CN104080281B - Laminating method of printed circuit board - Google Patents
Laminating method of printed circuit board Download PDFInfo
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- CN104080281B CN104080281B CN201410317480.4A CN201410317480A CN104080281B CN 104080281 B CN104080281 B CN 104080281B CN 201410317480 A CN201410317480 A CN 201410317480A CN 104080281 B CN104080281 B CN 104080281B
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Abstract
The invention discloses a laminating method of a printed circuit board. The method includes the steps that vacuumization is performed till preset vacuum degree of a laminating machine is achieved at preset temperature, laminating plates of the printed circuit board are pressed, the preset temperature is room temperature, the preset vacuum degree ranges from 1.3 Pa to 2 Pa, the preset vacuum degree is kept in the whole laminating process, the temperature is raised to the temperature 10 DEG C to 20 DEG C lower than the temperature corresponding to the smallest viscosity value of a prepreg, the laminating pressure intensity of the laminating machine is increased to 2*10<6> Pa to 3.5*10<6> Pa and kept for 60 min, the temperature is raised to the temperature corresponding to the smallest viscosity value of the prepreg, the laminating pressure intensity of the laminating machine is decreased to 0.1*10<6> Pa to 1*10<6> Pa and kept for 30 min, the temperature is raised to the temperature 10 DEG C higher than the temperature corresponding to a curing value of the prepreg, the constant temperature is kept for 60 min, and the temperature is lowered to room temperature. The printed circuit board made with the laminating method of the printed circuit board is simple in technology, no extra equipment or material is added, and the glue overflow amount can be effectively reduced.
Description
Technical field
The present invention relates to printed-board technology field is and in particular to a kind of compression method of printed circuit board (PCB).
Background technology
With the miniaturization of electronic product, various electronic devices and components also all develop towards miniaturization, miniaturization direction, carry
The printed circuit board (PCB) (printed circuit board, abbreviation pcb) of various electronic devices and components presents densification development
Trend.
The raw material of printed circuit board (PCB) generally comprise internal layer circuit and the semi-solid preparation setting gradually positioned at internal layer circuit both sides
Piece and Copper Foil, described prepreg is typically by treated reinforcing material, after resin adhesive liquid on dipping more thermally treated
The sheeting that (preliminary drying) makes resin enter b-stage and make is referred to as prepreg.
Fig. 1 is the curve synoptic diagram of the viscosity with temperature change of conventional prepreg, as shown in figure 1, prepreg is in room
It is solid-state under temperature, the rising with temperature first softens, and its viscosity is gradually lowered, generally in the minimum corresponding temperature of viscosity number
Under, the viscosity of resin can as little as tens of thousands of pascal seconds, now prepreg be easiest to excessive glue, the pressure of usual printed circuit board (PCB)
Conjunction is to make prepreg and upper and lower Copper Foil reach best wellability at this temperature.With the rising further of temperature, half
Curing agent in cured sheets is gradually had an effect, and resin starts to solidify, and resin viscosity is gradually increasing, and eventually becomes solid state.
Fig. 2 is the schematic diagram of printed circuit board (PCB) compression method in prior art, as shown in Fig. 2 by printed circuit under normal temperature
The lamination of plate is put in hot press, is evacuated to 2pa, is warming up to the corresponding temperature value of MV minium viscosity of prepreg, and such as 110
DEG C, the laminating machine pressing pressure simultaneously applying is 0.5 × 106Pa, constant temperature 45min, the main purpose of this process is in low temperature
Lower gas in lamination is all excluded by vacuum and pressure, be warming up to the corresponding temperature of curing values of prepreg, for example
220 DEG C, laminating machine pressing pressure is increased to 3 × 106Pa, constant temperature time is more than 60min, is cooled to room temperature afterwards, from partly
During the corresponding temperature of curing values of cured sheets is reduced to room temperature, described laminating machine pressing pressure keeps 3 × 106Pa is not
Become, last ejecting plate, complete the pressing of printed circuit board (PCB).
The compression method of existing printed circuit board (PCB) is due to carrying out at the corresponding temperature of MV minium viscosity value of prepreg
Pressing, thus substantial amounts of resin can be overflowed at the edge of the printed circuit board (PCB) after pressing, is that following process is made troubles.
Content of the invention
In view of this, the embodiment of the present invention provides a kind of compression method of printed circuit board (PCB), to solve printed circuit board (PCB) pressure
The big problem of glue overflow amount during conjunction.
Embodiments provide a kind of compression method of printed circuit board (PCB), methods described includes:
A1, it is evacuated to the predetermined vacuum degree of laminating machine at default temperature, in default temperature and predetermined vacuum degree
Under lower, the lamination of printed circuit board (PCB) is pressed, described lamination at least includes internal layer circuit and is set in turn in internal layer circuit two
The prepreg of side and Copper Foil, wherein, described default temperature is room temperature, and described predetermined vacuum degree is 1.3pa～2pa, and institute
State predetermined vacuum degree and keep whole bonding processes；
A2, when laminating machine reaches predetermined vacuum and spends, by temperature be warming up to described prepreg MV minium viscosity value correspond to
Temperature below 10 DEG C～20 DEG C, by laminating machine pressing pressure boost to 2 × 106Pa～3.5 × 106Pa, maintains 60min；
A3, temperature is warming up to the corresponding temperature of MV minium viscosity value of described prepreg, by laminating machine pressing pressure fall
It is depressed into 0.1 × 106Pa～1 × 106Pa, maintains 30min；
A4, temperature is warming up to 10 DEG C of more than the corresponding temperature of curing values of described prepreg, holds time and be more than
60min；
A5, temperature is down to room temperature for 10 DEG C more than the corresponding temperature of curing values of prepreg, maintains to ejecting plate, and complete
Become pressing.
Further, temperature is warming up to 10 DEG C of more than the corresponding temperature of curing values of described prepreg, holds time
Include first time period and second time period more than 60min,
In first time period, described laminating machine pressing pressure is maintained at 0.1 × 106Pa～1 × 106pa；
In second time period, laminating machine pressing pressure is boosted to 2 × 106Pa～3.5 × 106Pa, wherein, described
Two time periods be described in the last 10min that holds time hold time.
Further, when temperature being warming up to 10 DEG C of more than the corresponding temperature of curing values of described prepreg, during maintenance
Between more than 60min when,
In section of holding time, described laminating machine pressing pressure is maintained at 0.1 × 106Pa～1 × 106pa.
Further, described each step a1, a2, the temperature held time in section in a3, a4 and a5, laminating machine pressing pressure
Strong and predetermined vacuum degree is constant respectively.
Further, the temperature range of described room temperature is 10 DEG C～30 DEG C.
Further, the corresponding temperature range of MV minium viscosity value of described prepreg is 100 DEG C～130 DEG C.
Further, the corresponding temperature range of the curing values of described prepreg is 190 DEG C～220 DEG C.
The compression method of printed circuit board (PCB) provided in an embodiment of the present invention, by by printed circuit board (PCB), lamination is put at normal temperatures
Enter press, and laminating machine is evacuated to the predetermined vacuum of equipment, described predetermined vacuum degree scope is 1.3pa～2pa, this is preset
Vacuum maintains whole bonding processes, when laminating machine reaches predetermined vacuum and spends, is warming up to the MV minium viscosity value pair of prepreg
10 DEG C～20 DEG C below the temperature answered, and apply a higher laminating machine pressing pressure 2 × 106Pa～3.5 × 106Pa, maintains
60min, when the corresponding temperature of MV minium viscosity value that temperature raises, laminating machine pressing pressure is depressurized to 0.1 × 106Pa～1
×106Pa, maintains 30min, temperature is warming up to 10 DEG C of more than the corresponding temperature of curing values of prepreg, holds time and be more than
After 60min, cool the temperature to room temperature, maintain to ejecting plate and complete bonding processes.Made by the compression method of this printed circuit board (PCB)
Printed circuit board (PCB), process is simple, do not increase extras and material, and can effectively reduce glue overflow amount.
Brief description
The exemplary embodiment of the present invention will be described in detail by referring to accompanying drawing below, make those of ordinary skill in the art
Become apparent from the above-mentioned and other feature and advantage of the present invention, in accompanying drawing:
Fig. 1 is the curve synoptic diagram of the viscosity with temperature change of conventional prepreg；
Fig. 2 is the schematic diagram of printed circuit board (PCB) compression method in prior art；
Fig. 3 is the pressure of printed circuit board (PCB) provided in an embodiment of the present invention and the flow chart of method；
Fig. 4 is the corresponding temperature of compression method of printed circuit board (PCB) provided in an embodiment of the present invention, laminating machine pressing pressure
Curve synoptic diagram with the time；
The corresponding temperature of compression method of the printed circuit board (PCB) for the preferred embodiment offer of the embodiment of the present invention for the Fig. 5, layer
Press pressing pressure and the curve synoptic diagram of time.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just
Part related to the present invention rather than full content is illustrate only in description, accompanying drawing.
Fig. 3 is a kind of flow chart of printed circuit board (PCB) compression method provided in an embodiment of the present invention, as shown in figure 3, the party
Method includes:
Step 11, it is evacuated to the predetermined vacuum degree of laminating machine at default temperature, in default temperature and default true
Under reciprocal of duty cycle, the lamination of printed circuit board (PCB) is pressed, described lamination at least includes internal layer circuit and is set in turn in internal layer circuit
The prepreg of both sides and Copper Foil, wherein, described default temperature is room temperature, and described predetermined vacuum degree is 1.3pa～2pa, and
Described predetermined vacuum degree keeps whole bonding processes.
The structure of the lamination of described printed circuit board (PCB) can be the first Copper Foil, the first prepreg, from top to bottom successively
Through completing internal layer circuit, the second prepreg and second Copper Foil of graphic making, described first prepreg and the second semi-solid preparation
Piece is typically made up of high molecular synthetic resin and reinforcing material, and described high molecular synthetic resin includes but is not limited to: phenolic aldehyde tree
Fat, epoxy resin and polytetrafluoroethylene (PTFE) etc., described reinforcing material includes but is not limited to: glass-fiber-fabric, paper substrate and composite etc.
Several types, are carried out under the predetermined vacuum degree of default temperature and laminating machine by the first prepreg and the second prepreg
It is ensured that the gas in lamination is all excluded, wherein, described default temperature is room temperature, and described predetermined vacuum degree is for pressing
1.3pa～2pa.
Fig. 4 is the corresponding temperature of compression method of printed circuit board (PCB) provided in an embodiment of the present invention, laminating machine pressing pressure
With the curve synoptic diagram of time, as shown in figure 4, horizontal axis representing time (unit: h), the vertical pivot on the left side represent temperature (unit:
DEG C), the vertical pivot on the right represents the pressing pressure of laminating machine (unit: pa), and wherein, dotted line represents printed circuit board (PCB) in the present embodiment
The corresponding temperature curve schematic diagram of each step of compression method, solid line represents that the compression method of printed circuit board (PCB) in the present embodiment is each
The corresponding laminating machine of step presses pressure curve schematic diagram.
Referring to Fig. 4, a point is identical with the corresponding temperature of b point, is room temperature, and the temperature range of described room temperature is preferably 10 DEG C
～30 DEG C.A point to b point time be the predetermined vacuum degree being evacuated to and setting laminating machine time, that is, when laminating machine reach default
During vacuum, room temperature is held time end, and this time is the time of maintenance above-mentioned in this step, corresponds to this period
The warm-up phase of bonding processes, in this period, the pressing pressure of laminating machine is not pressurized or adds the minimal pressure of a laminating machine
Combined pressure is strong, such as 0.5pa.At room temperature, lamination is put in hot press, be evacuated to the predetermined vacuum of hot press, this is preset
Vacuum range is preferably 1.3pa～2pa, and the predetermined vacuum degree that specifically can provide to be determined it is therefore an objective to by lamination by hot press
In gas all discharge.During this period of time, temperature and predetermined vacuum degree are constant respectively, and that is, temperature is maintained at described temperature model
Enclose an interior fixed value, the predetermined vacuum degree of laminating machine is maintained at a fixation in the range of described predetermined vacuum degree simultaneously
Value.
Step 12, when laminating machine to spend to predetermined vacuum when, temperature is warming up to the MV minium viscosity value of described prepreg
10 DEG C～20 DEG C below corresponding temperature, laminating machine pressing pressure is boosted to 2 × 106Pa～3.5 × 106Pa, maintains 60min.
As shown in figure 4, from b point to d point, with this step by temperature be warming up to prepreg MV minium viscosity value corresponding
Temperature below 10 DEG C～20 DEG C, by laminating machine pressing pressure boost to 2 × 106Pa～3.5 × 106Pa is corresponding.
It should be noted that c point is identical with the temperature of d point, corresponding temperature range is the minimum viscous of described prepreg
10 DEG C～20 DEG C below the corresponding temperature of angle value, when the vacuum of laminating machine reaches predetermined vacuum and spends, by temperature from room temperature liter
Temperature is to the corresponding temperature of MV minium viscosity value of prepreg 10 DEG C～20 DEG C.The MV minium viscosity value of described prepreg corresponds to
Temperature range be preferably 100 DEG C～130 DEG C, for example: the corresponding temperature of MV minium viscosity value of prepreg be 110 DEG C, then c point
It is 90 DEG C～100 DEG C with the temperature range corresponding to d point.Additionally, c point is held time as 60min, in this period to d point
Interior, (described laminating machine pressing pressure is 2 × 10 to keep higher laminating machine pressing pressure6Pa～3.5 × 106Pa), so can
Make lamination at elevated pressures, be in more low viscous first prepreg and the second prepreg respectively to the first Copper Foil and
Two Copper Foils have preferable wellability, and the first prepreg and the second prepreg are also not reaching to MV minium viscosity simultaneously, and therefore
One prepreg and the second prepreg have relatively low mobility.Hold time in section at this, temperature and laminating machine pressing are pressed
Strong and laminating machine predetermined vacuum degree keeps constant.
Step 13, temperature is warming up to the corresponding temperature of MV minium viscosity value of described prepreg, laminating machine is pressed pressure
It is depressurized to by force 0.1 × 106Pa～1 × 106Pa, maintains 30min.
As shown in figure 4, from d point to f point, with this step by temperature be warming up to prepreg MV minium viscosity value corresponding
Temperature, by laminating machine pressing pressure be depressurized to 0.1 × 106Pa～1 × 106Pa is corresponding.
It should be noted that e point is identical with the temperature of f point, corresponding temperature is that the MV minium viscosity value of prepreg corresponds to
Temperature, the corresponding temperature of MV minium viscosity value of such as prepreg is 110 DEG C, then e point and the temperature corresponding to f point are 110
DEG C, it is 30min from e point to f point duration, during this period of time, the laminating machine pressing pressure keeping relatively low is (described relatively low
Laminating machine pressing pressure is 0.1 × 106Pa～1 × 106Pa), so enable in the first prepreg and the second prepreg
When being in low viscosity state, apply a less pressure so that the first prepreg and the second prepreg are in best stream
The first Copper Foil and the second Copper Foil and internal layer circuit is infiltrated further under dynamic state.Hold time in section at this, temperature and lamination
Machine presses pressure and the predetermined vacuum degree of laminating machine keeps constant.
Step 14, temperature is warming up to 10 DEG C of more than the corresponding temperature of curing values of described prepreg, holds time big
In 60min.
As shown in figure 4, from f point to h point, with the corresponding temperature of curing values that in this step, temperature is warming up to prepreg
Degree more than 10 DEG C corresponding.
It should be noted that g point is identical with the temperature of h point, corresponding temperature range is that the curing values of prepreg correspond to
Temperature more than 10 DEG C, the corresponding temperature range of curing values of described prepreg is preferably 190 DEG C～220 DEG C, and for example, half is solid
The corresponding temperature of curing values changing piece is 200 DEG C, then temperature is warming up to 210 DEG C, is big from g point to h point constant temperature duration
In 60min, described holding time includes first time period and second time period more than 60min, in first time period, keeps relatively
(described first laminating machine pressing pressure is maintained at 0.1 × 10 to the first low laminating machine pressing pressure6Pa～1 × 106Pa), for example
0.5×106Pa, in first time period, the predetermined vacuum degree of described temperature and the first laminating machine pressing pressure and laminating machine
Keep constant, in second time period, (described second laminating machine presses pressure to keep the second higher laminating machine pressing pressure
2×106Pa～3.5 × 106Pa), for example, during cooling the temperature to room temperature, described laminating machine pressing pressure keeps 3 ×
106Pa, wherein, described second time period be described in hold time and hold time more than the last 10min of 60min, then described
One time period was to hold time the time period before holding time more than 10min after 60min, in second time period, institute
State temperature and the second laminating machine presses pressure and the predetermined vacuum degree of laminating machine keeps constant.
Step 15, temperature is down to room temperature for 10 DEG C more than the corresponding temperature of curing values of prepreg, maintains to ejecting plate,
And complete to press.
As shown in figure 4, from h point to i point, with this step by temperature from the corresponding temperature of curing values of prepreg with
It is down to room temperature for upper 10 DEG C, maintains to ejecting plate, and complete to press corresponding, in the process, the vacuum of described laminating machine keeps
Predetermined vacuum degree is constant.
It should be noted that from h point to i point, temperature is dropped for 10 DEG C more than the corresponding temperature of curing values of prepreg
For room temperature, the corresponding temperature of described i point is room temperature, and in the process, described laminating machine presses the pressure (institute that pressure keeps higher
Stating laminating machine pressing pressure is 2 × 106Pa～3.5 × 106Pa), such as 3 × 106pa.
The compression method of printed circuit board (PCB) provided in an embodiment of the present invention, by being warming up to described prepreg by temperature
10 DEG C～20 DEG C below the corresponding temperature of MV minium viscosity value, apply a higher layer when prepreg has compared with low viscosity
Press presses pressure, and temperature is warming up to the corresponding temperature of MV minium viscosity value of prepreg afterwards, applies in MV minium viscosity
Temperature is increased to 10 DEG C of more than the corresponding temperature of curing values of prepreg by one relatively low laminating machine pressing pressure afterwards,
First apply a relatively low laminating machine pressing pressure, when constant temperature time is more than 50min, will be paramount for laminating machine pressing pressure boosting
Pressure, it is achieved thereby that the pressing of printed circuit board (PCB), the printed circuit board (PCB) pressing in this way, manufacture craft is simple, no
Extra equipment and material can be increased, and glue overflow amount can be reduced.
In a preferred embodiment of the present embodiment, corresponding in the curing values that temperature is warming up to described prepreg
More than temperature 10 DEG C, when holding time more than 60min, in section of holding time, described laminating machine pressing pressure is positively retained at 0.1
×106Pa～1 × 106Pa, till described temperature is down to room temperature.
The corresponding temperature of compression method of the printed circuit board (PCB) for the preferred embodiment offer of the embodiment of the present invention for the Fig. 5, layer
Press pressing pressure and the curve synoptic diagram of time, as shown in figure 5, horizontal axis representing time (unit: h), the vertical pivot on the left side represents
Temperature (unit: DEG C), the vertical pivot on the right represents the pressing pressure of laminating machine (unit: pa), and wherein, dotted line represents the excellent of embodiment
Select the pressure of printed circuit board (PCB) and each step of method corresponding temperature curve schematic diagram in embodiment, solid line represents the preferred of embodiment
The each step of the compression method of printed circuit board (PCB) corresponding laminating machine pressing pressure curve schematic diagram in embodiment.
As shown in figure 5, temperature is warming up to the curing values of described prepreg in h point, with this preferred embodiment from f point
More than corresponding temperature 10 DEG C corresponding, from h point in i point, with this preferred embodiment by temperature from the solidification of prepreg
It is worth 10 DEG C of processes being down to room temperature of more than corresponding temperature corresponding.
It should be noted that g point is identical with the corresponding temperature of h point, this temperature is the corresponding temperature of curing values of prepreg
More than degree 10 DEG C, the corresponding temperature of curing values of such as prepreg is 200 DEG C, then temperature is warming up to 210 DEG C, from g point to h
Point is held time more than 60min, and here is held time and is always maintained at relatively low laminating machine pressing pressure (described relatively low layer in section
Press pressing pressure is 0.1 × 106Pa～1 × 106Pa), such as 0.5 × 106Pa, till described temperature is down to room temperature.
The compression method of printed circuit board (PCB) provided in an embodiment of the present invention, by by printed circuit board (PCB), lamination is put at normal temperatures
Enter press, and press is evacuated to the predetermined vacuum of equipment, the scope of described predetermined vacuum is 1.3pa～2pa, and described pre-
If vacuum maintain whole bonding processes, when laminating machine reaches predetermined vacuum and spends, temperature is warming up to prepreg
Low viscosity is worth 10 DEG C～20 DEG C of below corresponding temperature, and applies a higher laminating machine pressing pressure 2 × 106Pa～3.5
×106Pa, maintains 60min, when temperature is increased to the corresponding temperature of MV minium viscosity value, laminating machine pressing pressure is depressurized to
0.1×106Pa～1 × 106Pa, maintains 30min, temperature is warming up to 10 DEG C of more than the corresponding temperature of curing values of prepreg,
After holding time more than 60min, cool the temperature to room temperature, maintain to ejecting plate and complete bonding processes.By this printed circuit board (PCB)
The printed circuit board (PCB) that compression method makes, process is simple, do not increase extras and material, and can effectively reduce excessive glue
Amount.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for those skilled in the art
For, the present invention can have various change and change.All any modifications made within spirit and principles of the present invention, equivalent
Replace, improve etc., should be included within the scope of the present invention.
Claims (7)
1. a kind of compression method of printed circuit board (PCB) is it is characterised in that methods described includes:
A1, it is evacuated to the predetermined vacuum degree of laminating machine at default temperature, will at default temperature and predetermined vacuum degree
The lamination of printed circuit board (PCB) is pressed, and described lamination at least includes internal layer circuit and be set in turn in internal layer circuit both sides half
Cured sheets and Copper Foil, wherein, described default temperature is room temperature, and described predetermined vacuum degree is 1.3pa～2pa, and described default
Vacuum keeps whole bonding processes；
A2, when laminating machine reaches predetermined vacuum and spends, temperature is warming up to the corresponding temperature of MV minium viscosity value of described prepreg
10 DEG C～20 DEG C below degree, laminating machine pressing pressure is boosted to 2 × 106Pa～3.5 × 106Pa, maintains 60min；
A3, temperature is warming up to the corresponding temperature of MV minium viscosity value of described prepreg, laminating machine pressing pressure is depressurized to
0.1×106Pa～1 × 106Pa, maintains 30min；
A4, temperature is warming up to 10 DEG C of more than the corresponding temperature of curing values of described prepreg, holds time more than 60min；
A5, temperature is down to room temperature for 10 DEG C more than the corresponding temperature of curing values of prepreg, maintains to ejecting plate, and complete to press
Close.
2. printed circuit board (PCB) according to claim 1 compression method it is characterised in that described temperature is warming up to described
More than the corresponding temperature of curing values of prepreg 10 DEG C, hold time and include first time period and the second time more than 60min
Section,
In first time period, described laminating machine pressing pressure is maintained at 0.1 × 106Pa～1 × 106pa；
In second time period, laminating machine pressing pressure is boosted to 2 × 106Pa～3.5 × 106Pa, wherein, when described second
Between section be that the described last 10min holding time holds time.
3. temperature is warming up to described half it is characterised in that working as by the compression method of printed circuit board (PCB) according to claim 1
More than the corresponding temperature of curing values of cured sheets 10 DEG C, when holding time more than 60min,
In section of holding time, described laminating machine pressing pressure is maintained at 0.1 × 106Pa～1 × 106pa.
4. printed circuit board (PCB) according to claim 1 compression method it is characterised in that described each step a1, a2, a3,
The temperature held time in section in a4 and a5, laminating machine pressing pressure and predetermined vacuum degree are constant respectively.
5. the compression method of printed circuit board (PCB) according to claim 1 is it is characterised in that the temperature range of described room temperature is
10 DEG C～30 DEG C.
6. the compression method of printed circuit board (PCB) according to claim 1 is it is characterised in that the minimum of described prepreg glues
The corresponding temperature range of angle value is 100 DEG C～130 DEG C.
7. the compression method of printed circuit board (PCB) according to claim 1 is it is characterised in that the curing values of described prepreg
Corresponding temperature range is 190 DEG C～220 DEG C.
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| CN110785027A (en) * | 2019-10-31 | 2020-02-11 | 日彩电子科技(深圳)有限公司 | PCB laminating method |
| CN111586964A (en) * | 2020-05-25 | 2020-08-25 | 上海航天电子通讯设备研究所 | LCP substrate-based high-density high-frequency microwave assembly preparation method and microwave assembly |
| CN112188758A (en) * | 2020-09-08 | 2021-01-05 | 深圳市兴森快捷电路科技股份有限公司 | Printed circuit board pressing method and device |
| CN112437560B (en) * | 2020-12-28 | 2022-08-12 | 珠海元盛电子科技股份有限公司 | LCP-FPC pressing method |
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| CN101733995A (en) * | 2009-12-08 | 2010-06-16 | 广东生益科技股份有限公司 | Copper-clad plate lamination and pressurization method |
| CN102310616A (en) * | 2011-08-05 | 2012-01-11 | 金安国纪科技（珠海）有限公司 | Weight and pressure reducing compacting method of copper-clad plate |
| CN103240833A (en) * | 2012-02-14 | 2013-08-14 | 台湾积体电路制造股份有限公司 | Methods for molding integrated circuits |
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