CN101733995A - Copper-clad plate lamination and pressurization method - Google Patents
Copper-clad plate lamination and pressurization method Download PDFInfo
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- CN101733995A CN101733995A CN200910188749A CN200910188749A CN101733995A CN 101733995 A CN101733995 A CN 101733995A CN 200910188749 A CN200910188749 A CN 200910188749A CN 200910188749 A CN200910188749 A CN 200910188749A CN 101733995 A CN101733995 A CN 101733995A
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Abstract
The invention provides a copper-clad plate lamination and pressurization method, comprising the following steps: 1. determining the softening temperature, the lowest melting viscosity point temperature and gel point temperature of resin in a presoak sheet; 2. laminating one or a plurality of presoak sheets together, and cladding copper foil on one or two sides of the presoak sheets; 3. feeding the laminated presoak sheets and copper foil into a laminating machine, then closing the laminating machine for vacuumizing; 4. starting to gradually increase lamination pressure and continuously raising the temperature when the lamination machine is in a vacuum state; 5. reducing lamination pressure when the temperature reaches the value of softening temperature of +/-10 DEG C; 6. gradually increasing lamination pressure after reaching the lowest melting velocity and before reaching the gel point temperature; and 7. entering the curing stage of the resin. The invention has simple operation, can reduce copper-clad plate resin recession amount and improve the uniformity of whole-plate thickness of the copper-clad plate.
Description
Technical field
The present invention relates to a kind of lamination and pressurization method, relate in particular to a kind of copper-clad plate lamination and pressurization method that reduces copper-clad plate gummosis amount.
Background technology
To soak reinforcing material with resin, through overbaking, drying, make resin from uncured glue, become pre-preg material, then prepreg is made in the section of pre-preg material, be superimposed together with one or more prepreg then again with certain state of cure, and one or both sides are coated with Copper Foil, make copper-clad laminate through heating up, pressurizeing, be called for short copper-clad plate (CCL), it is mainly used in the making printed circuit board (pcb).Present printed circuit board has become most of electronic products and has reached the indispensable main building block of circuit interconnects.Along with the extensive use of swift and violent raising of circuit signal transfer rate and high-frequency circuit, printed circuit board (PCB) is also had higher requirement.The circuit interconnects performance that printed circuit board (PCB) provides must allow complete in transmission course, reliable, accurate, the pulsation-free transmission of signal.And the integrality of signal, reliability, accuracy, uniformity all are subjected to the influence of copper-clad plate resin layer thickness.
The resin that has certain state of cure in the prepreg can melt along with the rising of temperature in heating pressure process.When initial, the viscosity of molten resin begins to reduce, and after being reduced to some scopes, begins to take place to flow, and the effect that is under pressure begins to flowing all around, along with the continuation rising of temperature, resin generation curing reaction begins to form cross-linked structure, this moment, resin viscosity changed rising into from reduction, this turning point is called the lowest melt viscosity point, and final resin reaches curing, becomes solid-state.In the resin flows process, can flow out outside the effective area of copper-clad plate, make that the edge thickness of copper-clad plate is lower than interior thickness, form certain thickness gradient.
Existing lamination pressuring method, in the copper-clad plate lamination process, in order to make the abundant sized glass fibres cloth of resin, in order to catch up with except that the minute bubbles in the prepreg, in conjunction with heating rate, segmentation is intensified pressure progressively, but pressure is too big before resin lowest melt viscosity point, causes copper-clad plate edge resin to flow out in a large number easily.After resin flowed out from the copper-clad plate edge, there was bigger gradient difference in the edge resin layer thickness with the center resin layer thickness, and edge thickness is than the thin 5-20% of interior thickness generally speaking, distortion and fluctuation in the time of can causing printed circuit board (PCB) to transmit signal; And, can cause that also the copper-clad plate marginal position is under-voltage, cause copper-clad plate edge resin can not soak into reinforcing material, form hole, reduce the reliability of copper-clad plate.In addition, resin might flow out Copper Foil, and each layer copper-clad plate sticked together, and causes follow-up fractionation and side cut to be difficult to carry out.
Summary of the invention
The objective of the invention is to, a kind of copper-clad plate lamination and pressurization method is provided, it is simple to operate, can avoid resin to flow out from the copper-clad plate edge, reduce copper-clad plate edge thickness and center thickness gradient thereby imitate, improve copper-clad plate performance reliability and uniformity, help the operating efficiency of follow-up fractionation and side cut operation.
For achieving the above object, the invention provides a kind of copper-clad plate lamination and pressurization method, it comprises the steps:
Step 1, the softening temperature of determining resin in the prepreg, lowest melt viscosity point temperature, and gel point temperature;
Step 2, one or more prepreg is superimposed together, and at its one or both sides coated with Copper Foil;
Step 3, the prepreg and the Copper Foil that are superimposed together are sent into laminating machine, close laminating machine then and begin to vacuumize;
Step 4, when reaching vacuum in the laminating machine, beginning progressively strengthens lamination pressure and continuous rising temperature;
Step 5, when temperature reach softening temperature ± 10 ℃ the time, reduce lamination pressure;
Step 6, after temperature reaches lowest melt viscosity, reach before the gel point temperature, lamination pressure progressively raises;
Step 7, resin enter cure stage.
Described step 1 comprises the steps:
Step 1.1, provide the resin-oatmeal in the prepreg;
Step 1.2, flow graph is connected with computer, and the initial temperature and the heating rate of flow graph are set;
Step 1.3, resin-oatmeal is put into test panel, when treating the resin-oatmeal variable color, the rheometer test awl is laid, and begin rotation;
The curve that step 1.4, rendering computer go out resin-oatmeal viscosity with temperature and time variation is a rheological curve;
Step 1.5, determine the minimum point of this rheological curve, i.e. the lowest melt viscosity of resin.
Resin-oatmeal uniform particles free from admixture in the described step 1.1.
The initial temperature of flow graph is a room temperature in the described step 1.2.
The heating rate of flow graph is 1 ℃/min, 2 ℃/min or 3 ℃/min in the described step 1.2.
Vacuum in the described step 4 in the laminating machine is 30～200Torr.
Temperature in the described laminating machine is 40～400 ℃.
The heating rate of described laminating machine is 0.5～3.0 ℃/min.
Beneficial effect of the present invention: method provided by the present invention is simple to operate, it reduces lamination pressure by the softening stress-displacement stage before the lowest melt viscosity of resin, thereby can avoid resin to flow out from the copper-clad plate edge, efficiency reduces copper-clad plate edge thickness and center thickness gradient, guarantee the uniformity of thickness of copper-clad plate, and then improve integrality, reliability, accuracy and the uniformity of printed circuit board (PCB) transmission signal; The resin flow output of the prepreg that this method is made is less or do not flow out, and can not cause that the copper-clad plate marginal position is under-voltage, promotes the edge resin to soak into reinforcing material, has improved copper-clad plate performance reliability and uniformity; In addition, this method also increased a kind of in copper-clad plate pressing process the method and the means of control resin flows, indirect increasing the process for pressing window of prepreg, help improving the operating efficiency of follow-up fractionation and side cut operation.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effect apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
Fig. 1 is the schematic flow sheet of copper-clad plate lamination and pressurization method of the present invention.
The specific embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
As described in Figure 1, copper-clad plate lamination and pressurization method of the present invention comprises:
Step 1, the softening temperature of determining resin in the prepreg, lowest melt viscosity point temperature, and gel point temperature.
This step 1 further comprises the steps:
Step 1.1, provide the resin-oatmeal in the prepreg.In the present embodiment, service property (quality) is the resin-oatmeal of 150g, and guarantees this resin-oatmeal uniform particles free from admixture, to guarantee accurately to test the rheological curve of resin.
Step 1.2, flow graph is connected with computer, and the initial temperature and the heating rate of flow graph are set.In the present embodiment, the initial temperature of flow graph is set to room temperature, and the flow graph heating rate is set to 1 ℃/min.In other embodiments, the flow graph heating rate can also be set to 2 ℃/min or 3 ℃/min.
Step 1.3, resin-oatmeal is put into test panel, when treating the resin-oatmeal variable color, the rheometer test awl is laid, and begin rotation.
The curve that step 1.4, rendering computer go out resin-oatmeal viscosity with temperature and time variation is a rheological curve.
Step 1.5, determine the minimum point of this rheological curve, i.e. the lowest melt viscosity of resin.Being the resin softening stress-displacement stage before lowest melt viscosity, is the resin gel stage after lowest melt viscosity.
Step 2, one or more prepreg is superimposed together, and at its one or both sides coated with Copper Foil.
Step 3, the prepreg and the Copper Foil that are superimposed together are sent into laminating machine, close laminating machine then and begin to vacuumize.
Step 4, when reaching vacuum in the laminating machine, beginning progressively strengthens lamination pressure and continuous rising temperature.In this lamination process, the vacuum in the laminating machine is generally 30～200Torr, could effectively discharge the bubble in the prepreg.And the temperature when beginning in the laminating machine is 40～400 ℃, in order to make the resin in the prepreg softening, needs the temperature in the continuous rising laminating machine, and its heating rate is 0.5～3.0 ℃/min.
Step 5, when temperature reach softening temperature ± 10 ℃ the time, reduce lamination pressure; Softening when resin, reduce pressure and can avoid resin from copper-clad plate pressing process, to flow out, to guarantee the thickness evenness and the reliability of copper-clad plate.At this moment, pressure little tree fat outflow copper-clad plate more is few more, but needs resin itself contains on the assurance prepreg moisture, small-molecule substance to discharge, in order to avoid produce bubble.
Step 6, after temperature reaches lowest melt viscosity, reach before the gel point temperature, lamination pressure progressively raises.When the resin of dipstick reaches lowest melt viscosity, resin begins gelation stage, appends pressure, and cooperates heating rate, can effectively guarantee copper-clad plate base material quality.
Step 7, resin enter cure stage.When reacting to cure stage, resin no longer flows, and is solid.After resin meets the requirements of state of cure, begin cooling and release pressure, final pressing and forming.
Please contrast and consult table 1 and table 2, table 1 is to be laminated to example with the FR-4 copper-clad plate (theoretic throat 1.5mm) that a kind of DICY solidifies, and uses the existing lamination mode of following certain heating rate progressively to pressurize, and is that sample thickness is measured numerical tabular with 30 copper-clad plates.Table 2 is to be laminated to example with the FR-4 copper-clad plate (theoretic throat 1.5mm) that a kind of DICY solidifies, and uses lamination and pressurization method of the present invention, and is that sample thickness is measured numerical tabular with 30 copper-clad plates.Through the copper-clad plate group internal standard difference calculated in can table 1 is 0.01572mm, and copper-clad plate group internal standard difference is reduced to 0.012269mm in the table 2.This shows that lamination and pressurization method provided by the present invention can effectively improve the thickness of copper-clad plate homogeneity.
By above-mentioned example as can be known, the method can effectively be improved DICY curing system thickness of copper-clad plate uniformity, but it is thick to be not limited in the copper-clad plate of DICY curing system.By adjusting the step-down time, the method also can be used for improving the laminate thickness evenness of other (as the Novolac system) system formulation.
Table 1
Table 2
| Sequence number | Corner points 1 | Corner points 2 | Corner points 3 | Corner points 4 | Intermediate point |
| ??1 | ??1.493 | ??1.478 | ??1.489 | ??1.493 | ??1.502 |
| ??2 | ??1.498 | ??1.504 | ??1.484 | ??1.491 | ??1.516 |
| ??3 | ??1.479 | ??1.485 | ??1.489 | ??1.471 | ??1.501 |
| ??4 | ??1.495 | ??1.488 | ??1.497 | ??1.49 | ??1.517 |
| ??5 | ??1.508 | ??1.485 | ??1.484 | ??1.492 | ??1.513 |
| ??6 | ??1.486 | ??1.491 | ??1.486 | ??1.503 | ??1.509 |
| Sequence number | Corner points 1 | Corner points 2 | Corner points 3 | Corner points 4 | Intermediate point |
| ??7 | ??1.488 | ??1.513 | ??1.479 | ??1.495 | ??1.503 |
| ??8 | ??1.501 | ??1.487 | ??1.487 | ??1.484 | ??1.514 |
| ??9 | ??1.494 | ??1.496 | ??1.484 | ??1.472 | ??1.503 |
| ??10 | ??1.482 | ??1.495 | ??1.482 | ??1.494 | ??1.527 |
| ??11 | ??1.489 | ??1.496 | ??1.501 | ??1.508 | ??1.511 |
| ??12 | ??1.493 | ??1.497 | ??1.472 | ??1.49 | ??1.515 |
| ??13 | ??1.494 | ??1.476 | ??1.484 | ??1.48 | ??1.515 |
| ??14 | ??1.484 | ??1.487 | ??1.485 | ??1.489 | ??1.519 |
| ??15 | ??1.478 | ??1.499 | ??1.493 | ??1.481 | ??1.504 |
| ??16 | ??1.488 | ??1.481 | ??1.493 | ??1.495 | ??1.505 |
| ??17 | ??1.498 | ??1.477 | ??1.489 | ??1.491 | ??1.507 |
| ??18 | ??1.484 | ??1.501 | ??1.495 | ??1.483 | ??1.51 |
| ??19 | ??1.489 | ??1.479 | ??1.498 | ??1.496 | ??1.51 |
| ??20 | ??1.483 | ??1.484 | ??1.485 | ??1.496 | ??1.498 |
| ??21 | ??1.498 | ??1.496 | ??1.48 | ??1.479 | ??1.504 |
| ??22 | ??1.496 | ??1.499 | ??1.483 | ??1.48 | ??1.507 |
| ??23 | ??1.484 | ??1.485 | ??1.494 | ??1.497 | ??1.492 |
| ??24 | ??1.491 | ??1.485 | ??1.487 | ??1.479 | ??1.51 |
| ??25 | ??1.473 | ??1.494 | ??1.489 | ??1.494 | ??1.507 |
| ??26 | ??1.503 | ??1.481 | ??1.499 | ??1.491 | ??1.521 |
| ??27 | ??1.492 | ??1.498 | ??1.501 | ??1.491 | ??1.529 |
| ??28 | ??1.487 | ??1.476 | ??1.504 | ??1.482 | ??1.509 |
| Sequence number | Corner points 1 | Corner points 2 | Corner points 3 | Corner points 4 | Intermediate point |
| ??29 | ??1.484 | ??1.497 | ??1.498 | ??1.491 | ??1.517 |
| ??30 | ??1.499 | ??1.482 | ??1.486 | ??1.49 | ??1.505 |
In sum, method provided by the present invention is simple to operate, it reduces lamination pressure by the softening stress-displacement stage before the lowest melt viscosity of resin, thereby can avoid resin to flow out from the copper-clad plate edge, efficiency reduces copper-clad plate edge thickness and center thickness gradient, guarantee the uniformity of thickness of copper-clad plate, and then improve integrality, reliability, accuracy and the uniformity of printed circuit board (PCB) transmission signal; The resin flow output of the prepreg that this method is made is less or do not flow out, and can not cause that the copper-clad plate marginal position is under-voltage, promotes the edge resin to soak into reinforcing material, has improved copper-clad plate performance reliability and uniformity; In addition, this method also increased a kind of in copper-clad plate pressing process the method and the means of control resin flows, indirect increasing the process for pressing window of prepreg, help improving the operating efficiency of follow-up fractionation and side cut operation.
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (8)
1. a copper-clad plate lamination and pressurization method is characterized in that, comprises the steps:
Step 1, the softening temperature of determining resin in the prepreg, lowest melt viscosity point temperature, and gel point temperature;
Step 2, one or more prepreg is superimposed together, and at its one or both sides coated with Copper Foil;
Step 3, the prepreg and the Copper Foil that are superimposed together are sent into laminating machine, close laminating machine then and begin to vacuumize;
Step 4, when reaching vacuum in the laminating machine, beginning progressively strengthens lamination pressure and continuous rising temperature;
Step 5, when temperature reach softening temperature ± 10 ℃ the time, reduce lamination pressure;
Step 6, after temperature reaches lowest melt viscosity, reach before the gel point temperature, lamination pressure progressively raises;
Step 7, resin enter cure stage.
2. copper-clad plate lamination and pressurization method as claimed in claim 1 is characterized in that described step 1 comprises the steps:
Step 1.1, provide the resin-oatmeal in the prepreg;
Step 1.2, flow graph is connected with computer, and the initial temperature and the heating rate of flow graph are set;
Step 1.3, resin-oatmeal is put into test panel, when treating the resin-oatmeal variable color, the rheometer test awl is laid, and begin rotation;
The curve that step 1.4, rendering computer go out resin-oatmeal viscosity with temperature and time variation is a rheological curve;
Step 1.5, determine the minimum point of this rheological curve, i.e. the lowest melt viscosity of resin.
3. copper-clad plate lamination and pressurization method as claimed in claim 2 is characterized in that, the resin-oatmeal uniform particles free from admixture in the described step 11.
4. copper-clad plate lamination and pressurization method as claimed in claim 2 is characterized in that, the initial temperature of flow graph is a room temperature in the described step 12.
5. copper-clad plate lamination and pressurization method as claimed in claim 4 is characterized in that, the heating rate of flow graph is 1 ℃/min, 2 ℃/min or 3 ℃/min in the described step 12.
6. copper-clad plate lamination and pressurization method as claimed in claim 1 is characterized in that, the vacuum in the described step 4 in the laminating machine is 30～200Torr.
7. copper-clad plate lamination and pressurization method as claimed in claim 6 is characterized in that, the temperature in the described laminating machine is 40～400 ℃.
8. copper-clad plate lamination and pressurization method as claimed in claim 1 is characterized in that, the heating rate of described laminating machine is 0.5～3.0 ℃/min.
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| CN200910188749A CN101733995A (en) | 2009-12-08 | 2009-12-08 | Copper-clad plate lamination and pressurization method |
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| CN200910188749A CN101733995A (en) | 2009-12-08 | 2009-12-08 | Copper-clad plate lamination and pressurization method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102275354A (en) * | 2011-06-10 | 2011-12-14 | 苏州生益科技有限公司 | Method for manufacturing tinsel laminate for improving thickness uniformity of insulating layer |
| CN102310616A (en) * | 2011-08-05 | 2012-01-11 | 金安国纪科技（珠海）有限公司 | Weight and pressure reducing compacting method of copper-clad plate |
| CN102490440A (en) * | 2011-12-23 | 2012-06-13 | 广东生益科技股份有限公司 | Laminating method for copper-clad laminates |
| CN104080281A (en) * | 2014-07-04 | 2014-10-01 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN106626692A (en) * | 2016-12-30 | 2017-05-10 | 广东生益科技股份有限公司 | Laminating method of laminate |
| CN110948954A (en) * | 2018-09-25 | 2020-04-03 | 汉能移动能源控股集团有限公司 | Front plate, thin-film solar module and preparation method thereof |
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2009
- 2009-12-08 CN CN200910188749A patent/CN101733995A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102275354A (en) * | 2011-06-10 | 2011-12-14 | 苏州生益科技有限公司 | Method for manufacturing tinsel laminate for improving thickness uniformity of insulating layer |
| CN102310616A (en) * | 2011-08-05 | 2012-01-11 | 金安国纪科技（珠海）有限公司 | Weight and pressure reducing compacting method of copper-clad plate |
| CN102310616B (en) * | 2011-08-05 | 2014-03-12 | 金安国纪科技（珠海）有限公司 | Weight and pressure reducing compacting method of copper-clad plate |
| CN102490440A (en) * | 2011-12-23 | 2012-06-13 | 广东生益科技股份有限公司 | Laminating method for copper-clad laminates |
| CN102490440B (en) * | 2011-12-23 | 2014-04-09 | 广东生益科技股份有限公司 | Laminating method for copper-clad laminates |
| CN104080281A (en) * | 2014-07-04 | 2014-10-01 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN104080281B (en) * | 2014-07-04 | 2017-01-25 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
| CN106626692A (en) * | 2016-12-30 | 2017-05-10 | 广东生益科技股份有限公司 | Laminating method of laminate |
| CN110948954A (en) * | 2018-09-25 | 2020-04-03 | 汉能移动能源控股集团有限公司 | Front plate, thin-film solar module and preparation method thereof |
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Application publication date: 20100616 |