CN203093249U - Device for manufacturing copper-clad plate - Google Patents
Device for manufacturing copper-clad plate Download PDFInfo
- Publication number
- CN203093249U CN203093249U CN 201320055316 CN201320055316U CN203093249U CN 203093249 U CN203093249 U CN 203093249U CN 201320055316 CN201320055316 CN 201320055316 CN 201320055316 U CN201320055316 U CN 201320055316U CN 203093249 U CN203093249 U CN 203093249U
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- copper
- clad plate
- prepreg
- heating
- plate
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Abstract
The utility model discloses a device for manufacturing a copper-clad plate. The device comprises a laminator, wherein the laminator comprises a box body, wherein at least one pair of upper heating plate and lower heating plates is arranged inside the box body; and heating devices are arranged at the periphery of the inner wall of the box body. The edge part rapidly enters into a high-elasticity state by heating the periphery of a prepreg at the prepreg fusing stage since the heating devices are arranged at the periphery of the inner wall of the box body. Thus, the problem of gummosis in the laminating process is prevented; and the problem of small thicknesses of four edges of the copper-clad plate is effectively lightened and the thickness uniformity and consistency of each part of a board are obviously promoted.
Description
Technical field
The utility model relates to a kind of manufacturing installation of copper-clad plate, belongs to the printed circuit board industry.
Background technology
Copper-clad plate (Copper Clad Laminate, full name copper-clad plate lamination plate, the English CCL that is called for short) is to make reinforcing material by wood pulp paper or glass cloth etc., soaks with resin, and single or double is coated with Copper Foil, a kind of product that forms through hot pressing.Copper-clad plate is the basic material of electronics industry, is mainly used in the processing and manufacturing printed circuit board (pcb).
Along with the direction of " gently ", " little " of terminal electronic product, " approaching ", " soon " develops, wiring board constantly develops towards the direction of circuit densification and interlayer slimming, therefore assembling and the machining accuracy to the impedance operator of transmission line and reliability, components and parts proposed more harsh control requirement, thereby also more and more stricter to the requirement of base material thickness of insulating layer precision.Copper-clad plate is as the baseplate material of wiring board, and the wiring board thickness and precision depends primarily on the thickness evenness of copper-clad plate.
Existing copper-clad plate preparation method comprises the steps: that mainly (1) is taken to few 1 prepreg, at the folded Copper Foil of establishing of its single or double; (2) put it into up and down between the heating plate of laminating machine, under HTHP, carry out lamination; Can obtain copper-clad plate.Its manufacturing installation that adopts is a laminating machine, and existing laminating machine mainly comprises casing, is provided with heating plate and following heating plate at least one pair of in the casing, is used for pressing from both sides and establishes the prepreg group.Lamination process generally comprises melt stage, cure stage and cooling stage.In the melt stage of the lamination process of prepreg, impregnated glue can be assembled to the edge of glass fabric under the effect that stands high temperature and high pressure and forms gummosis.The lighter can form more overflow and cause waste, makes the product thickness deviation bigger, and weight person then can pollute into product equipment, and production environment is destroyed, and What is more understands damage equipment, not only influences the technical qualities of product, the service life that also can reduce equipment.This problem has become one of long-term insurmountable difficult problem of the industry.
At the problems referred to above, existing method mainly comprises following several: (1) prepreg and Copper Foil staggered superimposed after, with high heat resistant adhesive tape sealing lamination four limits, improve sheet metal thickness by flowing of resin glue of obstruction.The high heat resistant adhesive tape good airproof performance that this kind processing technology is used is unfavorable for the little molecule volatile matter escape that produces in the cross-linking reaction process; In case little molecule volatile matter residues in the insulating barrier resin matrix, can cause resin cavity blemish grade visual defects, to multinomial performance indexs such as dielectric properties, curing degree, wet-hot aging performance and the reliability generation harmful effect of base material.Simultaneously, each pressing lamination is adopted the sealing of high heat resistant adhesive tape, need to adopt operation manually, inefficiency and occur sequence of operations problems such as poorly sealed, that contraposition is inaccurate easily is unfavorable for big applying of producing.(2) Chinese invention patent application CN102275354A discloses the inhomogeneity manufacture method of a kind of raising thickness of copper-clad plate, it mainly adopts the prepreg of the different resins curing degree at middle and edge, thereby improve the gummosis problem in the copper-clad plate lamination process, the curing degree of prepreg edge zone resin by original 40 ~ 60% be increased to 60%～80%; This scheme can be improved the gummosis problem of copper-clad plate, but adopt present existing manufacturing installation to be difficult to produce this type of extraordinary prepreg, if the heater that carries out synchronously in the package prepreg shear history solidifies the edge of prepreg, but shear rate comparatively fast is difficult to reach desired curing degree, and can't be to being cured around the whole prepreg, so this scheme can't be suitable on industrial production.(3) Chinese utility model patent CN202021901U discloses a kind of manufacturing equipment of prepreg, its mainly adopt the special metering roller make in the middle of with the prepreg of both sides different resins content, thereby improve edge gummosis in the copper-clad plate lamination process and the thin partially problem of thickness that causes.But the method is only controlled the resin content of uncontrollable edge to both sides edge resin content radially.
In sum, existing copper-clad plate manufacturing installation also can't really solve the thickness of copper-clad plate homogeneity question, is difficult to realize using on industrial production.
Summary of the invention
The purpose of this utility model provides a kind of manufacturing installation of copper-clad plate.
To achieve the above object of the invention, the technical solution adopted in the utility model is: a kind of manufacturing installation of copper-clad plate, comprise laminating machine, and described laminating machine comprises casing, be provided with heating plate and following heating plate at least one pair of in the casing, heater is set around the inwall of described casing.
Above, described heater is contactless mode of heating, preferentially adopts the infra-red radiation mode, as infrared radiation panel, all is located on the press inwall side all around, evenly distributes.
Cure stage mainly satisfies the solidifying requirements of sheet material by heating plate up and down in the copper coated plate manufacturing process, and guarantees the thickness evenness of whole plate.
Optimized technical scheme, described heater is distributed in around the cabinet wall.
Optimized technical scheme, described heater are infrared radiation panel.
In the technique scheme, also be provided with temperature control system, described heater is controlled by temperature control system.
The course of work of the present utility model is as follows: (1) is taken to few 1 prepreg, folds at its single or double and establishes Copper Foil, obtains the prepreg combination; (2) be taken to few 1 group of above-mentioned prepreg combination, put into up and down between the heating plate of laminating machine, prepare the lamination pressing; (3) in the melt stage of lamination process, to heating around the prepreg, make prepreg glue all around reach elastomeric state prior to the glue of centre by heater all around; (4) laminating operation routinely can obtain copper-clad plate.
Described prepreg combination is made up of at least 1 prepreg and the folded Copper Foil of joining of single or double, and the quantity of prepreg can be adjusted according to the thickness of copper-clad plate, belongs to prior art.Prepreg is meant within edge 10 mm of prepreg all around in the described step (3).Glue around the described prepreg arrives elastomeric state prior to the glue of centre, and described elastomeric state is that the relative curing degree of glue reaches more than 60%.
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1, the utility model design has obtained a kind of manufacturing installation of copper-clad plate, heater is set around the inwall of laminating machine casing, the marginal portion is by reaching curing (elastomeric state) rapidly to heating around the prepreg when the prepreg melt stage, thereby prevent the gummosis problem in the lamination process, effectively improve the thin partially problem of thickness at four edges of copper-clad plate, thereby significantly promoted sheet material thickness evenness and uniformity everywhere.
2. laminating machine of the present utility model can reduce pollution and the damage of overflow glue to equipment effectively, further promotes the service life of production equipment, can also improve the usable floor area of sheet material simultaneously, thereby effectively reduce the raw material loss, saves production cost.
3, of the present utility model simple in structure, to be convenient to promote, the cost demand is low.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one.
Wherein: 1, casing; 2, go up heating plate; 3, following heating plate; 4, heater; 5, mirror steel plate; 6, Copper Foil; 7, prepreg.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one
Shown in accompanying drawing 1, a kind of manufacturing installation of copper-clad plate comprises laminating machine, and described laminating machine comprises casing 1, is provided with heating plate 2 and following heating plate 3 at least one pair of in the casing, and heater 4 is set around the inwall of described casing.
Described heater is distributed in around the cabinet wall.Described heater is an infrared radiation panel.
Also be provided with temperature control system, described heater is controlled by temperature control system.
The course of work of the present utility model is as follows: (1) is taken to few 1 prepreg 7, folds at its single or double and establishes Copper Foil 6, obtains the prepreg combination; (2) be taken to few 1 group of above-mentioned prepreg combination, the folded mirror steel plate 5 of joining of each combination upper and lower surface; (3) combination of above-mentioned prepreg is put into up and down between the heating plate of laminating machine, prepare the lamination pressing; (4) in the melt stage of lamination process, to heating around the prepreg, make prepreg glue all around realize solidifying prior to the glue of centre by heater all around; (5) laminating operation routinely can obtain copper-clad plate.
Claims (4)
1. the manufacturing installation of a copper-clad plate comprises laminating machine, and described laminating machine comprises casing (1), is provided with heating plate at least one pair of (2) and following heating plate (3) in the casing, it is characterized in that: heater (4) is set around the inwall of described casing.
2. the manufacturing installation of copper-clad plate according to claim 1, it is characterized in that: described heater is distributed in around the cabinet wall.
3. the manufacturing installation of copper-clad plate according to claim 1, it is characterized in that: described heater is an infrared radiation panel.
4. the manufacturing installation of copper-clad plate according to claim 1, it is characterized in that: also be provided with temperature control system, described heater is controlled by temperature control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320055316 CN203093249U (en) | 2013-01-31 | 2013-01-31 | Device for manufacturing copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320055316 CN203093249U (en) | 2013-01-31 | 2013-01-31 | Device for manufacturing copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203093249U true CN203093249U (en) | 2013-07-31 |
Family
ID=48844684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320055316 Expired - Lifetime CN203093249U (en) | 2013-01-31 | 2013-01-31 | Device for manufacturing copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203093249U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113522690A (en) * | 2021-06-07 | 2021-10-22 | 延锋彼欧汽车外饰系统有限公司 | Glue solidification accelerating tool and method for automobile tail door |
-
2013
- 2013-01-31 CN CN 201320055316 patent/CN203093249U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113522690A (en) * | 2021-06-07 | 2021-10-22 | 延锋彼欧汽车外饰系统有限公司 | Glue solidification accelerating tool and method for automobile tail door |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130731 |