of the main high-frequency material plate for 16min under the pressure of 10kg/cm2；
Step four: fixing a base layer: laying a semi-solidified liquid on the top of the main high-frequency material plate, selecting a main semi-solidified sheet to be flatly laid on the top of the semi-solidified liquid, standing for 5min under the condition that the temperature of the bottom of the inner cavity is raised to 20 ℃, drying by matching with an external drying device, and simultaneously pressing under the matching of pressure of 5kg/cm2Scraping the semi-solidified liquid overflowing out of the partition fence with the pressure applying time of 15min, and gradually heating the cavity bottom plate to 30 ℃;
step five: and (3) laminating and fixing: spreading the prepreg on the top of the main prepreg again, selecting an FR4 material plate, enabling the bottom of the FR4 material plate to be in contact with the top of the prepreg, applying force to four corners for 5min, and applying force under the pressure of 3kg/cm2Then applying force from the central point for 10min under a pressure of 5kg/cm2；
Step six: fixing the top layer: bonding a secondary prepreg on the top of an FR4 material plate by matching with a prepreg solution, applying force at four corners for 5min under the pressure of 6kg/cm2And laying a prepreg on the top of the auxiliary prepreg, taking four corners of the auxiliary high-frequency material plate to contact with the top of the auxiliary prepreg, and matching with a press plate matching moldThe pressure is 12kg/cm2Continuously scraping the semi-solidified liquid overflowing out of the partition fence, gradually increasing the temperature of the inner cavity bottom plate to 45 ℃, and keeping for 45 min;
step seven: molding: after the whole is taken out, reversely pressing the die again, and continuously applying force with the pressure of 12kg/cm2And keeping the temperature of the inner cavity bottom plate at 50 ℃ for 45min, and taking out to obtain the mixed pressing plate.
Wherein, FR4 material board, main high frequency material board, vice high frequency material board, the thickness of main prepreg and vice prepreg is 2.2 + -0.22 mm, the size is 80X 200mm, the surface treatment mode is heavy gold, the height of mould is greater than FR4 material board, main high frequency material board, vice high frequency material board, the overall height of main prepreg and vice prepreg, the material of inner chamber bottom is heat conduction metal sheet, the heater possesses the knob that adjusts the temperature, FR4 material board is epoxy and glass fiber cloth pressfitting panel, main high frequency material board, vice high frequency material board are PTFE material or ceramic filler and glass fiber cloth pressfitting panel.
Synthesize more than, the usable inner chamber bottom that possesses the heater, the cooperation mould multiunit jube of slotting all around, can be carrying out built-in back application of force to high frequency material board, strike off the excessive half solidification liquid that overflows the jube when heating, when effectual improvement heats the speed of solidification, can guarantee to get rid of the excessive half solidification liquid, avoid secondary treatment, in high frequency material board and FR4 material board combination, the process of the reverse built-in secondary pressfitting of cooperation, make the compression strength of two-layer high frequency material board close, the combination thickness when effectual assurance layer connects is close, both ends are heated, good stability, anti hemming ability reinforce.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the embodiments disclosed herein may be used in any combination, provided that there is no structural conflict, and the combinations are not exhaustively described in this specification merely for the sake of brevity and conservation of resources. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (4)
1. A positioning and pressing method for manufacturing a mixed pressing plate is characterized in that: the method comprises the following steps:
the method comprises the following steps: material confirmation: selecting materials which are FR4 material plates, a main high-frequency material plate, an auxiliary high-frequency material plate, a main prepreg and an auxiliary prepreg, combing the requirements in detail by professional engineers after receiving the final requirements provided by the customer, and manufacturing a product PPT for the customer to review;
step two: molding a mold: selecting a mode of pressing in a die at room temperature, fixing two sides of the die respectively after selecting the die to prevent shaking, and slotting a plurality of groups of barriers on four sides of the die respectively, wherein a heater is fixed at the bottom of an inner cavity bottom plate of the die through screws, and the inner cavity bottom plate is in threaded connection with the die;
step three: entering a mold: selecting the main high-frequency material plate, placing the main high-frequency material plate on the top of the inner cavity bottom plate, and applying force to four corners of the main high-frequency material plate for 8-16 min at the pressure of 10kg/cm2；
Step four: fixing a base layer: laying a semi-solidified liquid on the top of the main high-frequency material plate, selecting the main semi-solidified sheet to be flatly laid on the top of the semi-solidified liquid, standing for 3-5 min under the condition that the temperature of the bottom of the inner cavity is raised to 20-25 ℃, drying by matching with an external drying device, and simultaneously pressing under the matching of the pressure of 5kg/cm2Pressing for 10-15 min, scraping the semi-solidified liquid overflowing out of the partition fence, and gradually heating the inner cavity bottom plate to 25-30 ℃;
step five: and (3) laminating and fixing: paving the main prepreg on the top of the main prepreg again by using the prepreg, selecting the FR4 material plate, enabling the bottom of the FR4 material plate to be in contact with the top of the prepreg, applying force to four corners, wherein the force application time is 2-5 min, and the pressure is 3kg/cm2Then applying force from the center pointThe force time is 5 min-10 min, and the pressure is 5kg/cm2；
Step six: fixing the top layer: matching a semi-solidified solution on the top of the FR4 material plate to bond the auxiliary semi-solidified plate, applying force at four corners for 5-8 min under the pressure of 6kg/cm2Laying a prepreg on the top of the auxiliary prepreg, taking four corners of the auxiliary high-frequency material plate to contact with the top of the auxiliary prepreg, matching a pressing plate with the mold to press, wherein the pressure is 12kg/cm2Continuously scraping the semi-solidified liquid overflowing out of the partition fence, gradually raising the temperature of the inner cavity bottom plate to 35-45 ℃ and keeping for 45-65 min;
step seven: molding: after the whole is taken out, reversely pressing the die again, and continuously applying force with the pressure of 12kg/cm2Keeping the temperature of the inner cavity bottom plate at 45-50 ℃ for 30-50 min, and taking out to obtain a mixed pressing plate;
the height of the mold is greater than the total height of the FR4 material plate, the primary high-frequency material plate, the secondary high-frequency material plate, the primary prepreg and the secondary prepreg.
2. The positioning and pressing method for manufacturing the hybrid pressing plate as claimed in claim 1, wherein: the FR4 material plate, the main high-frequency material plate, the auxiliary high-frequency material plate, the main prepreg and the auxiliary prepreg are 2.2 +/-0.22 mm in thickness and 80 x 200mm in size, and the surface treatment mode is immersion gold.
3. The positioning and pressing method for manufacturing the hybrid pressing plate as claimed in claim 1, wherein: the material of inner chamber bottom is heat conduction metal sheet, the heater possesses the adjust temperature knob.
4. The positioning and pressing method for manufacturing the hybrid pressing plate as claimed in claim 1, wherein: the FR4 material plate is an epoxy resin and glass fiber cloth laminated plate, and the main high-frequency material plate and the auxiliary high-frequency material plate are PTFE materials or ceramic filler and glass fiber cloth laminated plates.
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| JP2002334947A (en) * | 2001-05-10 | 2002-11-22 | Sony Corp | High-frequency module substrate device and method of manufacturing the same |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
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