CN202826636U - Hot pressboard for copper-clad plate and multilayer printed circuit board laminating machine - Google Patents
Hot pressboard for copper-clad plate and multilayer printed circuit board laminating machine Download PDFInfo
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- CN202826636U CN202826636U CN 201220457044 CN201220457044U CN202826636U CN 202826636 U CN202826636 U CN 202826636U CN 201220457044 CN201220457044 CN 201220457044 CN 201220457044 U CN201220457044 U CN 201220457044U CN 202826636 U CN202826636 U CN 202826636U
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Abstract
The utility model relates to a hot pressboard for a copper-clad plate and a multilayer printed circuit board laminating machine. The hot pressboard for the copper-clad plate and the multilayer printed circuit board laminating machine comprises a fixed pressboard and a moving pressboard, and the fixed pressboard and the moving pressboard are respectively composed of support platforms which play a supporting role and nipping structures which are fixedly connected with the supporting platforms and play a nipping role. The fixed pressboard and the moving pressboard are installed in an inversion symmetry mode, the nipping structures are opposite to each other, and thickness of the middle regions of the nipping structures is larger than that of the marginal regions of the nipping structures. The hot pressboard for the copper-clad plate and the multilayer printed circuit board laminating machine can overcome the defect that the thickness of the middle regions and the thickness of the marginal regions are not even in the laminating process of the copper-clad plate and a multilayer printed circuit board, and has the advantages of being simple in operation, high in production efficiency and low in production cost.
Description
Technical field
The utility model relates to a kind of laminating machine heating platen, relates in particular to a kind of thermal pressing board structure be used to improving copper-clad plate and multilayer printed circuit board thickness evenness, belongs to copper-clad plate and multilayer printed circuit board processing technique field.
Background technology
Copper-clad plate, full name copper-clad laminate (Copper Clad Laminate, CCL) is to make reinforcing material by wood pulp paper or glass-fiber-fabric etc., soaks with resin, single or double is coated with Copper Foil, a kind of composite that forms through hot pressing.Copper-clad plate is the basic material of electronics industry, is mainly used in processing and manufacturing printed circuit board (PCB), extensively is used in the electronic products such as television set, radio, computer, computer, mobile communication.
The making flow process of copper-clad plate is: prepreg PP cuts → prepares burden → mould → lamination → mould unloading → cutting → packing → warehouse-in → shipment of bed board dress.Wherein, the purpose of lamination be make many prepregs each ply adhesion together, form a complete plate.The operation principle of lamination is: interlayer is by stacking prepreg, after usefulness pipe position closing up is good, under uniform temperature and pressure-acting in the multi-layer sheet, the resin flows of prepreg is filled circuit and base material, when temperature arrives to a certain degree, crosslinking curing occurs, with ply adhesion together.
Along with printed circuit board making precision improves day by day, more and more higher to thickness and precision, the requirement of plate face planarization of copper-clad plate.To one-tenth-value thickness 1/10 ± 10% centered by the thickness requirement of copper-clad plate, along with the raising that copper-clad plate is required, the accuracy rating of thickness of copper-clad plate also will progressively be dwindled certainly at present.
For the planarization of the copper-clad plate that guarantees to suppress, existing laminating machine heating platen all requires high for thickness homogeneity, profile pattern.Prior art thinks that only guaranteed laminating machine surface of heating platen is smooth, and the thickness homogeneous, and the copper-clad plate that guarantee is suppressed is smooth, level and smooth, the thickness homogeneous.But in actual conditions, the copper-clad plate that the heating platen lamination of thickness homogeneous, surfacing goes out is the thin thickness of the Thickness Ratio central area of fringe region often.Cause the fringe region phenomenon thinner than the central area mainly to be because in copper coated plate manufacturing process, prepreg is in heating pressure process, resin flows out outside the effective area of copper-clad plate, so that the fringe region Thickness Ratio intermediate zone thicknesses of copper-clad plate is thin, and forming certain thickness gradient, copper-clad plate fringe region thickness is than central area thin thickness 5-20%.
CN 201198200 discloses the backing plate that a kind of copper-clad plate lamination is used, matrix thickness is successively decreased by gradient to periphery from the centre, the amplitude of successively decreasing is 5% to 50% of matrix, described gradient is decremented to line style and successively decreases, described gradient is decremented to notch cuttype and successively decreases, described gradient is decremented to non-notch cuttype and successively decreases, described matrix is square, cuboid or cylinder, described matrix is for using the heat resistant fibre braid to add the felt kind fabric that the heat proof material pressing forms, the use of this backing plate when copper-clad plate lamination, pressure distribution in the time of can changing copper-clad plate lamination, the formation intermediate pressure is large, and certain area pressure is little on the limit, thus the gummosis characteristics when having changed copper-clad plate lamination, the low regional gummosis of edges of boards upward pressure is reduced, improved the thickness qualification rate of product.
But the lamination process that uses CN 201198200 disclosed backing plates to carry out copper-clad plate, because of padded coaming in use through hot pressing function, its resiliency and thickness gradient distribution situation meeting variation, thereby reduce it to improving edges of boards and the inhomogeneity effect of plate interior thickness, need to meet the demands by the exchange buffering material, need additionally to process as requested for padded coaming simultaneously, cause the increase of processing cost; And in the use procedure, under hot pressing function, because the thickness of padded coaming fluctuates easily, cause the additional thickness of backing plate unstable, thickness homogeneity and the surface smoothness of the copper-clad plate that impact is suppressed; Simultaneously, because the varied in thickness of backing plate is graded, cause gummosis serious, reduce it to improving edges of boards and the inhomogeneity effect of plate interior thickness.
Therefore, it is low how to develop a kind of cost, and thickness fluctuation is little, and the structure that can effectively solve the gummosis problem is the problem demanding prompt solution in this area.
The utility model content
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of lamination heating platen that can improve copper-clad plate or multilayer printed circuit board thickness evenness and products thereof thickness qualification rate.
The utility model is achieved by the following technical solution:
A kind of copper-clad plate and multilayer printed circuit board laminating machine heating platen comprise fixed pressuring plate and dynamic pressure plate, and described fixed pressuring plate and dynamic pressure plate form by passive brace table and the flattened configuration that plays the pressing effect that is fixedly connected with it; Described fixed pressuring plate becomes Mirror Symmetry to install with dynamic pressure plate, flattened configuration is relative; The Thickness Ratio fringe region of described flattened configuration central area is thick.The present invention improves the structure of heating platen, but not the padded coaming backing plate to the copper-clad plate lamination process improves among the CN 201198200, has saved the step of exchange buffering material, and can realize continuous processing, greatly reduce production cost, improved production efficiency.And, adopt thermal pressing board structure described in the utility model to improve the production technology of copper-clad plate, need not to consider that the thickness of copper-clad plate that hot pressing function causes the impact of the performances such as padded coaming thickness is uneven, the defective that surface smoothing is inadequate.Certainly, owing to adopt thermal pressing board structure described in the utility model, the fringe region pressure of heating platen obviously reduces, and resin flows out few, and gummosis diminishes, and can reach equally to improve edges of boards and the inhomogeneity effect of plate interior thickness.
Preferably, described flattened configuration is smoothly successively decreased from the central area to fringe region thickness; The 0.05-20% of area thickness centered by the thickness of described fringe region is such as 0.05-18%, 0.05-15%, 0.05-10%, 0.06%, 0.09%, 0.15%, 4.6%, 8.8%, 12%, 17%, 19%, 19.4% etc.The utility model is selected the flattened configuration of smoothly successively decreasing from the central area to the fringe region, can further guarantee the flatness on the copper-clad plate surface of suppressing, and the gummosis amount of control copper-clad plate lamination process.
Preferably, described brace table is in cuboid, semicircular body, cylinder, triangle cone or the quadrangular pyramid body any a kind.The effect of brace table described in the utility model is the flattened configuration for the link gear that connects hot press and heating platen, thereby the move toward one another realizing flattened configuration relative on fixed pressuring plate and the dynamic pressure plate under the drive of hot press link gear realizes the compacting of copper-clad plate.Described brace table is fixedly connected with being connected to of flattened configuration, and is preferably as a whole.Shape the present invention of described brace table is not specifically limited, and those skilled in the art can select according to the connector of laminating machine.
As an optimal technical scheme of above-mentioned heating platen, the outer surface of described flattened configuration is circular arc camber, and the summit of described circular arc camber is the central area of flattened configuration.Described circular arc camber can be a circular arc camber, also can be the multi-section circular arc curved surface, that is:
A kind of copper-clad plate and multilayer printed circuit board laminating machine heating platen comprise fixed pressuring plate and dynamic pressure plate, and described fixed pressuring plate and dynamic pressure plate form by passive brace table and the flattened configuration that plays the pressing effect that is fixedly connected with it; Described fixed pressuring plate becomes Mirror Symmetry to install with dynamic pressure plate, flattened configuration is relative; The outer surface of described flattened configuration is comprised of a circular arc camber, and the summit of described circular arc camber is the central area of flattened configuration.
A kind of copper-clad plate and multilayer printed circuit board laminating machine heating platen comprise fixed pressuring plate and dynamic pressure plate, and described fixed pressuring plate and dynamic pressure plate form by passive brace table and the flattened configuration that plays the pressing effect that is fixedly connected with it; Described fixed pressuring plate becomes Mirror Symmetry to install with dynamic pressure plate, flattened configuration is relative; The outer surface of described flattened configuration is comprised of the multi-section circular arc curved surface, and the subsequent corrosion of described multi-section circular arc curved surface is diminished gradually by middle mind-set edge, and the summit of the circular arc camber of described subsequent corrosion maximum is the central area of flattened configuration.
As another preferred technical scheme of above-mentioned heating platen, the central area outer surface of described flattened configuration is the plane, is smoothly successively decreased to fringe region by the circular arc lead angle in described plane.Preferably, the area of described central area can be the 0-99% of whole heating platen cross-sectional area, certainly, those skilled in the art should understand that of the present invention 0% is approximation, rather than actual value, the area that is to say the central area can be a point, perhaps a plane domain.Preferably, the area of described central area can be the 1-90% of whole heating platen cross-sectional area, such as 5-80%, 10-90%, 20-90%, 1.6%, 5.6%, 15%, 42%, 68%, 81%, 88% etc.
Those skilled in the art should understand; no matter the outer surface of flattened configuration is any shape; as long as can satisfy the flattened configuration of the thick condition of the Thickness Ratio fringe region of central area all drops in protection scope of the present invention; and specifically selecting the outer surface of what shape, those skilled in the art can select according to professional knowledge and the actual conditions oneself grasped.
Gummosis of the present invention refers to that the prepreg resin flow goes out the outer situation of Copper Foil.
Compared with prior art, the utlity model has following beneficial effect:
Copper-clad plate described in the utility model and multilayer printed circuit board laminating machine heating platen can improve copper-clad plate or multilayer printed circuit board thickness evenness.There are certain thickness difference in the zone line of described heating platen and the fringe region of heating platen at thickness, changed copper-clad plate or the multilayer printed circuit board pressure distribution when lamination, thereby changed the gummosis of plate when lamination, the lower regional gummosis of edges of boards pressure is reduced, thereby when having reduced because of lamination, the partially thin defective of edges of boards that copper-clad plate or multilayer printed circuit board corner location resin gummosis cause, obtain copper-clad plate or the multilayer printed circuit board of even thickness, guaranteed copper-clad plate, the thickness qualification rate of the products such as printed wiring board and product impedance, the performance such as high pressure resistant.
In order further to understand feature of the present utility model and technology contents, see also following relevant detailed description of the present utility model and accompanying drawing.Yet accompanying drawing only provides reference and explanation, and the utility model is limited.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the structural representation of the utility model embodiment 2;
Fig. 3 is the structural representation of the utility model embodiment 3;
Fig. 4 is that the structure of heating platen in the prior art is to the schematic diagram of the hot pressing process of prepreg;
Reference numeral: 1001-brace table; The 1002-flattened configuration; The 1003-dynamic pressure plate; The 1004-fixed pressuring plate;
The 2001-brace table; The 2002-flattened configuration; The 2003-dynamic pressure plate; The 2004-fixed pressuring plate;
The 3001-brace table; The 3002-flattened configuration; The 3003-dynamic pressure plate; The 3004-fixed pressuring plate.
The specific embodiment
For ease of understanding the present invention, it is as follows that the utility model is enumerated embodiment.Those skilled in the art should understand that described embodiment helps to understand the utility model, should not be considered as concrete restriction of the present utility model.
Those skilled in the art should understand that although be the explanation of carrying out as example take copper-clad plate lamination machine heating platen in the embodiment of the present invention, described copper-clad plate lamination machine can be used in the lamination process of multilayer printed circuit board equally with heating platen.And for the specific embodiment of multilayer printed circuit board; those skilled in the art easily implementation content according to the present invention infer; repeat no more herein; but identical inventive concept is used in the laminating machine of multilayer printed circuit board with in the heating platen, also drops in protection scope of the present invention.
Embodiment 1
Copper-clad plate lamination machine heating platen as shown in Figure 1, comprise fixed pressuring plate 1004 and dynamic pressure plate 1003, wherein fixed pressuring plate 1004 and dynamic pressure plate 1003 form by brace table 1001 and flattened configuration 1002, and wherein fixed pressuring plate 1004 and dynamic pressure plate 1003 are respectively an integral slab and form by digital control processing; Wherein the outer surface of flattened configuration 1002 is comprised of a circular arc camber; 1003 one-tenth Mirror Symmetries of described fixed pressuring plate 1004 and dynamic pressure plate are installed, and the flattened configuration of fixed pressuring plate 1004 is relative with the flattened configuration of dynamic pressure plate 1003 to be served as a contrast; Described brace table 1001 is cuboid.
Embodiment 2
Copper-clad plate lamination machine heating platen as shown in Figure 2, comprise fixed pressuring plate 2004 and dynamic pressure plate 2003, wherein fixed pressuring plate 2004 and dynamic pressure plate 2003 form by brace table 2001 and flattened configuration 2002, and wherein fixed pressuring plate 2004 and dynamic pressure plate 2003 are respectively an integral slab and form by digital control processing; Wherein the outer surface of flattened configuration 2002 is comprised of the multi-section circular arc curved surface, and the subsequent corrosion of described multi-section circular arc curved surface is diminished gradually by middle mind-set edge; 2003 one-tenth Mirror Symmetries of described fixed pressuring plate 2004 and dynamic pressure plate are installed, and the flattened configuration of fixed pressuring plate 2004 is relative with the flattened configuration of dynamic pressure plate 2003 to be served as a contrast; Described brace table 2001 is cuboid.
Embodiment 3
Copper-clad plate lamination machine heating platen as shown in Figure 3, comprise fixed pressuring plate 3004 and dynamic pressure plate 3003, wherein fixed pressuring plate 3004 and dynamic pressure plate 3003 form by brace table 3001 and flattened configuration 3002, and wherein fixed pressuring plate 3004 and dynamic pressure plate 3003 are respectively an integral slab and form by digital control processing; The central area outer surface of described flattened configuration 3002 is the plane, is smoothly successively decreased to fringe region by the circular arc lead angle in described plane; 3003 one-tenth Mirror Symmetries of described fixed pressuring plate 3004 and dynamic pressure plate are installed, and the flattened configuration of fixed pressuring plate 3004 is relative with the flattened configuration of dynamic pressure plate 3003 to be served as a contrast; Described brace table 3001 is cuboid.
Embodiment 4
A kind of copper-clad plate lamination machine heating platen comprises fixed pressuring plate and dynamic pressure plate, and wherein fixed pressuring plate and dynamic pressure plate form by brace table and flattened configuration; Described brace table is cylinder, and wherein fixed pressuring plate is fixedly connected with flattened configuration by rivet with brace table during dynamic pressure plate divides; The central area outer surface of described flattened configuration is the plane, is smoothly successively decreased to fringe region by the circular arc lead angle in described plane; Described fixed pressuring plate becomes Mirror Symmetry to install with dynamic pressure plate, the flattened configuration of fixed pressuring plate is relative with the flattened configuration of dynamic pressure plate to be served as a contrast.
In the present embodiment, described brace table can be changed to any a kind in semicircular body, triangle cone, quadrangular pyramid body or the cone.
Contrast test
Comparative Examples 1 is lamination process of the prior art, and namely in the lamination process, each several part is all without the variation on the thickness.
Comparative Examples 2 namely in the lamination process, is selected the backing plate of thickness gradient variation for using the lamination process of CN 201198200 disclosed structures.
Fig. 4 is that the structure of heating platen in the prior art is to the schematic diagram of the hot pressing process of prepreg.As seen from Figure 4, prior art is in the hot pressing process of copper-clad plate, and the prepreg resin is easy to flow out outside the effective area of copper-clad plate, so that the edge thickness of copper-clad plate is thinner than the centre position, forms certain thickness gradient.
And if the laminating machine heating platen is designed to structure described in the utility model, heating platen fringe region pressure is less, the gummosis of prepreg resin is also less; And the zone line pressure is larger, and the gummosis of prepreg resin is also larger, thereby has reduced the thickness difference of heating platen fringe region and heating platen zone line, guarantees the thickness evenness on the copper-clad plate effective area.
In lamination process, because the heating platen fringe region is partially thin because of the large thickness of gummosis, zone line position thickness evenness is good.The utility model can be by carrying out design modifying to the laminating machine thermal pressing board structure, as shown in Figure 3, the centre position is flat configuration, and the position thickness of heating platen fringe region smoothly successively decreases from B is curved, along with heating platen the closer to the edge, the thickness of heating platen is thinner, the prepreg resin also reduces at edges of boards zone pressure thereupon, thereby reduced the gummosis of edges of boards, improved the thickness of edges of boards, guaranteed the thickness evenness on the copper-clad plate effective area.
In the copper-clad plate lamination technology, select existing ordinary flat structure, heating platen to select the structure of the thickness-tapered that the utility model provides heating platen, and disclosed backing plate among the lamination use CN 201198200, three kinds of techniques compare, and comparative result is as shown in table 1.
The comparative test result of table 1 the utility model and Comparative Examples
* the numerical value that marks is: the panel edges place is because the width of the part that the prepreg resin thickness that gummosis causes reduces.
Disclosed backing plate is as contrast test in the CN 201198200, and the structure of the disclosed heating platen of the utility model has obvious advantage, shown in comparing result as shown in table 2.
The performance comparison of table 2 the utility model and CN 201198200
Can be found out by table 1 and table 2, copper-clad plate lamination machine disclosed in the utility model can solve the defective of zone line and fringe region uneven thickness in the copper-clad plate lamination process with the structure of heating platen, have simultaneously simple to operately, production efficiency is high, the characteristics that production cost is low.
Applicant's statement, the utility model illustrates detailed construction of the present utility model by above-described embodiment, but the utility model is not limited to above-mentioned detailed construction, does not mean that namely the utility model must rely on above-mentioned detailed construction and could implement.The person of ordinary skill in the field should understand; to any improvement of the present utility model; to the interpolation of the equivalence replacement of each raw material of the utility model product and auxiliary element, the selection of concrete mode etc., all drop within protection domain of the present utility model and the open scope.
Claims (7)
1. a copper-clad plate and multilayer printed circuit board laminating machine heating platen comprise fixed pressuring plate and dynamic pressure plate, it is characterized in that, described fixed pressuring plate and dynamic pressure plate form by passive brace table and the flattened configuration that plays the pressing effect that is fixedly connected with it; Described fixed pressuring plate becomes Mirror Symmetry to install with dynamic pressure plate, flattened configuration is relative; The Thickness Ratio fringe region of described flattened configuration central area is thick.
2. heating platen as claimed in claim 1 is characterized in that, described flattened configuration is smoothly successively decreased from the central area to fringe region thickness; The 0.05-20% of area thickness centered by the thickness of described fringe region.
3. heating platen as claimed in claim 1 is characterized in that, described brace table is any a kind in cuboid, semicircular body, cylinder, Rotary-table, triangle cone or the quadrangular pyramid body.
4. such as the described heating platen of one of claim 1-3, it is characterized in that the outer surface of described flattened configuration is circular arc camber, the summit of described circular arc camber is the central area of flattened configuration.
5. heating platen as claimed in claim 4 is characterized in that, the outer surface of described flattened configuration is comprised of a circular arc camber.
6. heating platen as claimed in claim 4 is characterized in that, the outer surface of described flattened configuration is comprised of the multi-section circular arc curved surface, and the subsequent corrosion of described multi-section circular arc curved surface is diminished gradually by middle mind-set edge.
7. such as the described heating platen of one of claim 1-3, it is characterized in that the central area outer surface of described flattened configuration is the plane, is smoothly successively decreased to fringe region by the circular arc lead angle in described plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220457044 CN202826636U (en) | 2012-09-07 | 2012-09-07 | Hot pressboard for copper-clad plate and multilayer printed circuit board laminating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220457044 CN202826636U (en) | 2012-09-07 | 2012-09-07 | Hot pressboard for copper-clad plate and multilayer printed circuit board laminating machine |
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| Publication Number | Publication Date |
|---|---|
| CN202826636U true CN202826636U (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220457044 Expired - Fee Related CN202826636U (en) | 2012-09-07 | 2012-09-07 | Hot pressboard for copper-clad plate and multilayer printed circuit board laminating machine |
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| CN (1) | CN202826636U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142363A (en) * | 2015-09-07 | 2015-12-09 | 浪潮电子信息产业股份有限公司 | High speed PCB laminating method |
| CN109451683A (en) * | 2018-12-11 | 2019-03-08 | 深圳市景旺电子股份有限公司 | A kind of asymmetric multi-layer board pressing back plate that solves sticks up undesirable method and compression method |
| CN113707400A (en) * | 2020-05-21 | 2021-11-26 | 青岛云路先进材料技术股份有限公司 | Amorphous alloy strip with ultrathin coating and preparation method and equipment thereof |
-
2012
- 2012-09-07 CN CN 201220457044 patent/CN202826636U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142363A (en) * | 2015-09-07 | 2015-12-09 | 浪潮电子信息产业股份有限公司 | High speed PCB laminating method |
| CN109451683A (en) * | 2018-12-11 | 2019-03-08 | 深圳市景旺电子股份有限公司 | A kind of asymmetric multi-layer board pressing back plate that solves sticks up undesirable method and compression method |
| CN109451683B (en) * | 2018-12-11 | 2020-09-04 | 深圳市景旺电子股份有限公司 | Method for solving poor warping of asymmetric multilayer board after lamination and lamination method |
| CN113707400A (en) * | 2020-05-21 | 2021-11-26 | 青岛云路先进材料技术股份有限公司 | Amorphous alloy strip with ultrathin coating and preparation method and equipment thereof |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20200907 |