CN206341474U - A kind of anti-corrugation PCB layer pressure fusion structure - Google Patents
A kind of anti-corrugation PCB layer pressure fusion structure Download PDFInfo
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- CN206341474U CN206341474U CN201621473222.6U CN201621473222U CN206341474U CN 206341474 U CN206341474 U CN 206341474U CN 201621473222 U CN201621473222 U CN 201621473222U CN 206341474 U CN206341474 U CN 206341474U
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- sensation
- fusion
- corresponding circle
- copper foil
- top layer
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Abstract
The utility model discloses a kind of anti-corrugation PCB layer pressure fusion structure, including basic unit, is arranged on the top layer of basic unit's one side and the Copper Foil being covered in above top layer, and the top layer includes line areas and multiple corresponding circle of sensation；The corresponding circle of sensation includes the multiple fusion blocks for being attached to substrate surface, and the fusion block is set along the circuit area edge in array-like；The fusion block periphery is surrounded with the framework being made up of metal.The utility model is by the additional corresponding circle of sensation in original pcb board laminar structure periphery, extending laminar structure edge to prevent that laminar structure surface Copper Foil from wrinkling.By adding merging block and increasing the adhesion and seal between pcb board and Copper Foil for prepreg and base material, reduce the inclined phenomenon of layer and occur and the loss of laminar structure heat can be reduced, reduce scrappage, saving cost.
Description
Technical field
The utility model is related to PCB manufacture fields, and in particular to a kind of anti-corrugation PCB layer pressure fusion structure.
Background technology
During PCB layer pressure fusion, because corresponding circle of sensation designs unreasonable, cause fusion plate corrugation after pressing.Meanwhile, because of pressing region
Adhesion is poor, and the inclined phenomenon of layer easily occurs in pressing causes material scrap, increases production cost.
The content of the invention
To achieve the above object, the utility model is adopted the following technical scheme that：A kind of anti-corrugation PCB layer pressure fusion knot
Structure, including basic unit, be arranged on the top layer of basic unit's one side and the Copper Foil being covered in above top layer, the top layer include line areas with
And multiple corresponding circle of sensation；The corresponding circle of sensation includes being attached to multiple fusion blocks of substrate surface, and the fusion block is along the line areas
Edge is set in array-like；The fusion block periphery is surrounded with the framework being made up of metal.
Operation principle of the present utility model is：During pcb board laminate fusion, the part comprising required circuit is line areas, its
Edge is provided with multiple corresponding circle of sensation.Multiple same sizes are set close to line areas and the boundary line of corresponding circle of sensation on corresponding circle of sensation
Fusion block, make fusion block along this boundary line be arranged into array-like constitute grid pattern.Framework, frame are provided with the periphery of fusion block
Frame is arranged on the corresponding circle of sensation on pcb board.The utility model passes through in the additional corresponding circle of sensation in original pcb board laminar structure periphery, extension
Laminar structure edge is so as to prevent the Copper Foil corrugation of laminar structure surface.
Further, the framework side is provided with opening, and the opening is fitted with the circuit area edge.
Framework is provided with opening close to line areas side, can be brought into close contact with the edge of line areas, so as to increase seal
Reduce the thermal loss of inside configuration.
Further, the corresponding circle of sensation thickness is identical with the line areas thickness.
Fusion block in corresponding circle of sensation is base material, and the thickness of base material can be adjusted with the flaggy thickness of line areas in 1mm--10mm
Section, makes its height identical with the flaggy thickness of line areas all the time, prevents that Copper Foil from wrinkling.
Further, prepreg is provided between the corresponding circle of sensation and the Copper Foil.
The material of prepreg is resin and glass fibre, and resin can melt under conditions of airtight heating, with good
Viscous stickiness, therefore the adhesion of prepreg Copper Foil and base material compared with the adhesion of Copper Foil is bigger, can further increase layer
Press the overall adhesion of fusion structure.The closed of laminate fusion structure entirety can also be increased using addition prepreg simultaneously
Property, reduce line areas thermal loss.Occur so as to reduce the inclined phenomenon of layer, reduce scrappage, save cost.
The beneficial effects of the utility model are：The utility model passes through in the additional fusion in original pcb board laminar structure periphery
Area, extension laminar structure edge are so as to prevent the Copper Foil corrugation of laminar structure surface.By adding melting for prepreg and base material
Close block to increase the adhesion and seal between pcb board and Copper Foil, reduce the inclined phenomenon of layer and occur and laminar structure heat can be reduced
The loss of amount, reduces scrappage, saves cost.
Brief description of the drawings
With accompanying drawing, the utility model is described in further detail, but the embodiment in accompanying drawing is not constituted to of the present utility model
What is limited.
Fig. 1 is the structural representation that a kind of anti-corrugation PCB layer of the present utility model presses fusion structure.
Fig. 2 is the side structure schematic diagram that a kind of anti-corrugation PCB layer of the present utility model presses fusion structure.
In Fig. 1：1）Pcb board, 2）Line areas, 3）Corresponding circle of sensation, 4）Boundary line, 5）Merge block, 6）Framework, 7）P pieces, 8）Copper
Paper tinsel.
Embodiment
For the ease of it will be appreciated by those skilled in the art that making below in conjunction with accompanying drawing and embodiment to the utility model into one
Step is described in detail：
1. a kind of anti-corrugation PCB layer pressure fusion knot that as shown in Figure 1-2, in one embodiment, the utility model is provided
Structure, including pcb board 1, the pcb board 1 are provided with line areas 2 and multiple corresponding circle of sensation 3 being centered around around line areas 2, in pcb board
Covered with Copper Foil 8 on 1, P pieces 7 are provided between pcb board 1 and Copper Foil 8.The rectangle provided with multiple same specifications melts on corresponding circle of sensation 3
Block 5 is closed, fusion block 5 is set along line areas and the boundary line of corresponding circle of sensation 4 in array-like, U-shaped framework is provided with the periphery of fusion figure 5
6, U-shaped framework 6 is arranged on corresponding circle of sensation 3, and the rectangle for constituting closing with boundary line 4 will merge block 5 and surround.The thickness of corresponding circle of sensation 3 with
The thickness of line areas 2 is identical.
Fusion block 5 in corresponding circle of sensation 3 is base material, and its thickness can be with the flaggy thickness in the line areas 2 of pcb board 1 in 1mm--
Adjusted in 10mm, make its height identical with the flaggy thickness of line areas 2 all the time.
Merge and P pieces 7 are provided between block 5 and Copper Foil 8, the material of P pieces 7 is resin and glass fibre, in the bar of airtight heating
Resin can melt under part, with good viscous stickiness, therefore the knot of Copper Foil 8 with merging block 5 compared with the adhesion of Copper Foil 8 of P pieces 7
It is bigger with joint efforts, it can further increase the overall adhesion of pcb board 1.Laminar structure can also be increased using addition P pieces 7 simultaneously whole
The seal of body, reduces laminated area thermal loss.
Finally it should be noted that above example is only illustrating the technical solution of the utility model, rather than to this reality
With the limitation of novel protected scope, although being explained with reference to preferred embodiment to the utility model, this area it is general
Lead to it will be appreciated by the skilled person that can be modified to the technical solution of the utility model or equivalent, without departing from this
The spirit and scope of utility model technical scheme.
Claims (4)
1. a kind of anti-corrugation PCB layer pressure fusion structure, including basic unit, it is arranged on the top layer of basic unit's one side and is covered on top layer
The Copper Foil of side, the top layer includes line areas and multiple corresponding circle of sensation；It is characterized in that：The corresponding circle of sensation includes being attached to basic unit
Multiple fusion blocks on surface, the fusion block is set along the circuit area edge in array-like；The fusion block periphery is surrounded with
The framework being made up of metal.
2. laminate fusion structure according to claim 1, it is characterised in that：The framework side is provided with opening, the opening
Fitted with the circuit area edge.
3. laminate fusion structure according to claim 2, it is characterised in that：The corresponding circle of sensation thickness and the line areas thickness
It is identical.
4. laminate fusion structure according to claim 1, it is characterised in that：It is solid provided with half between the corresponding circle of sensation and the Copper Foil
Change piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621473222.6U CN206341474U (en) | 2016-12-30 | 2016-12-30 | A kind of anti-corrugation PCB layer pressure fusion structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621473222.6U CN206341474U (en) | 2016-12-30 | 2016-12-30 | A kind of anti-corrugation PCB layer pressure fusion structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206341474U true CN206341474U (en) | 2017-07-18 |
Family
ID=59304257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621473222.6U Active CN206341474U (en) | 2016-12-30 | 2016-12-30 | A kind of anti-corrugation PCB layer pressure fusion structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206341474U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
| CN107770975A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of anti-corrugation compression methods of PCB |
-
2016
- 2016-12-30 CN CN201621473222.6U patent/CN206341474U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
| CN107770975A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of anti-corrugation compression methods of PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510000 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangdong Patentee after: Guangzhou Guanghe Technology Co., Ltd Address before: 510000 No. 22, Ying Ying Road, Guangzhou Free Trade Zone, Guangdong Patentee before: DELTON TECHNOLOGY (GUANGZHOU) Inc. |
|
| CP01 | Change in the name or title of a patent holder |