CN102310616A - Weight and pressure reducing compacting method of copper-clad plate - Google Patents
Weight and pressure reducing compacting method of copper-clad plate Download PDFInfo
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- CN102310616A CN102310616A CN201110224875A CN201110224875A CN102310616A CN 102310616 A CN102310616 A CN 102310616A CN 201110224875 A CN201110224875 A CN 201110224875A CN 201110224875 A CN201110224875 A CN 201110224875A CN 102310616 A CN102310616 A CN 102310616A
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Abstract
The invention discloses a weight and pressure reducing compacting method of a copper-clad plate. The method comprises steps of: (1) a compacting process with a temperature from low to high gradually and an increasing pressure; (2) a compacting process after a temperature continuously rises to a rated high value and a pressure continuously rises to a rated high value; (3) a compacting process with a temperature reducing from the rated high value to a low value and a pressure reducing from the rated high value to a low value, wherein, in the compacting process in step (2), reducing the pressure to a preset low value and returning to the rated high pressure is repeated more than twice. According to the weight and pressure reducing compacting method provided by the invention, the pressure is reduced to a preset low value repeatedly during a traditional high temperature and high pressure compacting process, so as to release stress continuously and reduce internal stress of a sheet material. Copper-clad plate produced by the method of the invention has better sheet material planarization, greatly reduced warping probability and obviously improved dimension stability.
Description
Technical field
The present invention relates to copper-clad laminate and make the field, be specifically related to the compression moulding technology of copper-clad laminate.
Background technology
The basic framework of electric equipment products is a pcb board, and PCB is based upon copper-clad laminate (to be called for short down: on basis copper-clad plate), form through boring, plating, line pattern transfer, etching, printed circuit operation such as anti-welding.High speed development along with electronic technology; Various mounting technologies make rapid progress; Components and parts packaging density in the unit are is increasingly high; Particularly package module, BGA technical elements are had higher requirement to planarization, the dimensional stability of PCB, and this also correspondingly requires the basic material copper-clad plate of pcb board to have the characteristics of high planarization and dimensional stability.
Copper-clad laminate will pass through adhesive preparation, reinforcing material impregnation, HTHP compacting three big basic manufacture processes.Be that example describes with main product FR-4 series of products below:
In conjunction with shown in Figure 1, the traditional drawing method of FR-4 plate is that the folded prepreg for preparing is sent into hot press, adds less pressure earlier, is generally 5～6kg/cm
2, heat up then, along with material temperature ground constantly raises, the resin on the prepreg begins fusion, and applied pressure also constantly raises, and is added to the maximum pressure of technological requirement gradually, is generally 20～45kg/cm
2Whole process, the process that resin melt viscosity on prepreg experience is following: viscosity is big------viscosity diminishes----viscosity is minimum----it is big that viscosity begins to become----viscosity no longer change----solidify.
Traditional drawing method more than the concrete analysis, when temperature by 110～120 ℃ to 170～185 ℃ of initial temperatures (about 150～160 ℃ of material temperature), pressure is by 5～6kg/cm
2To 20～45kg/cm
2In the process, it is big that resin is experiencing viscosity, and------viscosity diminishes, and----minimum-----viscosity of viscosity begins a process becoming big, says from chemical constitution; This process belongs to the process of little molecule resin polymerization; The functional group that participates in reaction is the ring-opening polymerisation under the effect of amine curing agent of the higher epoxy radicals of specific activity, has formed the high molecular polymer of certain chain length, but this high molecular polymer still has certain plasticity.When temperature is higher than 170～180 ℃ (150～160 ℃ of material temperature), high molecular polymer degree of depth polymerization once more, some OH base beginning polymerizations, the process that a bigger plasticity changes will take place in the macromolecule of this moment, forms rigid structure.In two change procedures, high molecular polymer will produce internal stress, can not be released under this stress high pressure, remains in the resin structure of curing.
On the other hand, glass cloth weave cotton cloth process, gluing process because transmission tension force do usefulness; Directly, the glass strands on the latitude direction also can be subjected to displacement and form physics internal stress in the prepreg; When in pressing process, the resin fusion, this displacement under high pressure can not be released and residue in the sheet material.No matter be the physics internal stress that forms in the immersing glue process, or the internal stress that forms in the polymerization process, all remain in the sheet material always.
Serious internal stress in the copper-clad plate shows to make that the sheet material planarization is poor, angularity is big, the several aspects of poor dimensional stability, has a strong impact on the assembling of postorder PCB components and parts; Slight internal stress, then when components and parts assembled, the heat treatment process through operations such as wave-soldering or Reflow Solderings will discharge, and causes pcb board change in size or deformation, also can influence the surface-mounted precision of components and parts.
Summary of the invention
The present invention seeks to solve the problem of internal stress remaining in the copper-clad plate; Through adjustment to the compacting pressuring method; Two kinds of remaining in sheet material internal stress are released, are able to unfold, discharge for macromolecule resin polymerization stress especially, thus the planarization and the dimensional stability of raising sheet material.
A kind of copper-clad plate subtracts pound and falls to pressing drawing method, comprising: the pressing process of boosting is heated up, followed simultaneously in (1) from low to high gradually; (2) continue to be warming up to the high temperature rated value, continue to boost to the pressing process after the rated high voltage value; (3) reduce to low temperature, reduce to the pressing process of low pressure from the rated high voltage value from the high temperature rated value; It is characterized in that, in the pressing process of said step (2), return the rated high voltage value again after twice above low voltage value that pressure is reduced to setting repeatedly.
Heating up gradually from low to high described in the above-mentioned steps (1) is meant, is warming up to 170-180 ℃ by initial temperature 110-120 ℃, and said boosting of following is meant that pressure is by 5～6kg/cm
2Boost to 20～45kg/cm
2
High temperature rated value described in the above-mentioned steps (2) is 200～210 ℃.
The number of times that reduces pressure described in the above-mentioned steps (2) repeatedly is three times.
The low voltage value of setting described in the above-mentioned steps (2) is 8～10kg/cm
2
The pound that subtracts provided by the invention falls to pressing pressing, in the pressing process of traditional high temperature, high pressure, repeatedly pressure is reduced to the low voltage value of setting, thereby stress is constantly discharged, and reduces the internal stress in the sheet material.The sheet material planarization of the copper-clad plate of producing through the present invention is better, the warpage probability significantly reduces, dimensional stability also improves significantly.
Description of drawings
Fig. 1 is that traditional FR-4 plate is suppressed pressure, temperature, the time diagram of formula.
Fig. 2 falls to pressing under the drawing method execution curve map of its temperature, pressure for the pound that subtracts that the embodiment of the invention provides.
The specific embodiment
In conjunction with shown in Figure 2, present embodiment provides subtracts pound and falls to pressing pressing, is resin once more in the polymerization process in compacting, just high temperature, high pressure phase (be among Fig. 2 after 180 ℃, get into 205 ℃ stage), regularly pressure is reduced to setting value, like 8kg/cm
2, make polymer molecule be able to unfold, internal stress is released, and then, boosts to operation pressure again, and so repeatedly several times, the internal stress in its sheet material will be discharged effectively, and is as shown in Figure 2, and present embodiment design subtracting pound falls to pressing three times.
The step of utilizing press to carry out the copper-clad plate compacting mainly comprises: the superimposed sheet material that will assemble pushes press; Matched moulds, close pressure gate; Start the compacting formula, system's automatic vacuum.In the present embodiment, the compacting formula starts back according to the form below 1 formula and moves automatically.
Table 1
Referring to shown in Figure 2, wherein temperature controlled process is following:
The 1st step: the laminate that assembles pushes pressure and wants machine, 120 ℃ of machine temperature, and keep 2min.
The 2nd step: the 2min hot plate is warmed up to 155 ℃ from 120 ℃.
3rd, 4 steps: hot plate is at 155 ℃ of constant temperature, 34min.
The 5th step: hot plate heats up, and 7min rises and is raised to 170 ℃ from 155 ℃.
The 6th step: hot plate heats up, and 18min rises and is raised to 205 ℃ from 170 ℃.
7th, 8,9 steps: hot plate constant temperature, at 205 ℃ of constant temperature 38min.
The 10th step: cooling, 15min drops to 175 ℃ from 205 ℃.
The 11st step: the hot plate cooling, 10min drops to 140 ℃ from 175 ℃.
The 12nd step: the hot plate cooling, 6min drops to 120 ℃ from 140 ℃.The temperature formula finishes.
Continuation is referring to Fig. 2, and wherein pressure controlled process is following:
1st, 2 steps: press closes matched moulds, plus-pressure are 6kg/cm2, keep 10min.
The 3rd step: boost, 1min pressure is raised to 14kg/cm2 from 6kg/cm2.
The 4th step: constant voltage, pressure keeps 33min at 14kg/cm2.
The 5th step: boost, 1min pressure is raised to 22kg/cm2 from 14kg/cm2.
The 6th step: constant voltage, pressure keeps 21min at 22kg/cm2.
The 7th step: subtract pound for the 1st time and fall to pressing, in the 1min pressure is dropped to 8kg/cm2 from 22kg/cm2.
The 8th step: the 2min that boosts, pressure is raised to 30kg/cm2 from 8kg/cm2.
The 9th step: constant voltage, pressure keeps 10min at 30kg/cm2.
The 10th step: subtract pound for the 2nd time and fall to pressing, in the 1min pressure is dropped to 8kg/cm2 from 30kg/cm2.
The 11st step: boost, 2min pressure is raised to 30kg/cm2 from 8kg/cm2.
The 12nd step: constant voltage, pressure keeps 18min at 30kg/cm2.
The 13rd step: subtract pound for the 3rd time and fall to pressing, in the 1min pressure is dropped to 8kg/cm2 from 30kg/cm2.
The 14th step: boost, 2min pressure is raised to 30kg/cm2 from 8kg/cm2.
The 15th step: constant voltage, pressure keeps 14min at 30kg/cm2.
The 16th step: temperature gets into the stage of cooling, and the pressure step-down drops to 20kg/cm2 with pressure from 30kg/cm2 in the 1min.
The 17th step: constant voltage, pressure keeps 7min at 20kg/cm2, and this process press also cools continuing.
The 18th step: step-down drops to 8kg/cm2 with pressure from 20kg/cm2 in the 1min.
The 19th step: constant voltage, pressure keeps 6min at 8kg/cm2, and afterwards, the pressure formula finishes, and at this moment, the temperature formula also finishes simultaneously, and whole pressing process finishes.
In addition, in above-mentioned pressing process, cooperate the process that vacuumizes control following:
The 1st step: vacuum is wanted matched moulds from pressure, the operation of pressure formula, and in the time of the operation of temperature formula, the vacuum formula starts.About 7～10min reaches the high vacuum of 750mm Hg of technique initialization.
The 2nd step: vacuum reaches, and keeps this vacuum always, is lower than setting value like vacuum, and vavuum pump starts automatically, makes vacuum reach setting value.
The 3rd step: when the pressure formula ran to the 14th step 1min, the formula of keeping vacuum 750mm Hg finished, but after this press doors or closed condition, like the vacuum pressure reduction, start vacuum no longer automatically.
The 4th step: when the pressure formula moved to the 19th step 1min, vacuum discharged.The vacuum formula finishes.
During the 19th EOS, temperature, pressure, vacuum control process finish, and press doors is opened automatically, automatic die sinking, and whole compaction procedure finishes.
Below relatively, explain that method that present embodiment provides compares the beneficial effect of prior art through data:
With the two-sided half OZ Copper Foil assessment of 1.6mm, add up with 100,000 board materials production amounts: traditional compacting formula institute pressed sheet, probability is 10% between its angularity 0.5～1.0%; Angularity is at 0.3～0.5% probability 40%, and angularity is at 0.1～0.3% probability 50%.The size expansion rate of X, Y direction is: 270～320ppm; The pound that subtracts that present embodiment provides falls to pressing the pressing pressed sheet; Probability is 0% between its angularity 0.5～1.0%; Angularity is at 0.3～0.5% probability 10%, and angularity is that the size expansion rate of X, Y direction is: 240～260ppm at 0.1～0.3% probability 90%.
Claims (5)
1. a copper-clad plate subtracts pound and falls to pressing drawing method, and comprising: the pressing process of boosting is heated up, followed simultaneously in (1) from low to high gradually; (2) continue to be warming up to the high temperature rated value, continue to boost to the pressing process after the rated high voltage value; (3) reduce to low temperature, reduce to the pressing process of low pressure from the rated high voltage value from the high temperature rated value; It is characterized in that, in the pressing process of said step (2), return the rated high voltage value again after twice above low voltage value that pressure is reduced to setting repeatedly.
2. copper-clad plate according to claim 1 subtracts pound and falls to pressing drawing method, it is characterized in that: heating up gradually from low to high described in the step (1) is meant, is warming up to 170-180 ℃ by initial temperature 110-120 ℃, and said boosting of following is meant that pressure is by 5-6kg/cm
2Boost to 20-45kg/cm
2
3. copper-clad plate according to claim 1 subtracts pound and falls to pressing drawing method, and it is characterized in that: the high temperature rated value described in the step (2) is 200-210 ℃.
4. copper-clad plate according to claim 1 subtracts pound and falls to pressing drawing method, and it is characterized in that: the number of times that reduces pressure described in the step (2) repeatedly is three times.
5. copper-clad plate according to claim 1 subtracts pound and falls to pressing drawing method, it is characterized in that: the low voltage value of setting described in the step (2) is 8-10kg/cm
2
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103612464A (en) * | 2013-11-11 | 2014-03-05 | 莱芜金鼎电子材料有限公司 | Copper-clad plate with two flexible surfaces and preparation method of copper-clad plate with two flexible surfaces |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104080281A (en) * | 2014-07-04 | 2014-10-01 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN105873367A (en) * | 2016-05-27 | 2016-08-17 | 深圳崇达多层线路板有限公司 | Method for reducing warping degree of multilayer board |
| CN106476405A (en) * | 2016-09-30 | 2017-03-08 | 生益电子股份有限公司 | The lamination sheeting process of PCB and PCB |
| CN110557899A (en) * | 2019-08-28 | 2019-12-10 | 广合科技（广州）有限公司 | method for processing expansion and shrinkage of PCB finished board |
| CN111774437A (en) * | 2020-07-28 | 2020-10-16 | 宁波江丰电子材料股份有限公司 | Pressurizing and shaping method for target material after welding |
| CN113635649A (en) * | 2021-08-17 | 2021-11-12 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103612464B (en) * | 2013-11-11 | 2015-11-25 | 莱芜金鼎电子材料有限公司 | A kind of double side flexible copper coated board and preparation method thereof |
| CN103612464A (en) * | 2013-11-11 | 2014-03-05 | 莱芜金鼎电子材料有限公司 | Copper-clad plate with two flexible surfaces and preparation method of copper-clad plate with two flexible surfaces |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN104080281A (en) * | 2014-07-04 | 2014-10-01 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN104080281B (en) * | 2014-07-04 | 2017-01-25 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN105873367B (en) * | 2016-05-27 | 2019-03-05 | 深圳崇达多层线路板有限公司 | A method of reducing multi-layer board angularity |
| CN105873367A (en) * | 2016-05-27 | 2016-08-17 | 深圳崇达多层线路板有限公司 | Method for reducing warping degree of multilayer board |
| CN106476405A (en) * | 2016-09-30 | 2017-03-08 | 生益电子股份有限公司 | The lamination sheeting process of PCB and PCB |
| CN110557899A (en) * | 2019-08-28 | 2019-12-10 | 广合科技（广州）有限公司 | method for processing expansion and shrinkage of PCB finished board |
| CN111774437A (en) * | 2020-07-28 | 2020-10-16 | 宁波江丰电子材料股份有限公司 | Pressurizing and shaping method for target material after welding |
| CN111774437B (en) * | 2020-07-28 | 2022-04-08 | 宁波江丰电子材料股份有限公司 | Pressurizing and shaping method for target material after welding |
| CN113635649A (en) * | 2021-08-17 | 2021-11-12 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
| CN113635649B (en) * | 2021-08-17 | 2023-09-22 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
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