CN202053617U - Bonding sheet structure used for improving uniformity of thickness of copper-clad plate - Google Patents
Bonding sheet structure used for improving uniformity of thickness of copper-clad plate Download PDFInfo
- Publication number
- CN202053617U CN202053617U CN2011201369693U CN201120136969U CN202053617U CN 202053617 U CN202053617 U CN 202053617U CN 2011201369693 U CN2011201369693 U CN 2011201369693U CN 201120136969 U CN201120136969 U CN 201120136969U CN 202053617 U CN202053617 U CN 202053617U
- Authority
- CN
- China
- Prior art keywords
- thickness
- copper
- clad plate
- bonding sheet
- sheet structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model provides a bonding sheet structure used for improving the uniformity of the thickness of a copper-clad plate, which comprises a middle part and two side corner parts connected to the two opposite side ends of the middle part, wherein the thickness of the middle part is uniform; the thickness of the two side corner parts is greater than that of the middle part; and the thickness of the two side corner parts is gradually increased in the shape of an arc or a straight line from the ends connected to the middle part to the other ends. In the bonding sheet structure used for improving the uniformity of the thickness of the copper-clad plate, the thickness of the middle is uniform and is gradually increased from the middle to the outer side, and then a structure of which the thickness of the side corners is greater than that of the middle is formed, so the defect that the side corners become relatively thin when resin at the positions of the side corners flows out during lamination is overcome, the copper-clad plate with uniform thickness is obtained, and performances, such as impedance, high-voltage resistance and the like, of the copper-clad plate (CCL) and a printed circuit board (PCB), are ensured.
Description
Technical field
The utility model relates to the copper-clad plate technical field, relates in particular to a kind of inhomogeneity bonding sheet structure of thickness of copper-clad plate that is used to improve.
Background technology
The bonding sheet of copper-clad plate lamination use at present all is that wide cut scope inner resin layer thickness is uniform, bonding sheet is pressed in the copper-clad plate process, as shown in Figure 2, the resin bed melted by heating of bonding sheet 3, under the press pressure effect, the resin bed melt-flow, bonding sheet 3 corner location resins 30 outwards flow out Copper Foil 1, cause the corner resin bed to reduce, and the centre position resin is outwards mobile little, the copper-clad plate corner is thin partially after causing the ubiquity pressing, influences the thickness of copper-clad plate uniformity, thereby has influence on the product impedance of CCL, PCB, performance such as high pressure resistant.
The utility model content
The purpose of this utility model is, a kind of inhomogeneity bonding sheet structure of thickness of copper-clad plate that is used to improve is provided, interior thickness evenly and thickness outwards increase gradually from the centre, form the structure of corner thickness greater than interior thickness, be used to improve the thickness evenness of the copper-clad plate of made.
To achieve these goals, the utility model provides a kind of inhomogeneity bonding sheet structure of thickness of copper-clad plate that is used to improve, it comprises pars intermedia and is connected to the bight, both sides of the relative two side ends of this pars intermedia, described pars intermedia thickness is even, the thickness of corner portion is greater than the thickness of pars intermedia, and the thickness of corner portion curved or straight line increases gradually to its relative other end from an end that connects pars intermedia.
It is 3-30cm that described corner portion connects pars intermedia one side to the length of its relative opposite side from it.
Thickening between described corner portion's thickness and the pars intermedia thickness than being 0.05-1%.
The beneficial effects of the utility model: of the present utility modelly be used to improve the inhomogeneity bonding sheet structure of thickness of copper-clad plate, even and the thickness outwards increase gradually of interior thickness from the centre, form the structure of corner thickness greater than interior thickness, the corner location resin flows out the defective that causes that the corner approaches partially when remedying lamination, obtain the uniform copper-clad plate of thickness, guaranteed the product impedance of CCL, PCB, performance such as high pressure resistant.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and other beneficial effect apparent by the specific embodiment of the present utility model is described in detail.
In the accompanying drawing,
Fig. 1 is the cross section structure schematic diagram that is used to improve the inhomogeneity bonding sheet structure of thickness of copper-clad plate of the present utility model;
Fig. 2 is the hot pressing process schematic diagram of existing bonding sheet.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1, be the cross section structure schematic diagram that is used to improve the inhomogeneity bonding sheet structure of thickness of copper-clad plate of the present utility model, described bonding sheet is made by resin impregnation reinforcing material, and resin forms resin bed on reinforcing material, and gives certain face shaping of this bonding sheet and thickness.Bonding sheet structure of the present utility model comprises pars intermedia 20 and is connected to the bight, both sides 40 of these pars intermedia 20 relative two side ends, described pars intermedia 20 thickness are even, and the thickness of corner portion 40 is all greater than the thickness of pars intermedia 20, and curved or linear increases the thickness of corner portion 40 gradually to its relative other end from an end that connects pars intermedia 20, and this varied in thickness is promptly changed by described resin layer thickness and forms.Be a bit larger tham pars intermedia 20 thickness settings by corner portion 40 thickness, the pars intermedia of avoiding the resin of corner portion with lamination such as Copper Foil the time to flow out being caused 20 and the problem of corner portion 40 uneven thickness, and obtain the uniform copper-clad plate of thickness.
Wherein, described corner portion 40 from its connect pars intermedia 20 1 sides to the length B of its relative opposite side be 3-30cm, promptly this bonding sheet structure begins at distolateral 3-30cm place outside it from the curved or straight line progressive additive in interior side direction two outer ends, thereby corner portion 40 cross sections are trapezoidal, as shown in fig. 1, the relative up and down curved or straight line of dual-side of corner portion 40.Between described corner portion's 40 thickness and pars intermedia 20 thickness to thicken than C/A be 0.05-1%, this thickens than actual parameter and adjusts according to the bonding sheet model.
When the utility model is applied to the copper-clad plate making, place between two Copper Foils, during hot pressing, the resin of corner portion 40 can outwards flow out, thereby solves corner portion's 40 thickness and pars intermedia 20 thickness difference problems, improves the thickness evenness of the copper-clad plate of made.
In sum, of the present utility modelly be used to improve the inhomogeneity bonding sheet structure of thickness of copper-clad plate, even and the thickness outwards increase gradually of interior thickness from the centre, form the structure of corner thickness greater than interior thickness, the corner location resin flows out the defective that causes that the corner approaches partially when remedying lamination, obtain the uniform copper-clad plate of thickness, guaranteed the product impedance of CCL, PCB, performance such as high pressure resistant.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to the technical solution of the utility model and technical conceive, and all these changes and distortion all should belong to the protection domain of the utility model claim.
Claims (3)
1. one kind is used to improve the inhomogeneity bonding sheet structure of thickness of copper-clad plate, it is characterized in that, it comprises pars intermedia and is connected to the bight, both sides of the relative two side ends of this pars intermedia, described pars intermedia thickness is even, the thickness of corner portion is greater than the thickness of pars intermedia, and the thickness of corner portion curved or straight line increases gradually to its relative other end from an end that connects pars intermedia.
2. as claimed in claim 1ly be used to improve the inhomogeneity bonding sheet structure of thickness of copper-clad plate, it is characterized in that, it is 3-30cm that described corner portion connects pars intermedia one side to the length of its relative opposite side from it.
3. as claimed in claim 1ly be used to improve the inhomogeneity bonding sheet structure of thickness of copper-clad plate, it is characterized in that thickening between described corner portion's thickness and the pars intermedia thickness than being 0.05-1%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201369693U CN202053617U (en) | 2011-05-03 | 2011-05-03 | Bonding sheet structure used for improving uniformity of thickness of copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201369693U CN202053617U (en) | 2011-05-03 | 2011-05-03 | Bonding sheet structure used for improving uniformity of thickness of copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202053617U true CN202053617U (en) | 2011-11-30 |
Family
ID=45013602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201369693U Expired - Lifetime CN202053617U (en) | 2011-05-03 | 2011-05-03 | Bonding sheet structure used for improving uniformity of thickness of copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202053617U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538300A (en) * | 2012-07-16 | 2014-01-29 | 苏州维艾普新材料有限公司 | Heat-sealing composite barrier film and preparation method thereof |
| CN112916695A (en) * | 2020-12-29 | 2021-06-08 | 江西生益科技有限公司 | Method for manufacturing buffer backing plate for improving corner defect of copper-clad plate |
-
2011
- 2011-05-03 CN CN2011201369693U patent/CN202053617U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538300A (en) * | 2012-07-16 | 2014-01-29 | 苏州维艾普新材料有限公司 | Heat-sealing composite barrier film and preparation method thereof |
| CN112916695A (en) * | 2020-12-29 | 2021-06-08 | 江西生益科技有限公司 | Method for manufacturing buffer backing plate for improving corner defect of copper-clad plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203722926U (en) | PCB made of PTFE material | |
| CN105430941B (en) | A kind of technique for improving thick copper coin pressing white edge | |
| CN102149253B (en) | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step | |
| CN202053617U (en) | Bonding sheet structure used for improving uniformity of thickness of copper-clad plate | |
| MY163564A (en) | Tab terminal for electrolytic capacitor | |
| CN204257372U (en) | A kind of denoising structure of amorphous alloy transformer | |
| EP1487245A4 (en) | Circuit board and process for producing the same | |
| CN206341474U (en) | A kind of anti-corrugation PCB layer pressure fusion structure | |
| CN202826636U (en) | Hot pressboard for copper-clad plate and multilayer printed circuit board laminating machine | |
| CN104064336A (en) | Graphite coil plane pulse transformer | |
| CN202021901U (en) | Metering roll | |
| CN203063121U (en) | High-frequency heating rapid molding device | |
| CN104275741B (en) | Plasterboard edge banding apparatus | |
| CN202998654U (en) | Flexible circuit single sided board with PET film being attached to base material | |
| CN203617086U (en) | High-strength iron core clamp oil duct structure | |
| CN203381032U (en) | Gypsum board edge sealing device | |
| CN205022141U (en) | Ferrite trades operation panel of gluey facial mask | |
| CN203399420U (en) | Auxiliary clamp improving laminating flatness of multilayer thick copper foil circuit board | |
| CN206835458U (en) | Battery protection Rigid Flex | |
| CN206938135U (en) | A kind of multilayer board lamination device | |
| CN201528030U (en) | Microstrip antenna filter structure | |
| CN205165600U (en) | Cell -phone metal frame is riveted with well plate voltage and is covered stay knot structure | |
| CN208035423U (en) | High-precision Multi-step forming board | |
| CN203661416U (en) | Thin-type HDI high-density plate structure | |
| CN203222350U (en) | Copper-clad plate mirror plate unilateral guide mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111130 |
|
| CX01 | Expiry of patent term |