CN103429013B - Multilayer printed wiring board and preparation method thereof - Google Patents
Multilayer printed wiring board and preparation method thereof Download PDFInfo
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- CN103429013B CN103429013B CN201210152710.7A CN201210152710A CN103429013B CN 103429013 B CN103429013 B CN 103429013B CN 201210152710 A CN201210152710 A CN 201210152710A CN 103429013 B CN103429013 B CN 103429013B
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Abstract
The present invention discloses a kind of preparation method of multilayer printed wiring board, this multilayer printed wiring board comprises spaced central layer and insulating laminated plate, and the method comprises: the multilayer printed wiring board of 1) determining required making in the number of plies about the architectural difference between centrosymmetric two-layer central layer; 2), according to the architectural difference between described two-layer central layer, the formation of adjacent with described two-layer central layer respectively dielectric layers plate is selected; 3) utilize described central layer and selected insulating laminated plate to make multilayer printed wiring board. In the present invention, thereby utilize difference between asymmetrical insulating barrier to come structure between central layer that balance brings due to reasons such as the mixed high frequency material processed in part and the difference of stress, stick up problem thereby overcome in multilayer printed wiring board the plate causing due to said structure and stress difference, improved the quality of multilayer printed wiring board.
Description
Technical field
The present invention relates to multilayer printed wiring board technical field, particularly a kind of multilayer printedThe preparation method of road plate and multilayer printed wiring board.
Background technology
For the making of multilayer printed wiring board, in industry, need to do symmetry for joining this structure at presentDesign, in the insulating laminated plate of upper and lower central layer consistency of thickness and correspondence, prepreg (claims again PPSheet or prepreg) type consistent, consult Fig. 1 below and illustrate the design philosophy of symmetric design,In Fig. 1, illustrated that the total number of plies of line layer is the wiring board of n layer, wherein, L1 refers to the 1st sandwich circuit layer,Ln refers to ground n sandwich circuit layer, and the layer between line layer and line layer is central layer or insulating laminated plate, for example,L1/2 layer is the central layer between the 1st sandwich circuit layer and the 2nd sandwich circuit layer, and L2/3 layer is the 2ndInsulating laminated plate between sandwich circuit layer and the 3rd sandwich circuit layer. According to symmetric design requirement, L1/2 layer withThe thickness of Ln-1/n layer central layer (core) is identical. Be all for example 0.2mm, L2/3 layer and Ln-2/n-1In layer insulating plate, prepreg type is identical with thickness. For example, all adopt half of two-layer 2116 typesCured sheets, the rest may be inferred, Li/ (i+1) layer and L (n-i)/(n+1-i) consistency of thickness (its of layer central layerMiddle i is odd number), the layer insulating plate of the layer of and L (i+1)/(i+2) and L (n-i-1)/(n-i)Type consistent (wherein i is even number), by such design, makes upper and lower central layer and insulating laminated plateTo join this structure symmetrical. If upper and lower central layer variable thickness causes or the type of insulating laminated plate differsCause the situation that there will be so plate to stick up. At present in industry be defined as angularity need meet be less than or etc.In 7.5%.
In general,, for common FR-4 multi-layer sheet, can meet by above-mentioned symmetric designThe requirement of angularity. But, for local mixed pressure printed wiring board, be difficult to use above-mentioned symmetric designMeet the requirement of angularity. Local mixed pressure printed wiring board is as required at common FR-4 multi-layer sheetCertain one deck or which floor part use high frequency material, save to reach in realizing high-frequency transmissionThe object of cost. As shown in Figure 2, in the L1/2 of the superiors central layer, part has been used high frequency materialRO4350, the material in the central layer of other layers is common FR-4 material. Mixed pressure plate uses at least two kindsThe material of different resins system, due to the intensity difference of material own and architectural difference, after mixed pressureThe whole plate stress of printed wiring board can not offset completely, after lamination, can produce plate in various degreeStick up. This structure of joining of printed wiring board to local mixed pressure carries out, after symmetric design, joining as stated aboveThis angularity is greater than 7.5%, does not meet quality requirements in industry.
In addition,, for the method for current normally used minimizing warpage, comprise hot pressing drying-plate or artificialBreak straight mode, in the process that hot pressing drying-plate dries in heat, eliminate plate by release internal stress and stick up, artificialBreak straight mode and eliminate plate and stick up by applying external force, can reduce to a certain extent warpage degree,But by hot pressing drying-plate or manually break Nogata formula printed wiring board after treatment, due to wiring board insideThe difference of structure, thus the process of being heated at such as wave-soldering etc. can occur that stress difference causes plate againThe phenomenon of sticking up, therefore, above-mentioned by hot pressing drying-plate or manually break straight method and cannot solve from rootThe problem that plate sticks up.
Summary of the invention
The invention provides a kind of preparation method and multilayer printed wiring board of multilayer printed wiring board, useThe multilayer causing due to the reason such as the mixed high frequency material processed in part in solving prior artThe plate of printed wiring board sticks up problem.
For achieving the above object, the invention provides a kind of preparation method of multilayer printed wiring board,Described multilayer printed wiring board comprises spaced central layer and insulating laminated plate, and described method comprises:
1) multilayer printed wiring board of determining required making in the number of plies about centrosymmetric two-layer coreArchitectural difference between plate;
2) according to the architectural difference between described two-layer central layer, to adjacent with described two-layer central layer respectivelyThe formation of dielectric layers plate select, to make because of the architectural difference between described two-layer central layerAnd the stress producing on multilayer printed wiring board after making can partial offset or is all offset;
3) utilize described central layer and selected insulating laminated plate to make multilayer printed wiring board.
Preferably, in step 1), the architectural difference between two-layer central layer comprises:
The difference of two-layer central layer in material; And/or,
Difference in the type of the prepreg adopting in two-layer central layer; And/or,
The difference of two-layer central layer on thickness; And/or,
Fluting and unslotted on another central layer on a central layer in two-layer central layer; And/or,
The difference of two-layer central layer in the size of fluting; And/or,
Chimeric on a central layer in two-layer central layer have the abaculus different from this central layer material, and another central layerOn not chimeric abaculus; And/or,
Difference on two-layer central layer in the size of chimeric abaculus; And/or,
Difference on two-layer central layer in the material of chimeric abaculus.
Preferably, described two-layer central layer is respectively the first central layer and the second central layer, described two-layer insulationLaminate is respectively first insulating laminated plate adjacent with the first central layer, and adjacent with the second central layer secondInsulating laminated plate,
In step 2) in, according to the architectural difference between described two-layer central layer, to respectively with described twoThe method that the formation of the dielectric layers plate that layer central layer is adjacent is selected is as follows:
According to the architectural difference between the first central layer and the second central layer, make the first insulating laminated plate andBetween two insulating laminated plates, there is identical architectural difference; Or,
Judge the large of intensity between two-layer central layer according to the architectural difference between the first central layer and the second central layerLittle relation, if the intensity of the first central layer is greater than the intensity of the second central layer, to dielectric layers plateForming selects to make the intensity of the first insulating laminated plate to be greater than the intensity of the second insulating laminated plate; IfThe intensity of the first central layer is less than the intensity of the second central layer, the formation of dielectric layers plate is selectedTo make the intensity of first insulating laminated plate adjacent with the first central layer be less than adjacent with the second central layerThe intensity of two insulating laminated plates.
Preferably, the described formation to dielectric layers plate is selected to be specially: to two-layer insulationThe prepreg that laminate adopts is selected; Thereby make poor between the first difference and the second differenceValue is less than predetermined value; Wherein, the first difference is between the intensity of the first central layer and the intensity of the second central layerDifference, the second difference is poor between the intensity of the first insulating laminated plate and the intensity of the second insulating laminated plateDifferent.
Preferably, prepreg is selected to comprise the type and/or definite half of selecting prepregThe resin content of cured sheets.
Preferably, the insulating laminated plate adjacent with two-layer central layer is specially respectively:
The insulating barrier of adjacent with two-layer central layer and close multilayer printed wiring board center one side respectivelyPlate;
Or, adjacent with two-layer central layer and near the insulation of multilayer printed wiring board surface one side respectivelyLaminate.
Preferably, after step 3), also comprise, according to the test plate (panel) of the multilayer printed wiring board of makingAngularity, adjust the formation of the insulating laminated plate adjacent with two-layer central layer.
For achieving the above object, the present invention also provides a kind of multilayer printed wiring board, and its feature existsIn, if in the number of plies about there is architectural difference between centrosymmetric two-layer central layer, respectively with twoBetween the adjacent dielectric layers plate of layer central layer, there is corresponding architectural difference.
Preferably, described two-layer central layer is respectively the first central layer and the second central layer, wherein, and the first coreThe intensity of plate is greater than the intensity of the second central layer, and first insulating laminated plate adjacent with the first central layer is strongDegree is greater than the intensity of second insulating laminated plate adjacent with the second central layer; Or the intensity of the first central layer is less thanThe intensity of the second central layer, and the intensity of first insulating laminated plate adjacent with the first central layer is less than and secondThe intensity of the second insulating laminated plate that central layer is adjacent.
For achieving the above object, the present invention also provides make according to above-mentioned arbitrary described method manyLayer printed wiring board.
The present invention has following beneficial effect:
In technical scheme of the present invention, according to the difference between central layer, select adjacent insulating laminated platePrepreg, thereby the characteristic based on prepreg is non-by selecting different prepregs to formSymmetrical insulating barrier, thus utilize the difference between asymmetrical insulating barrier to carry out balance due to the mixed system in partStructure between the central layer that the reasons such as high frequency material are brought and the difference of stress, thus overcome multilayerThe plate causing due to said structure and stress difference in printed wiring board sticks up problem, has improved multilayer sealThe quality of wiring board processed.
Brief description of the drawings
Fig. 1 is the schematic diagram that in prior art, multilayer printed wiring board is carried out symmetric design;
Fig. 2 is the structural representation of the mixed multilayer printed wiring board of having made high frequency material in prior art;
The flow chart of the preparation method of the multilayer printed wiring board that Fig. 3 provides for the embodiment of the present invention one;
The flow chart of the preparation method of the multilayer printed wiring board that Fig. 4 provides for the embodiment of the present invention two.
Detailed description of the invention
For making those skilled in the art understand better technical scheme of the present invention, below in conjunction with attachedFigure carries out multilayer printed wiring board preparation method provided by the invention and multilayer printed wiring board in detailDescribe.
First prepreg is simply introduced, prepreg claims again " PP sheet " or " prepreg ",Be one of main material during multilayer printed wiring board is produced, mainly formed by resin and reinforcing material,Reinforcing material is divided into again the several types such as glass-fiber-fabric, paper substrate, composite. Multilayer printed wiring board instituteThe prepreg using adopts glass fabric to do reinforcing material mostly, at treated glassThe upper resin adhesive liquid of fiber cloth dipping, then the sheeting of making through heat treatment preliminary drying is called semi-solid preparationSheet, now the resin in prepreg is the material of semi-harden B-stage, it is in heating pressurizationLower meeting is softening, can reaction be cured as the material of C-stage after cooling. Prepreg is for connection-coreFlaggy also provides insulation, to form a basic multilayer printed wiring board. Multilayered printed in formationIn the process of wiring board, by considering, thickness of insulating layer, internal layer copper are thick, resin content,Each layer of remaining copper area of internal layer and symmetry etc. are because usually selecting the type of prepreg. Half is solidChange three kinds of main character of sheet and be flow adhesive (ResinFlow), gel time (Geltime) andGlue content (ResinContent) (being resin content). According to the model of glass-fiber-fabric in prepregDistinguish, the modal model of prepreg has respectively 7628,1506,2116,1080,106 etc.The prepreg of each type has different thickness and resin content.
One of core idea of the present invention is, for multilayer printed wiring board, the present invention no longer adopts, after carrying out symmetric design, utilize hot pressing drying-plate or manually break straight mode with of the prior artReduce the mode that plate sticks up, but characteristic based on prepreg, by selecting different prepreg shapesBecome asymmetrical insulating barrier, utilize the difference between insulating barrier to carry out balance due to the mixed high frequency material processed in partStructure between the central layer bringing etc. reason and the difference of stress, thus overcome multilayer printed-wiringIn plate because the stress difference that produces such as the mixed reason of having made high frequency material in part causesPlate sticks up problem, has improved the quality of multilayer printed wiring board.
Embodiment mono-
The present invention proposes a kind of preparation method of multilayer printed wiring board.
As shown in Figure 3, show a kind of multilayer printed wiring board that the embodiment of the present invention one providesPreparation method, is applied in the design and production process of multilayer printed wiring board, prints thereby control multilayerThe plate of wiring board processed sticks up problem, and the method comprises:
Step 301, determines in the number of plies about the architectural difference between centrosymmetric two-layer central layer.
Step 302, according to determine two-layer central layer between architectural difference, to respectively with two-layer central layerThe formation of adjacent dielectric layers plate is selected, to make because of the architectural difference between two-layer central layerAnd the stress producing on multilayer printed wiring board after making can partial offset or is all offset.
Step 303, utilizes central layer and selected insulating laminated plate to make multilayer printed wiring board.
In embodiments of the present invention, according in the number of plies about the architectural difference on centrosymmetric central layer,Form asymmetrical insulating barrier, asymmetrical insulating barrier can produce different receipts in the process of heat cureStress under compression, thereby the different shrinkage stress that balance causes due to the architectural difference of central layer, utilize notWith insulating barrier come core plate structure that balance is different and and the difference of stress, thereby overcome multilayer sealIn wiring board processed, because sticking up, the plate that the reasons such as the mixed high frequency material processed in part cause stress difference and cause asksInscribe, improved the quality of multilayer printed wiring board.
Embodiment bis-
Illustrate that below by a more detailed embodiment the present invention proposes multilayer printed wiring boardPreparation method.
As shown in Figure 4, show a kind of multilayer printed wiring board that the embodiment of the present invention two providesPreparation method, is applied in the design and production process of multilayer printed wiring board, sticks up with control panel, shouldMethod comprises:
Step 401, determines in the number of plies about the architectural difference between centrosymmetric two-layer central layer.
Wherein, in the number of plies, refer in multilayer printed wiring board its layer about centrosymmetric central layerCount the centrosymmetric central layer about multilayer printed wiring board, for example, for the wiring board of 8 layers, itsL1/2 layer, L3/4 layer, L5/6 layer, L7/8 layer are central layer, wherein L1/2 layer central layer and L7/8 layerCentral layer is central layer symmetrical in the number of plies, and L3/4 layer central layer and L5/6 layer central layer are cores symmetrical in the number of pliesPlate.
Architectural difference between central layer comprises the architectural difference that makes central layer produce Strength Changes. Two-layer coreArchitectural difference between plate includes but not limited to: the difference of two-layer central layer in material; And/or two-layerDifference in the type of the prepreg adopting in central layer; And/or poor on thickness of two-layer central layerDifferent; And/or fluting and unslotted on another central layer on a central layer in two-layer central layer; And/or two-layer central layerDifference in the size of fluting; And/or chimericly on a central layer in two-layer central layer have and this central layer materialDifferent abaculus, and not chimeric abaculus on another central layer; And/or chimeric abaculus on two-layer central layerSize on difference; And/or the difference in the material of chimeric abaculus on two-layer central layer.
In the making of multilayer printed wiring board, due to the difference in each layer of central layer intensity, cause thermosettingIn the process of changing, produce different stress, the imbalance between each ply stress will cause plate to stick up. For exampleIn the time that central layer is provided with groove milling, the intensity of central layer reduces along with the increase of groove milling opening on central layer, and/ or increase along with the increase of the resin content in the prepreg of formation central layer, and/or along with central layerThe increase of thickness and increasing. The factor that affects central layer intensity is not limited to the above-mentioned factor listing, and also canTo use other to make central layer produce the factor of Strength Changes.
Therefore, can be according to type and/or sheet number and/or the semi-solid preparation of the prepreg of formation central layerResin content in sheet, determines the difference between central layer symmetrical in the number of plies, for example, and 8 layers of printingIn wiring board, if L1/2 layer central layer is made up of 2 2116 type prepregs, L7/8 layer central layer by3 1080 type prepregs, and the tree of above-mentioned 2116 type prepregs and 1080 type prepregsFat content is respectively A or B, and the parameters such as the above-mentioned type and resin content all can cause central layer intensity notWith, therefore can use above-mentioned parameter to be used as the structure between L1/2 layer central layer and L7/8 layer central layerDifference. In addition, if in the number of plies one or two mixed pressure in symmetrical central layer high frequency material, instituteState high frequency material and embed in this central layer by the groove milling of offering on central layer, and the intensity of central layer can be withMixed pressure in central layer high frequency material groove milling opening increase and reduce, thereby can be according to central layerThe size of the opening of upper groove milling is considered the architectural difference between two central layers. Said structure difference can beDefinite parameter, the type of for example prepreg, resin content, sheet number etc., can be also according to asThe determined difference affecting in intensity of factor of openings of sizes of groove milling and so on.
Step 402, according to the architectural difference between definite central layer, to adjacent with two-layer central layer respectivelyThe formation of dielectric layers plate select.
Required prepreg is selected.
Wherein, the dielectric layers plate adjacent with central layer in the number of plies about Central Symmetry, and twoLayer insulating plate is adjacent with two-layer central layer and near multilayer printed wiring board center one side respectivelyInsulating laminated plate, or can be also adjacent with two-layer central layer and near multilayer printed wiring board table respectivelyThe insulating laminated plate of face one side, or respectively near center one side with near the dielectric layers of a surperficial sidePlate. For example, for the L1/2 layer central layer in 8 layers of printed wiring board and L7/8 layer central layer, it is adjacentInsulating laminated plate be respectively L2/3 layer insulating plate and L6/7 layer insulating plate. Adjacent with central layer twoLayer insulating plate preferably adopts the dielectric layers plate near multilayer printed wiring board center one side. SoAnd, in some cases, when selecting the situation of while near the dielectric layers plate of center one sideUnder, can select the dielectric layers plate of adjacent with a two-layer central layer and close surperficial side respectively. ExampleAs, for the L3/4 layer central layer in 8 layers of printed wiring board and L5/6 layer central layer, due to two-layer with thisThe insulating laminated plate of the adjacent and close center of central layer one side is only one deck, i.e. L4/5 layer, can selectSelect L2/3 insulating laminated plate and L6/7 layer insulating plate as respectively with L3/4 layer central layer and L5/6 layer coreThe dielectric layers plate that plate is adjacent.
Wherein, the formation of dielectric layers plate being selected can be specifically to forming insulating laminated platePrepreg select, can carry out forming the prepreg of insulating laminated plate according to following principleSelect, wherein, set and be called the first central layer and the second central layer about centrosymmetric two-layer central layer,With the first central layer and the second central layer respectively adjacent dielectric layers plate be called the first insulating laminated plateWith the second insulating laminated plate,, if the intensity of the first central layer is greater than the intensity of the second central layer, half-and-halfCured sheets selects to make the intensity of first insulating laminated plate adjacent with the first central layer to be greater than andThe intensity of the second insulating laminated plate that two central layers are adjacent; If the intensity of the first central layer is less than the second central layerIntensity, selects to make the strong of first insulating laminated plate adjacent with the first central layer to prepregDegree is less than the intensity of second insulating laminated plate adjacent with the second central layer.
Optionally, for the degree of proof stress balance and make stress reach as much as possible balance,Need to make the strength difference between the first insulating laminated plate and the second insulating laminated plate approach as much as possible firstStrength difference between central layer and the second central layer. For example, for the degree of proof stress balance, canSet a predetermined value delta, for make select the first insulating laminated plate and the second insulating laminated plate itBetween difference delta2 equal as much as possible or close to the difference between the first central layer and the second central layerDelta1, selects dielectric layers plate, makes it meet the absolute value of delta1-delta2Be less than or equal to predetermined value delta. Therefore pass through the setting of predetermined value delta, can proof stressThe precision of balance, it is less that predetermined value delta arranges, and the effect of stress equilibrium is better.
Can describe said process by two concrete examples below:
Example 1:
In 8 layers of printed wiring board, if L1/2 layer central layer is by 2 2116 type prepreg groupsBecome, L7/8 layer central layer is made up of 3 1080 type prepregs, and above-mentioned 2116 type prepregsBe respectively A and B with the resin content of 108 type prepregs, A is not equal to B, so, forThe L2/3 insulating laminated plate that L1/2 layer central layer is adjacent, can to select by resin content be A 2 2116Type prepreg composition, for the L6/7 insulating laminated plate adjacent with L7/8 layer central layer, can select byResin content is 3 1080 type prepreg compositions of B. By such selection, make insulationStrength difference between laminate equal or two-layer central layer between strength difference, thereby reach the flat of stressWeighing apparatus.
Example 2:
Taking 8 sandwich circuit boards as example, L1/2 layer central layer and L7/8 layer central layer are by identical semi-solid preparation equallySheet forms, but on L1/2 layer central layer in 1/3 area mixed pressure high frequency material. According to L1/2Architectural difference between layer central layer and L7/8 layer central layer, can determine that the intensity of L1/2 layer central layer is less thanThe intensity of L7/8 layer central layer, therefore needs to make the intensity of L2/3 layer insulating plate to be less than L6/7 layer exhaustedThe intensity of edge laminate. Therefore, can first select the type of prepreg for dielectric layers plate, soThe resin content of rear selection prepreg, to meet above-mentioned requirement of strength. Below with reference to shown in table 1The selection course of parameter list prepreg of prepreg describe. Wherein in table 1 with 100The prepreg of the S0401 of the residual copper rate of % is the resin content that has exemplified dissimilar prepregWith pressing thickness.
Table 1 is about the resin content of dissimilar prepreg and the parameter list of pressing thickness
Be less than the intensity of L6/7 layer insulating plate in order to meet the intensity of L2/3 layer insulating plate, needSelect the prepreg that resin content is lower to form L2/3 layer insulating, select resin content higherPrepreg form L6/7 layer insulating because have higher compared with the prepreg of high resin contentIntensity, simultaneously the shrinkage stress of prepreg determines according to its resin content, resin content is higher,Its shrinkage stress producing in the time of heat cure is just larger. Therefore, the resin content in reference table 1, rightIn L2/3 layer insulating plate, can adopt 2 2116 type prepregs, insulate for L6/7 layerLaminate, can adopt 3 1080 type prepregs, in meeting requirement of strength, makes like thisThe thickness that obtains dielectric layers plate is more consistent. After determining the type of prepreg, can be furtherAdjust as required the resin content of prepreg, the intensity of the higher prepreg of resin content moreGreatly. For example, the high frequency material of the local mixed pressure of L1/2 layer central layer account for whole core version area 1/3Time, can make the resin content of L2/3 layer and the prepreg in L6/7 layer insulating plate relevant publicFormula is: the resin content of the prepreg of B >=A+12(A:L2/3 layer, the semi-solid preparation of B:L6/7 layerThe resin content of sheet). By such selection, difference between insulating laminated plate is equaled or two-layerDifference between central layer, answers equilibrium of forces thereby reach. Concrete, for mixed pressure in two-layer central layerIn the difference of the high frequency material difference of groove milling openings of sizes (or in two-layer central layer) and two kinds of insulating barriersRelation between prepreg resin content difference, can determine according to the test plate (panel) process in making, andForm empirical value. In the embodiment of the present invention, select 2116 type prepregs and 1080 type prepregsForm insulating laminated plate only as example explanation, also can select the prepreg of other types, as long asMeet the requirement of above-mentioned intensity. In addition, table 1 is only as example, the prepreg of each typeParameter along with the different prepreg products that different manufacturers provides can change.
In above-mentioned two concrete examples, by the selection to insulating laminated plate prepreg, makeThe stress of the stress that the prepreg of L2/3 layer produces in curing process and L1/2 layer central layer is flatWeighing apparatus, the stress of the stress that the prepreg of L6/7 layer produces in curing process and L7/8 layer central layerBalance, answers equilibrium of forces on the whole thereby reach, and solves from root the problem that plate sticks up.
By above-mentioned steps 401 and step 402, to about Central Symmetry and the two-layer core that there are differencesPlate has carried out the processing of equilibrium stress. Optionally, above-mentioned selection course is a preliminary definite process,In actual production, can tentatively make examination according to the result of initial option and follow-up correlation stepPlate, and according to the warpage situation of test plate (panel), proceed further adjustment.
Optionally, comprise step 403, judge in multilayer printed wiring board whether also have other aboutBetween centrosymmetric two-layer central layer, there are differences, if had, repeating step 401 to 402; AsFruit does not have other about there are differences between centrosymmetric two-layer central layer, continues next step.
Step 404, utilizes the insulating laminated plate that the prepreg of selecting forms to make multilayer printed-wiringPlate.
Preferably, step 405, according to the angularity of the test plate (panel) of the multilayer printed wiring board of making, entersPrepreg in the whole insulating laminated plate of one step.
If the angularity of the multilayer printed wiring board of making is still larger, can adjust prepregType and/or resin content, thus further adjustment completed.
In the present embodiment, can be for entering all about Central Symmetry and the two-layer central layer that there are differencesRow is answered equilibrium of forces, namely carries out in for example step 401 and step 402 for this two-layer central layer,But also can carry out a judgement to the difference of two-layer central layer, in the time that it differs greatly, it be carried outEquilibrium stress processing, when its difference hour, skip stress equilibrium processing.
In sum, the outstanding feature that this method is different from prior art is no longer to adopt existingHave in technology after carrying out symmetric design, utilize hot pressing drying-plate or manually break straight mode to subtractThe mode that platelet sticks up, but according to the difference about intensity on centrosymmetric central layer in the number of plies, selectDifferent prepregs forms asymmetrical insulating barrier, utilizes different insulating barriers to carry out the core that balance is differentPlate structure and and the difference of stress, thereby overcome in multilayer printed wiring board because the mixed system in part is highFrequently the reason such as material causes stress difference and the plate that causes sticks up problem, has improved multilayer printed wiring boardQuality.
Below in conjunction with concrete application scenarios, the multilayer printed-wiring that the embodiment of the present invention provides is describedPlate is made flow process. Total number of plies of supposing the printed wiring layer of printed wiring board is n, and n is more than or equal to 5(for example, if n is 4, between two-layer central layer, only have one deck insulating laminated plate, therefore can not pass throughThe difference of insulating laminated plate is carried out the difference between balance L1/2 layer central layer and L3/4 layer central layer), this realityExecuting routine method comprises:
Step 1: determine the difference between intensity and the Ln-1/n layer central layer of L1/2 layer central layer.
In general, in order to ensure as far as possible the symmetry of L1/2 layer central layer and Ln-1/n layer central layer,Can select the central layer of consistency of thickness, if variable thickness causes, can be by empirical value or by experimentThe impact that the difference of the thickness between mensuration L1/2 layer central layer and Ln-1/n layer central layer produces intensity.Same, can determine L1/2 layer central layer and Ln-1/n by empirical value or concrete method for measuringThe strength difference that the fluting size of layer central layer groove milling causes. Its assay method is those skilled in the artCan both know, not describe in detail here. And according to the strength difference between definite central layer, reallyDetermine the difference size between the formation of dielectric layers version, thus the above-mentioned strength difference of balance. For rightThe architectural difference that intensity effect is little, can be not considered, if there is in addition various structures difference,The impact that can produce intensity according to it considers.
Step 2: according to the difference between the intensity of L1/2 layer central layer and the intensity of Ln-1/n layer central layer,To L2/3 layer insulating plate and Ln-2/Ln-1 layer insulating plate in prepreg select.
Step 3: continue to determine between the intensity of L3/4 layer central layer and the intensity of Ln-3/n-2 layer central layerDifference, if not there are differences between two-layer central layer, can select so by same type and resinThe prepreg of content is made L4/5 layer insulating plate and Ln-4/Ln-3 layer insulating plate. IfBetween two-layer central layer, there are differences, so according to the difference between central layer, to L4/5 layer insulating plateAnd prepreg in Ln-4/Ln-3 layer insulating plate is selected.
Step 4, if also have other about there are differences between centrosymmetric two-layer central layer, continuesPrepreg to its adjacent insulating laminated plate is selected, until by the choosing of adjacent insulating laminated plateSelect, all central layers symmetrical in the number of plies are reached and answer equilibrium of forces.
Step 5: according to the prepreg that each insulating laminated plate is selected, form test plate (panel), and according to examinationThe flatness result of plate, adjusts the resin content of prepreg.
In the present embodiment, according to the difference about intensity on centrosymmetric central layer in the number of plies, selectDifferent prepregs forms asymmetrical insulating laminated plate, utilizes different insulating laminated plates to carry out balance differenceCore plate structure and and the difference of stress, thereby overcome in multilayer printed wiring board because part is mixedThe reasons such as high frequency material processed cause stress difference and the plate that causes sticks up problem, have improved multilayer printed-wiringThe quality of plate.
In the present invention, can select as the case may be the insulating laminated plate adjacent with central layer, for example, 8In layer central layer, if any one in L1/2 layer central layer and L7/8 layer central layer has groove milling, rightThe selection of the prepreg of L2/3 layer insulating plate and L6/7 layer insulating plate adjusts accordingly, fromAnd stress difference between balance L1/2 layer central layer and L7/8 layer central layer. If L1/2 layer central layerIdentical with L7/8 layer core plate structure, but in L3/4 layer central layer and L5/6 layer central layer arbitrarilyOne has groove milling, owing to only having one deck insulating laminated plate between L3/4 layer central layer and L5/6 layer central layer,Therefore can select respectively the insulating laminated plate in L3/4 layer central layer and L5/6 layer central layer outside adjacent as itInsulating laminated plate, still the prepreg of L2/3 layer insulating plate and L6/7 layer insulating plate is enteredRow design, with the stress difference of balance L3/4 layer central layer and L5/6 layer central layer.
Embodiment tri-
Based on the design identical or similar with said method embodiment, the embodiment of the present invention three providesA kind of multilayer printed wiring board, in this multilayer printed wiring board, if in the number of plies about centerBetween symmetrical two-layer central layer, there are differences, respectively the dielectric layers plate adjacent with two-layer central layer itBetween there is corresponding difference.
Wherein, for the first central layer and the second central layer symmetrical in the number of plies, if the first central layerIntensity is greater than the intensity of the second central layer, prepreg is selected to make adjacent with the first central layerThe intensity of the first insulating laminated plate be greater than the intensity of second insulating laminated plate adjacent with the second central layer; IfThe intensity of the first central layer is less than the intensity of the second central layer, prepreg is selected to make andThe intensity of the first insulating laminated plate that one central layer is adjacent is less than second insulating laminated plate adjacent with the second central layerIntensity.
Wherein, if the difference between the intensity of the first central layer and the intensity of the second central layer is first poorDifferent, the difference between the intensity of the first insulating laminated plate and the intensity of the second insulating laminated plate is the second difference,So, the absolute value of the difference between the first difference and the second difference is less than predetermined value.
Wherein, the dielectric layers plate adjacent with two-layer central layer can be adjacent with two-layer central layer respectivelyAnd near the insulating laminated plate of multilayer printed wiring board center one side; Or, adjacent with two-layer central layer respectivelyAnd near the insulating laminated plate of multilayer printed wiring board surface one side.
The multilayer printed wiring board that the embodiment of the present invention provides can be according in said method embodimentThe multilayer printed wiring board made of multilayer printed wiring board preparation method.
Be understandable that, above embodiment is only used to illustrate principle of the present invention and adoptsIllustrative embodiments, but the present invention is not limited thereto. For the ordinary skill in this areaPersonnel, without departing from the spirit and substance in the present invention, can make various modification andImprove, these modification and improvement are also considered as protection scope of the present invention.
Claims (9)
1. a preparation method for multilayer printed wiring board, described multilayer printed wiring board comprises intervalThe central layer and the insulating laminated plate that arrange, is characterized in that, described method comprises:
1) multilayer printed wiring board of determining required making in the number of plies about centrosymmetric two-layer coreArchitectural difference between plate;
2) according to the architectural difference between described two-layer central layer, to adjacent with described two-layer central layer respectivelyThe formation of dielectric layers plate select, to make because of the architectural difference between described two-layer central layerAnd the stress producing on multilayer printed wiring board after making can partial offset or is all offset;
3) utilize described central layer and selected insulating laminated plate to make multilayer printed wiring board;
In step 1) in, the architectural difference between two-layer central layer comprises:
The difference of two-layer central layer in material; And/or,
Difference in the type of the prepreg adopting in two-layer central layer; And/or,
The difference of two-layer central layer on thickness; And/or,
Fluting and unslotted on another central layer on a central layer in two-layer central layer; And/or,
The difference of two-layer central layer in the size of fluting; And/or,
Chimeric on a central layer in two-layer central layer have the abaculus different from this central layer material, and another central layerOn not chimeric abaculus; And/or,
Difference on two-layer central layer in the size of chimeric abaculus; And/or,
Difference on two-layer central layer in the material of chimeric abaculus.
2. according to the method described in claim 1, it is characterized in that, described two-layer central layer respectivelyBe the first central layer and the second central layer, described dielectric layers plate is respectively adjacent with the first central layer firstInsulating laminated plate, and second insulating laminated plate adjacent with the second central layer,
In step 2) in, according to the architectural difference between described two-layer central layer, to respectively with described twoThe method that the formation of the dielectric layers plate that layer central layer is adjacent is selected is as follows:
According to the architectural difference between the first central layer and the second central layer, make the first insulating laminated plate andBetween two insulating laminated plates, there is identical architectural difference; Or,
Judge the large of intensity between two-layer central layer according to the architectural difference between the first central layer and the second central layerLittle relation, if the intensity of the first central layer is greater than the intensity of the second central layer, to dielectric layers plateForming selects to make the intensity of the first insulating laminated plate to be greater than the intensity of the second insulating laminated plate; IfThe intensity of the first central layer is less than the intensity of the second central layer, the formation of dielectric layers plate is selectedTo make the intensity of first insulating laminated plate adjacent with the first central layer be less than adjacent with the second central layerThe intensity of two insulating laminated plates.
3. method according to claim 2, is characterized in that, described to dielectric layers plateFormation select to be specially: the prepreg that dielectric layers plate is adopted is selected; FromAnd make the difference between the first difference and the second difference be less than predetermined value; Wherein, the first difference isDifference between the intensity of the intensity of one central layer and the second central layer, the second difference is the first insulating laminated plateDifference between the intensity of intensity and the second insulating laminated plate.
4. method according to claim 3, is characterized in that, prepreg is selectedComprise and select the type of prepreg and/or the resin content of definite prepreg.
5. according to the method described in any one in claim 1 to 4, it is characterized in that, respectively withThe insulating laminated plate that two-layer central layer is adjacent is specially:
The insulating barrier of adjacent with two-layer central layer and close multilayer printed wiring board center one side respectivelyPlate;
Or, adjacent with two-layer central layer and near the insulation of multilayer printed wiring board surface one side respectivelyLaminate.
6. according to the method described in claim 1 to 4 any one, it is characterized in that, in step 3)Also comprise afterwards, according to the angularity of the test plate (panel) of the multilayer printed wiring board of making, adjust and two-layer coreThe formation of the insulating laminated plate that plate is adjacent.
7. the basis multilayer printed wiring board that method is made as described in any one in claim 1 to 6.
8. a multilayer printed wiring board, described multilayer printed wiring board comprises spaced central layerAnd insulating laminated plate, it is characterized in that, if in the number of plies about existing between centrosymmetric two-layer central layerArchitectural difference, exists corresponding structure poor between the dielectric layers plate adjacent with two-layer central layer respectivelyDifferent;
Architectural difference between two-layer central layer comprises:
The difference of two-layer central layer in material; And/or,
Difference in the type of the prepreg adopting in two-layer central layer; And/or,
The difference of two-layer central layer on thickness; And/or,
Fluting and unslotted on another central layer on a central layer in two-layer central layer; And/or,
The difference of two-layer central layer in the size of fluting; And/or,
Chimeric on a central layer in two-layer central layer have the abaculus different from this central layer material, and another central layerOn not chimeric abaculus; And/or,
Difference on two-layer central layer in the size of chimeric abaculus; And/or,
Difference on two-layer central layer in the material of chimeric abaculus.
9. multilayer printed wiring board according to claim 8, is characterized in that,
Described two-layer central layer is respectively the first central layer and the second central layer,
Wherein, the intensity of the first central layer is greater than the intensity of the second central layer, and adjacent with the first central layerThe intensity of the first insulating laminated plate be greater than the intensity of second insulating laminated plate adjacent with the second central layer; Or,The intensity of the first central layer is less than the intensity of the second central layer, and first insulating barrier adjacent with the first central layerThe intensity of plate is less than the intensity of second insulating laminated plate adjacent with the second central layer.
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| CN107632255B (en) * | 2017-10-16 | 2021-03-09 | Oppo广东移动通信有限公司 | Test fixture plate |
| CN108012466A (en) * | 2017-12-14 | 2018-05-08 | 郑州云海信息技术有限公司 | A kind of method of optimized PCB stack-design |
| CN109696206B (en) * | 2018-06-26 | 2021-04-13 | 上海嘉捷通电路科技股份有限公司 | Self-made buried resistance plate and testing method thereof |
| CN109041460A (en) * | 2018-10-18 | 2018-12-18 | 莆田市涵江区依吨多层电路有限公司 | A kind of control method that multi-layer PCB board module product plate is stuck up |
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| CN101080164A (en) * | 2007-06-27 | 2007-11-28 | 迈普（四川）通信技术有限公司 | Board joint method of dual-side printed circuit board |
| CN101662897A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for multilayer stacking printed wiring board |
| CN102056414A (en) * | 2010-12-29 | 2011-05-11 | 北大方正集团有限公司 | Manufacturing method of printed circuit board |
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| JP2009218392A (en) * | 2008-03-11 | 2009-09-24 | Furukawa Electric Co Ltd:The | Metal core multilayer printed wiring board |
| JP5289996B2 (en) * | 2009-02-16 | 2013-09-11 | 日本特殊陶業株式会社 | Reinforced wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101080164A (en) * | 2007-06-27 | 2007-11-28 | 迈普（四川）通信技术有限公司 | Board joint method of dual-side printed circuit board |
| CN101662897A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for multilayer stacking printed wiring board |
| CN102056414A (en) * | 2010-12-29 | 2011-05-11 | 北大方正集团有限公司 | Manufacturing method of printed circuit board |
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