CN206141042U - Copper -clad plate is blotter for lamination - Google Patents
Copper -clad plate is blotter for lamination Download PDFInfo
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- CN206141042U CN206141042U CN201620877319.7U CN201620877319U CN206141042U CN 206141042 U CN206141042 U CN 206141042U CN 201620877319 U CN201620877319 U CN 201620877319U CN 206141042 U CN206141042 U CN 206141042U
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- cushion pad
- copper
- layer
- clad plate
- clad
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Abstract
The utility model relates to a copper -clad plate is blotter for lamination for copper -clad plate lamination technology, including the outside coating of blotter base member, blotter internal thermal conductance layer and blotter, the utility model discloses use metal forming cladding inorganic non -metallic fibre blotter, fine improvement copper -clad plate lamination technology for the temperature of heating can be very fast transmit the copper -clad plate material by the conduction oil platform, practiced thrift the come uptime of whole process, also practiced thrift the energy consumption simultaneously, make the release that obtains that the high pressure of press can be even, the production of bad phenomenon such as avoided dried flower that copper -clad plate lamination in -process exists, blister, corrugate, make the blotter to use by manifold cycles, practiced thrift use cost.
Description
Technical field
This utility model is related to copper-clad plate manufacturing technology field, especially a kind of copper-clad plate lamination cushion pad.
Background technology
Copper-clad plate is the stock for being PCB, is often base material, and it is supporting material to be soaked with resin, and one or both sides cover
With Copper Foil, referred to as a kind of board-like material of Jing hot pressing, copper-clad laminate.When it is produced for multi-layer sheet, core is also
Plate (CORE).Copper-clad plate is the basic material of electronics industry, and most of electronic products realizes the indispensable master that circuit is interconnected
Want building block, be mainly used in processing and manufacturing printed circuit board (PCB), be widely used in television set, radio, computer, computer,
The electronic products such as mobile communication.Copper-clad plate lamination process needs to be carried out under conditions of High Temperature High Pressure, in order to ensure substrate mass and
The thickness evenness control ability of sheet material is improved, padded coaming is used mostly in lamination process, wherein relatively conventional for cattle
The liner of mulberry paper and organic fiber class.
Copper-clad plate lamination structure is：Bottom is stainless steel platform, and rustless steel platform interior is distributed heat-conducting oil pipes, in rustless steel
One layer of steel plate is laid on platform, cushion pad is placed above steel plate, one layer of steel plate, here is placed above in cushion pad during lamination
Steel plate is placed above the copper-clad plate material for needing lamination.Cushion pad is normally between laminate steel and sheet material, in hot pressing
In, the conduction oil of the stainless steel platform in bottom rises high-temperature, and temperature has stepped through steel plate and is quickly delivered to uppermost covering by bottom
Copper sheet material, at the same time, the pressure of press is delivered to plate surface by means of padded coaming.
The bi-material for using at present has certain heat-resisting quantity and resiliency, but both conventional at present materials are more
For close Plant fiber or organic fibrous material, because the reason for material and structure, having in lamination process a lot
Limitation, including 1:Resiliency is inadequate；2:The uniform quick transmission and pressure that heat cannot be realized uniformly is adjusted；3：In high warm
Under pressure condition, padded coaming is affected mass loss obvious by high temperature；4th, cushion pad is recycled not enough etc., and problem above is not only
The lifting of existing plate property is limited, and when existing in the face of needing same sheet material different piece to have different performance requirement, mesh
The situation that front these conventional padded coamings cannot be used completely.
Utility model content
The technical problems to be solved in the utility model is：Propose a kind of copper-clad plate lamination cushion pad, it is possible to increase buffering
The shock-absorbing capacity of pad, realization is covered the temperature of copper coin diverse location and the Partial controll of pressurized situation, improves copper-clad plate
The uniformity that temperature and pressure is quickly transmitted and is distributed, the repeat usage of cushion pad is high.
The technical scheme that this utility model is adopted for：A kind of copper-clad plate lamination cushion pad, for copper-clad plate lamination work
Skill, including cushion pad matrix, internal cushion heat conduction layer and cushion pad outside clad；Described cushion pad matrix be to
Few one layer inorganic non-metallic fibrous layer；Described internal cushion heat conduction layer is least one layer of metal foil layer；Described
Inorganic non-metallic fibrous layer and metal foil layer alternate placement；Described cushion pad outside clad is also metal foil layer；Institute
The cushion pad outside clad stated is separately positioned on the upper and lower surface of cushion pad matrix；Described cushion pad outside cladding
Layer edge has flanging.
Further, inorganic non-metallic fibrous layer described in the utility model is fiberglass sheet material or ceramic fibre
Sheet material or basalt fibre sheet material；Described inorganic non-metallic fibrous plate with good resistance to elevated temperatures, in high temperature
When cushion pad quality will not lose；The thickness of described inorganic non-metallic fibrous layer is 0.1～6mm；Inorganic non-metallic fibrous layer
Fibre diameter be 0.6～5 μm.Inorganic non-metallic fibrous plate can be used with multiple-layer stacked, and with good resilience
Can, can repeatedly pressurized resilience, can uniformly discharge pressure.
Further say, metal foil layer described in the utility model is aluminium foil either Copper Foil or tinfoil paper.Inorganic non-gold
Category per layer of fibrous plate between place a piece of aluminium foil either the metal forming such as Copper Foil or tinfoil paper so that heat is quickly transmitted.
Further say, the size of cushion pad described in the utility model outside clad more than cushion pad matrix and
The size of internal cushion heat conduction layer；Cushion pad outside covering material can quickly transfer heat to copper-clad plate material
In, cushion pad outside clad is mediated up and down and edge beyond the sized fraction of cushion pad matrix and internal cushion heat conduction layer
Surrounding is repeatedly folded；So that monoblock cushion pad forms an entirety, each folding width is 5～6mm.
The beneficial effects of the utility model are：Using metal forming coated inorganic non-metallic fibers cushion pad, improve well
Copper-clad plate lamination technique so that the temperature of heating can be delivered in copper-clad plate material faster by conduction oil platform, saves
Heating-up time of whole operation, while also saving energy consumption；The high pressure for enabling press is uniformly released, it is to avoid
The generation of the bad phenomenon such as dry flower, foaming, corrugation present in copper-clad plate lamination process；Cushion pad is repeatedly circulated
Use, saved use cost.
Description of the drawings
This utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of one embodiment of the present utility model；
Fig. 2 is the structural representation of another embodiment of the present utility model；
In figure：1st, cushion pad matrix；2nd, internal cushion heat conducting material；3rd, cushion pad outside covering material.
Specific embodiment
This utility model is described in further detail presently in connection with accompanying drawing and preferred embodiment.These accompanying drawings are letter
The schematic diagram of change, only illustrates in a schematic way basic structure of the present utility model, therefore it only shows relevant with this utility model
Composition.
Copper-clad plate lamination technique refer to sticky piece, Copper Foil be heated it is pressurized under conditions of, through resin melting, gummosis, most
Solidify afterwards molding so that the mistake of the referred to as entirety that is firmly bonded together between each sticky piece and between sticky piece and Copper Foil
Journey.The whole process of copper-clad plate lamination is divided into four-stage：Preheating, gummosis, solidification, cooling.And the technique three of lamination process will
Element is：Temperature, pressure, time.
Wherein：
1st, the Main Function of temperature is to provide required for the temperature conditionss required for one curing reaction of resin, and reaction
Heat energy.For temperature, major control be sheet material heating rate, it be control lamination gummosis and ensure plate property most
Main control parameter.The size of heating rate affects the gummosis size of sheet material, therefore the also thickness of impact sheet material, while to plate
Material microbubble etc. also has an impact.
Affecting the factor of the determination of temperature in laminating technology has：1) resin system.During its solidification of different magnitude systems
Best curing temperature is different；2) the different heat transfer coefficient of heat transfer medium, lamination cushion pad is played a part of to be exactly conduction oil
Heat transfer medium between heating plate and copper-clad plate, its heat transfer coefficient also just determines whether heat energy can be quickly by conduction oil
Heating plate is delivered to inside copper-clad plate so that resin sheet can be melted rapidly and uniformly, forms stable gummosis.
Therefore current copper-clad plate lamination cushion pad not can solve this problem, cushion pad of the present utility model
With good heat conductivility, the good conductor of heat energy can either be referred to as, additionally it is possible to so that heat transfer distribution is very uniform so that resin
The dispersion flows of glue allround fastness.
2nd, the Main Function of pressure is that have：1) improve copper-clad plate internal resin glue adhesion, between sticky piece and
Adhesive force between Copper Foil and sticky piece；2) mobilization force of resin is increased so that the thickness of sheet material is more towards uniform；3) plate is prevented
Because thermal stress causes deformation when material is cooled down.
3rd, the control of time：For copper-clad plate lamination technique, mainly seek temperature and pressure and reach within a certain period of time
One optimal collocation, this is accomplished by when pressure is produced, and temperature can be quickly delivered to inside copper-clad plate.
Common quality problems and countermeasure in copper-clad plate lamination technique；
1st, dry flower is also referred to as woven design and appears, and typically has several respects reason to produce：1) bottom panel dry flower is serious, and middle dry flower is more
Light or do not have, reason is that pressing time is unreasonable with the control of heating-up time, now there is also microbubble；2) local dry flower,
Reason is that pressure distribution is uneven, needs the shock-absorbing capacity for increasing lamination cushion pad.
2nd, microbubble, has several according to its form of expression：1) whole plate face is covered with microbubble, and reason is lamination gummosis rank
Section, pressure drop is obvious；2) there is microbubble plate face local, and pressure distribution is uneven when reason is pressurization, is laminated the slow of cushion pad
Punching performance declines；3) corner microbubble, when reason is usually pressurizeed pressure too slow either corner of either heating up less than normal it is under-voltage or
Whole plate face temperature distributing disproportionation is even.
3rd, foaming or wrinkle, main cause：1) time of low pressure warm-up phase is oversize, and heat energy is delivered to by conduction oil plate face
The time that copper-clad plate inside spends is too long；2) when being laminated the gummosis stage, pressure distribution is unstable.Solution：1) control heats up
Time and the collocation of pressing time；2) shock-absorbing capacity of lamination cushion pad and the performance of conduction heat energy are increased.
It is below two specific embodiments of the present utility model：
Embodiment 1
It is as shown in figure 1, copper-clad plate lamination cushion pad including cushion pad matrix 1, internal cushion heat conducting material 2, slow
The outside covering material 3 of punching pad.Wherein cushion pad matrix material adopts fiberglass sheet material, and thickness is 1mm, and glass fiber diameter is
3μm；Internal cushion heat conducting material adopts aluminium foil, and thickness is 0.0065mm；Cushion pad outside covering material adopts aluminium foil, thick
Spend for 0.08mm.6 thickness are adopted for the fiberglass sheet material of 1mm, size is the rectangle of 1150*1302mm, 6 sheet glass are fine
Dimension sheet material is superimposed, and surrounding is flushed；The aluminium foil of a piece of 0.0065mm, aluminium foil chi are placed between every layer of fiberglass sheet material
The very little rectangle for 1150*1302mm, places altogether 5, now forms whole cushion pad matrix material；In whole cushion pad matrix
Upper and lower surface place two aluminium foils, the aluminum foil thickness be 0.08mm, size is 1202*1358mm, by upper and lower aluminium foil edge
Overlap alignment, then starts to fold three times along surrounding, and each fold distance is 6mm, ultimately forms copper-clad plate lamination cushion pad.
Embodiment 2
It is as shown in Fig. 2 copper-clad plate lamination cushion pad including cushion pad matrix 1, internal cushion heat conducting material 2, slow
The outside covering material 3 of punching pad.Wherein cushion pad matrix material adopts ceramic fibre sheet material, and thickness is 2mm, and glass fiber diameter is
4μm；Internal cushion heat conducting material adopts Copper Foil, and thickness is 0.008mm；Cushion pad outside covering material adopts Copper Foil, thick
Spend for 0.06mm.3 thickness are adopted for the ceramic fibre sheet material of 2mm, size is the rectangle of 1050*1202mm, 3 ceramics are fine
Dimension sheet material is superimposed, and surrounding is flushed；The aluminium foil of a piece of 0.008mm, aluminium foil chi are placed between every layer of ceramic fibre sheet material
The very little rectangle for 1050*1202mm, places altogether 2, now forms whole cushion pad matrix material；In whole cushion pad matrix
Upper and lower surface place two Copper Foils, the aluminum foil thickness be 0.06mm, size is 1102*1258mm, by upper and lower copper foil edge
Overlap alignment, then starts to fold three times along surrounding, and each fold distance is 6mm, ultimately forms copper-clad plate lamination cushion pad.
Simply specific embodiment of the present utility model described in description above, various illustrations are not to this practicality
New flesh and blood is construed as limiting, and person of an ordinary skill in the technical field can be to former institute after description has been read
The specific embodiment stated is made an amendment or is deformed, without departing from the spirit and scope of utility model.
Claims (3)
1. a kind of copper-clad plate lamination cushion pad, for copper-clad plate lamination technique, it is characterised in that：Including cushion pad matrix, delay
The internal heat conduction layer of punching pad and cushion pad outside clad；Described cushion pad matrix is that least one layer of inorganic non-metallic is fine
Dimension layer；Described internal cushion heat conduction layer is least one layer of metal foil layer；Described inorganic non-metallic fibrous layer and gold
Category layers of foil alternates placement；Described cushion pad outside clad is also metal foil layer；Described cushion pad outside clad
It is separately positioned on the upper and lower surface of cushion pad matrix；Described cushion pad outside clad edge has flanging；It is described
Cushion pad outside clad size more than cushion pad matrix and internal cushion heat conduction layer size；Outside cushion pad
Clad is mediated up and down and carried out repeatedly along surrounding beyond the sized fraction of cushion pad matrix and internal cushion heat conduction layer
Fold；Each folding width is 5～6mm.
2. a kind of copper-clad plate lamination cushion pad as claimed in claim 1, it is characterised in that：Described inorganic non-metallic fiber
Layer is fiberglass sheet material either ceramic fibre sheet material or basalt fibre sheet material；The thickness of described inorganic non-metallic fibrous layer
Spend for 0.1～6mm；The fibre diameter of inorganic non-metallic fibrous layer is 0.6～5 μm.
3. a kind of copper-clad plate lamination cushion pad as claimed in claim 1, it is characterised in that：Described metal foil layer is aluminium foil
Either Copper Foil or tinfoil paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620877319.7U CN206141042U (en) | 2016-08-12 | 2016-08-12 | Copper -clad plate is blotter for lamination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620877319.7U CN206141042U (en) | 2016-08-12 | 2016-08-12 | Copper -clad plate is blotter for lamination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206141042U true CN206141042U (en) | 2017-05-03 |
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ID=58627166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620877319.7U Expired - Fee Related CN206141042U (en) | 2016-08-12 | 2016-08-12 | Copper -clad plate is blotter for lamination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206141042U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106113805A (en) * | 2016-08-12 | 2016-11-16 | 常州拓达绝热材料有限公司 | Copper-clad plate lamination cushion pad |
-
2016
- 2016-08-12 CN CN201620877319.7U patent/CN206141042U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106113805A (en) * | 2016-08-12 | 2016-11-16 | 常州拓达绝热材料有限公司 | Copper-clad plate lamination cushion pad |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170503 Termination date: 20180812 |
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| CF01 | Termination of patent right due to non-payment of annual fee |