CN102490440A - Laminating method for copper-clad laminates - Google Patents
Laminating method for copper-clad laminates Download PDFInfo
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- CN102490440A CN102490440A CN2011104404922A CN201110440492A CN102490440A CN 102490440 A CN102490440 A CN 102490440A CN 2011104404922 A CN2011104404922 A CN 2011104404922A CN 201110440492 A CN201110440492 A CN 201110440492A CN 102490440 A CN102490440 A CN 102490440A
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Abstract
The invention provides a laminating method for copper-clad laminates. The method consists of: step 1. providing a sheet material; step 2. placing the sheet material into a laminating machine for preparing lamination; step 3. increasing the temperature: employing a stepped temperature increasing mode, controlling the temperature increasing rate below 40DEG C/min, and keeping an interval of 20-60DEG C between each temperature step; step 4. conducting curing: by means of a slow temperature lowering mode, lowering the temperature from a highest curing temperature slowly at a rate of 0.1-0.5DEG C/min; and step 5. carrying out cooling. By adopting a stepped temperature increasing mode in the temperature increasing period, the laminating method for copper-clad laminates in the invention improves the temperature consistency of an intermediate laminate and a bottom laminate, enhances the dimension stability of each laminate after lamination as well as the thickness consistency of the sheet material, reduces the problems of warping and internal quality abnormities, etc.; and through a slow curing temperature lowering mode, the laminates need less heat after reaching a curing temperature, then the hot oil introducing amount of the laminating machine can be reduced, thus reaching the energy consumption saving purpose effectively.
Description
Technical field
The present invention relates to copper-clad plate, PCB industry technology field, relate in particular to a kind of copper-clad plate compression method.
Background technology
Temperature curve in the pressing process procedures in the copper-clad plate industry mainly is divided into three parts: heat up, solidify and cooling.And the general one-part form that adopts of the temperature rise period of conventional pressing program heats up, and solidifies at the then many employing thermostatic types of cure stage, wherein; One-part form heats up: after the BOOK that folds got into press, program was provided with temperature and directly is raised to high temperature (160-300 ℃) from low temperature (50-150 ℃), and this kind mode program is provided with simply; Easy to operate; Lower to the Equipment Control required precision, but in the actual use, if lamination quantity is many; Influenced by heat transfer rate must to cause intermediate laminate and bottom surface stack temperature difference excessive, process consistency is poor.Thermostatic type solidifies: in the cure stage temperature with constant at a certain specified temp point (160-300 ℃) and be retained to solidify and finish, this kind mode program is provided with simply, control is convenient, but that program consumes energy is higher.
Summary of the invention
The object of the present invention is to provide a kind of copper-clad plate compression method, adopt the staged heating mode, improve the uniformity of intermediate laminate and bottom surface stack temperature, and fall formula solidification temperature mode, effectively reach the purpose of energy efficient through slow in the temperature rise period.
For realizing above-mentioned purpose, the present invention provides a kind of copper-clad plate compression method, comprises the steps:
Step 1, sheet material is provided;
Step 2, sheet material is put into laminating machine prepare pressing;
Step 3, temperature rise period: adopt the staged heating mode, heating rate is controlled at below 40 ℃/minute, 20-60 ℃ at interval of every section temperature ladder;
Step 4, cure stage: adopt temperature to delay and fall mode, temperature slowly reduces from the speed of the highest solidification temperature with 0.1-0.5 ℃/minute;
The said temperature rise period comprises temperature ladder more than two sections or two sections.
In the said temperature rise period, at the heating rate in ℃ interval, temperature≤180 heating rate greater than ℃ interval, temperature＞180.
The highest solidification temperature of said cure stage is 185-250 ℃.
Said cure stage comprises the stage of the slow reduction of speed rate of a plurality of differences.
The invention has the beneficial effects as follows: copper-clad plate compression method of the present invention; Adopt the staged heating mode in the temperature rise period; Improve the uniformity of intermediate laminate and bottom surface stack temperature; Dimensional stability and sheet metal thickness uniformity after the raising pressing between each lamination reduce problems such as warpage and internal soundness are unusual; And through the slow formula solidification temperature mode of falling, make to be stacked in that to reach the heat that needs after the solidification temperature few that can reduce laminating machine deep fat feeding amount this moment, effectively reaches the purpose of energy efficient.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through the specific embodiment invention, will make technical scheme of the present invention and other beneficial effect obvious.
In the accompanying drawing,
Fig. 1 is the flow chart of copper-clad plate compression method of the present invention;
Fig. 2 is the temperature changing curve diagram in the pressing process of the present invention, and wherein dotted line representes to be provided with temperature curve, realizes expression actual temperature curve.
The specific embodiment
In conjunction with Fig. 1, shown in Figure 2, copper-clad plate compression method of the present invention comprises the steps:
Step 1, sheet material is provided; Sheet material comprises several laminations, and its lamination number not only can be below 13, its lamination number more can >=13 layers.
Step 2, sheet material is put into laminating machine prepare pressing; Should preceding two steps get final product, in the pressing process, comprise intensification, solidify and the cooling Main Stage through existing techniques in realizing.
Step 3, temperature rise period: adopt the staged heating mode; Shown in the A-B stage among Fig. 2; Temperature is raised to 160-300 ℃ from 50-150 ℃ with staged, and heating rate is controlled at below 40 ℃/minute, and heating rate is that 0 ℃ of/minute i.e. expression keeps a certain temperature-resistant; The said temperature rise period comprises temperature ladder more than two sections or two sections; 20-60 ℃ at interval of every section temperature ladder; And in the temperature rise period, can adopt heating rate relatively fast, can adopt relatively slow heating rate in ℃ interval, temperature＞180 in ℃ interval, temperature≤180.Through this temperature rise period; Reduce the intermediate laminate and the bottom surface lamination temperature contrast at one time of sheet material; Increase the temperature uniformity (particularly lamination number >=13) of all laminations of sheet material, reduce plate face warpage after the hot pressing, reach sheet metal thickness evenly, the uniformity of internal soundness.
Step 4, cure stage: adopt the slow mode of falling of temperature; Shown in the B-C stage among Fig. 2; Temperature slowly reduces from the speed of the highest solidification temperature with 0.1-0.5 ℃/minute, and this kind mode reaches the control stack temperature after reaching solidification temperature point, and lamination reduces the heat energy demand; Can reduce laminating machine deep fat feeding amount this moment through reducing design temperature, reaches the purpose of energy efficient; The highest solidification temperature of said cure stage is 185-250 ℃.The rate of temperature fall of this cure stage can comprise a plurality of slow reduction of speed rate stages, and each stage has one 0.1-0.5 ℃/minute different slow reduction of speed rate.
In sum; Copper-clad plate compression method of the present invention adopts the staged heating mode in the temperature rise period, improves the uniformity of intermediate laminate and bottom surface stack temperature; Dimensional stability and sheet metal thickness uniformity after the raising pressing between each lamination reduce problems such as warpage and internal soundness are unusual; And through the slow formula solidification temperature mode of falling, make to be stacked in that to reach the heat that needs after the solidification temperature few that can reduce laminating machine deep fat feeding amount this moment, effectively reaches the purpose of energy efficient.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of accompanying Claim of the present invention.
Claims (5)
1. a copper-clad plate compression method is characterized in that, comprises the steps:
Step 1, sheet material is provided;
Step 2, sheet material is put into laminating machine prepare pressing;
Step 3, temperature rise period: adopt multistage staged heating mode, every section heating rate is controlled at below 40 ℃/minute, 20-60 ℃ at interval of every section temperature ladder.
Step 4, cure stage: adopt temperature to delay and fall mode, temperature slowly reduces from the speed of the highest solidification temperature with 0.1-0.5 ℃/minute;
Step 5, cooling.
2. copper-clad plate compression method as claimed in claim 1 is characterized in that, the said temperature rise period comprises temperature ladder more than two sections or two sections.
3. copper-clad plate compression method as claimed in claim 1 is characterized in that, in the said temperature rise period, at the heating rate in ℃ interval, temperature≤180 heating rate greater than ℃ interval, temperature＞180.
4. copper-clad plate compression method as claimed in claim 1 is characterized in that the highest solidification temperature of said cure stage is 185-250 ℃.
5. copper-clad plate compression method as claimed in claim 1 is characterized in that, said cure stage comprises the stage of the slow reduction of speed rate of a plurality of differences.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110440492.2A CN102490440B (en) | 2011-12-23 | 2011-12-23 | Laminating method for copper-clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110440492.2A CN102490440B (en) | 2011-12-23 | 2011-12-23 | Laminating method for copper-clad laminates |
Publications (2)
| Publication Number | Publication Date |
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| CN102490440A true CN102490440A (en) | 2012-06-13 |
| CN102490440B CN102490440B (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110440492.2A Active CN102490440B (en) | 2011-12-23 | 2011-12-23 | Laminating method for copper-clad laminates |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106476405A (en) * | 2016-09-30 | 2017-03-08 | 生益电子股份有限公司 | The lamination sheeting process of PCB and PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007066867A1 (en) * | 2005-12-07 | 2007-06-14 | Ye Kun Lee | Method of manufacturing heavy clad material (hcm) using anchor-treated cold-rolled copper foil |
| CN101733995A (en) * | 2009-12-08 | 2010-06-16 | 广东生益科技股份有限公司 | Copper-clad plate lamination and pressurization method |
| CN102189722A (en) * | 2011-01-30 | 2011-09-21 | 金安国纪科技股份有限公司 | Copper-clad plate and processing method thereof |
-
2011
- 2011-12-23 CN CN201110440492.2A patent/CN102490440B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007066867A1 (en) * | 2005-12-07 | 2007-06-14 | Ye Kun Lee | Method of manufacturing heavy clad material (hcm) using anchor-treated cold-rolled copper foil |
| CN101733995A (en) * | 2009-12-08 | 2010-06-16 | 广东生益科技股份有限公司 | Copper-clad plate lamination and pressurization method |
| CN102189722A (en) * | 2011-01-30 | 2011-09-21 | 金安国纪科技股份有限公司 | Copper-clad plate and processing method thereof |
Non-Patent Citations (3)
| Title |
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| 田民波等: "《高密度封装基板》", 30 September 2003 * |
| 陈大柱等: "从聚合物的结晶到热固性树脂的固化-AVRAMI理论在研究热固性树脂固化过程中的应用", 《2003年全国高分子学术论文报告会》 * |
| 陈晓东: "改善FR-4覆铜板层压工艺降低产品翘曲度", 《印制电路信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106476405A (en) * | 2016-09-30 | 2017-03-08 | 生益电子股份有限公司 | The lamination sheeting process of PCB and PCB |
| CN106476405B (en) * | 2016-09-30 | 2019-04-16 | 生益电子股份有限公司 | The lamination sheeting process and PCB of PCB |
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| Publication number | Publication date |
|---|---|
| CN102490440B (en) | 2014-04-09 |
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