TW200843608A - Metal-plated laminated board, multilayer laminated board and method for manufacturing the same - Google Patents

Abstract

A laminated body (5) is formed by laminating prepreg (2) on the both surfaces of an inner layer circuit board (1), and arranging metal foils (4) on the outer surfaces of the prepreg. In a method for manufacturing a multilayer laminated board, the laminated body is formed by heating and pressurizing the laminated body at a prescribed temperature under a forming pressure (P1), and by cooling the laminated body. The laminated body is held under a forming pressure (P2) of 0.4 or less of the forming pressure (P1) in pressure ratio, for 5 minutes or longer from a point 30 minutes prior to starting cooling, at a temperature at least 5 DEG C lower than a temperature where the prepreg (2) has the minimum melt viscosity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal foil laminate and a multilayer laminate and a method of manufacturing the same. [Prior Art] In the prior art, a printed circuit board is formed of a metal foil laminate or a multilayer laminate. Wherein, the metal foil laminate is a metal foil such as copper foil laminated on one or both sides of the prepreg; the multilayer laminate is disposed on both sides of the inner circuit substrate and pre-impregnated. A metal foil is stacked on the outer side of the body. In order to fabricate a multilayer printed circuit board, a multi-layer laminate is used. In the above-mentioned multilayer laminated board, the prepreg is placed on the inner layer circuit board, and the laminated body formed by arranging the copper foil on the outer layer is sandwiched between the forming flat plates, and then the prepreg is heated and pressurized. The resin is hardened to achieve integration. ,

In the method for producing a multi-layer laminate, the laminate is placed alternately with the molding plate, and the molding plate is placed on the outermost side to form a pressed body, and then the pressed body is pressed. The method of cooling and forming after heating and pressurizing is the most common. The method of forming the above is, for example, a method of pressing a pressed object in a hot plate of a press and heating it while being heated by heat from a hot plate, or a patent document. A method of supplying power to a copper crucible in a state of being pressed and heating while heating by resistance heating. Against aL ^ ^

As described in 2014-9518-PF 5 200843608, by adjusting the forming pressure, the method of dimensional accuracy, and the like. 'In terms of 'the conditions for forming the 兮 夕 夕 夕 夕 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层 层7 ..., Μ 〖I a) C b) No, with the predetermined smear forming pressure (in Figure 7 (b) corresponding to the pressure Rl) heating and pressing: cold, Figure 7 (a) is not painted The temperature profile in the formation of the multi-layer laminate; the vertical axis is the temperature in the formation of the multi-layer laminate; the horizontal axis is the passage of the forming time. Figure 8: Pressure curve in the formation of laminated sheets of households, 曰, 曰, 曰, 曰, 纵, 纵, 多层, wi, wi, forming pressure in the formation of laminated sheets; horizontal axis is forming time Passed by. According to Fig. 7 (a) and (b), the temperature during the formation of the multilayer laminated plate is gradually increased, and is maintained at the highest temperature (1) of the set temperature for a predetermined time, and then the temperature is gradually lowered and cooled. On the other hand, the pressure in the forming of the multi-layer laminated sheet is, for example, temporarily pressed at the initial pressure R2 after the start of forming, and then pressurized at a forming pressure R1 set higher than the initial pressure R2 to carry out two stages. Pressurize. Under these conditions, the thermosetting resin of the prepreg is hardened by the forming pressure R during the molding, and is cooled in its state. Moreover, the symbol so in the figure is the forming start time; 5\ is the cooling start time. The proximity of printed circuit boards has increased the requirements for surface mounting of large components. However, once the surface mounting component is enlarged, since the bending (4) of the printed circuit board affects the increase of A, there is a problem that the bending of the printed circuit board is large and the component cannot be mounted or mounted, and the solder is cracked due to stress. Therefore, it is also required to reduce the bending in the multilayer laminated board. Generally

2014-9518-PF 6 200843608 The occurrence of the bending of the multilayered laminate is caused by a molding method including the following molding conditions, for example, residual stress or unevenness of thermal cycle during heating and pressurization during molding. . Further, in the same manner, in the metal foil laminate in which the inner layer circuit substrate is not used but the metal foil is disposed on the single surface or both surfaces of the prepreg, the bending of the printed circuit board is also a problem to be solved. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Laminated board and method of manufacturing the same. A method for manufacturing a metal foil laminate according to an embodiment of the present invention includes: a first step of heating and pressurizing a laminate formed by pre-positioning a metal case with a predetermined forming temperature and a predetermined second forming pressure In the second step, from the predetermined time after the heating and pressurization in the second step, the second molding pressure is at least 5 minutes or longer and the pressure ratio is 0. 4 or less of the second forming pressure. The laminated body is pressurized, and the temperature of the laminated body is maintained at a temperature lower than a temperature at which the prepreg body becomes the lowest melt viscosity by 5 ° C or more; and the third step is passed over the predetermined time Then, the laminate is cooled and formed. The inventors of the present invention found that, according to this structure, it is possible to obtain

2014-9518-PF 7 200843608 Metal foil laminate with reduced bending, and multi-layer laminate. Therefore, a printed circuit board fabricated using the same can be used to reduce the bending of the printed circuit board. Thereby, it is possible to reduce the problem that the component caused by the bending cannot be mounted or the problem of the solder crack due to the stress after the mounting. [Embodiment] An embodiment of a method for producing a multilayer laminated sheet of a metal foil laminated board of the present invention will be described with reference to Figs. 1 is a cross-sectional view showing a combination of laminated sheets before forming; and FIG. 2 is a schematic view showing a forming temperature and a forming pressure when the multilayer laminated sheets are formed. In this embodiment, the composite junction in the case of a multi-layer laminated board is used as an embodiment. As shown in FIG. 1, the prepreg body 2 is stacked on both sides of the inner layer circuit board i as the inner layer body 3, and A metal case 4 is disposed on the side surface of the inner layer body 3 as a laminated body 5. Circuit for inner layer: plate j is an insulating substrate on which an epoxy resin glass substrate or the like is formed with a circuit

12 circuit board. Further, a circuit H is formed on the surface of the insulating substrate, wherein the circuit 12 is a necessary target mark in the circuit forming step of the subsequent step. under

The prepreg 2 is a material in which a thermosetting resin composition is impregnated into a glass substrate such as a glass woven fabric or a glass non-woven fabric, and is semi-cured. = Thermosetting resin composition, an epoxy resin, a polyamide resin, a fluororesin, an unsaturated polyester resin, a resin, or the like can be used. In the case of the thermosetting resin composition, if necessary, it is possible to harden (iv) a hardening accelerator, various additives, inorganic fillers and the like. In the case of an inorganic filler, 2014-9518-PF 8 200843608 is, for example, alumina, ceria, calcium carbonate, aluminum hydroxide or the like. For example, a solvent such as methyl ethyl ketone (MEK) or dimethylformamide (DMF) is used, and the above materials are mixed by a mixer or a mixer to prepare a resin varnish. Next, the resin varnish was impregnated into the glass substrate and semi-cured to obtain a prepreg. As the metal foil 4, for example, a foil of copper or a copper alloy, nickel or a nickel alloy, aluminum or aluminum alloy can be used. In the present embodiment, the laminated body 5 having the above configuration is sandwiched by the molding flat plate 6 made of stainless steel or the like, and is sandwiched by a molding device (pressure plate 7), and heated and pressurized to laminate the layers. The plate is formed. However, the laminated layer 5 and the forming flat plate 6 may be alternately overlapped to form a plurality of laminated bodies. As shown in FIG. A cushioning material 8 is disposed between the pressure plates 7 to be formed. In the pressurizing plate 7, the heated heat medium _ is circulated, so that the laminated body 5 can be heated by the pressurizing plate 7. Next, the molding conditions of the above laminated body will be described. 2 shows the temperature profile and pressure curve during the forming time and during forming. The temperature curve is indicated by a dotted line; the pressure curve is indicated by a solid line. The temperature curve rises from the forming start time (t0) and is temporarily maintained at the highest temperature (A) of the predetermined forming temperature, and then falls by cooling. The cooling start time is indicated by t 3 . The pressure curve is maintained at a predetermined forming pressure ((1) from the forming start time (t 〇) to the starting time (1) of the forming pressure (P2)), and then maintained at the forming pressure (P2) for at least 5 minutes or more;

2014-9518-PF 9 200843608 The longest can be maintained at the forming pressure (P2) until the end of forming. Further, the forming pressure (pυ is equivalent to the second forming pressure, and the forming pressure (Ρ2) is one example of the second forming pressure. The forming plate may be formed from the forming plate. From the beginning time (ΐΟ) to about 20 minutes, the laminate is formed by a predetermined molding pressure (P1) at an initial stage of, for example, about 0.2 to 8 MPa. By reducing the resin to about 8 MPa, the resin can be reduced. Reduce the effect of the bending problem of the substrate.

The contact pressure is sufficiently contacted to form, and then, the initial pressure is controlled to the effect of the problem of excessive flow of 〇. 2, in this embodiment, the predetermined maximum temperature of the forming temperature (person) is set to be higher than the pre-reverse The shell body becomes the lowest melt viscosity and the temperature is lower than its temperature. Further, the minimum melt viscosity is the viscosity at which the resin of the prepreg is melted to have the lowest viscosity. The temperature at which this minimum melt viscosity is obtained is measured by a differential scanning calorimeter (DSC) at a rate of 2 (TC/min, and measured by the temperature of the prepreg, and the prepreg is changed from a glassy state. The maximum temperature (A) varies depending on the type of the thermosetting resin composition in the prepreg to be used, but, for example, a range of 13 〇 to 200 ° C may be considered. In addition, the predetermined molding pressure (ρι) means the highest pressure applied during heating in order to harden the prepreg neutral thermosetting resin composition in the laminate, for example, 2~ In the manufacturing method of the present embodiment, the pressure ratio (P2/P1) with respect to the molding pressure (p2) and the molding pressure (P1) is 〇·4 or less, and is set to 2014-9518-PF 10 . 200843608 Shape pressure (P2) ° The start time (ti) of the forming pressure (P2) is the time of 30 minutes or more of the cooling start time (t3); at the forming pressure (p2), it is the lowest than the prepreg. The temperature of the melt viscosity is also lower than the temperature of 5 ° C or higher. At least for 5 minutes or more, that is, 'the time from the time (ti) at which the molding pressure (P1) is lowered to the molding pressure (P2), the laminated body 5 is cooled at a time of 3 minutes or more. In the manufacturing method, as described above, the start time (t1) of the molding pressure (P2) φ is a time of 3 minutes or more before the cooling start time (t3), and the specific start time is used because the prepreg is used according to the use. Although the type of the material to be crushed differs, it is not particularly limited. However, the temperature at the start time (t1) may be lower than the temperature at which the pre-impregnated body has the lowest melt viscosity by 5 C or more. When the molding pressure (1 > 2) is set at a temperature lower than the temperature of 5 ° C, the pores are mainly caused by the formation of pores, and an ideal multilayered laminate cannot be obtained. The formation time of the laminate is at the highest temperature ( A) The thermosetting resin composition of # in the lower prepreg is sufficiently hardened, and for example, a range of 120 to 360 minutes (including cooling time) may be considered. The inventors of the present invention found Experimentally, in the manufacturing method of the present embodiment, the repeated force at the predetermined time 30 minutes or more before the cooling start time (t3) is the forming force (10), and the minimum melting rate is at the pressure and at the lower prepreg. The temperature of the viscosity is also lower than 5. The temperature above 〇 is maintained for at least 5 minutes or more, which can effectively reduce the squeak of the multilayered laminate produced. In addition, the inventors found that the predetermined time before the start of cooling is more than 3 minutes. At the moment, if it is impossible to reduce the forming pressure (Ρ2), it cannot be sufficiently slowed down when it is cooled.

2014-9518-PF 11 200843608 and the stress in the thermosetting multilayered laminate, the bending effect cannot be sufficiently obtained. Further, the inventors have found that once the pressure ratio between the forming pressure (p2) and the forming pressure (P1) at this time is higher than 〇·4, the residual stress cannot be eliminated, and the effect of reducing the bending cannot be sufficiently obtained. Although it is preferable that the forming pressure (P2) is low, if A is too low, a gap will be formed between the forming flat plate and the laminated body, and sufficient heat transfer may not occur, resulting in insufficient hardening or surface unevenness. The situation, therefore, can consider the pressure ratio of i as the lower limit 値. Further, the inventors have found that when the holding time of the forming pressure (P2) is less than 5 minutes, the stress cannot be sufficiently relieved, and the effect of reducing the bending cannot be sufficiently obtained. Fig. 3 is a graph showing the temperature profile (dotted line) and the pressure curve (solid line) at the time of the forming time and the forming of the other embodiment. In this embodiment, for example, after the molding pressure (10) is maintained for 5 minutes or more, at a time (t2) before the start of cooling, the forming pressure is set to a pressure ratio of 0 to 5 with respect to the forming pressure (ρ1). Within the range and cooling under the forming pressure. For example, when the molding pressure (i.e., the molding pressure in the range of 0.5 to 1·〇 with respect to the molding pressure (ρι)) is p3, the molding pressure at least during cooling becomes P3. Further, the forming force (P 3 ) corresponds to an example of the third forming pressure. The inventors have found that it is possible to reduce the bending more effectively. In the case where the dusting force ratio of the forming force (10) to the forming pressure (ρι) is less than 〇·5, the difference in thermal cycling caused by the skew caused by the difference in thermal expansion between the materials in the laminated body The effect of bending and getting bigger

2014-9518-PF 12 200843608 The situation is not good. When the pressure ratio of the forming pressure (P3) to the forming pressure (ρι) is more than 1.0, the forming pressure tends to be skewed and the bending tends to occur, which is not preferable. Further, the reason why the forming pressure is controlled at p3 before the start of cooling is that it is preferable to form the pressure at a temperature lower than the temperature at which the pre-impregnated body becomes the lowest melting temperament. . When the molding pressure is changed to P3 after the start of cooling, the change may occur after the temperature has not reached a temperature lower than the temperature at which the prepreg is the lowest melt viscosity. In this case, since the resin is hardened at a temperature that is 5 ° C lower than the temperature at which the prepreg is at the lowest melt viscosity, the change to the molding pressure P3 is not sufficiently reflected. The effect is not the result of the pleasure. That is, the method for manufacturing a metal foil laminated board according to an embodiment of the present invention includes the first step of forming a laminated body formed by disposing a metal case in the prepreg by a predetermined forming temperature and a predetermined forming pressure. Perform heating: pressure; step 2, from the above! In the step, the predetermined pressing time after the heating and pressurization is performed for at least 5 minutes or longer, and the pressure ratio is the second forming pressure ' of the first forming waste force of 〇·4 or less, and the laminated body is added. The temperature of the laminate is maintained at a temperature lower than a temperature at which the prepreg is at a minimum melting temperature of 5 t; and in the third step, after 30 minutes or more from the predetermined time, the laminate is cooled. Forming. According to this configuration, the inventors of the present invention have found that a metal laminated plate which reduces the koji can be obtained, and a multilayer laminated plate can be obtained. Therefore, regarding the printed circuit board produced by using the same, it is possible to reduce the bending of the printed circuit.

20I4-9518-PF 13 200843608 Road board. Thereby, it is possible to reduce the problem that the component caused by the bending cannot be mounted or the problem of the solder crack due to the stress after the mounting. Further, the fourth step further includes controlling the molding pressure of the laminated body to a third forming pressure after the second step and before the cooling of the third step, wherein the pressure of the third forming pressure is Within the range of the first 10%/C force 〇·5~1.0. In the third step, the laminated body is pressurized by the third forming pressure, and the cooling is performed. According to this configuration, after the second molding pressure is maintained for 5 knives or more in the second step, the pressure ratio between the third molding pressure and the first molding pressure is set to 〇·5 to 丨 at the time before the start of cooling. Within the range of the crucible, the forming pressure is maintained to cool the laminate. Once this is done, since the molding pressure is set to the third molding pressure before the start of cooling, before the temperature of the laminate is less than the temperature at which the pre-impregnation body becomes the lowest melt viscosity, the temperature is 5 ° C lower, that is, It is said that since the resin is formed at the third forming pressure before the resin of the prepreg is hardened, a good molding result can be obtained. Further, in the fourth step described above, the second forming pressure was increased to the third forming pressure at a speed of MPa·5 MPa/min. The inventors of the present invention found that in the fourth step, the second molding pressure was raised to the third molding pressure at a speed of MPa 5 MPa/min, and a good molding result was obtained. Further, the predetermined timing may be a timing at which the temperature of the layered body heated in the second step reaches the temperature at which the minimum melt viscosity is reached. &

According to this configuration, when the prepreg is at the lowest melt viscosity, since the molding pressure is lowered from the first forming pressure to the second forming pressure, the stress in the laminated body can be most effectively alleviated. Reduce the bending of the metal foil laminate. Further, in the second step, the temperature of the laminate may be maintained at a temperature equal to or higher than the temperature at which the prepreg is the lowest melt viscosity. The inventors of the present invention have found that in the second step, a good molding result can be obtained by keeping the temperature of the laminate at a temperature at which the prepreg becomes the lowest melt viscosity. Further, the pressure ratio of the second forming pressure to the first forming pressure may be 0.1 or more. In the case of stress relaxation, the lower the second forming pressure, the easier it is to alleviate the stress in the laminated body. However, if the pressure is too low, the following problems may occur. For example, a gap is formed between the forming flat plate for heating and pressurization and the laminated body, so that insufficient heat transfer is caused, resulting in insufficient hardening or 'there is unevenness on the surface of the laminated body. Therefore, if the pressure ratio of the first Φ 2 forming pressure to the first forming pressure is set to 0.1 or more, the problem of insufficient hardening due to insufficient heat transfer or the unevenness of the surface of the laminated body can be reduced. In addition, a fifth step may be included before the first step, and the laminated body is pressurized at an initial pressure of 0·2 〜 (8 8 kPa. According to this configuration, the initial pressure is controlled to 〇. 2 to 0·8 MPa. 'It is possible to reduce the effect of excessive resin flow or to reduce the bending of the metal foil laminate. In addition, in the first and second steps, the temperature rise rate is

2014-9518-PF 15 .200843608 4C / min way to heat. The inventors of the present invention found that in the first and second steps, the θ degree increase rate was four minutes, and a good result was obtained. Further, in the second step, the speed from the ith forming pressure to the second forming pressure is preferably 〇 5 Mp a/min. The inventors of the present invention found that in the second step, by controlling the speed from the first molding pressure to the second molding pressure to Q 5 Mpa/min, a good molding result can be obtained. Further, preferably, the predetermined forming temperature is 13 〇 2 〇〇 1 . The inventors of the present invention found that in the i-th step, the above-mentioned forming temperature is controlled to 13 〇 2 (4). c, good forming results can be obtained. Further, it is preferable that the "first! molding pressure is 2 to 3 MPa. The inventors of the present invention have found that a good molding result can be obtained by controlling the first molding pressure at 23 MPa'. It is a plate-shaped member having an epoxy resin and having a thickness of 〇·1 mm, wherein the amount of the resin is 52% by weight. The inventors of the present invention have found that the above-mentioned prepreg is made into a glass = A plate-shaped member having an epoxy resin and having a thickness of 52% by weight in the resin can obtain a good molding result. Further, preferably, the time from the start of the above i-th step to the end of the third step is performed. The control is in the range of 12 〇 to 36. The inventors of the present invention found that good control can be obtained by controlling the day-to-day control from the start of the first step to the third step at 120 to 360 minutes.

2014-9518-PF 16 200843608 Results. In addition, the immersion body has a minimum melt viscosity of 125 ° C. The inventors of the 'X-months found that good results were obtained by using a prepreg having a minimum melt viscosity of 125 °C. Further, the above-mentioned laminated system can be laminated on both surfaces of the inner layer circuit board by the above-mentioned prepreg, and a metal foil is disposed on the outer side surface thereof to be laminated. According to this configuration, a multilayered laminate (a type of metal slab) can be produced. Further, a metal foil laminated board according to an embodiment of the present invention is produced by the above-described method for manufacturing a metal box laminate. The above metal f| laminate can reduce bending. Further, a multilayer laminated board according to an embodiment of the present invention is obtained by the above-described method for producing a metal foil laminated board. The above multi-layer laminate can reduce bending. In the following, although several embodiments of the invention are presented, it is not intended to limit the invention. Further, with respect to the metal case laminate having no inner layer circuit substrate shown in Fig. 4, the bending of the metal foil laminate according to the present invention can be reduced. ® 4 is a cross-sectional view showing the combination of the two sides of the metal-layered sheet before forming. The difference between the metal delamination layer shown in W 4 and the multi-layer laminate in the figure is that the metal box laminate shown by @4 replaces the inner layer body 3 with the prepreg body 2a. Because other points are the same as those in Fig. 1. Show more

2014-9518-PF 17 .200843608 The laminates are the same, so the description is omitted. The prepreg 2a is composed of a plurality of resin cloths 9 stacked. The number of layers of the resin cloth 9 is appropriately set in accordance with the required substrate thickness. The resin cloth 9 has the same structure as the prepreg 2 shown in Fig. 1, for example, and a material having a smaller amount of resin than the prepreg 2 can be used. [Examples] <Examples 1 to 9 and Comparative Examples 1 to 4 &gt; A multilayered layer composed of the layered body 5 shown in Fig. 1 was produced by a molding method using heat from a hot plate (pressing plate 7) board. In the inner layer circuit board 1, a copper foil (thickness: 35 pm) on the surface of an etched copper foil laminate (R176 6 manufactured by Matsushita Electric Works Co., Ltd.) is used, and a circuit substrate is formed on both surfaces, wherein the thickness of the substrate is 〇· Lmm. In the prepreg 2, a prepreg (made of Matsushita Electric Co., Ltd.: R1661) in which the glass fabric contains an epoxy resin is used, wherein the thickness of the prepreg is 〇丨 ,, and the resin contained therein The amount was 52% by weight. The prepreg 2 is placed on both sides of the circuit board on which the inner layer is placed, and the steel having a thickness of 18 mm (metal case 4) is placed on the outer surface thereof to form the laminated body 5. The temperature at which the prepreg 2 became the lowest melt viscosity was 125 °C. Further, the laminated body 5 is sandwiched between the forming flat plates 6 of the stainless steel sheets having a thickness of 1 mm and sandwiched between the forming devices (for example, the pressing plates 7). Further, the above-mentioned laminated body 5 is configured to obtain a multilayer laminated plate having a size of 5QGx5G() mm.

10 multi-layer laminates were prepared according to the above method, and by the standing method shown in Fig. 5 (the multi-layer laminate was carried on a smooth plate, the end of the plate and the multi-layer product 2014-9518-PF 18 200843608 was measured. The maximum bending (height) of the portion was measured to determine the bending of the multilayer laminate. The measurement of the bending is performed after the forming and after the aging. The aging was carried out after fully etching the outer steel foil (metal town 4) at 150 t: for 3 minutes. The temperature, pressure, time, and the like of the forming process are 根据 y according to the conditions shown in Table i, and the temperature profile and pressure curve during the forming time and the forming are as shown in Fig. 6. The dotted line in Fig. 6 indicates the set temperature, the solid line indicates the η and 疋 pressure, and the dotted line indicates the temperature of the laminated body 5. % As shown in Fig. 6, the temperature during heating is heated to 18 °C at a temperature rise rate of 4 t/min, and is maintained at a maximum temperature of 18 Torr. Hey. The pressure during heating was controlled at 〇·5Μ pa for the first 10 minutes, and then increased to a forming pressure (pi) of 2.5 MPa at a pressure increase rate of 〇·5 MPa/s. Thereafter, the pressure was reduced to the forming pressure (p2) at a pressure reduction rate of 0.5 MPa/min, and maintained for Μ minute. Thereafter, in the case of boosting, the pressure is increased by 〇·5Μρ at a step-up speed to the forming pressure (Ρ3)' until the cooling end is maintained at the forming pressure (ρ3). The temperature in the cold section is cooled from 18 ° C to 50 ° C at a temperature drop rate of 5 ° C / min. The temperature shown in Figure 6 is 125 ° C. This temperature is prepreg. 2 Become the temperature of the low/valley. Further, the temperature of the laminated body 5 becomes τ C 寸 ' from the forming pressure (ρι) to the forming pressure (p2). More specifically, when the temperature of the laminated body 5 becomes T°c, the forming pressure (P1) is started to be lowered to the forming pressure (P2). Further, the time from the start of the pressure reduction of the forming pressure (ρι) to the forming pressure (p2) until the start of the cold laminated body 5 is indicated by the time before cooling.

2014-9518-PF 19 200843608 The pressure in the middle: and the comparison is formed by the conventional method shown in Fig. 7 and the shape of Fig. 6 (the joint is formed at 〇5 MPa at the same time) The result of the measurement of the bending of the laminate layer from the forming pressure (10) to the forming dust force (10) in each of the respective examples and the comparative example in the disk Μ纴H^ Table] and Table 2 are shown. 【Table 1】

Table 2] Example 6 Example 7 Example 8 Example 9 Time before cooling 分 (minutes) P2 (MPa) P3 (MPa) Maximum bending amount After forming 5 1.0 1.4 3 5 ------ 90 1.0 1.4 1 4 一————— 5 1.0 1.4 3.5 6 _____ ^120 '' ^— 90 1.0 1.4 0.5 2

2014-9518-PF 20 •200843608 It can be confirmed from the results of Table 2 in Table 1 that by the time from the start of cooling 3 minutes or more, the time of # 5 minutes or more is at the following condition y: maintaining the forming pressure (P2) The temperature is lower than the temperature at which the pre-impregnated body 2 is at the lowest melt viscosity by 5 ° C or higher (Examples ～ 9), and the multilayer after molding and after aging can be further reduced beyond the comparative example. The bending of the laminate. Here, the pressure ratio between the forming pressure (P2) and the forming pressure (P1) is 0 or less. φ In particular, in Examples 2 and 3, it was confirmed that the bending can be further reduced by controlling the forming pressure to the forming pressure (p3) before the start of cooling and cooling at the forming pressure (P3), wherein the forming pressure The pressure ratio of (P3) to the forming pressure (P1) is in the range of 〇·5~〗·〇. On the other hand, in Comparative Examples 1 to 4, it was confirmed that the following conditions were not satisfied for 5 minutes or more from the time when the uranium was cooled for 30 minutes or more: kept at the molding pressure (P2), and remained at The temperature at which the pre-impregnated body 2 becomes the lowest melting degree is lower than the temperature of 5 or more. Therefore, _ cannot be sufficiently reduced as in Examples 1 to 9 to bend the multilayered laminate after aging. Here, the pressure ratio of the forming pressure (P2) to the forming pressure (P1) is 〇 · 4 or less. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] is a cross-sectional view showing a combination of multi-layer laminates before forming. Fig. 2 is a schematic view showing an embodiment of the molding conditions of the present invention, showing a temperature profile and a pressure curve at the time of forming time and molding. Fig. 3 is a view showing another embodiment of the molding conditions of the present invention, which is a schematic diagram showing the temperature curve of the passage of time and the time of forming and the 久久堡力 curve of 2014-9518-PF 21 200843608. Fig. 4 is a cross-sectional view showing a combination of two-sided metal/white laminate sheets before forming. Fig. 5 is a view for explaining a method of measuring the bending of a multilayered laminate in the examples. Fig. 6 is a schematic view showing the temperature profile and the pressure curve at the time of the forming time and the forming of the embodiment.

_ [Fig. 7] The rim shows the passage of time and temperature, pressure; (a) B temperature curve; (b) is a schematic diagram of the pressure curve. [Description of main component symbols] 1~ inner layer circuit board; 2~pre-impregnation body; 3~ inner layer body; 4~metal foil; • 5~ laminated body; 6~ forming plate; 7~pressing plate; Insulating substrate; 12~ circuit. 2014-9518-PF 22

Claims (1)

200843608 X. Patent Application Range: 1. A method for manufacturing a metal foil laminated board, comprising: a first step of laminating a metal foil in a prepreg by a predetermined forming temperature and a predetermined first forming pressure The second step is to perform the second step of the first forming pressure from the predetermined time after the heating and pressurization in the first step, and the pressure ratio is the second or lower of the first forming pressure. Forming pressure, pressurizing the laminate, and maintaining the temperature of the laminate at a temperature lower than a temperature at which the prepreg is at a minimum melt viscosity by 5 ° C or higher; and a third step, from the above predetermined After 30 minutes or more has elapsed from time, the laminated body is cooled and formed. The method for producing a metal foil laminated board according to the first aspect of the invention, further comprising: the fourth step of forming the laminated body after the second step and before the cooling of the third step is started The pressure is controlled to a third forming pressure, wherein the pressure of the third forming pressure is in the range of 第·5 to 1.0 of the first forming pressure; and in the third step, the third forming pressure is The laminate is pressurized and cooled as described above. 3. The method for producing a metal foil laminated board according to the second aspect of the invention, wherein in the fourth step, the speed from the second forming pressure to the third forming pressure is 〇·5 MPa/ Minute. The metal foil according to any one of claims 1 to 3, wherein the predetermined time is the above-mentioned first! The temperature of the layered body heated in the step reaches a point at which the temperature of the lowest melting degree is reached. The method for producing a metal rafter according to any one of claims 1 to 3, wherein, in the second step, maintaining the temperature of the laminate in the prepreg is the lowest The temperature of the melt viscosity is above. The method of manufacturing the metal foil laminate according to any one of the first aspect of the invention, wherein the pressure ratio of the second forming pressure is 0.1 or more of the first forming pressure. 7. The method for producing a metal foil laminate according to any one of claims 1 to 3, further comprising: the fifth step, before the first step, starting from 〇2 to 〇. (10) Pressure, pressurizing the above laminated body. The method for producing a metal foil φ laminate according to any one of claims 1 to 3, wherein in the first and second steps, the temperature increase rate is 4 ° C /min. The way to heat. The method for producing a metal foil laminate according to any one of the first to third aspect, wherein, in the second step, the first molding pressure is lowered to the second molding pressure The speed is 0 5 MPa / min. The method for producing a metal-clad laminate according to any one of claims 1 to 3, wherein the predetermined molding temperature is 13 〇 to 2 〇〇〇C. The metal according to any one of claims 1 to 3, wherein the ith forming pressure is 2 to 3 MPa. The method for producing a metal name laminate according to any one of claims 1 to 3, wherein the pre-impregnation system has an epoxy resin and a thickness of 0 · 1 mm. A plate-shaped member in which the amount of the resin was 52% by weight. The method for producing a metal laminate according to any one of the first to third aspects, wherein the time from the first step to the end of the third step is 120 to 360 minutes. The method for producing a metal foil laminate according to any one of claims 1 to 3, wherein the prepreg has a temperature at which the minimum melt viscosity is 125 °C. The method for manufacturing a metal vl laminate according to any one of claims 3 to 3, wherein the laminate system is laminated on both sides of the inner layer of the inner circuit substrate by the prepreg; A metal case is placed on the outer side surface to perform multi-layer stacking. The metal pig laminate is produced by the method for producing a metal foil laminate according to any one of claims 1 to 3. A multi-layer laminate is produced by a method for producing a metal delamination layer as described in claim 15. 2014-9518-PF 25